Dr. Nokibul Islam, Senior Director at STATS ChipPAC, presented the company's advanced packaging technology roadmap at the 2025 Advanced Packaging Developers Conference (APDC), identifying advanced packaging as one of the fastest-growing areas in the semiconductor industry

Ang Wee Seng, Executive Director of the Singapore Semiconductor Industry Association (SSIA), told attendees at the 2025 Advanced Packaging Developers Conference (APDC) that the industry must strengthen collaboration and local networks to navigate geopolitical and resource challenges as it moves toward a projected US$1 trillion market by 2030

Chinese electronics manufacturer Wingtech Technology has filed a formal statement with the Dutch public broadcaster NOS, urging the Netherlands to revoke its decision to temporarily take control of Nexperia, the semiconductor company Wingtech acquired in 2019. The move marks a new flashpoint in the increasingly strained relationship between China and Europe's technology industries, as national security and industrial policy concerns collide

China's next phase of technology strategy is injecting fresh uncertainty into global supply chains, signalling a new round of strategic recalibration across industries worldwide

As Moore's Law nears its physical and commercial limits, advanced packaging has become the new battleground defining the evolution of IC substrate technology and the global PCB landscape. Henry Utsunomiya, President of Fujitsu Interconnect Technologies (FICT) under Fujitsu Limited, noted that with heterogeneous integration now the dominant approach, the industry is undergoing a crucial shift from organic to inorganic substrates

After dominating China's first wave of electric vehicle (EV) adoption, BYD is shifting its focus in 2025 from electrification to intelligent mobility. The automaker has launched what it calls a campaign for "smart driving for everyone," aiming to make autonomous driving technologies accessible to mass-market consumers