A loophole in US export controls reportedly lets high-bandwidth memory (HBM) made by Samsung Electronics and SK Hynix reach China's AI chip industry. The loophole shows how much Huawei's next-generation processors still depend on foreign memory, while China's domestic suppliers struggle to close the gap.
Beijing has instructed top securities firms and investment banks to pause initial public offerings and restrict large-scale share sales by major shareholders. Reporting by The Wall Street Journal reveals that the China Securities Regulatory Commission (CSRC) issued "window guidance" to slow equity supply and stem a prolonged market sell-off.
Qisda posted October consolidated revenue of NT$19.39 billion (US$590.8 million), up 13.47% year-over-year but down 1.85% from September, as its AI infrastructure, AI solutions, and smart manufacturing, and AI healthcare businesses all recorded double-digit growth from a year earlier.
China's National Integrated Circuit Industry Investment Fund Phase III (Big Fund III) is shifting its focus from targeted semiconductor investments to large-scale manufacturing and industry consolidation, with a CNY900 million (approx. US$134 million) capital injection into Silan Microelectronics' 12-inch analog chip project highlighting its latest priorities.
Samsung Display (SDC) is facing a shortage of automotive OLED panels supplied to Chinese EV maker Li Auto, prompting Li Auto to temporarily ship some new Mega vehicles with LCD panels. Strong vehicle sales have driven demand for high-specification displays beyond expectations, potentially giving SDC's automotive OLED business fresh momentum.
Apple has opened testing of its China-specific Apple Intelligence service with the iOS 27.3 developer beta released on November 4, integrating Alibaba's Qwen model into Siri. The full version is expected in December, as Apple works to close the gap in its generative AI offerings in China.
AI data centers are accelerating demand for high-speed optical communications, extending competition in the optical transceiver market beyond chips and module manufacturing to critical upstream materials. Indium phosphide (InP), a key substrate for high-speed optical lasers and optoelectronic devices, is increasingly sought after as 800G and 1.6T transceivers gain traction. With capacity expansion requiring time and product qualification presenting technical hurdles, securing InP wafer supplies has become a strategic priority for optical communications companies.
South Korean AI software developer Moreh says AMD Instinct MI355X GPUs running its inference software delivered more than twice the throughput of Nvidia B200 GPUs in company tests, as South Korea moves ahead with plans to build AI infrastructure combining AMD processors with locally developed chips.
South Korean cloud services provider Naver Cloud now runs AMD EPYC processors in about 35,000 servers and plans to deploy 144-core fifth-generation EPYC chips in its public cloud services in the second half of 2026. The company turned to AMD after high prices for Intel's higher-core-count processors slowed its server expansion.
The Research Institute for Democracy, Society and Emerging Technology (DSET) released a report on November 4 at the 2026 Taiwan Marine Tech & Unmanned Robotics Expo (MATURE Taiwan), examining Taiwan's unmanned boat industry and international cooperation. Experts from Ukraine and the US urged Taiwan and its allies to connect technology networks and move faster.
Chinese AI developers are losing a key route to advanced US chips, renting them in data centers outside China, as Washington and US companies stretch American controls over compute well beyond US borders. The squeeze falls heavily on Southeast Asian data center operators that built capacity around Chinese demand. Beijing, meanwhile, is pressing its own tech giants to rely less on American hardware.
Samsung Electronics is preparing to build a 2nm- and 4nm-class foundry fab at its Giheung campus in Yongin, South Korea, to expand production of logic base dies used in high-bandwidth memory (HBM). The fab is estimated to cost KRW25 trillion (approx. US$18.6 billion), with the broader project potentially reaching KRW30 trillion if an existing production line is converted into an advanced packaging facility, Seoul Economic Daily reported on November 4.
Mitsubishi UFJ Financial Group's MUFG Bank and Sumitomo Mitsui Financial Group's Sumitomo Mitsui Banking (SMBC) plan to renew a combined JPY600 billion (approx. US$3.8 billion) in credit facilities for Nidec through November 2027, providing financial support as the Japanese electric motor maker works to restore confidence following an accounting scandal, according to Nikkei Asia.
Global memory supply constraints are creating opportunities for Chinese DRAM maker CXMT to expand its market share. As major international manufacturers prioritise high-bandwidth memory (HBM) and advanced DRAM, the tightening supply of mainstream DRAM is allowing CXMT to capitalise on domestic demand and capacity expansion.
Mitsui Chemicals is planning to acquire semiconductor materials maker JSR from state-backed Japan Investment (JIC) in a deal potentially worth more than JPY1.3 trillion (US$8.2 billion), which would rank as the largest acquisition in Japan's chemicals sector, according to reports by Nikkei Asia and Reuters on November 4, 2026.
Corning's move to begin making optical connectivity products in Pune and add a larger adjacent plant by 2027 shows the AI-driven surge in data center fiber demand, so far strongest in the US, starting to reshape the company's manufacturing footprint in India.