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Tuesday 30 June 2026
Samsung commits KRW2,655 trillion to future industries, anchoring new Gwangju fab
Samsung said on June 29 it will invest a combined KRW2,655 trillion (approx. US$1.72 trillion as of June 30, 2026) across its domestic operations, splitting the figure between continued buildout of its existing Pyeongtaek and Yongin semiconductor clusters and a fresh push into Korea's southwestern Honam region, where the bulk of the new money is aimed at memory capacity.
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Tuesday 30 June 2026
Optiemus, Quectel launch India manufacturing tie-up for automotive and connectivity modules
Optiemus Electronics and Quectel have launched a manufacturing partnership in India to localize advanced wireless modules for vehicles, telecom networks, and industrial systems. The tie-up could improve supply chain resilience, accelerate product launches, and expand access to next-generation connectivity across global markets.
Tuesday 30 June 2026
Samsung revives 1.4nm foundry push as 2029 timeline takes shape

Samsung Electronics is moving forward again on its 1.4nm foundry process, but on a slower schedule than originally planned, The Bell reported, citing industry sources.

Tuesday 30 June 2026
SK Hynix accelerates Yongin fab timeline by 12 years as HBM strains memory capacity
SK Hynix said on June 29 it will spend KRW1,100 trillion (approx. US$710 ​billion) across three sites in South Korea over the coming decades, accelerating its Yongin cluster timeline by 12 years as it warned that even faster construction will not be enough to meet projected AI memory demand.
Tuesday 30 June 2026
AI super cycle lifts semiconductors, but China chip group warns of a distorted boom

AI has pushed the global semiconductor industry into a new "super cycle," but the AI boom is also creating distorted demand, tighter capacity, soaring memory prices, and overheated capital spending, according to China Semiconductor Industry Association executive secretary-general Wang Junjie.

Tuesday 30 June 2026
China's third-largest pure-play foundry's HK filing shows growth, but also rising risks

Nexchip Semiconductor has filed for a Hong Kong listing to fund expansion, following rapid revenue growth and a stronger market position. The prospectus highlights its scale in display driver chips and image sensors, while also warning investors about customer concentration, heavy capital needs, and exposure to shifting trade policy.

Tuesday 30 June 2026
South Korea looks to Taiwan as model for semiconductor decentralization
South Korea is overhauling its semiconductor manufacturing footprint to secure an edge in the AI era, drawing direct inspiration from a fierce competitor: Taiwan.
Tuesday 30 June 2026
DRAM price surge tests South Korean memory makers' HBM4 push

Reports in South Korea that SK Hynix is slowing the pace of converting production lines to sixth-generation high-bandwidth memory, or HBM4, and shifting more capacity toward commodity DRAM have drawn market attention.

Tuesday 30 June 2026
Nvidia, Firmus partner on Indonesia AI infrastructure project

A new partnership between Nvidia and Firmus aims to expand access to advanced AI computing for customers worldwide, including AI-native companies, enterprises, and independent software vendors. The deal underscores how demand for large-scale AI infrastructure is reshaping global technology markets, especially in the Asia-Pacific region.

Tuesday 30 June 2026
Riken and Taiwan academia join forces on next-gen compound semiconductors
Japan's world-renowned Riken institute announced in late March 2026 that its homegrown superconducting quantum computer, "Ei-II," jointly developed with the University of Osaka, had officially gone online with 144 qubits and 99.9% fidelity. Taiwan's National Science and Technology Council (NSTC) said Riken will next work with Taiwan's academic community on research, including next-generation compound semiconductors.
Tuesday 30 June 2026
Samsung, SK Hynix step up CO₂ buying as supplies tighten
South Korea's inventories of high-purity carbon dioxide, a critical material used in advanced semiconductor manufacturing, have fallen below normal buffer levels, raising procurement concerns across the chip industry, according to The Elec.
Tuesday 30 June 2026
China's LineShine puts Beijing back on top of supercomputer race

A name largely absent from the global supercomputing stage for years returned to the spotlight at ISC 2026 in Hamburg, Germany.

Tuesday 30 June 2026
China's SiC race shifts from EVs to AI data centers as SICC overtakes Wolfspeed

China's silicon carbide (SiC) supply chain is finding a new growth engine as AI strains data-center power systems, extending a market long driven by electric vehicles.

Tuesday 30 June 2026
Hyundai says one year of output beats Tesla's 10-year sales; manufacturing capacity crucial in physical AI race
Amid the ongoing AI race between the US and China, industry players in South Korea are now focusing on physical AI as a competitive factor, with manufacturing momentum as a core advantage, according to Park Min-woo, head of Hyundai Motor's Advanced Vehicle Platform (AVP) division and CEO of 42dot.
Monday 29 June 2026
China memory makers fuel local chip equipment push as CXMT lands Tencent deal

ChangXin Memory Technologies has signed a long-term DRAM supply agreement with Tencent Holdings valued at more than CNY20 billion (approx. US$2.94 billion), three people with knowledge of the deal told Reuters, as the Hefei-based chipmaker prepares for one of China's largest stock listings in years.

Monday 29 June 2026
Baidu subsidiary Kunlunxin seeks US$50B IPO valuation, asks investors to buy its chips

Kunlunxin, the semiconductor subsidiary of Chinese search engine giant Baidu, is targeting a US$50 billion valuation for its Hong Kong public offering. The company is also asking investors to commit to buying its chips as a condition of participation, according to The Information, underscoring the competitive dynamics shaping chip makers as Beijing moves to strengthen its domestic AI supply chain.