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Thursday 10 September 2026
Analysis: China chases EUV as chipmakers move to High-NA
The extreme ultraviolet (EUV) lithography race is splitting into two tracks. Intel has moved High-NA EUV into production, Samsung Electronics and SK Hynix are targeting DRAM production in 2028, and TSMC plans to introduce the technology into advanced-node high-volume manufacturing in 2030.
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Friday 11 September 2026
AI server tracker: Taiwan's rack supply chain reveals where the AI buildout is accelerating

The three Taiwanese supply chain categories closest to the physical AI rack — thermal, power supply, and rail kits — booked combined August revenue of NT$121.48 billion (US$3.86 billion), according to monthly filings with the Market Observation Post System (MOPS). The growth rates behind it diverge sharply: rail kits rose 191.2% from a year earlier, thermal 58.4%, and power supply 32.5%. The spread maps where rack-scale deployment is binding.

Friday 11 September 2026
Anthropic disrupts Chinese AI firms' attempts to extract Claude capabilities
Anthropic has disrupted a series of operations in which Chinese AI companies allegedly used its Claude models to extract capabilities for their own AI systems, highlighting growing tensions over AI model distillation and data security.
Friday 11 September 2026
Rayzher rides semiconductor fab buildout to record revenue
Rayzher Industrial, a high-tech factory gas supply system solutions provider, reported consolidated revenue of NT$369 million (approx. US$11.7 million) in August 2026, up 83.26% year-over-year and a record monthly high. Cumulative consolidated revenue for the first eight months of 2026 reached NT$1.993 billion, up 27.91% from the same period in 2025 and also a record for the period.
Friday 11 September 2026
China's Shenzhen Kaifa plans CNY1.85 billion expansion for high-end memory packaging and testing
Chinese electronics manufacturer Shenzhen Kaifa Technology, also known as Shenzhen Kaifa or Kaifa, plans to invest CNY1.85 billion (about US$260 million) to expand high-end memory-chip packaging and testing capacity through its wholly owned subsidiary Payton Technology (Shenzhen), according to a company announcement.
Friday 11 September 2026
Samsung 2nm push gains momentum as Synopsys cuts NPU die area by 22%
Synopsys has reported a 22% reduction in die area for a neural processing unit (NPU) implemented with its Fusion Compiler design tool on Samsung Foundry's SF2P process, providing a concrete design-level result as Samsung seeks to turn its 2nm technology into more commercial foundry business.
Friday 11 September 2026
ProLogium deepens partnership with Kyushu Electric Power through strategic investment

ProLogium said Kyushu Electric Power will make a strategic investment as its long-running collaboration expands from industrial cooperation into capital participation. The move signals growing confidence in next-generation battery technologies, with potential implications for energy security, manufacturing supply chains, and electrification efforts in global markets.

Friday 11 September 2026
Global IC substrate market to surge 32% to US$19.5 billion in 2026 as Taiwan, Korea lead ABF, BT
Rising demand for generative AI, high-performance computing (HPC), and data center buildouts is pushing the global IC substrate industry into a new phase marked by upgrades in high-end product specifications, tight supplies of critical materials, and intensifying competition in advanced packaging technologies.
Friday 11 September 2026
Samsung, SK Hynix eye 2028 High-NA DRAM rollout

SK Hynix is targeting 2028 to apply High-NA extreme ultraviolet lithography to DRAM mass production and is considering joining an industry initiative to develop 12-inch photomasks, according to South Korea's fnnews. The company has separately confirmed both plans.

Friday 11 September 2026
Academia Sinica to open 8-inch quantum chip platform in September 2026

Academia Sinica's Quantum Chip Fabrication Space (QC-Fab) in Tainan will open to external users at the end of September 2026, marking a new stage in Taiwan's in-house quantum chip development and manufacturing efforts. After the cleanroom was completed, the institute finished installing process equipment, connecting factory utility lines, testing equipment functions, and training operators.

Friday 11 September 2026
Quantum computer development is more about national security than profits, says expert

Japanese electronics giant NEC stopped development of gate-based superconducting quantum computer hardware at the end of March 2026. According to Japanese media reports, NEC concluded that the commercialization timeline for a physical quantum computer was too long and that hardware investment would be unlikely to deliver commensurate returns. The decision also reportedly prompted quantum R&D researchers to join Fujitsu.

Thursday 10 September 2026
Navigating economies of scale: how South Korea and China are reshaping the OLED market
Economies of scale occur when a company's average cost per unit falls as overall production volume increases. In the competitive display industry, reaching this state relies on either mass production, technological innovation, or specialization. Currently, South Korean and Chinese display manufacturers are pursuing distinct strategies to achieve cost advantages in the OLED market. While South Korea focuses on advanced process integration and technological upgrades, China leverages massive production infrastructure and upcoming facility amortization.
Thursday 10 September 2026
Foxsemicon hits record 2Q26 revenue on Thailand ramp-up
Foxsemicon Integrated Technology (FITI) posted record consolidated revenue of NT$6.3 billion (approx. US$200.0 million) in the second quarter of 2026, up 13.3% quarter-over-quarter and 21.1% year-over-year. The semiconductor equipment maker said second-half operations should outperform the first half as its Thailand plant ramps following a July production increase and product mix improves.
Thursday 10 September 2026
Gem Terminal rides China plug rule shift for 8.8% sales growth
Gem Terminal Industry said its August 2026 consolidated revenue continued to show steady growth, helped by the approaching conversion deadline for China's new insulation requirements for plug pins under GB 1002-2024 and by stronger orders and a broader customer base for its specialty copper materials business.
Thursday 10 September 2026
China's Nvidia rivals raise prices as HBM shortage bites
Chinese chipmakers challenging Nvidia are sharply raising prices for current and next-generation accelerators as high-bandwidth memory (HBM) becomes scarcer and more expensive, adding another cost constraint to China's push for domestic computing hardware.
Thursday 10 September 2026
Enflame to list on Septemper 11 as China's four major domestic GPU makers complete IPOs

Chinese AI chipmaker Enflame will list on the STAR Market of the Shanghai Stock Exchange on September 11, 2026, becoming the last of China's "four little GPU dragons" to go public. Enflame is grouped with Moore Threads, MetaX, and Biren Technology as China's "four little GPU dragons," and with Enflame's listing, all four companies will have entered the capital market.