DIGITIMES Asia news

Thursday 18 September 2025

Huawei charts 6-year Ascend AI chip roadmap, showcasing HBM advances and SuperNode scale

Huawei is pressing ahead with its in-house chip and AI infrastructure strategy despite escalating US–China tech tensions. At Huawei Connect 2025 in Shanghai, deputy and rotating chairman Eric Xu unveiled the company's first detailed Ascend AI chip roadmap in six years, highlighting Huawei's advances in high-performance computing and long-term ambitions in AI infrastructure

Samsung chair inspects OLED plant as Apple competition heats up

Thursday 18 September 2025

BOE loses ground to LGD as Apple reconfigures OLED supply chain

Thursday 18 September 2025

DeepSeek AI conducts undisclosed risk evaluation amid heightened Chinese regulatory scrutiny

Thursday 18 September 2025

From delay to debut: iPhone 17 gets fast-tracked in Indonesia after US trade deal

Thursday 18 September 2025

LATEST STORIES

Friday 19 September 2025

Samsung counters Apple with new Galaxy S25 FE, AI earbuds, and ultra-thin tablet

Samsung Electronics is set to launch its latest suite of consumer tech products on September 19, 2025, headlined by the Galaxy S25 FE, Galaxy Buds3 FE, and the Galaxy Tab S11 series. The release date — just days ahead of Apple's expected iPhone 17 launch — is widely seen by South Korean media as a strategic move to compete head-to-head with its US rival

Friday 19 September 2025

A trio of factors tips Shibaura to Yageo in takeover fight

After months of back-and-forth in the takeover battle for Japanese negative temperature coefficient (NTC) thermistor manufacturer Shibaura Electronics, Taiwanese passive component giant Yageo has emerged on top. Yageo has secured Shibaura Electronics' full support for the acquisition by offering a higher bid than competitor MinebeaMitsumi

Friday 19 September 2025

Japan and EU deepen battery cooperation to counter geopolitical risks

Japan and European countries are strengthening their collaboration to mitigate geopolitical tensions and supply chain vulnerabilities stemming from tensions between the US and China. On September 15, 2024, Japan's Ministry of Economy, Trade and Industry (METI) announced expanded cooperation with the European Union (EU), particularly focusing on the battery supply chain, as reported by Yomiuri Shimbun and Nikkei Asia. This move is part of broader partnerships aimed at advancing technology industries, green energy, and satellite sectors

Friday 19 September 2025

Samsung, Wolfspeed escalate silicon carbide race as EV and AI demand climbs

Samsung Electronics is accelerating its research into silicon carbide (SiC), a next-generation power semiconductor material, as competition heats up across the industry

Friday 19 September 2025

Energy warning for Korea's semiconductor cluster: grid, LNG plans clash with net-zero goals

The Yongin Semiconductor Cluster in South Korea, which is anchored by Samsung Electronics and SK Hynix, is currently under development. However, experts caution that there are unresolved power grid issues, mainly due to the massive energy demands of the cluster. Additionally, the current energy supply plan may conflict with the national goals for carbon neutrality

Friday 19 September 2025

SK Hynix's KRW100 million bonus lures Samsung talent

As SK Hynix kicks off its second-half 2025 recruitment drive with a generous bonus package, the move has generated significant buzz among Samsung Electronics employees, especially those with shorter tenures. Some are now openly weighing the prospect of jumping ship

Friday 19 September 2025

Xpeng starts Austria EV production with Magna Steyr to bypass EU tariffs

Chinese electric vehicle maker Xpeng has begun European production in partnership with Magna Steyr, using the Austrian contract manufacturer's Graz plant to assemble its G6 and G9 models. The collaboration marks a pivotal step in Xpeng's push to localize operations, bypass trade barriers, and establish a lasting presence in the European market

Friday 19 September 2025

Huawei's Ascend chips to surpass Nvidia's China-only GPUs with up to 8 PFLOPS, 14.4TB/s bandwidth

US export controls have capped the performance of Nvidia's "China-only" GPUs, opening the door for domestic chipmakers to compete. Huawei's Ascend roadmap, announced at its 2025 Connect Summit, is widely seen as a direct challenge to Nvidia's restricted offerings in China

Friday 19 September 2025

China's skyward ambitions face reality check after XPeng eVTOL crash

A dramatic accident unfolded during a rehearsal for the Changchun Air Show this week, when two XPeng AeroHT manned electric vertical takeoff and landing (eVTOL) aircraft collided midair while performing a formation flight. One of the aircraft crashed and caught fire upon landing, sending thick black smoke billowing across the runway

Friday 19 September 2025

Huawei Ascend 950 to feature in-house HBM in 2026, advancing China's AI memory independence

Huawei unveiled its next-generation Ascend AI chip roadmap at the 2025 Connect summit, highlighting a milestone for China's semiconductor ambitions. Starting in early 2026, the Ascend 950 PR will integrate Huawei's self-developed high-bandwidth memory (HBM), marking a pivotal advance in the country's drive for independence in AI chip memory systems

Friday 19 September 2025

Alibaba's T-Head AI chip rivals Nvidia H20, wins major China Unicom data center deal

Alibaba's chip design arm T-Head has introduced its latest AI accelerator, the PPU, positioning it as a rival to Nvidia's China-only H20 GPU. The processor has already been rolled out in volume at China Unicom's Sanjiangyuan Big Data Base in Qinghai, representing one of the country's largest deployments of homegrown AI chips

Friday 19 September 2025

Domestic AI chips forecast to capture over half of China's market by 2027

Once confined to gaming arcades, GPUs have transformed into the lifeblood of the AI revolution. Nvidia, the undisputed industry titan, wields what many call the "golden shovel" in the global artificial intelligence gold rush

Friday 19 September 2025

Samsung and SK Hynix set stage for global battle over HBM4 chips

SK Hynix has announced it is the first in the world to establish a mass production system for sixth-generation High Bandwidth Memory (HBM4), signaling the start of a new technological arms race in next-generation memory chips

Thursday 18 September 2025

XPeng taps Magna for European production as EU tariffs bite

As the European Union imposes steep anti-subsidy tariffs on Chinese-made battery electric vehicles (BEVs), a new mode of cross-border cooperation is quietly reshaping the continent's automotive landscape

Thursday 18 September 2025

RaaS model key to turning around South Korea's robot industry losses

Despite rising labor costs and challenges from a declining birthrate and aging society, South Korea's robotics market has failed to meet high demand expectations. Many robotics companies are facing revenue declines and increasing losses in the first half of 2025. According to South Korean startup BigWave Robotics, the robot as a service (RaaS) business model will be the solution to address insufficient robot demand and navigate the emerging humanoid robot era

1/59 pages

Meet ADLINK's cExpress-R8: The compact solution to demanding and diverse industrial workloads

MOST-READ
7 DAYS NEWS

Full list