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Thursday 3 July 2025
US unleashes Section 232 tariffs, global trade talks in disarray
With the July 9, 2025, deadline for new tariffs fast approaching, trade talks between the US and key partners like Japan, India, and France are showing signs of strain. At the heart of the deadlock lies Washington's increasingly aggressive use of Section 232 tariffs, a tool with far greater bite than traditional reciprocal duties
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Thursday 3 July 2025
Samsung completes development of 1c DRAM, paving way for HBM4 rollout

Samsung Electronics has successfully developed its sixth-generation DRAM, known as 1c DRAM, built using a 10nm class process. The product has received internal Production Readiness Approval (PRA), signaling it has met key quality and performance benchmarks and is now in the final phase before mass production. The milestone brings Samsung one step closer to its goal of mass-producing HBM4, or fourth-generation high-bandwidth memory, in the second half of 2025

Thursday 3 July 2025
China rare earth curbs put US in chokehold

Rare earth elements—critical to electric vehicles, defense systems, and advanced electronics—are once again at the center of geopolitical tensions. China, which controls more than 90 percent of the world's rare earth refining and processing capacity, continues to wield outsized influence over global supply

Thursday 3 July 2025
Radiant merges three companies in two years to fuel meta-optics expansion
Radiant Opto-Electronics, a major manufacturer of backlight modules, acquired Finnish optics company Nanocomp in August 2023. Just over a year later, in September 2024, Radiant fully acquired Danish meta-optics firm NIL Technology ApS (NILT)
Thursday 3 July 2025
Foxconn's recall of hundreds of Chinese staff from India iPhone plant siren concerns over Apple's South Asia strategy
Foxconn has instructed hundreds of Chinese engineers and technicians at its iPhone assembly plant in southern India to return to China, according to a Bloomberg report. Sources familiar with the matter said most Chinese employees were notified over the past two months, and more than 300 have already left. Only a limited number of Taiwanese support personnel remain on site
Thursday 3 July 2025
Wolfspeed bankruptcy no surprise as product development lags Chinese rivals
US-based silicon carbide (SiC) giant Wolfspeed officially filed for bankruptcy this week following a series of rumors, initiating restructuring proceedings. Industry players in power semiconductors and wide bandgap semiconductors largely view this outcome as unsurprising
Thursday 3 July 2025
Samsung to restart P5 fab construction after two years as AI semiconductor grows
After a two-year hiatus, Samsung Electronics is reportedly set to resume construction of its advanced semiconductor production facility, the P5 fab, located in Pyeongtaek. With continuous improvements in high-bandwidth memory (HBM) and next-generation DRAM technologies, alongside strong market growth expectations for AI semiconductors over the coming years, Samsung is preparing to launch a new round of equipment investment in South Korea
Thursday 3 July 2025
Chips for rare earths: An uneven US-China trade gambit
Since the onset of the US-China tech war, both sides have engaged in multifaceted struggles over strategic industries such as semiconductors, AI, and critical resources
Thursday 3 July 2025
China's EV leaders switch gears from horsepower to chip power
As global automakers advance deeper into electrification and intelligent mobility, China's top EV brands—BYD, Nio, and Xiaomi—are fast-tracking the development of self-designed chips. The push reflects a broader transition from dependence on foreign semiconductor suppliers to fully integrated hardware-software platforms, with significant implications for the global EV value chain
Thursday 3 July 2025
Trump Vietnam trade deal hits Chinese transshipment with higher tariff
US President Donald Trump announced a sweeping trade deal with Vietnam, proposing tariffs on Vietnamese and transshipped goods while securing zero-tariff access for American products, especially SUVs, in Vietnam, pending confirmation from the White House and Hanoi
Thursday 3 July 2025
Nio spins off chip division with new 5nm auto SoC under volume production
China's first-tier electric vehicle (EV) manufacturer Nio has taken a significant step forward in its chip self-sufficiency strategy, announcing that its chip division has officially spun off from the parent company to form a new entity, Anhui Shenji Technology. The spin-off has completed mass production and large-scale vehicle integration of its first self-developed automotive-grade 5nm smart driving chip, the Shenji NX9031, marking a new phase from chip development to commercial application
Thursday 3 July 2025
ByteDance expands AI hiring spree into humanoid robotics
ByteDance is recruiting heavily for humanoid robot development as the TikTok parent accelerates its push beyond social media into cutting-edge artificial intelligence (AI) applications
Thursday 3 July 2025
D-Link locks in 50,000-unit Wi-Fi 6 deal in India's enterprise market

Taiwanese networking firm D-Link Corporation has landed a significant Wi-Fi 6 enterprise access point (EAP) order in India, securing a contract for 50,000 units slated for shipment beginning in July 2025. The deal highlights D-Link's growing foothold in India's rapidly expanding enterprise networking market and reflects the success of its long-term investment in the region

Thursday 3 July 2025
AMD to boost India headcount beyond 10,000, calls for GPU openness for AI infrastructure
AMD is significantly expanding its footprint in India, with plans to increase its employee base to over 10,000 within the next two to three years. This move reflects the company's confidence in the country's engineering talent and its supportive environment for semiconductor and artificial intelligence (AI) development
Thursday 3 July 2025
Problematic IVI systems draw most complaints from car owners
In-vehicle infotainment (IVI) systems are a key feature of smart cockpits and the driving technology experience, but their high failure rates and quality issues have become a major problem for car manufacturers
Wednesday 2 July 2025
Towa expands South Korea presence as AI spurs demand for HBM packaging tools
Japanese semiconductor equipment maker Towa Corporation, a global leader in advanced packaging systems, recently unveiled its newest technology for sixth-generation HBM4, aiming squarely at the surging demand from generative AI and high-performance computing markets
Research Report Database
Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES