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Tuesday 8 September 2026
CIOE 2026 opens in Shenzhen: 5,000 exhibitors chase the AI-driven optics boom
The 27th China International Optoelectronic Exposition (CIOE 2026) will run September 9-11 in Shenzhen, bringing together more than 5,000 exhibitors from over 30 countries and regions as AI infrastructure, high-speed optical communications and AR/VR applications reshape the optoelectronics industry.
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Wednesday 9 September 2026
Sysgration expands Taiwan, US drone manufacturing as procurement plans advance
Sysgration said in August 2026 that rising demand for artificial intelligence, industrial PCs, and drone systems continued to expand its operating scale, while Taiwan's government moved closer to large-scale drone procurement. The company said the policy push is shifting into budget and purchasing stages, positioning 2026 as a key year for domestic drone buying in Taiwan.
Wednesday 9 September 2026
Thailand pauses 49 data center projects
Thailand has suspended construction on 49 data center projects while stressing that it is not trying to "close the door" to investment. The move comes as the government works to draft a regulatory framework amid public concern over energy use and environmental impacts, Bloomberg reported.
Wednesday 9 September 2026
Axcelis to build new Korea manufacturing site in US$35 million expansion
Axcelis Technologies plans to invest US$35 million in a new semiconductor equipment manufacturing facility in Pyeongtaek, South Korea, a move that could help strengthen global chip supply chains. The project underscores how leading suppliers are expanding production capacity to meet rising demand from manufacturers worldwide.
Wednesday 9 September 2026
Huawei orchestrates China's DUV lithography push to cut reliance on ASML
Huawei is emerging as a central organiser of China's effort to build a domestic semiconductor equipment supply chain, backing critical lithography suppliers and helping connect them with major chipmakers including SMIC.
Wednesday 9 September 2026
Commentary: Huawei's Kirin comeback, Xiaomi's Xring entry widen China's chipmaking race
In September 2020, Huawei's smartphone business suffered a severe blow.
Wednesday 9 September 2026
LG Innotek tackles glass substrate microcrack issue as 2028 production race heats up

LG Innotek is applying internally developed artificial intelligence to semiconductor glass substrate manufacturing, targeting microcracks, one of the technology's toughest yield challenges. The move comes as industry forecasts and supplier roadmaps increasingly point to around 2028 as an early window for initial glass-core substrate production.

Wednesday 9 September 2026
Huawei Qiankun turns 2 million cars into its next assisted-driving advantage

Huawei's automotive technology business has crossed a new scale threshold, with both Huawei Qiankun Intelligent Driving and HarmonySpace surpassing 2 million installations, while the Huawei Qiankun app has also reached 2 million users.

Wednesday 9 September 2026
SEMIFIVE begins HyperAccel chip production on Samsung 4nm as capacity tightens
SEMIFIVE has begun mass production of HyperAccel's data center inference accelerator using Samsung Foundry's 4nm process, marking the Korean custom-silicon company's first large-scale production program on the node as Samsung's Pyeongtaek SF4 line remains at full utilization.
Wednesday 9 September 2026
India's HCLTech opens semiconductor lab in Bengaluru to serve global chip supply chains
HCLTech has opened a new semiconductor laboratory in Bengaluru, a move that could matter for chipmakers and device makers worldwide as they look for faster testing, qualification, and failure analysis. The facility is designed to shorten development cycles, support production quality, and strengthen India's role in the global semiconductor ecosystem.
Wednesday 9 September 2026
China's AI computing plan targets sixfold growth, 100,000-card clusters
China is accelerating the large-scale deployment of AI computing infrastructure. On September 7, the Ministry of Industry and Information Technology (MIIT) released its 15th Five-Year Plan for the information and communications industry, setting out CNY3.8 trillion (US$566.3 billion) in cumulative information infrastructure investment from 2026 to 2030.
Wednesday 9 September 2026
Exclusive Interview: WG Tech sees a faster route for TGV beyond displays

WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV) substrates for optical communications and advanced packaging as AI demand expands.

Wednesday 9 September 2026
US security agencies tell AI firms to degrade answers to suspected Chinese distillation traffic in secret
The NSA, CISA, and the FBI are asking American frontier AI developers to treat model outputs themselves as an exfiltration surface, in a joint Cybersecurity Advisory that names six China-based AI companies as running what the agencies call industrial-scale knowledge distillation campaigns against US models. The most operationally striking recommendation is not a block or a ban: the agencies want providers to subtly alter responses to high-confidence malicious distillation requests, without telling the user.
Wednesday 9 September 2026
Mature-node chip scramble may persist through 2028 as supply chain management becomes bargaining leverage
Capacity for advanced semiconductor processes and packaging remains tight, while mature-node chips required for AI-related peripheral applications are also facing mounting supply pressure. IC design houses and semiconductor industry sources generally expect the current capacity constraints to last longer than the chip supply crunch that followed the COVID-19 pandemic.
Wednesday 9 September 2026
Chinese automakers face globalization test in overseas push
China's auto industry has moved from capacity expansion and price competition into a final round of competition, as the decisive factor shifts to how each brand performs overseas. The reason is simple: overseas markets offer more rational margins, making the global expansion of Chinese brands increasingly important.
Wednesday 9 September 2026
China GPU developer Biren expands AI chip R&D into optical interconnects, advanced cooling
Chinese GPU developer Biren Technology has teamed up with Shanghai University to establish an Integrated Circuit Intelligent Chip Joint Laboratory, expanding their cooperation into joint research on AI-chip optical interconnects and advanced thermal management.