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Wednesday 11 November 2026
SK Hynix taps Nvidia to speed up memory chip simulations
SK Hynix is using Nvidia's AI technology and GPU acceleration to speed up memory chip simulations, with improvements in etching-process development and tests of thermal and elastic deformation analysis...
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Thursday 12 November 2026
Sharp sells LCD color filter plant to Nitto Denko for JPY22.2B
Sharp is accelerating efforts to address its loss-making display component business. According to Nikkei, Sharp will sell its Hisai plant in Tsu, Mie Prefecture, Japan, which produces color filters for LCD panels, to Nitto Denko. Sharp officially announced the sale on the morning of November 12. The transaction is valued at JPY22.2 billion (approximately US$139 million) and is expected to close on December 24.
Thursday 12 November 2026
Sam Altman warns Samsung of short-term AI demand volatility
OpenAI CEO Sam Altman warned Samsung Electronics executives that AI memory demand could fluctuate in the short term, with the market potentially counting the same demand more than once. He nevertheless expects long-term AI demand to surge, creating shortages of chips and data centers and underscoring the need for greater supply chain investment.
Thursday 12 November 2026
Chinese media question timing of Huang allegations amid chip controls
With Chinese and US leaders expected to meet on October 18 during the APEC Economic Leaders' Meeting, allegations involving Nvidia CEO Jensen Huang's extramarital affair and supposed links to Chinese espionage continue to escalate. China's state-run Global Times questioned whether the closely timed media reports and congressional actions reflect political maneuvering behind US technology policy toward China.
Thursday 12 November 2026
Chinese models capture 89% of US corporate spending in open-source AI
Chinese AI models have taken a dominant position as demand for open-source models grows among US businesses. According to the "2026: The State of Enterprise AI" report released in early November by US venture capital firm Menlo Ventures, Chinese models accounted for 89% of US corporate spending on open-source AI models.
Thursday 12 November 2026
Huawei's new OSTA smartphone brand targets wider displays, AI features ahead of November 20 debut
Huawei is preparing to introduce a new smartphone sub-brand, OSTA, at a product launch event on November 20, potentially expanding its portfolio with a wider-format candybar smartphone featuring AI capabilities.
Thursday 12 November 2026
Toyota to assemble and sell Japanese light-duty trucks in the US, with sales starting in 2H27
Japanese automaker Toyota has announced plans to revive the Scion brand, which was discontinued nearly a decade ago, with the launch of its first model, the KEI-01, in the second half of 2027. The light-duty truck (kei truck) will be assembled in Indiana and sold in the US market, targeting short-distance transportation needs at farms, ranches, small businesses, and corporate campuses. Based on Daihatsu Motor's Hijet Jumbo light commercial mini pickup truck, the KEI-01 will be Toyota's first kei truck manufactured in the US.
Thursday 12 November 2026
Intel China wants to turn untapped renewable energy into AI tokens with computing pods slated for 1H27
As demand for AI computing expands across industries and applications, chipmakers are seeking opportunities beyond conventional data centers, extending into enterprise deployments and personal devices. At the ninth China International Import Expo (CIIE) in 2026, Intel China showcased three AI computing solutions: green computing pods for large data centers and enterprise campuses, integrated AI inference systems for small and medium-sized enterprises (SMEs), and AI Agent PCs for individual users.
Thursday 12 November 2026
South Korea’s HBM demand drives 54% surge in Taiwan glass fiber exports
Taiwan’s glass fiber exports to South Korea rose 54.0% year-over-year in the first nine months of 2026 as demand for high-bandwidth memory (HBM) and advanced packaging expanded. South Korea has also become Taiwan’s largest trade deficit partner, with Taiwan’s deficit reaching US$59.37 billion in the first 10 months of 2026, more than double its US$25.39 billion deficit with Japan.
Thursday 12 November 2026
Mitsubishi Gas Chemical bets on AI packaging with Thailand BT materials line
Mitsubishi Gas Chemical (MGC) announced on November 10 that it will expand manufacturing and shipment-inspection equipment at its Thailand subsidiary to increase capacity for BT (Bismaleimide-Triazine) laminates used in semiconductor packaging. The new line is scheduled to begin construction in April 2027 and start operations in October 2028, targeting growing demand from data centers, servers and high-density IC substrates.
Thursday 12 November 2026
The China chip self-sufficiency paradox: YMTC eyes 2027 IPO as restricted Nvidia GPUs reach Chinese universities
China is advancing its domestic semiconductor ambitions while continuing to access restricted US AI processors, exposing the limits of Washington's export controls and the challenges facing Beijing's pursuit of technological self-sufficiency.
Thursday 12 November 2026
Samsung Display, BOE weigh low-cost OLED panels as phone sales fall
Samsung Display, BOE Technology Group and Tianma Microelectronics are considering cheaper OLED panels for budget smartphones to boost factory utilization as handset sales decline, ZDNet Korea reported on November 9, citing industry sources.
Thursday 12 November 2026
Apple, Samsung reportedly developing new foldable glass for 2028
Apple and Samsung Electronics are working with suppliers on foldable phone glass that is thinner at the hinge and thicker elsewhere, a design they are considering for 2028 models, ZDNet Korea reported, citing industry sources.
Thursday 12 November 2026
TECO pivots to AI infrastructure services with Japan project
TECO Electric & Machinery is expanding into global AI computing infrastructure, announcing on the November 11 that it will partner with AI cloud service provider GMI Cloud and KSDI to build an modular AI data center in Satsumasendai, Kagoshima Prefecture, Japan. TECO will serve as the modular data center contractor, handling design, electromechanical systems integration, and technical guidance, with the first 6.4MW phase scheduled for delivery within nine months.
Thursday 12 November 2026
ABF substrate shortage to last through 2028 as Wah Lee targets next-gen products
Demand for AI, high-performance computing (HPC), and semiconductors continued to rise, driving Wah Lee Industrial's 3Q26 profit to record-high levels. Gross profit reached NT$2.06 billion (US$62.7 million), up 28.7% year-on-year, while earnings per share (EPS) reached NT$3.46; cumulative EPS for the first three quarters rose to NT$9.4, also a record for the period.
Thursday 12 November 2026
Samsung, AMD team up to upgrade chip testing
Samsung Electronics and AMD are teaming up to upgrade the Korean chipmaker's semiconductor manufacturing test infrastructure, combining AMD's new EPYC Embedded 9006 processors with Samsung memory and storage technologies, according to AMD's November 10 announcement.