In aerodynamics, the Aito M9 underwent more than 100 engineering refinements, achieving a drag coefficient of just 0.249 Cd — among the lowest ever recorded for a full-size sport utility vehicle
The Trump administration is in talks to provide funding to several US drone companies, in a move that would mark a stronger federal push to expand domestic drone manufacturing and reduce the cost of battlefield systems that have become central to modern warfare
LinkerBot, a leading Chinese developer of robotic dexterous hands, has acquired Jingling Zhikang in a strategic move that could push AI-powered bionic hands from high-cost rehabilitation devices into a broader assistive technology market
Xpeng Motors, often described as "China's Tesla," is advancing on two very different international fronts — cautious and measured in South Korea, but increasingly strategic in Europe — while competing Chinese EV peers such as Zeekr accelerate their own overseas expansion
India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel's first significant participation in India's semiconductor manufacturing ecosystem beyond its existing design and technology operations
Samsung Electronics has overtaken Micron Technology to become the world's largest supplier of automotive memory chips for the first time, according to new S&P Global Mobility data, marking a shift in a market long led by the US memory maker
Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential
C2i Semiconductors has advanced its power management technology with the tape-out of a chip designed for AI infrastructure, while also securing fresh venture backing to expand development and scale production. The developments underscore growing investor interest in addressing power delivery bottlenecks in data centers, driven by accelerating AI workloads
Nvidia's expanding recruitment activity in Vietnam signals a potential shift in the country's role within advanced AI infrastructure manufacturing, as Taiwanese server and EMS players continue to scale up production capacity in the region. The developments underscore Vietnam's growing importance in the global reconfiguration of AI hardware supply chains, particularly for high-end data-center systems and GPU-based servers
Oppstar Bhd has restructured the delivery framework of an artificial intelligence chip development project with a Yokohama-based client, replacing an earlier tripartite arrangement with separate design services agreements and formalizing a US$2.9 million contract for its engineering scope, according to The Edge Malaysia
Anthropic is expanding its leadership and operational presence in India as it scales adoption of its Claude AI models across startups and enterprises, appointing senior executives to lead growth, partnerships, and digital-native customer engagement in one of its fastest-growing markets
Chinese CMOS image sensor supplier SmartSens Technology announced on May 26 that it has entered into a strategic partnership with Chinese IC design company Unisoc to jointly develop Micro LED-based high-speed optical interconnect technology, targeting applications in AI computing clusters, smart vehicles, and industrial vision
As Moore's Law nears its limits, Huawei is promoting its "Tau (τ) Law" as a post-Moore chip framework that shifts the focus from nanometer process nodes to shorter signal transmission times across electronic systems
ChangXin Memory Technologies (CXMT), China's top DRAM maker, has been cleared by China's securities regulator for its highly anticipated IPO, which could raise funds worth CNY29.5 billion (approx. US$4.4 billion) for the company. The Shanghai Stock Exchange said on May 27 that it had cleared a listing review for its STAR Board
Solidigm, the enterprise storage brand under SK Hynix, announced a leadership reshuffle this spring, naming two executives as co-chief executive officers to divide responsibilities between global operations and commercial growth. One co-CEO was appointed in March 2026, and the other took office on May 1, with leadership stating the change aims to accelerate product execution and business performance amid rising demand for storage driven by artificial intelligence
