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Wednesday 3 June 2026
Micron's HBM4 push signals bigger Nvidia supply role
Micron Technology may supply more HBM4 memory for Nvidia's next-generation Vera Rubin platform than the market currently expects, as the US memory maker ramps up equipment investment for the new technology, according to sources in South Korea's memory equipment industry
Wednesday 3 June 2026
SK Group weighs pausing SK Siltron sale as AI chip demand lifts wafer strategy
SK Group is reportedly placing AI and semiconductors at the center of its next round of business restructuring, prompting a fresh internal review of the strategic value of SK Siltron, a major global silicon wafer maker. The planned sale of SK Siltron, once seen as a move to improve SK Group's financial structure, now faces uncertainty as the group reconsiders whether to push ahead with the deal
Wednesday 3 June 2026
NAND market hits record as YMTC closes in on global rivals
The global NAND flash memory market reached a record US$46 billion in revenue in the first quarter of 2026, driven by AI infrastructure demand, higher enterprise SSD shipments, and rising NAND prices, according to Counterpoint Research
Wednesday 3 June 2026
Indian states pitch for Taiwan's electronics exodus during COMPUTEX
Five of India's most industrialized states sent high-level officials to pitch their regions as the next anchors for global electronics and AI supply chains this week at the 2026 Taiwan–India Investment Partnership Forum
Wednesday 3 June 2026
Naura pushes into AI chip packaging with first 600mm PLP descum tool
Naura Technology Group has shipped its first 600mm × 600mm panel-level packaging descum tool, marking a key step in the Chinese semiconductor equipment maker's move from wafer-level packaging into panel-level packaging, according to ICviews and ICsmart
Wednesday 3 June 2026
BYD is building its own chips and looking abroad to make them

China's electric vehicle (EV) makers are increasingly designing their own artificial-intelligence (AI) chips. Manufacturing them, however, remains a more complicated challenge

Wednesday 3 June 2026
Samsung Foundry eyes Anthropic as OpenAI chip project reportedly stalls

Samsung Electronics is seeking to secure major artificial intelligence (AI) logic-chip customers as its reported preliminary work on a custom SoC for OpenAI slows, while Anthropic emerges as another potential opportunity for Samsung Foundry

Wednesday 3 June 2026
Commentary: China shifts exports toward higher-value tech as US trade pressure reshapes supply chains
China moved toward higher-value exports in response to escalating US trade and technology restrictions, reshaping global supply chains and forcing manufacturers to absorb higher costs, executives and research findings showed. The shift, visible in early 2026 trade patterns, came after rounds of US containment measures that began with 2018 tariffs and intensified following the 2025 policy expansion, according to a report commissioned by the Mainland Affairs Council
Tuesday 2 June 2026
EVE Energy ends six-year partnership with SK On
A six-year battery partnership that once symbolized cross-border cooperation between China and South Korea is coming to an end, reflecting broader shifts in the global energy industry
Tuesday 2 June 2026
Analysis: With Xuanji A3, BYD bets on integration over specifications
At a recent product launch, BYD Chairman and President Wang Chuanfu unveiled the company's first in-house autonomous driving system-on-chip, the Xuanji A3, marking a significant milestone in BYD's push toward greater technological self-sufficiency
Tuesday 2 June 2026
SK Hynix reportedly preparing Dalian fab for 200-layer FG NAND to capture AI storage demand
SK Hynix is reportedly preparing to mass-produce a new generation of 200-layer-class NAND flash memory based on floating-gate (FG) architecture at its Dalian Phase 2 facility in China, as the company seeks to strengthen its position in the fast-growing enterprise SSD (eSSD) market for AI data centers
Tuesday 2 June 2026
GCS Shenzhen connects Chinese brands with global markets
Global Connect Show Shenzhen 2026 (GCS SZ 2026) was successfully held on June 1 in Shenzhen, China's innovation hub. Under the theme "Where Global Innovation Meets Market Opportunity," the event brought together more than 80 mainstream technology editors, key opinion leaders (KOLs), channel partners, and business associations from North America, the UK, Europe, and Southeast Asia, alongside over 100 Chinese enterprises expanding into international markets
Tuesday 2 June 2026
China's underwhelming holiday season shows memory hikes still weigh on consumer demand
After sharp swings in the memory spot market in April and May 2026, the industry's tight supply-demand balance has not changed. Spot prices through the end of May have recovered modestly from April, while the third-quarter memory contract price increase is expected to slow from a high base but remain firmly on an upward trend, with quarterly gains likely to stay in the double-digit 10-20% range
Tuesday 2 June 2026
China bars AI as official reason for layoffs, pushing firms to hide cuts and retrain staff
China moved in late 2025 to prohibit companies from citing AI adoption as a reason for layoffs, directing employers to justify any workforce reductions as unrelated to AI, executives said. The policy followed meetings between senior officials and major employers to assess AI's impact on jobs and aimed to avoid social instability as firms accelerate AI deployment
Tuesday 2 June 2026
Naver launches defense AI unit to pursue military data and decision-making market
South Korean internet giant Naver said it has formed a dedicated defense AI organization to pursue military AI transformation, deploy field engineers to client sites, and develop defense-specific AI capabilities. The move was disclosed by South Korean media outlets Seoul Economic Daily and Maeil Business Newspaper, which reported that Naver Cloud has established a "Defense AX Special Task Force" to commercialize AI services for defense customers