CONNECT WITH US
Tuesday 5 May 2026
Analysis: How China’s HJT curb accelerates domestic consolidation and redefines solar competition
China is reportedly planning targeted export rules for heterojunction (HJT) solar equipment. The move has sparked broad industry debate in 2026, as energy transition and aerospace development grow increasingly intertwined. More than a trade measure, it reflects a cross-domain effort to protect technological sovereignty and keep core R&D value within China
Tuesday 5 May 2026
Samsung reportedly eyes SiC foundry reboot, targets 2028 mass production
Samsung Electronics is reportedly restarting its silicon carbide (SiC) wafer foundry business, aiming to tap into the fast-growing next-generation power semiconductor market, reinforce its market position, and improve utilization rates at its existing 8-inch foundry lines. Industry estimates suggest Samsung could enter mass production of SiC chips by 2028
Tuesday 5 May 2026
Malaysia becomes AI data center hub, attracts Chinese cloud giants and Nvidia AI chips

As power constraints and tighter policy controls in Singapore limit expansion, Malaysia is rapidly emerging as Southeast Asia's most important data center hub. A DIGITIMES research report finds that Chinese cloud service providers (CSPs), including ByteDance and Alibaba, are accelerating their shift southward, using Malaysia's unique supply chain pathways to deploy high-end AI computing power locally, including Nvidia's B200 systems

Tuesday 5 May 2026
SK Hynix disputes report on M15X memory investment shift

SK Hynix disputed reports that it is considering shifting DRAM investment at its new M15X memory production base in Cheongju, South Korea, from fifth-generation 10nm-class, or 1b, DRAM toward sixth-generation 10nm-class, or 1c, DRAM

Tuesday 5 May 2026
Kioxia, SanDisk to unveil 3D flash architecture targeting 1,000-layer milestone
Kioxia and SanDisk are set to present a new 3D flash memory architecture aimed at extending NAND scaling beyond 1,000 stacked layers, as memory makers seek ways to overcome the physical and electrical limits of conventional layer increases
Monday 4 May 2026
ADT lands US AI chip deal using Samsung 4nm
ADTechnology said it has signed a KRW40 billion (US$27.1 million) turnkey contract with a US-based AI fabless company to develop and supply HPC SoC chiplets for AI data-center applications using Samsung Foundry's 4nm process
Monday 4 May 2026
Samsung strike exposes AI-era pay divide, raises HBM supply risks

A looming strike at Samsung Electronics is exposing deeper fractures than a typical labor dispute, with widening pay gaps, divisional tensions, and a controversial bonus structure converging into a broader test of how AI-era profits are distributed inside one of the world's most critical semiconductor suppliers

Monday 4 May 2026
DIGITIMES Chair: South Korea's 260,000 GPU plan relies heavily on Taiwanese production, highlights need for collaboration in AI era
As global demand for AI infrastructure accelerates, the collaboration between Taiwan and South Korea—the core pillars of the global semiconductor supply chain—is critical to winning the new tech race. Colley Hwang, chairman of DIGITIMES and IC Broadcasting, said South Korea's plan to deploy 260,000 Nvidia GPUs remains heavily reliant on Taiwan's manufacturing capabilities
Monday 4 May 2026
AI's 1.6T shift turns InP into optical supply chain bottleneck

The transition from 800G to 1.6T optical modules is no longer an upgrade cycle — it is a physics-driven inflection point

Monday 4 May 2026
Samsung reshuffles TV leadership amid Chinese rivalry and service pivot
Samsung Electronics has replaced the head of its Visual Display (VD) business in a rare mid-cycle reshuffle, responding to weakening demand and intensifying global competition in the television market
Monday 4 May 2026
Samsung pulls ahead of SK Hynix as commodity DRAM prices surge

Samsung Electronics and SK Hynix are both riding a historic memory upcycle, but a profit gap of about KRW15 trillion (approx. US$10 billion) has opened between the two Korean chipmakers, driven largely by commodity DRAM rather than high-bandwidth memory (HBM), according to Sedaily

Monday 4 May 2026
Tata Electronics' rumored workforce expansion to 75,000 underscores rapid rise in Apple's supply chain
Tata Electronics has rapidly expanded its electronics manufacturing operations, emerging as one of Apple's most important contract manufacturers in India as the country strengthens its position in global electronics production
Monday 4 May 2026
China curbs memory speculation; DDR4 spot slides, contract prices surge

Spot memory prices surged in early 2026, triggering stockpiling and speculative buying across distribution channels, before reversing from a March peak. DDR4 DRAM spot prices have since corrected by more than 20% quarter-over-quarter, yet lower prices have failed to revive demand. With holidays approaching, buyers remain on the sidelines, while contract memory prices continue to climb

Monday 4 May 2026
L&T Semiconductor Technologies joins imec automotive chiplet program, aiming to shape global vehicle electronics
Larsen & Toubro's semiconductor unit, L&T Semiconductor Technologies, has joined imec's Automotive chiplet Program. The participation is expected to drive collaboration on packaging, die-to-die links, diagnostics, and lifecycle management, and to help shape standards for next-generation software-defined, energy-efficient vehicles worldwide
Monday 4 May 2026
China's auto sector pushes standards and exports while disposable-car concept gains traction
The 2026 Beijing Auto Show signaled a significant shift in China's new energy vehicle sector as automakers accelerated adoption of ultra-fast charging, intelligent powertrains, and embodied AI as standard features, and promoted faster moves toward higher-level autonomous driving, according to a J.P. Morgan research note and supply-chain sources. The show, held in Beijing in 2026, highlighted how scale, speed, and globalization have become central to domestic strategy and are shaping product, sales, and export priorities