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Wednesday 19 February 2025
Samsung semiconductor chief reportedly meets with Nvidia CEO as HBM3E race heats up
Samsung Electronics' semiconductor head Young-Hyun Jun reportedly met with Nvidia CEO Jensen Huang in the US, fueling speculation that Samsung is advancing its bid to supply HBM3E memory. Industry sources suggest the visit signals that Samsung's 8-layer HBM3E could soon pass Nvidia's quality certification
Wednesday 19 February 2025
SK Hynix taps VP to lead US HBM packaging facility
SK Hynix has reportedly appointed Vice President Woong-sun (William) Lee to head its newly established semiconductor packaging facility in the US. His leadership will be closely watched as the company navigates intensifying market competition
Tuesday 18 February 2025
Acer's 10% price hike: Assessing fallout of US tariffs on American firms and Asia
Acer CEO Jason Chen confirmed in a UK interview that the company will raise prices on US-bound laptops made in China by 10% next month in response to Trump's tariffs. He also hinted at possible production shifts beyond China, including manufacturing in the US, The Telegraph reported
Tuesday 18 February 2025
Apple pulls plug on Micro LED smartwatch, but industry pushes forward
Apple has scrapped its plans to develop a Micro LED smartwatch in 2024, dealing a blow to the technology's immediate prospects. Yet, the scene at CES 2025 suggests Micro LED remains a hotbed of innovation, with companies pressing ahead on new products and breakthroughs. Apple's retreat may signal challenges, but it hasn't dampened industry momentum
Tuesday 18 February 2025
Fujifilm expands CMP slurry and post-CMP cleaner production to target advanced processes
Fujifilm is rapidly expanding its production of semiconductor materials in Kyushu, Japan. In addition to increasing the production capacity of chemical mechanical polishing (CMP) slurries at its factory near TSMC's Kumamoto plant, the company will also expand production of post-CMP cleaners in Oita Prefecture by the spring of 2026
Tuesday 18 February 2025
Chinese robotics firms embrace modularization to enhance adaptability in humanoid robots
Industry insiders observe that Chinese robotics companies aim to differentiate themselves from American rivals by embracing modularization. Instead of concentrating only on full humanoid robots, they focus on flexible designs, such as splitting the upper and lower body and creating modular parts like dexterous hands to boost adaptability
Tuesday 18 February 2025
SMIC and Hua Hong expand capacity despite US curbs and domestic oversupply
Despite technological restrictions from the US and its allies, SMIC and Hua Hong Semiconductor remain dedicated to investment and continue to expand their production capacity, highlighting China's resilience and adaptivity
Tuesday 18 February 2025
Chinese automakers remain ambitious despite US, EU trade barriers
Starting in 2024, Europe and the US have set up trade barriers against imports of battery electric vehicles (BEV) from China. However, Chinese automakers have shifted their export focus, demonstrating resilience and supporting their ambitions for global expansion
Tuesday 18 February 2025
Chinese automakers shift export focus to PHEVs, but may face new trade trade barrier
Chinese automakers are shifting their export focus from battery electric vehicles (BEV) to plug-in hybrid EVs (PHEV), as they seek to circumvent the trade barriers. But their attempts may fail
Tuesday 18 February 2025
GM to shutter Shenyang plant as part of China market restructuring
General Motors (GM) is closing its Shenyang manufacturing plant in northeastern China, a move that aligns with its broader restructuring strategy to navigate the shifting competitive landscape. The plant, which has been producing Buick GL8 MPVs and Chevrolet Tracker SUVs, is being shut down as part of GM's efforts to streamline operations and counter growing pressure from domestic automakers
Tuesday 18 February 2025
Why SK Hynix is scrutinizing Chinese EDA: two key drivers behind strategic shift
SK Hynix has reportedly launched a review of its use of Chinese Electronic Design Automation (EDA) software in response to potential US restrictions targeting Chinese technology in South Korea
Tuesday 18 February 2025
Baidu and Tencent integrate DeepSeek AI Models to enhance their services

Chinese companies Baidu and Tencent have begun integrating DeepSeek's artificial intelligence (AI) models into their services

Tuesday 18 February 2025
NEG expands glass substrate production amid HBM and semiconductor packaging boom
Nippon Electric Glass (NEG) is increasing its production of carrier glass for advanced memory and semiconductor packaging due to the growing demand for generative AI, which has boosted sales of glass materials used for support in semiconductor processes. The company plans to enhance capacity at its Shiga Prefecture factory in Japan
Monday 17 February 2025
Kioxia announces capex reduction due to NAND surplus despite profitability forecast
Kioxia has projected a return to profitability for fiscal 2024 (April 2024 - March 2025). However, its capex is expected to decrease by approximately 25% year-over-year in response to the accumulation of NAND Flash inventory
Monday 17 February 2025
TSMC and Rapidus: Monitoring PFAS emissions and water quality in Japan
After Taiwan Semiconductor Manufacturing Company's (TSMC) subsidiary JASM's first wafer fab began mass production at the end of 2024, the Kumamoto Prefectural Government initiated the collection of river and groundwater samples in January 2025 to evaluate the environmental impact following the start of production. A similar investigation will also target Rapidus, which is constructing its first plant in Hokkaido
Research Report Database
Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES