CONNECT WITH US
Tuesday 15 July 2025
China's TPV slips into the red in 1H25 on weak margins, FX headwinds

TPV Technology, a leading manufacturer of smart display terminals, expects to post a net loss of CNY450 million to CNY490 million (approx. US$62 to 68 million) for the first half of 2025, according to a July 11 earnings forecast. The projected loss marks a significant swing from a CNY53.39 million profit in the same period last year

Tuesday 15 July 2025
China lags in chip lithography, influential DC think tank says
China faces significant challenges advancing its semiconductor lithography, a key hurdle for its drive toward technological self-sufficiency and superiority in the trade war with the US
Tuesday 15 July 2025
China's PIM chip sidesteps HBM restrictions, advanced node barriers
China remains at a disadvantage in high-bandwidth memory (HBM) and other advanced chip technologies, with sanctions on cutting-edge process nodes further delaying domestic semiconductor progress. However, researchers are now turning to processing-in-memory (PIM) as a potential workaround—a path that could allow China to bypass traditional bottlenecks through architectural innovation
Tuesday 15 July 2025
Jensen Huang's G2 tango secures Nvidia H20 chip exports to China
Nvidia CEO Jensen Huang announced that the company is preparing to resume shipments of its H20 AI GPU to China, following reassurances from the US government that export licenses will be granted. The H20, a data center GPU tailored for China's market, had been delayed amid tightening US export controls
Tuesday 15 July 2025
Alpha and Omega sells China stake after Huawei export violations
Alpha and Omega Semiconductor (AOS) is repositioning its China strategy while simultaneously grappling with the fallout from a significant US export control violation
Tuesday 15 July 2025
Exclusive: Jensen Huang's third visit to China in 2025; RTX 6000D aims for two million shipments
Nvidia CEO Jensen Huang made his third visit to China in 2025, demonstrating significant sincerity to revive the Chinese market. According to supply chain sources, Nvidia has confirmed it will supply the RTX 6000D in the third quarter of 2025, manufactured using TSMC's 4nm process. The shipment target is set at around two million units by year-end, aiming to fill a revenue gap exceeding US$10 billion
Tuesday 15 July 2025
US tariffs disrupt China's PCB expansion plans in Thailand
China has hit a roadblock in its printed circuit board (PCB) industry on its way to expand to Southeast Asia. Starting on August 1, 2025, the US will impose tariffs of up to 36% on goods from Thailand, which risks seriously impacting Thailand's manufacturing sector and upstream Chinese PCB operations in the country
Tuesday 15 July 2025
Japan's JS Foundry files for bankruptcy following power chip strategy setbacks
JS Foundry, a Japanese contract manufacturer focused on power semiconductors, filed for bankruptcy with the Tokyo District Court on July 14, reporting liabilities of JPY16.1 billion (approx. US$110 million). The company's failure highlights increasing challenges faced by the global power semiconductor industry, where optimistic projections linked to electric vehicle (EV) demand have confronted difficult market conditions
Tuesday 15 July 2025
China approves Synopsys-Ansys merger, but draws red lines on contracts
On the afternoon of July 14, 2025, China's State Administration for Market Regulation announced its conditional approval of US-based Synopsys' acquisition of Ansys shares. This deal is a significant merger in the global semiconductor and simulation software sectors, valued at approximately US$35 billion. It has attracted considerable industry attention since its announcement in early 2024
Monday 14 July 2025
As physical AI matures, SOS Lab bets big on smarter, smaller LiDAR
With autonomous vehicles and service robots ushering in a new era of "physical AI," the spotlight is once again on core sensing technologies. While Tesla CEO Elon Musk has famously championed vision-based systems over LiDAR, South Korean startup SOS Lab believes laser-based sensing is poised for a comeback, thanks to breakthroughs in size, clarity, and safety
Monday 14 July 2025
SoftBank to launch high-altitude 5G network using solar planes and airships by 2026
SoftBank is preparing to commercialize its next-generation telecommunications infrastructure using high-altitude platforms by 2026, marking a pivotal milestone in its UTX (Ubiquitous Transformation) initiative. The company announced that it will deploy a hybrid fleet of solar-powered aircraft and unmanned airships to operate base stations in the stratosphere, approximately 20 kilometers above the Earth's surface. This dual-platform system is expected to support emergency communications first, with plans to expand into broader commercial services by 2027
Monday 14 July 2025
Tariffs bite: China–US trade drops 9% in 1H as chip imports, rare earth exports climb

China–US trade fell 9.3% year-over-year in the first half of 2025, totaling CNY2.08 trillion (approx. US$290 billion), according to data released by the General Administration of Customs on July 14. Chinese exports to the US dropped 9.9% to CNY1.55 trillion, while imports from the US fell 7.7% to CNY530.35 billion during the same period

Monday 14 July 2025
BOE pivots beyond displays to glass substrate packaging, perovskite solar
BOE Technology chairman Chen Yanshun revealed at the 2025 BOE Investor Day that the company will pivot toward glass substrate packaging and perovskite solar cell (PSC) technology as strategic growth drivers. The initiative targets high-value semiconductor backend processes and automotive electronics, aiming to diversify beyond BOE's maturing display business
Monday 14 July 2025
Next-gen semiconductor push: SK Hynix prepares laser cutting overhaul for ultra-thin wafers

As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt. In preparation for next-generation HBM4 and NAND flash memory exceeding 400 layers, SK Hynix is reportedly preparing to overhaul its wafer dicing technologies — a foundational step in semiconductor production that is becoming increasingly difficult due to thinning wafers

Monday 14 July 2025
Huawei's 'Little HiSilicon' launches all-out chip blitz: from RISC-V MCUs to AI edge SoCs
HiSilicon (Shanghai) Technologies — Huawei's application-specific chip design arm known as "Little HiSilicon" — has launched a broad lineup of self-developed chips spanning IoT, industrial automation, smart home devices, visual AI, and energy management. The company also unveiled its first RISC-V-based chips, highlighting China's accelerating push for independent innovation in semiconductor design