DIGITIMES Asia news

Thursday 28 August 2025

Youngwoo DSP secures display equipment contract with Samsung Display Vietnam

South Korean display inspection equipment company Youngwoo DSP has signed a supply contract with Samsung Display Vietnam (SDV) valued at KRW17.9 billion (approx. US$13.2 million). This contract accounts for roughly 30.3% of Youngwoo DSP's forecasted revenue for the year 2024, according to reports from Korean media outlets Hankyung and EBN

Thursday 28 August 2025

Cross-industry rivalry heats up as DJI, Insta360, and Dreametech diversify product portfolios

As the consumer electronics market matures, leading companies are exploring new growth by entering each other's sectors. Recently, DJI Technology, Insta360, and Dreametech have expanded beyond drones, imaging devices, and cleaning appliances, hinting at a possible shake-up in the industry

Thursday 28 August 2025

Japan expected to advance legacy semiconductor, LCD production transfer to India

Japan and India are accelerating plans to relocate production of legacy semiconductor and LCD technologies to India, aiming to reduce dependence on China and strengthen economic security

Thursday 28 August 2025

Huawei Cloud overhauls business unit, reportedly eliminates PanGu division in profit push

Huawei Cloud has launched a sweeping restructuring as it seeks to halt losses and return to profit, with people familiar with the matter saying the overhaul includes scrapping the enterprise intelligence division tied to its PanGu language model. The move could affect thousands of employees across dozens of units, from product management to R&D

Thursday 28 August 2025

Hesai wins CSRC approval for Hong Kong IPO after turning quarterly profit

Hesai Group, the world's top LiDAR maker, has filed with China's securities regulator to pursue a secondary listing in Hong Kong. The move comes months after rival RoboSense Technology's Hong Kong debut in January 2024, setting the stage for another major LiDAR player to tap Asian capital markets

Thursday 28 August 2025

Nvidia warns on China H20 sales, clarifies Singapore billing

Nvidia faces uncertainty over H20 chip shipments to China despite strong second-quarter result

Thursday 28 August 2025

Samsung is reportedly considering a stake in Intel to boost chip packaging and challenge TSMC

Samsung Electronics is reportedly considering a strategic investment in Intel to strengthen its foundry business, according to South Korean media outlets Businesspost and Newstomato, which cited industry sources. The move would target their common rival TSMC, the world's leader in advanced chip manufacturing

Thursday 28 August 2025

Samsung’s hush on HBM4 fuels doubts over Nvidia supply readiness

South Korean media report that Samsung Electronics' sixth-generation high-bandwidth memory (HBM4) has cleared Nvidia's preliminary tests and could enter pre-production (PP) by late August 2025. Samsung, however, struck a cautious note, saying it "cannot confirm customer-related matters." While HBM4 is seen as promising, many investors remain unconvinced, viewing Samsung's progress as something that still "needs watching.

Thursday 28 August 2025

South Korea weighs Westinghouse deal as nuclear export chances grow

The global surge in energy demand has brought a turnaround to South Korea's once-stagnant nuclear power industry. However, at the beginning of 2025, Korea Hydro & Nuclear Power (KHNP) and Korea Electric Power Corporation (KEPCO) faced scrutiny for signing an unequal agreement with US-based Westinghouse Electric Corporation (WEC) while competing for the Czech Republic's nuclear power plant project. The medium- to long-term implications of the agreement have raised significant concerns

Thursday 28 August 2025

South Korea races to close gap in hybrid bonding as global rivals move ahead

South Korean experts are raising alarms that domestic semiconductor equipment manufacturers may be falling behind in developing hybrid bonding technology—critical for advancing next-generation HBM chips. Hybrid bonding allows chip-to-chip connections without bumps, enabling thinner stacks, improved thermal management, and higher performance, crucial for AI and high-performance computing. While foreign competitors, including Dutch firm Besi and US-based Applied Materials, have completed technical development, South Korean companies face the main hurdle of high costs—estimated to be three times that of current thermal compression bonding equipment

Thursday 28 August 2025

China’s cities outpace Beijing in AI chip race, setting steeper targets than the state

On August 25, Nikkei Asia reported that Shanghai aims to raise the domestic semiconductor share in AI and data center operations to more than 70% by 2027. Guizhou's Guiyang, in the Gui'an New Area, has set a steeper 90% target, while Beijing has gone further still, vowing to reach full self-sufficiency by 2027 as it fast-tracks a supply chain insulated from US technology

Wednesday 27 August 2025

Rebellions unveils chiplet AI accelerator to challenge Nvidia in hyperscale market

Korea-based Rebellions unveiled its next-generation AI accelerator, REBEL-Quad, at the Hot Chips 2025 symposium in California, positioning itself as a direct rival to Nvidia's Blackwell processors. The chip is the world's first neural processing unit (NPU) to adopt the UCIe-Advanced standard for chiplet interconnect, a design that enables faster and more power-efficient data transfer

Wednesday 27 August 2025

Nvidia's Huang meets Samsung, SK leaders at US summit as HBM battle escalates

The South Korea-US summit offered a rare gathering of tech heavyweights, as Nvidia CEO Jensen Huang met with Samsung Electronics Chairman Lee Jae-yong and SK Group Chairman Chey Tae-won. The encounter underscored the rising importance of high-bandwidth memory (HBM) and cross-border semiconductor investment in the intensifying global AI race

Wednesday 27 August 2025

DeepSeek’s FP8 model signals China’s push to cut reliance on US AI chips

DeepSeek shook up China's AI race on August 21 with the release of its V3.1 model, built on UE8M0 FP8 Scale precision and designed for upcoming Chinese processors

Wednesday 27 August 2025

Huawei slashes Mate series prices, prepares tri-fold launch ahead of Apple event

Apple will unveil its latest iPhone lineup on September 9 in California, but Huawei is looking to pre-empt the buzz. The Chinese tech giant confirmed it will hold its "Mate XT Ultimate Master and Full-Scenario Launch Event" on September 4, where it is expected to introduce a tri-fold smartphone. The timing, just five days before Apple's event, is seen as a direct challenge, highlighting Huawei's push to regain ground in the premium smartphone market

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