DIGITIMES Asia news

Wednesday 31 December 2025

Samsung reportedly plans 50% HBM output surge through 2026

Samsung Electronics plans to boost its high-bandwidth memory (HBM) production capacity by approximately 50% through late 2026, according to South Korean media outlet ET News, as the company secures key technical milestones with major AI customers

Wednesday 31 December 2025

South Korean PCB industry faces cost challenges as AI drives raw material prices up

The South Korean printed circuit board (PCB) industry is struggling as soaring gold and copper prices, up 50% and 30% respectively since early 2025, increase production costs. Despite high factory utilization due to the AI boom in semiconductors, many companies cannot raise product prices, worsening profitability

Wednesday 31 December 2025

BOE 8.6G AMOLED production line in Chengdu to begin production early

BOE announced on December 30 that its first 8.6G AMOLED production line in Chengdu, China, has begun early production, five months ahead of the original schedule, shifting from construction to operation and mass production preparation, with full production expected to start in 2026

Wednesday 31 December 2025

YMTC goes full speed toward HBF next

Amid rising US-China tech tensions and tight semiconductor supply chains, YMTC disclosed advances in 3D NAND flash memory and plans to develop high bandwidth flash (HBF) technology. Their Xtacking architecture evolution supports integration with AI accelerators, addressing capacity and cost challenges beyond traditional HBM

Wednesday 31 December 2025

Mitsubishi launches XForce in Taiwan, confirms EV partnership with Foxtron

Yulon Motor Group's subsidiaries China Motor (CMC) and Yulon Nissan Motor are showcasing new car models at the Taipei Auto Show, which runs from December 31 to January 4 at the Taipei World Trade Center. The launch of the Mitsubishi XForce in Taiwan is a key highlight of the event

Wednesday 31 December 2025

YMTC pushes for equipment localization despite elusive profitability

As China's leading 3D NAND maker, Yangtze Memory Technologies (YMTC) has recently been regarded as the most aggressive company in promoting the adoption of domestic equipment. Its Phase III fab is even striving to build a purely all-domestic-equipment wafer production line

Wednesday 31 December 2025

The chip industry in 2025: Boom, rivalry, and a fragile new order

In 2025, generative AI investments are reshaping the global semiconductor industry. Nvidia, TSMC, and their supply chains emerge as the biggest winners. But the boom brings new challenges. Rising competition in AI chips threatens a market bubble. Meanwhile, China accelerates its push for self-reliance as US export restrictions tighten. The DIGITIMES news team highlights the year's defining trends

Wednesday 31 December 2025

ByteDance balances Nvidia, Huawei chips in China's localization squeeze

ByteDance is planning to procure a mix of Nvidia H200 accelerators and Huawei Technologies Ascend chips to meet its growing artificial intelligence needs while adhering to China's push for localized hardware. The move underscores the challenge facing Chinese technology companies that must preserve high-performance training capacity while signaling compliance with domestic industrial policy

Wednesday 31 December 2025

Samsung faces scrutiny over Taiwan probe, denies memory market ties

Samsung Electronics has expanded an internal investigation into alleged employee misconduct at its Taiwan subsidiary, a move the company characterizes as an isolated matter despite its timing amid a global tightening of memory chip supplies. The probe, which stems from a routine internal audit, focuses on suspected kickbacks involving a limited number of staff and predates the current first quarter of the 2025 fiscal year, according to reporting from DIGITIMES and industry sources in South Korea

Tuesday 30 December 2025

TSMC hits its 2nm milestone on schedule as China flexes military muscle

TSMC today announced that its highly anticipated 2nm (N2) technology began volume production in the fourth quarter of 2025, meeting its roadmap targets precisely on schedule

Tuesday 30 December 2025

Chinese GPU provider Lisuan Technology begins shipping self-developed 7G100 GPU

Chinese GPU developer Lisuan Technology has started shipping its 7G100 GPU, marking a significant step toward commercialization. Reported by Jiemian News, the GPU uses TSMC's 6nm process and is designed for applications such as gaming, smart cockpits, and digital twins

Tuesday 30 December 2025

China's Univista rides domestic EDA surge to push for IPO

Univista Industrial Software Group filed for initial public offering guidance on December 26, seeking capital to support the development of domestic semiconductor design tools in China. The Shanghai-based company submitted its filing to the Shanghai Securities Regulatory Bureau with Guotai Haitong Securities serving as the sponsor, according to a report by Sina Finance

Tuesday 30 December 2025

Huawei chair outlines resilience under years of sanctions

Huawei rotating chairwoman Sabrina Meng delivered the company's 2026 New Year speech on December 30, 2025, highlighting Huawei's resilient business strategy despite enduring years of geopolitical challenges and US sanctions. The address served both as an annual corporate review and a subtle response to ongoing external pressures

Tuesday 30 December 2025

Top tech topics in 2025 (1): a year of strategic realignment for global semiconductors

As 2025 draws to a close, the global semiconductor industry has undergone a fundamental transformation marked by heightened geopolitical tensions, supply chain restructuring, and an unprecedented surge in AI-driven demand. What distinguishes this year from previous cycles is the shift from aspirational roadmaps to hard-edged execution, where manufacturers must deliver not just technological advancement but reliable, scalable production under increasingly complex constraints

Tuesday 30 December 2025

South Korea charts road to 0.2nm chips by 2040

The global semiconductor industry is poised to enter the "angstrom era" by 2040 as circuit dimensions shrink to one-tenth of current levels, according to a long-term technology roadmap from the Korean Institute of Semiconductor Engineers. The report suggests that transistor dimensions will push far beyond today's nm scale, forcing fundamental shifts in chip design as traditional scaling reaches its physical limits

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