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Parallel development key to meet surging AI packaging demand, says TSMC Advanced Packaging Division VP

Jay Liu, Phoenix; Emily Kuo, DIGITIMES Asia 0

Dr. Jun He. Credit: DIGITIMES Asia

SEMICON West 2025 was held for the first time in Phoenix, Arizona, with a significant increase in the number of CEO Summits and various forums compared to previous years, with one of the most anticipated events at this year's CEO Summit being the speech...

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