Exclusive: AMD, UALink, UEC leaders on AI infrastructure ahead of OCP Summit

Levi Li, DIGITIMES Asia, Taipei Wednesday 30 July 2025 0

Credit: AFP

As generative AI pushes data center infrastructure to new limits, pressure is mounting on thermal management, interconnect design, and ecosystem interoperability. Ahead of the 2025 OCP APAC Summit, executives from AMD, the Ultra Ethernet Consortium...

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