WinWay Technology, a Taiwan-based provider of semiconductor test interface solutions, has emerged as the world's largest supplier of test sockets, riding the wave of accelerating demand for high-performance computing driven by artificial intelligence.
Strategic pivot pays off
Chairman Mark Wang said the company's years-long strategic push into high-frequency, high-speed test solutions for advanced computing is now bearing fruit. As of May 2025, shipments tied to artificial intelligence and high-performance computing applications accounted for 42% of WinWay's total output, while products supporting sub-7nm process nodes made up a staggering 87% of its business, both record highs.
Cautious optimism amid market headwinds
Looking ahead to the second half of 2025, Wang struck a tone of cautious optimism. While global growth faces headwinds from shifting tariff regimes and currency volatility, the ongoing expansion by hyperscalers provides a strong foundation for demand. Wang revealed that WinWay is planning to establish a US-based repair center as early as the second half of 2026 to better serve North American clients.
Geographic expansion strategy
North America remains WinWay's largest market, contributing 67% of its revenue, with Taiwan and China evenly splitting the remainder. As major foundries ramp up US investment, particularly in Arizona, WinWay is exploring the establishment of a local support center there, though its core manufacturing and research and development operations will remain in Taiwan.
However, Wang acknowledged that nearly 70% of WinWay's revenues are denominated in US dollars, making the company vulnerable to foreign exchange losses. This, he said, could compress profit margins in the second quarter. Still, he remains confident about the outlook, noting that demand for advanced test interfaces remains strong. Current order visibility extends up to three months, and he expects a surge of rush orders in the artificial intelligence and high-performance computing sectors later in the year.
Advanced packaging drives innovation
The importance of wafer-level testing is increasing alongside the rise of advanced packaging technologies. WinWay has been ramping up research and development investment in vertical probe cards, a segment that has already reached a double-digit share of company revenue in 2025. Simultaneously, production capacity for micro-electromechanical systems probe cards is also expanding, positioning the company for further growth.
WinWay's three primary growth drivers in 2025 are: its next-generation HyperSocket platform for 2.5D and 3D chip packaging; micro-electromechanical systems probe cards; and functional burn-in systems for high-speed aging tests.
Optical testing advancement
The company is also advancing its wafer-level optical co-packaged optics testing solutions, integrating offerings across wafer, package, and module levels. Combined with its high-end test sockets and vertical probe cards, WinWay aims to deliver fully customized solutions for next-generation optical-electrical testing, particularly as the industry moves toward 1.6 Tbps data transmission.
Strong financial performance
At its investor conference on June 26, WinWay reported the first quarter 2025 revenue of NT$2.297 billion (US$79 million), up 49.3% quarter-over-quarter and 114.1% year-over-year. Net income after tax reached NT$613 million, a 206.8% increase from the same period in 2024. For the first five months of the year, cumulative revenue totaled NT$3.443 billion, representing year-over-year growth of 81.3%.
Article edited by Jerry Chen
