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Thu, Mar 23, 2023
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TSMC sees utilization rates for advanced packaging loosen

Julian Ho, Taipei; Jessie Shen, DIGITIMES Asia 0

Credit: DIGITIMES

TSMC has seen capacity utilization rates for advanced integrated fan-out (InFO) and chip-on-wafer-on-substrate (CoWoS) packaging start loosening in the fourth quarter of 2022, due to a slowdown in demand for HPC and smartphone chips, according to industry...

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