Kioxia has introduced an industrial-grade series of its 3D flash memory BiCS FLASH. Sampling commenced earlier this year, with mass production expected late in the fourth quarter of 2022.
The new lineup utilizes Kioxia's latest-generation BiCS FLASH 3D flash memory with 3-bit-per-cell (triple-level cell, TLC) technology, and is available in a 132-BGA package. Densities range from 512 gigabits (64 gigabytes) to four terabits (512 gigabytes) to support the requirements of industrial applications including telecommunication, networking, and embedded computing.
The storage requirements for many industrial applications stand in contrast to those of SSDs designed to be housed in climate-controlled data centers - including the need for extended temperature ranges and the ability to maintain high reliability and performance in rugged operating conditions. The new Kioxia devices support a wide temperature range (from -40 degrees to 85 degrees Celcius), the company indicated.
Due to the fact that flash memory cell performance and reliability improve with a smaller number of bits per cell, the new Kioxia devices feature 1-bit-per-cell (single-level cell, SLC) mode for applications that require faster read/write times and high cell endurance.
Kioxia's new industrial grade flash memory device
Photo: Company
