Highlights of the day: TSMC 3nm monthly output to reach 100,000 wafers


Demand for TSMC's advanced process support has been strong. The foundry is set to move the 3nm node to volume production in 2022, with monthly output expected to reach 100,000 wafers in 2023. It remains to be seen whether Huawei - banished by the US from large parts of the IT world - could receive capacity support from TSMC again. Handset retailers in China are raising prices for Huawei smartphones that are powered by the vendor's in-house-developed, TSMC-made Kirin chips, expecting them to be out of stock soon. Meanwhile, memory module firms expect demand to pick up during fourth-quarter shopping season, but falling DRAM and NAND prices will continue to heap pressure on their profitability.

TSMC to ramp up 3nm chip production starting 2H22: TSMC is on track to enter 3nm chip production with monthly output set to reach 55,000 wafers in the second half of 2022, according to sources familiar with the matter. The 3nm process output will climb further to 100,000 units in 2023.

Huawei Kirin-powered smartphone prices hiking in China: Retail channel operators for Huawei's smartphones in China are hiking prices of the vendor's models powered by HiSilicon's Kirin chips that are expected to become obsolete in the wake of the US sanctions against the Chinese tech giant, according to industry sources.

Memory module firms expect demand to pick up in 4Q20: Memory module makers expect end-market demand to pick up substantially in the fourth quarter of 2020, driven by e-commerce operators' year-end promotions.