TSMC has kicked off its 2nm process R&D, and is progressing in research and exploratory studies for nodes beyond 2nm, the foundry has disclosed in its annual report to shareholders.
TSMC indicated in 2020, it will focus intensely on improving EUV quality and cost in 2nm technology and beyond. The focus for R&D lithography in 2019 was on 5nm technology transfer, the development of 3nm technology and preparation of 2nm. TSMC has initiated the development of 2nm technology since last year.
TSMC's 3nm technology is the sixth generation of technology platform to make use of 3D transistors, said the company, adding that it will continue full development of the process in 2020. TSMC expects to move 3nm process technology to risk production in 2021 followed by volume production in 2022.
TSMC noted the company maintained its leading position in the foundry market sector in 2019, with an estimated market share of 52%. Half of TSMC's wafer revenue came from advanced manufacturing process, defined as geometries of 16nm and smaller, last year, compared with 41% in 2018.
TSMC's 7nm process technology entered its second year of commercial production in 2019. The foundry also moved an enhanced 7nm process with EUV to mass production last year. Sales generated from N7 and N7+ accounted for 27% of TSMC's total wafer revenue in 2019, thanks to strong adoption across applications ranging from mobile, HPC, IoT to automotive.
TSMC has also introduced 6nm technology, which entered risk production in the first quarter of 2020, to further extend its 7nm family.
TSMC's 5nm technology with extensive EUV adoption has kicked off volume production since April. The company expects to see 5nm chip sales account for about 10% of its total wafer revenue this year.
TSMC major future R&D projects | ||
Project name | Description | Risk production (estimated target schedule) |
3nm logic technology platform and applications | 6th-gen 3D CMOS technology platform for SoC | 2021 |
Beyond-3nm logic technology platform and applications | 3D CMOS technology platform for SoC | 2023 |
3D IC | Cost-effective solution with better form factor and performance for SiP | 2018-2021 |
Next-gen lithography | EUV lithography and related patterning technology to extend Moore's Law | 2018-2021 |
Long-term research | Specialty SoC technology (including new NVM, MEMS, RF, analog) and transistors for 8-10 year out horizon | 2018-2026 |
Source: Company, compiled by Digitimes, April 2020
Article translated by Jessie Shen
