MediaTek's 8K digital TV system-on-chip (SoC) manufactured with 12nm technology, the MediaTek S900, has entered volume manufacturing with TSMC, according to the companies.
Built on TSMC's low-power 12nm FinFET Compact (12FFC) process, the S900 is MediaTek's first flagship smart TV SoC supporting 8K resolution and high-speed edge AI computation. The integrated S900 supports features including AI voice-user interface and picture quality enhancements, enabling the next generation of smart TVs to deliver a vastly improved user experience.
TSMC's ultra-low power 12FFC process leads the foundry segment's 16/14nm generation technologies in reducing die size and power consumption, which is essential for digital TV applications. It provides a sweet spot between performance and low power that is ideal for enabling voice recognition and edge AI capabilities in consumer electronics, wearables and Internet of Things (IoT) devices.
"TSMC has been a key strategic partner of MediaTek for a long time, and their advanced processes have consistently enabled MediaTek's industry-leading designs with innovative features which have satisfied the stringent requirements of our SoC solutions," said HW Kao, corporate VP of MediaTek.
"TSMC is pleased to have the opportunity to continue our long history of collaboration and working together on such an innovative product as the S900," said Kevin Zhang, TSMC's VP of business development. "We will continue to expand our ultra-low power technology offering to help our customers to create AI-enabled SoCs to enrich smart homes for a smarter world."