TSMC 7nm ready for customer tape-outs in 2Q17, says report

REALTIME NEWS

Taiwan Tech powers up Taiwan power supply industry in preparation for future energy market

IT + CE

2min ago

FETC to implement free flow ETC system in foreign markets after domestic success

Mobile + Telecom

11min ago

Home Tech Chips + Components

TSMC 7nm ready for customer tape-outs in 2Q17, says report

Jessie Shen, DIGITIMES, Taipei Tuesday 3 January 2017 0

Taiwan Semiconductor Manufacturing Company (TSMC) has moved to qualify its more advanced 7nm FinFET technology, which will be ready for customer tape-outs in the second quarter of 2017, according to a recent Chinese-language Commercial Times...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.

LOGIN

Email address

Passwords

Save my User ID and Password

Save my User ID and Password

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Save my User ID and Password' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

NEW individual users please REGISTER first.

Enterprise user first-time LOGIN.

I forgot my ID and/or password?

MEMBERSHIP BENEFITS

Full access to articles dating back to 2000.
Real-time access to the news as it breaks.
Access to premium content.
Full access to Before Going to Press.
Asia Supply Chain 100 dataset access.
Access to research insights.