Worldwide semiconductor manufacturing equipment billings reached US$2.69 billion in the second quarter of 2009, representing decreases of 13% sequentially and 66% on year, according to SEMI.
SEMI also reported worldwide chip equipment bookings totaled US$2.95 billion in the second quarter, with the figure showing 58% less than the same quarter a year ago but 83% greater than the bookings figure for the prior quarter.
"Spending for the first half of 2009 is comparable to spending reported in the early 1990s," said Stanley Myers, president and CEO of SEMI. "While 2009 is an extremely challenging year for the industry, it is encouraging to observe improvement in equipment bookings over recent months."
| SEMI: Chip equipment billings data by region, 2Q09 (US$b) | |||||
| Region | 2Q09 | 1Q09 | Q/Q | 2Q08 | Y/Y |
| Europe | 0.17 | 0.36 | (52%) | 0.52 | (67%) |
| China | 0.11 | 0.10 | 10% | 0.47 | (77%) |
| Japan | 0.33 | 0.79 | (58%) | 1.93 | (83%) |
| North America | 0.69 | 1.12 | (38%) | 1.25 | (45%) |
| Korea | 0.41 | 0.28 | 46% | 1.41 | (71%) |
| Taiwan | 0.74 | 0.29 | 155% | 1.45 | (49%) |
| ROW | 0.22 | 0.13 | 69% | 0.80 | (72%) |
| Total | 2.69 | 3.08 | (13%) | 7.83 | (66%) |
Source: SEMI/SEAJ, compiled by Digitimes, September 2009
Article translated by Jessie Shen
