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Japan chip equipment orders down 22% on year in September 2009, says SEAJ

Press release
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Japan-based semiconductor equipment manufacturers received 61.567 billion yen (US$682.92 million) in orders in September 2009, down 22.2% from the same period in 2008, according to data gathered by the Semiconductor Equipment Association of Japan (SEAJ). On a sequential basis, the bookings figure was up 11% on the final August level of 55.457 billion.

The three-month average of worldwide billings was 48.219 billion in September, up 25% from 38.569 billion in August but down 42.2% from 83.408 billion in 2008, the data showed.

The book-to-bill ratio for Japan-based semiconductor-making equipment averaged 1.28 in September, compared to 1.44 in the prior month and 0.95 in September 2008. A book-to-bill ratio of 1.28 means that 128 yen worth of new orders was received for every 100 yen of product billed for the month.

A book-to-bill ratio of above 1.00 indicates a strong market where demand outpaces supply, whereas a book-to-bill ratio of below 1.00 points to weaker demand.

SEAJ: Japan semiconductor equipment book-to-bill ratio, September 2009 (million yen)

Billings
(three-month avg.)

Bookings
(three-month avg.)

Book-to-bill ratio

March 2009

44,475

13,551

0.30

April 2009

40,444

17,945

0.44

May 2009

39,156

25,972

0.66

June 2009

28,101

35,581

1.27

July 2009

32,794

43,788

1.34

August 2009 (final)

38,569

55,457

1.44

September 2009 (prelim)

48,219

61,567

1.28

Source: SEAJ, compiled by Digitimes, October 2009

Article translated by Jessie Shen