People growingly rely on their phones for navigating via GPS, communicating via satellite and checking weather forecasts. All these services that make our life more intelligent and convenient are made possible by space technology breakthroughs.Taiwan Accelerator Plus (TAcc+), an international startup program powered by the Industrial Technology Research Institute (ITRI), played a key role in facilitating a space industry delegation to the United Kingdom in March 2025. The program is sponsored by the Small and Medium Enterprise and Startup Administration (SMESA), Ministry of Economic Affairs, and executed by ITRI. SMESA served as the official organizer of the mission, while TAcc+ coordinated the activities and engagements throughout the trip.Taiwan's first team of space industry representatives exhibiting at Space-Comm Expo and holding Taiwan Country Showcase at the event to introduce Taiwan's space industry strength and spark off cross-border partnerships. Credit: ITRIThe Taiwan delegation brought together representatives from the private sector, academia, and government, including companies such as Hon Hai Precision, the Department of Space Science and Engineering at National Central University, and several emerging Taiwan-based space startups. Their participation in Space Comm Expo 2025 aimed to showcase Taiwan's growing space capabilities and foster international cooperation.With the support of ITRI's international partners—including Space South Central, ADS Group, the Department for Business and Trade (DBT), and the British Office in Taipei—the delegation also visited several key organizations in the United Kingdom space sector. These included the UK Space Agency, Airbus, Eutelsat OneWeb, Satellite Applications Catapult, STFC RAL Space, Surrey Satellite Technology Limited, Surrey Space Centre, and the 5G Innovation Centre. These visits offered the Taiwan delegation valuable insights into the United Kingdom space ecosystem and opened the door for future collaboration.This mission aimed to build lasting communication channels, deepen partnerships, and strengthen connections between the space and startup communities of both countries.As the largest and most influential space industry exhibition in the UK, Space-Comm Expo gathered more than 200 exhibitors from all over the world and received 5,900 visitors in 2025. At this year's event, ITRI organized a Taiwan pavilion, themed on 5G/6G, satellite manufacturing and application, Earth observation, and space applications, to showcase Taiwan-based startups' creativity and innovations.ITRI also secured opportunities to have the Taiwan team of exhibitors participate in technology sharing sessions and present their achievements at Space-Comm Expo forums, including Taiwan Country Showcase and the Global Space Industry Showcase. These opportunities allowed Taiwan-based startups to network with exhibitors from other countries and boost their visibility in the global marketplace.Two noteworthy events were held on March 11. The Taiwan Cultural Tea Reception took place at the Space-Comm Expo. UK-Taiwan Night, co-hosted with Space South Central, took place at UCL East. Well attended by government representatives and industry experts from different corners of the world, both events offered opportunities for face-to-face communication and media exposure that helped increase the Taiwan space industry's global visibility and sparked off cross-border partnerships.International SpaceTech Startup Supporting Program 2025 kicking off, welcoming international startups to TaiwanSMESA's International SpaceTech Startup Supporting Program has been running for years. The program has successfully brought a great many international startup teams to Taiwan, including Axiom Space, HEX20, and Reflex Aerospace. They have infused a new energy into Taiwan's space industry development. At the same time as ITRI led the delegation to participate in Space-Comm Expo, SMESA launched the 2025 International SpaceTech Startup Supporting Program, aiming to attract international startups with critical space technologies to Taiwan. The initiative is part of a broader effort to accelerate the upgrade and transformation of Taiwan's space industry. The program will connect selected international startups with Taiwan's space industry ecosystem resources through match-making visits to local companies, POC validations, and exhibition event marketing. Taiwan will serve as their gateway to Asian markets.The International SpaceTech Startup Supporting Program 2025 will focus on international startups endeavoring in communication satellite and system integration, remote sensing and imaging technologies for satellite application, small rocket manufacturing and launching, AI edge computing applications, ground equipment, satellite manufacturing, and other space technologies. The focus on satellite manufacturing is aimed at helping strengthen Taiwan's ability to design, assemble, and make satellites and drive high-performance satellite system development. The focus on remote sensing and imaging technologies for satellite applications is intended to drive advances in remote sensing and imaging technologies for their extended use in environmental monitoring, agriculture, and smart city. The focus on AI edge computing applications is for the purpose of enhancing Taiwan's ability to analyze satellite data and perform real-time computation while creating a diversity of space data application scenarios.On the foundation of the country's robust semiconductor, ICT, and precision machinery sectors, Taiwan's space industry is gaining attention in the global marketplace. Future synergy with international startups' technological strengthwill boost Taiwan's competitiveness in the global space sector and reenergize Taiwan's overall economic development.Visit https://taccplus.com/en/international-program/ for more information.Taiwan-UK Space Delegation being impressed by STFC RAL Space's achievements in large geosynchronous satellite integration and testing technologies. Credit: ITRITaiwan-UK Space Delegation visiting UK Space Agency. Credit: ITRI

Chenbro makes its first appearance at Nvidia GTC 2025, displaying the Nvidia GB300 Grace Blackwell Ultra Superchip compute tray and a full range of AI server chassis solutions based on the Nvidia MGX architecture, including 1U, 2U, and 4U models. At GTC, Chenbro not only highlights its product development expertise but also supports customers in demonstrating next-gen AI servers, promoting mutual growth in the server industry.Full range of Nvidia MGX products to meet enterprise and large CSP data center needsNvidia CEO Jensen Huang unveiled the transformative Nvidia GB300 NVL72 platform at the GTC keynote. Chenbro is showcasing the latest compute trays, featuring Nvidia GB300 and GB200 NVL72 solutions, and accelerated Nvidia ConnectX-8 SuperNIC and Nvidia BlueField-3 DPU networking capabilities, compatible with the NVL72 liquid-cooled rack at GTC. The 2U MGX chassis offers flexible configuration and future compatibility for enterprise applications, while the 4U MGX air-cooled and liquid-cooled chassis are tailored to meet enterprise data center needs.Chenbro CEO Corona Chen stated that with strong R&D and manufacturing capabilities, Chenbro has collaborated with Nvidia to offer a complete AI product line based on the Nvidia MGX modular architecture. Through Open Chassis, JDM/ODM, and OEM services, Chenbro provides server chassis solutions ranging from standardized products to fully customized development that meet the needs of system integrators and brand customers. This supports the diverse deployments of AI, HPC, and big data in data centers and enterprises.Deepening AI product development and creating a win-win collaboration modelChenbro made its debut at GTC, led by CEO Corona Chen. Nvidia GTC is an annual AI grand event that brings together thousands of developers, innovators, and business leaders from around the world to share how AI is driving the next generation of development. She stated that Chenbro has achieved outstanding results in the AI and cloud server sectors. At this year's GTC, several major tech companies showcased products co-developed with Chenbro, highlighting the industry's collaborative, win-win growth.Corona further emphasized that Chenbro will continue to increase its investment in AI server development, ensuring that Chenbro will not disappoint the market. With the localization of product development teams closer to customers and the implementation of a global manufacturing localization strategy, including the establishment of the USA NCT plant and a new factory in Malaysia, Chenbro will be able to meet global customer demands more quickly and accurately. Chenbro's operational goals for this year are expected to continue growing, with AI product development as a key driver.

As edge AI applications experience rapid proliferation, intelligent terminal devices, such as ultra-thin laptops, tablets, and AI edge computing terminals, are facing exponentially growing demands for storage performance and capacity. However, conventional storage solutions are increasingly revealing their inherent shortcomings:Traditional SSD expansion requires case disassembling, a cumbersome process necessitating specialized tools and technical expertise, which elevates after-sales service costs.While memory card solutions offer portability, CF cards are constrained by performance limitations, struggling to meet the high-speed read/write requirements of AI applications. High-end alternatives like CFexpress deliver comparable speeds but are hindered by limited interface compatibility and cost-effectiveness.Embedded storage options (such as eMMC and UFS) lack post-purchase expandability, making it difficult for terminal manufacturers to flexibly respond to users' growing storage needs.Addressing these challenges, BIWIN introduces the Mini SSD—a compact, modular, high-performance storage solution designed to empower terminal manufacturers to overcome the constraints of traditional storage systems and capitalize on emerging opportunities in the edge AI storage market.The BIWIN Mini SSD is featured with advanced LGA packaging processes, minimizing its dimensions to as compact as 15 × 17 × 1.4mm. Credit: Biwin01 Innovative Design for Seamless Storage ExpansionThe BIWIN Mini SSD is featured with advanced LGA packaging processes, minimizing its dimensions to as compact as 15 × 17 × 1.4mm, approximately only 15% of the area of a conventional M.2 2280 SSD, with a significantly thinner profile akin to a mobile SIM card. This drastic size reduction optimizes internal device space, unlocking greater flexibility for layout design, thermal management, and battery capacity enhancements.Building on this compact form factor, the Mini SSD introduces a pioneering "standardized slot-based plug-and-play" architecture to the SSD domain. Users can upgrade to terabyte-scale storage with a straightforward three-step process: open the bay, insert the card, and lock it in place. This tool-free physical upgrade approach revolutionizes the storage expansion experience, alleviating manufacturers from complex after-sales maintenance and inventory challenges while enabling true "storage capacity customization."Building on this compact form factor, the Mini SSD introduces a pioneering "standardized slot-based plug-and-play" architecture to the SSD dom. Credit: Biwin02 Flagship Performance, High-Speed Data Transfer Empowering AI ApplicationsDespite its miniaturized design, the Mini SSD delivers uncompromising performance. Equipped with a PCIe 4.0 ×2 high-speed interface, it achieves sequential read and write speeds of up to 3700MB/s and 3400MB/s, respectively—far surpassing typical memory card solutions and rivaling mainstream consumer-grade M.2 SSDs. This capability ensures seamless performance in high-demand scenarios such as AI model loading, 4K/8K video editing, and large-scale design software operation, fully meeting the stringent storage requirements of edge AI terminals.Flagship Performance, High-Speed Data Transfer Empowering AI Application. Credit: Biwin03 Technology-Driven Innovation for Competitive DifferentiationThe Mini SSD's core strengths stem from BIWIN's industry-leading expertise in storage solution development, IC design, and advanced packaging and testing processes, underpinned by a robust end-to-end supply chain. For terminal manufacturers seeking to differentiate their offerings in the AI era and avoid homogenization in the red ocean market, the Mini SSD presents a compelling pathway:Standardized interfaces and modular design help streamline BOM (Bill of Materials) management, reducing production and inventory costs.User-upgradeable storage capabilities minimize after-sales service demands, enhancing product lifecycle efficiency.Cutting-edge packaging and testing processes ensure stable high-frequency signal transmission and system reliability, elevating overall product quality and competitiveness.

SK Hynix Inc. (or "the company") announced today that it has shipped the samples of 12-layer HBM4, a new ultra-high performance DRAM for AI, to major customers for the first time in the world.The samples were delivered ahead of schedule based on SK Hynix's technological edge and production experience that have led the HBM market, and the company is to start the certification process for the customers. SK Hynix aims to complete preparations for mass production of 12-layer HBM4 products within the second half of the year, strengthening its position in the next-generation AI memory market.The 12-layer HBM4 provided as samples this time features the industry's best capacity and speed which are essential for AI memory products.The product has implemented bandwidth capable of processing more than 2TB (terabytes) of data per second for the first time. This translates to processing data equivalent to more than 400 full-HD movies (5GB each) in a second, which is 60 percent faster than the previous generation, HBM3E.SK Hynix also adopted the Advanced MR-MUF process to achieve a capacity of 36GB, which is the highest among 12-layer HBM products. The process, of which competitiveness has been proved through a successful production of the previous generation, helps prevent chip warpage while maximizing product stability by improving heat dissipation.Following its achievement as the industry's first provider to mass produce HBM3 in 2022, and 8- and 12-high HBM3E in 2024. SK Hynix has been leading the AI memory market by developing and supplying HBM products in a timely manner."We have enhanced our position as a front-runner in the AI ecosystem following years of consistent efforts to overcome technological challenges in accordance with customer demands," said Justin Kim, President & Head of AI Infra at SK Hynix. "We are now ready to smoothly proceed with the performance certification and preparatory works for mass production, taking advantage of the experience we have built as the industry's largest HBM provider."

To cope with the disruptive changes that generative AI is bringing across all sectors, companies today have soaring needs for AI talents with real-world experience, global vision and bilingual proficiency. Following the success of the first AIWave: Taiwan Generative AI Applications Hackathon, held in 2024, DIGITIMES again organizes the 2025 competition with the support from the National Development Council in Taiwan for the purpose of cultivating more world-class AI talents that will invigorate AI development for Taiwan's industries. The 2025 event will take place on April 26-27. Contestants will be able to utilize cloud and generative AI services from Amazon Web Services (AWS), including LLMs such as Amazon Nova, Anthropic Claude 3.7 Sonnet, the generative AI-powered assistant for software development - Amazon Q Developer, as well as the no-code, generative AI app builder - PartyRock. The competition is open to anyone in Taiwan, whether students or professionals.Contestants will be divided into a hacker group and an idea exchange group. They will tackle challenges set by renowned Taiwanese companies including Advantech, Chang Chun Group, Cooler Master, ETMall, Gamania Vyin AI, Taishin Financial Holding, and Walsin Lihwa.To build up competency, DIGITIMES and AWS will also hold preparatory workshops covering enterprise data workshops and generative AI workshops to guide teams in utilizing multi-agent collaboration, multimodal models, and large language model reasoning. A panel discussion on nurturing generative AI talents will also be held alongside AI EXPO 2025 from March 26-28 to broaden contestants' perspectives. There will also be a mentorship session from industry experts. After one month of training, teams will be able to create innovative applications and minimum-viable products in a secure environment using company data."Amid the sweeping generative AI wave, governments and leading high-tech companies around the world are pouring tremendous resources into AI development. To keep up with the strong trend, the Taiwanese government is making efforts toward fostering AI industry growth, strengthening domestic AI research capabilities, promoting cross-border collaborations, and training multi-lingual AI talents. These efforts not only set a clear roadmap for Taiwan's AI development but also signify the Taiwan government's determination to play a part in the global race for AI," noted DIGITIMES.DIGITIMES further commented "By organizing the hackathon and workshops, DIGITIMES aims to help Taiwan's developers and students leverage Taiwan's unique strength to create globally competitive generative AI applications. Taiwan has a well-established high-tech supply chain, an abundance of data resources, and a solid foundation for AI research. It is hoped that through the hackathon, Taiwan will develop innovations that overcome challenges the world faces today and usher in a new generative AI era." AWS remarked "Working with schools, governments and companies through AWS Educate, AWS Academy, Cloud Innovation School, and AWS Training Partner, which are programs for different talent incubation stages, AWS has trained more than 100,000 cloud professionals in Taiwan. For generative AI, AWS also launched AI Ready in 2023, a program that aims to provide free AI training and education resources to two million people around the world by 2025. It also teamed up with online learning platform Udacity to award scholarships to students while working with Code.org to teach students about generative AI.""A new AWS Region is coming to Taiwan in 2025. AWS also plans to invest billions of dollars over the next 15 years in Taiwan to support local digitization and AI developments. AWS hopes that more creative talents will be discovered at the hackathon and that its support will help not only transform Taiwan's industries but also build world-leading Taiwan-based unicorns," added AWS.Online registration for the 2025 AI Wave: Taiwan Generative AI Applications Hackathon is open until March 30, 2025. Both students and professionals are encouraged to register. Click here for more information.

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal Chiplet Interconnect Express (UCIe) PHY silicon, achieving a data rate of 32 Gbps per lane, the highest speed defined in the UCIe specification. The 32G UCIe IP, supporting UCIe 2.0, delivers an impressive bandwidth density of 10 Tbps per 1 mm of die edge (5 Tbps/mm full-duplex). This milestone was achieved using TSMC's advanced N3P process and CoWoS packaging technologies, targeting AI, high-performance computing (HPC), xPU, and networking applications.In this test chip, several dies with North-South and East-West IP orientations are interconnected through the CoWoS interposer. The silicon measurements show robust 32Gbps operation with wide horizontal and vertical eye openings. GUC is working aggressively on the full-corner qualification, and the complete silicon report is expected to be available in the coming quarter.To ensure seamless system integration, GUC has developed bridges for AXI, CXS, and CHI buses utilizing the UCIe Streaming Protocol. These bridges are optimized for high traffic density, low power consumption, minimal data transfer latency, and efficient end-to-end flow control – enabling an effortless transition from traditional single-chip Networks-on-Chip (NoC) to chiplet-based architectures. Additionally, the bridges support Dynamic Voltage and Frequency Scaling (DVFS), allowing real-time voltage and frequency adjustments independently of each die without interrupting data flow.GUC's UCIe IP also features advanced reliability capabilities, including UCIe Preventive Monitoring functionality and integrated I/O signal quality monitors from proteanTecs. This technology enables continuous, mission-mode monitoring of signal integrity during data transmission without the need for retraining or disrupting operations. Each signal lane is individually monitored, with real-time detection of power and signal integrity anomalies. Potential defects in bumps and traces are identified early, triggering repair algorithms that replace marginal I/Os with redundant ones to prevent system failures. This proactive approach significantly extends chip lifespan and enhances system reliability.Pushing the boundaries of performance, GUC is committed to further increasing lane speeds while reducing power consumption. GUC has successfully taped out its second-generation UCIe IP, achieving 40 Gbps per lane in late 2024.This new version incorporates Adaptive Voltage Scaling (AVS), delivering approximately 2x power efficiency improvements. In addition, a face-up version of the UCIe-40G IP, designed for 3D integration (SoIC) with Through-Silicon Vias (TSVs), is scheduled for tape-out in the coming months. Looking ahead, GUC's third-generation UCIe IP, capable of 64 Gbps per lane, is currently in development and slated for tape-out in the second half of this year. UCIe product line is optimized for all types of CoWoS and for future TSMC's SoW-X platform. "We are excited to announce the successful silicon bring-up of the world's first UCIe IP supporting 32 Gbps," said Aditya Raina, CMO of GUC."With a comprehensive, silicon-proven 2.5D/3D chiplet IP portfolio across TSMC's 7nm, 5nm, and 3nm process technologies, we deliver robust solutions that go beyond IP. Combined with our expertise in design, package engineering, electrical and thermal simulations, design-for-test (DFT), and production testing for TSMC's 3DFabric technologies, including CoWoS, InFO, TSMC-SoICR, we empower our customers to accelerate design cycles and achieve rapid bring-up of their AI, HPC, xPU, and networking products.""We are committed to delivering the highest performance and lowest power 2.5D/3D chiplet and HBM interface IPs," said Igor Elkanovich, CTO of GUC. "The convergence of 2.5D and 3D packaging technologies, leveraging HBM3E/4/4E, UCIe, and UCIe-3D interfaces, enables the development of highly modular processors that exceed reticle size limitations, paving the way for the next generation of high-performance computing."GUC UCIe-32G Silicon Highlights√ 32Gbps per lane√ Beachfront bandwidth density (full-duplex): 5Tbps/mm√ AXI, CXS and CHI bus bridges√ Dynamic Voltage and Frequency Scaling (DVFS)√ UCIe Preventive Monitoring: per lane, in-mission mode I/O signal quality monitoring by protean Tecs

SK Hynix Inc. (or "the company") announced today that it has received the 2025 World's Most Ethical Companies® recognition by Ethisphere*, a global leader in defining and advancing the standards of ethical business practices, marking the first case for a Korean semiconductor company to be named as an honoree.* Ethisphere: global leader in defining and advancing the standards of ethical business practices that strengthen corporate brands, build trust in the marketplace, and deliver business success. Ethisphere honors superior integrity programs through the World's Most Ethical Companies® recognitionThe assessment is based on Ethisphere's proprietary Ethics Quotient®, which requires companies to provide 240+ different proof points on practices that support robust ethics and compliance; governance; a culture of ethics; environmental and social impact; and initiatives that support a strong value chain.In 2025, 136 honorees were recognized spanning 19 countries and 44 industries. SK Hynix is one of only four honorees in the semiconductor industry.The international recognition follows years of the company's efforts to set up goals for business ethics and systematic evaluation and implementation of them. SK Hynix expects an ethics management system that the stakeholders can trust and is suitable for a global company to help it and its customers achieve higher corporate values.SK Hynix and its employees have combined efforts to advance business ethics further with members participating in the signing of compliance commitment letters and compliance surveys every year with passion.In 2023, SK Hynix also started a program to share its operation and know-how of the business ethics system with business partners to further grow it into a system for the broader supply chain."Congratulations to SK Hynix for achieving recognition as one of the World's Most Ethical Companies®," Erica Salmon Byrne, Ethisphere's Chief Strategy Officer and Executive Chair, said. "Behind this honor is a true dedication and a commitment to advancing business integrity.""I would like to express my gratitude to our members for their continued efforts to help advance the company's principles for ethical management to be recognized globally," SK Hynix Chief Executive Officer Kwak Noh-Jung said. "We will strive to meet the trust of our stakeholders and do our part to continue as an ethically responsible AI memory provider."Credit: SK Hynix

AI semiconductor company DEEPX (CEO: Lokwon Kim) has been steadily increasing its global marketing efforts since introducing sample chips for international customer evaluation. Now, DEEPX is ramping up the supply of mass-production chips, paving the way for broader commercial opportunities across global markets.Last month at CES 2025 - one of the world's largest electronics trade shows - DEEPX was recognized as a "must-visit company" by the event's organizer, the Consumer Technology Association (CTA), shining a spotlight on the global market. During the show, over 16,000 visitors stopped by the DEEPX booth, resulting in more than 100 requests for mass-production chip samples—strong indicators of the company's expanding commercial prospects.During CES, DEEPX showcased various applications of its chips in edge devices for smart cities, smart factories, and robotics, as well as in industrial equipment and edge servers for global enterprises. Demonstrations and on-site meetings were held with a wide range of customers and partners from the United States, Taiwan, Japan, and Europe. In addition, major Korean corporations, government officials, and investors visited the booth on tours to get a firsthand look at DEEPX's technological strengths.Among the highlights, DEEPX successfully ran its first-generation mass-production chips using AI algorithms developed by:–Hyundai-Kia Motor Robotics Lab (robot platform)–Inventec (smart factory)–POSCO DX (smart factory & logistics automation)–LG U+ (industrial and urban security)This demonstration underscored the critical role of on-device AI semiconductors - beyond cloud-based approaches - in ushering in a new era of AI.DEEPX also directly compared its solution to NVIDIA's Jetson Orin, a GPU-based edge platform, demonstrating approximately 10 times the power efficiency and 20 times the price/performance efficiency of its own NPU-based product. By also conducting a 'butter benchmark' test against other leading global NPU technologies, DEEPX demonstrated its advantage in power efficiency, thermal management, and operational stability - critical factors for on-device AI.To illustrate its broad compatibility, DEEPX showcased integrations with application processor (AP) systems-including NXP, Renesas, TI, Broadcom, Rockchip, and Intel-as well as small form factor computing solutions such as the popular Raspberry Pi. The company also demonstrated interoperability with partner industrial PCs and leading workstation and server systems from HP, Dell, Supermicro, Lenovo, Inventec, and others, highlighting the versatility and scalability of its solution.Looking ahead, DEEPX will partner with LG U+ at MWC (Mobile World Congress) in Barcelona from March 3 to demonstrate on-device AI solutions powered by its first-generation chip. DEEPX will also host its own booth to showcase the roadmap for its DX-M2 on-device AI semiconductor, designed for large language models.Following MWC, DEEPX will head to Embedded World on March 11 in Nuremberg, Germany, where its products will be showcased at partner booths - including Micron, Raspberry Pi, AAEON, DFI, Portwell, SEEED, Biostar, Advantech, and Network Optix - as well as DEEPX's own stand. The company will conduct additional live demos and meet with potential customers to explore new business opportunities.

Darveen Co., Ltd., a global provider specializing in rugged industrial computer solutions, is pleased to announce its participation in Embedded World 2025, one of the largest global platforms for the embedded community. The event will take place in Nuremberg, Germany, from March 11 to 13, 2025. Visit Darveen at Hall 3, Booth 3-230 to explore our latest rugged computing solutions designed for a wide range of vertical industries, including in-vehicle environments, marine applications, industrial edge computing, and mobile workforce operations.Stop by our booth to discover our newest product lineup, including:In-vehicle computing solutionsDarveen's in-vehicle solutions are purpose-built for demanding vehicle environments, featuring all-in-one vehicle mount computers with integrated monitors and in-vehicle box PCs. Engineered for reliability, these solutions offer wide temperature and wide voltage support, along with rugged designs, making them ideal for trucks, forklifts, cranes, mining vehicles, agricultural vehicles, and buses. With MIL-STD-810H/G compliance and M12 connectors, our solutions are well-suited for transportation, logistics, warehousing, and port terminal operations.Rugged tablets, RTC seriesDarveen will showcase its rugged RTC Series tablets, available in sizes ranging from 8" to 11.6". A key highlight is the recently launched RTC-I116, featuring a high-brightness 1,000-nit display, hot-swappable dual batteries, and a range of expansion options—perfect for boosting productivity in field operations. The Android OS version of the RTC Series is also available. These versatile tablets are suitable for industries such as manufacturing, law enforcement, firefighting, energy, and logistics.Marine computing solutionsDarveen is introducing a new marine-grade computer powered by a 13th Gen Intel Core processor. Designed for high-performance marine applications, it features 4x NMEA 0183 ports and 8x isolated GPIO ports, ensuring stable connectivity with various ship instruments and systems. Whether managing electronic chart display and information systems (ECDIS) or handling complex vessel-specific applications, this solution delivers exceptional performance and reliability at sea.Industrial edge computing solutionsBeyond vertical-specific solutions, Darveen will also present its latest industrial embedded computers and HMI panel PCs, designed to handle the challenges of edge computing in harsh industrial environments. These high-performance solutions support smart factories and industrial automation, enabling real-time data processing and control.Darveen's comprehensive product portfolio serves diverse industries with customized solutions tailored to specific application needs. As a trusted provider, we are committed to accelerating our customers' time-to-market with innovative, high-quality computing solutions.Join us at Embedded World 2025 and experience the future of rugged computing firsthand!

BIOSTAR, a leading manufacturer of IPC solutions, motherboards, graphics cards, and PC peripherals, is set to showcase its latest industrial computing and edge AI computing solutions at the upcoming Embedded World 2025. The event will take place from March 11-13, 2025, at Nurnberg Messe, Nurnberg, Germany, with BIOSTAR's booth located at 2-321, Hall 2.At Embedded World 2025, BIOSTAR will spotlight its edge computing solutions powered by Intel CPUs, including AI-driven platforms tailored for industrial automation, smart cities, and HMI (Human-Machine Interface) applications. Key highlights will include 3.5" SBCs, NVIDIA Jetson Orin platforms, and industrial-grade systems engineered for scalable, efficient, and robust performance.As an essential player in the IPC and edge AI industries, BIOSTAR continues to lead the way in providing scalable, efficient, and powerful computing solutions. BIOSTAR's diverse portfolio includes products across multiple form factors, including ATX, Mini iTX, SBC, and embedded industrial computers, ensuring versatility and adaptability for various use cases.Credit: BIOSTARIn addition, with the successful cooperation at CES 2025, BIOSTAR will partner with DEEPX again at the exhibition to integrate AI technologies into its edge computing solutions, further solidifying its leadership in Edge AI platforms. The collaboration with renowned AI chip solution providers underscores BIOSTAR's critical role in shaping the future of intelligent computing.Credit: BIOSTARBIOSTAR is excited to welcome industry professionals, IPC innovators, and tech enthusiasts to join them at Embedded World 2025. The exhibition will feature the latest advancements in edge AI and industrial computing technology, showcasing BIOSTAR's commitment to pushing the boundaries of innovation to address the evolving demands of smart industries. Attendees are welcome to apply for FREE tickets using ew25543325, the BIOSTAR invitation code, and invited to visit booth 2-321, Hall 2, to experience firsthand how BIOSTAR's cutting-edge solutions transform industrial applications through enhanced AI computing capabilities.