The explosion of edge AI is reshaping the mission of ultrabooks, transforming them from mere productivity tools into real-time intelligent terminals. From real-time voice translation to generative AI for images and localized large-model inference, higher challenges are proposed for storage systems, that is, delivering high-frequency data throughput while optimizing efficiency in a millimeter-scale footprint. Traditional storage solutions often struggle to balance performance, dimension, and expandability. However, BIWIN Mini SSD introduces a new approach by leveraging technological innovations in spatial reconstruction and modular design, providing ultrabooks with a fresh solution.01 Spatial Reconstruction: Enabling Design Flexibility Through Extreme MiniaturizationIn the quest for every gram and millimeter in ultrabooks, traditional M.2 SSDs have become a bottleneck in space optimization. The bulky physical footprint forces manufacturers into difficult trade-offs between battery capacity, thermal modules, and AI acceleration chips, often leading to compromises in either battery life or performance.Underpinned by advanced LGA packaging technology, BIWIN Mini SSD compresses the storage module to just 15×17×1.4mm, reducing its footprint to only 8.3% of a standard M.2 2280 SSD. This breakthrough miniaturization frees up valuable space inside the device, enabling ultrabooks to achieve more optimized functional integration. It allows for larger batteries to mitigate AI workload power consumption, optimized thermal solutions for sustained high-load performance, and provides room for AI components such as NPU chips and LiDAR sensors, paving the way for advanced on-device AI interactions.Underpinned by advanced LGA packaging technology, BIWIN Mini SSD compresses the storage module to just 15×17×1.4mm. Credit: Biwin02 Modular Revolution: Redefining Storage Expansion LogicMost ultrabooks today feature soldered storage, leaving users stuck with a fixed configuration for the entire lifespan of the device. Manufacturers, in turn, must maintain multiple SKUs to accommodate different storage capacities, adding unnecessary supply chain costs.BIWIN Mini SSD introduces a standardized slot-based plug-and-play structure, simplifying storage upgrades to a three-step process: "open, insert, and lock." This delivers dual benefits. For users, it empowers creators to expand storage capacity on demand and enables developers to quickly set up local AI testing environments. For manufacturers, modular configurations reduce production complexity, minimize after-sales service needs, and reshape product lifecycle management.03 Uncompromised Performance: Matching Mainstream Consumer PCIe SSDsWhile achieving breakthroughs in miniaturization and modularity, BIWIN Mini SSD makes no sacrifices in performance. Powered by a PCIe 4.0 ×2 high-speed interfaces, it delivers sequential read/write speeds of up to 3700MB/s and 3400MB/s, respectively—on par with mainstream consumer-grade M.2 SSDs—while offering capacities up to 2TB. This ensures ultrabooks can achieve "smaller size, uncompromised performance," directly supporting the storage demands of edge AI applications:• Efficient Model Loading: Meets the rapid loading needs of multi-gigabyte AI models, reducing startup latency for local inference tasks.• Stable Data Throughput: Ensures smooth performance in high-load scenarios like real-time 4K/8K video processing and multi-layer rendering in design software.• Low-Power, High-Performance Balance: Utilizes dynamic SLC caching to significantly boost read/write performance while maintaining high output within limited power constraints.While achieving breakthroughs in miniaturization and modularity, BIWIN Mini SSD makes no sacrifices in performance. Credit: Biwin04 From Hardware Innovation to Ecosystem Transformation: Mini SSD Pioneers a New Paradigm for Edge IntelligenceAs the fusion of AI and intelligent terminals accelerates, storage must evolve to enhance device performance and enrich application scenarios across multiple dimensions: scalability, lightweight design, energy efficiency, and operational stability. Leveraging its core strengths in IC design, storage solutions, and advanced packaging and testing technology, BIWIN is well-positioned to meet the diverse needs of customers and markets comprehensively.The technological breakthrough of BIWIN Mini SSD represents a fundamental reinvention of storage solutions for edge AI. This not only marks a major step forward in optimizing physical space within devices but also provides manufacturers with greater design flexibility and expanded capabilities in product definition. More efforts can be concentrated on boosting AI computing power and advancing innovations in human-machine interactions, unencumbered by the compromises traditionally imposed by storage design. Meanwhile, users are afforded the freedom of "expansion on demand," thereby achieving a precise correspondence between their intelligent terminals and individual requirements.

TCL CSOT, a global leader in display technology innovation, is making a significant presence at TouchTaiwan 2025, held from April 16-18, showcasing its electronic paper display solutions under the company's advanced APEX technology brand.Credit: TCL CSOTTCL CSOT's APEX display technology brand continues to push boundaries in visual experience. APEX is built on the brand core of "PACE TO APEX". It is set to deliver a pleasant display experience, reliable vision health, sustainable green and low carbon, and unlimited future imagination for users worldwide. Under the exhibition theme "Forward Together," TCL CSOT presents an impressive array of electronic paper displays that combine ultra-low power consumption, eye protection, and sustainable design, reinforcing the company's commitment to eco-friendly display technologies.The 9.7" E-paper Table Card redefines intelligent office environments with its paper-like display and bistable technology that consumes power only when refreshing, providing over six months of battery life on a single charge. Users can update content conveniently through Bluetooth or NFC connections from mobile devices or PCs.Credit: TCL CSOTTCL CSOT's electronic paper signage solutions, available in various sizes (25.3", 28.3", 31.5", 42", and 75"), all feature full-color display capabilities, reflective imaging for clear visibility without backlighting, and impressive battery life of up to 18 months with approximately 3,000 image refreshes per charge. The 28.3" model incorporates new oxide technology for faster refresh rates, enhancing the user experience while maintaining ultra-low power consumption. These signage solutions support multiple connectivity options, including Wi-Fi, Bluetooth, 4G, and USB for flexible content management.For personal use, the company showcases the 13.3" E-Paper Photo Frame and 4" Electronic Paper Phone Case. Both utilize the same advanced e-paper technology, offering full-color reproduction without the eye strain associated with traditional backlit displays.Credit: TCL CSOTThrough these Electronic Paper Display products, TCL CSOT continues to push the boundaries of display technology, creating more immersive and sustainable visual experiences across all consumer electronics categories while reinforcing its leading position in advanced display solutions.Visit TCL CSOT's YouTube for more information: https://www.youtube.com/@TCLCSOT

The application of artificial intelligence (AI) has emerged as a driving force behind global technological innovation. As AI adoption proliferates, the mastery of semiconductor chip technology becomes paramount for success. The escalating complexity and design costs of chips are fueling the rapid evolution of electronic design automation (EDA) and upstream chip design solutions. Altair, a global leader in computational intelligence, has rapidly established a foothold in EDA and multi-physics simulation tools for electronic systems and the semiconductor industry.In an exclusive interview, Sarmad Khemmoro, senior vice president of Technical Strategy for electronic design and simulation at Altair, highlighted the company's strategic acquisitions to bolster its EDA and multi-physics simulation offerings. Leveraging its Detroit, Michigan roots in the automotive hub, Altair has cultivated 40 years of experience serving major automotive manufacturers with its mechanical systems functional verification and simulation software. Its core clientele spans automotive, aerospace, industrial systems, and consumer electronics. The surge in AI and advanced driver-assistance systems (ADAS) within the smart vehicle sector has propelled Altair's expertise in system-level functional simulation.As electronic designs, including electronic control units (ECUs) and ADAS, increasingly permeate automotive systems, Altair has expanded into electronic system functional verification and automotive printed circuit board (PCB) validation. Emphasizing design for manufacturability (DFM) verification, Altair's solutions encompass simulation and validation across logical, physical, thermal, electrical, and mechanical domains.Altair's EDA Strategy Targets System-Level Functional Verification and SimulationKhemmoro observes that AI is central to the current technological transformation. With a widening talent gap and the rise of intricate and diverse designs, traditional simulation tools often require days to yield results, incurring substantial costs. AI-driven automation is therefore crucial to enhance analysis and simulation efficiency, making AI integration a highly competitive field in EDA.About a decade ago, Altair embarked on expanding its EDA and simulation portfolio. Unlike the established EDA giants, Altair focuses on niche products, particularly system-level EDA verification and simulation tools. A key offering is Altair® PollEx™, a comprehensive suite for PCB design review, analysis, and verification, catering to electrical, electronic, and manufacturing engineers. PollEx PCB Verification detects manufacturing, assembly, and electrical defects early in the design phase, reducing costs and accelerating development cycles.PollEx is an open solution that supports various ECAD, EDA, and CAE file formats, facilitating collaboration among PCB design experts. It enables improved board layout, signal integrity, power integrity, and electromagnetic compatibility (EMC) verification, and seamlessly integrates with multi-physics simulation environments.Multi-Physics Simulation: A Cornerstone for 3D IC Advanced Packaging and PCB DesignAltair's multi-physics simulation solutions, evolving from structural simulation tools, address critical design challenges. Altair® SimLab®, a process-oriented multi-disciplinary analysis platform, automates structural stress, vibration, and drop test performance, delivering accurate and consistent results.The rise of 3D IC design has increased demand for multi-physics simulation and verification of large 3D packaged chips and PCBs. Khemmoro notes the importance of simulating thermal stress at the chip-package level and fluid, thermal effects, fatigue, warpage stress, and EMC at the PCB and system level. These simulations are vital for large electronics systems in automotive, medical, military, and industrial applications, where long lifecycles, harsh environments, and complex supply chains are standard.Altair's AI Studio solution facilitates AI predictive modeling for engineering design, further enhancing PCB design agility.DSim: Cost-Effective ASIC and FPGA Design Simulation and DebuggingAltair's acquisition of Metrics Design Automation and its DSim™ solution expanded its EDA capabilities. DSim leverages cloud-native environments and integrates with major cloud providers (Google Cloud, Microsoft Azure, AWS) to reduce computational costs. Optimized for speed, capacity, and accuracy, DSim, combined with Altair's Silicon Debug Tools®, offers robust functional verification, simulation, and debugging on desktops, servers, or in the cloud, supporting large regression tests.This pay-as-you-go model provides a cost-effective alternative to the expensive IC design verification market. DSim supports ASIC and FPGA digital circuit simulation using System Verilog and VHDL RTL, employing parallel processing for accelerated testing.Altair's strong automotive client base, coupled with its experience serving EMS providers and consumer electronics manufacturers, underscores its industry leadership. As a TSMC Open Innovation Platform (OIP) partner, Altair aims to empower Taiwan's semiconductor and IC design sectors in the AI era.Altair will host its biennial Altair Technology Conference Taiwan in Taipei on May 28, 2025, featuring insights from Altair's CTO, chief engineers, and industry leaders. The conference will explore CAE, AI, and HPC advancements. For details, visit: https://events.altair.com/atc-taiwan-2025/.Altair Technology Conference Taiwan 2025. Credit: Altair

Rugged embedded computer brand — Cincoze, will be at North America's largest automation technology exhibition - Automate 2025 (Booth 232) in Detroit, USA, on May 12–15, 2025. Cincoze will display its range of industrial embedded computing products around the theme of "Edge AI, Smart Integration," encompassing the full spectrum of industrial application environments in four dedicated zones for GPU Computers, DIN-RAIL Computers, Rugged Embedded Computers, and Industrial Panel PCs and Touch Monitors. GPU computer zone: Key for edge AI computingCincoze GPU Computing — GOLD product line provides computing performance and AI inference capabilities to meet the demands of real-time processing and image analysis in rapidly expanding Edge AI applications. Cincoze will showcase the GJ, GM, and GP series for light, medium, and heavy AI applications. The NVIDIA Jetson SoM GPU-equipped GJ series provides low power consumption with efficient AI boost for Light AI applications. The GM series supports MXM GPU modules and offers rich expansion flexibility, making it a long-time customer favorite for mobility or Medium AI applications. The GP series supports up to two 250W high-end GPU cards and has patents for heat dissipation, scalability, and vibration-proof stability, making it the first choice for Heavy AI applications. All series meet EN50121-3-2, E-mark, and MIL-STD-810H standards, ensuring reliable operation in harsh industrial environments. DIN-RAIL computer zone: Performance for smart machinesThe new Cincoze Machine Computing – MAGNET product line provides the compact size, high computing performance, and multiple rich connections for industrial computing in smart machines. The MD-3000 series is the most powerful and complete model in the product line supporting high-performance, the best operating interface, and small size, making it easy to integrate into various control cabinet. The flexible scalable design allows for 2, 4, or 6 expansion boxes, including nearly 20 I/O, storage, and wireless modules to meet the varied connection and function requirements for smart machines. Rugged embedded computers zone: Reliability in harsh environment Cincoze Rugged Computing – DIAMOND product line of industrial computers are designed to face the harsh environmental challenges of edge computing in manufacturing, transportation, maritime, military, and more. The seven series in the DIAMOND line support wide temperatures and voltages, have industrial-grade protections, and enable users to select performance, expandability, size, power consumption, and industry certifications according to application specifications. Every model can be configured to support additional I/O and functions through Cincoze's exclusive modular expansion technology. Industrial panel PCs and touch monitors zone: 250+ options for HMICincoze Display Computing – CRYSTAL product line is for critical HMI solutions across diverse industrial applications. There are nearly 250 combinations across three series, including industrial panel PCs (CV/P series) and monitors (CV/M series) for harsh indoor environments, sunlight readable panel PCs (CS/P series) and monitors (CS/M series) for high brightness outdoor environments, and open frame panel PCs (CO/P series) and monitors (CO/M series) for seamless integration in advanced machine equipment. The CRYSTAL line offers a range of performance, screen size, display ratio, and touch options, includes IP65 dustproof and waterproof front panels, and complies with US UL safety standards, providing a complete and comprehensive selection for any HMI application.AUTOMATE 2025 InformationDateMon. – Thu., May 12 - 15, 2025LocationHuntington Place Convention Center in Detroit, Michigan, USABooth232Opening time· Monday, May 12, 10:00 am – 5:00 pm· Tuesday, May 13, 10:00 am – 5:00 pm· Wednesday, May 14, 10:00 am – 5:00 pm· Thursday, May 15, 10:00 am – 3:00 pm About CincozeCincoze is a brand manufacturer dedicated to providing embedded computing systems for edge computing, AIoT, and critical applications in harsh environments. Its product lines include rugged embedded computers, industrial panel PCs, industrial monitors, and embedded GPU computers. Cincoze products meet the application needs of various vertical markets, especially manufacturing, in-vehicle, railway, transportation, energy, and logistics. Over the years, Cincoze has launched numerous innovative products and has won several patents, awards, and international certifications.

With the rapid expansion of the global medical devices market, the field of medical power supplies is undergoing technological innovations focusing on third-generation semiconductor materials. This year, at the China International Medical Equipment Fair (CMEF) from Apr 8 to 11, APD showcased a full range of medical power supplies, including its next-generation GaN medical power supplies.During the on-site media interview, Rax Chuang, General Manager of APD Power System Business, stated, "The application of GaN in the field of medical power supplies is ringing in a critical moment of comprehensive breakthrough. In the next few years, such power supplies will play a crucial role in the high-end medical devices market."GaN technology drives the innovation of medical power suppliesWith the development trend of modern medical devices moving toward miniaturization, lightweight design, and high portability, products like wearable medical devices and micro medical test equipment require power supplies to provide higher power density. However, the properties of traditional silicon-based power supply materials make it difficult to overcome the bottleneck of power density; besides, a lower conversion efficiency results in high power consumption and large heat generation, and further affects device reliability as well as user experience.Against such a background, the application of third-generation semiconductor material, GaN technology, has brought a revolutionary breakthrough to the field of medical power supplies. On top of high power density, APD's new GaN medical power supplies feature a more compact footprint and significantly lighter weight, as well as remarkably enhance the user experience of portable medical devices. Also, GaN's characteristics, such as high efficiency and low power consumption, can greatly reduce the heat generation of power supplies and improve product reliability to ensure the long-term stable operation of medical devices.Full range of products meets diverse medical application requirementsIn addition to the new generation GaN medical power supplies, APD also presented a full range of highly reliable medical power supplies at CMEF 2025. All models are compliant with global medical product safety regulations IEC 60601, with many of them also complying with household and consumer electronics grade standards to support applications in various fields.Regarding protection class, APD's medical power supplies offer IP22 rating, and some can be upgraded to IPX4 or even higher based on customer requirements. The housing, designed with wear-resistant and robust surface treatments, utilizes fire-resistant materials that comply with UL94V0. The compact design is ideally suited for portable medical devices and can be tailored to meet customer requirements, ensuring seamless integration of appearance and quality. Additionally, the ID-integrated LED design not only clearly displays operational status, but also incorporates details like color, brightness, and viewing angles.Excellent performance ensures stable operation of medical devicesIn terms of product performance, APD's full range of medical power supplies supports outstanding peak current requirements, reaching up to 120%~300%, to more efficiently support the stable operation of medical devices with motors or electric machines. The extremely low noise during full-load operation makes products perfect for an environment where patients need to rest quietly. A service life of more than 10 years further ensures high equipment reliability.For safety performance, APD's embedded power supplies are suitable for various harsh environments and compliant with 2x MOPP requirements; the extremely low leakage current can effectively guarantee patient safety. CAE-assisted simulation technology is employed during the design stage to optimize heat dissipation structure to ensure safe and stable operation; electromagnetic compliant design is also introduced to improve anti-interference ability. Meanwhile, products also feature multiple protection functions like overvoltage protection, overcurrent protection, over-temperature protection, and short-circuit protection, and offer diverse options including automatic self-recovery, adjustable self-recovery, and latching protections.Wide range of global applications in different marketsToday, APD's medical power supplies have been widely applied to diverse medical sub-markets such as ventilators, oxygen generators, monitoring instruments, infusion pumps, ultrasonic equipment, beauty equipment, and hair removal devices. Take APD's electric wheelchair medical charger (60W/90W) for example, powered by lithium and lead-acid batteries, this product is compliant with global medical safety regulations IEC 60601-1, household appliance safety standards IEC 60335, and China GB9706 standard for medical power supplies. The compact and lightweight design makes this product 30% smaller than similar products on the market, as well as 30% lighter. It also features a hidden IP22 rating, operates with a noise level under 25dBA, and can run stably at altitudes up to 5,000m.Continuous expansion to increase global production capacityTo support customers across the world, APD proactively increases global production capacity. Besides continuously expanding its Shenzhen manufacturing site, APD also established a new factory to further improve manufacturing capacity and delivery efficiency. The group ceaselessly drives innovation forward and leverages advanced technologies, reliable product performance, and stringent safety standards to provide global medical device manufacturers with optimal power solutions. With technological breakthroughs and acceleration of applications, APD will open up brand-new development opportunities to consolidate as well as expand its leading position in the global market of medical power supplies.About APD Asian Power DevicesAsian Power Devices (APD) was founded in Taiwan in 1994 and focuses on power electronics and renewable energy technologies. The company has established an important position in the global market because of its world-class technology, as well as R&D capabilities and highly competitive products and services.APD products include power supplies, uninterruptible power systems, and PV inverters. Besides committing to the R&D of key technologies and the pursuit of highly efficient production and services, APD also promises continuous innovation and sustainable operation. We have become a technology leader in power electronics and renewable energy technologies in the global market. APD's mission is to leverage energy-efficient technologies to achieve a real green future.Rax Chuang, General Manager of APD Power System Business, and new medical power supplies. Credit: APDAPD showcases GaN medical power supplies. Credit: APD

Macronix, a leading global non-volatile memory (NVM) integrated device manufacturer, has launched its all-new ArmorBoot MX76 series flash memory. The ArmorBoot MX76 is designed for rapid initialization of electronic devices in diverse application scenarios. Authentication, data protection, and configuration are all completed simultaneously to provide Macronix customers with the winning edge in very challenging AI environments.Even as digital products become more and more diverse, market expectations on security, startup speed, and version updates have continued to increase as well. ArmorBoot is designed to speed up boot times. It is equipped with the standard SPI interface and supports both 1.8V and 3V for optimal power efficiency. The integration of advanced encryption algorithms, authentication, and data integrity verification technologies ensures data security at every stage of system operation. In addition to rapid authentication when a device is started for the first time, it also protects critical data against external interference during system upgrades and updates.#ArmorBoot MX76: Providing the ultra-fast startup time the market has been clamoring forIn today's highly connected environment, risks such as data leaks, data theft, or systems being paralyzed by hacker attacks have become all too real. Device boot times and data protection during the update process now play a crucial part in protecting system stability and user experience. C.T. Yeh, Project Department Manager of Product Marketing at Macronix, stated that legacy electronic devices are generally unable to provide both security and performance during the startup process. ArmorBoot MX76 was developed to satisfy this particular requirement. The product's high-speed boot capability is combined with encryption technology and a secure boot mechanism to complete the authentication and data verification processes several times faster than legacy solutions. Data integrity and security are also assured at every step.The ArmorBoot MX76 owes its outstanding performance during system updates to its enhanced anti-replay attack mechanism. Protection against unauthorized attacks during version updates or execution of secure commands by the system effectively prevents data tampering, malicious attacks, and virus infections. If the system is subjected to security threats or anomalous situations, the integrated advanced protection mechanism switches rapidly over to a secure mode to maintain system stability and greatly reduce security risks. Whether or not used for initial startup or system upgrades/updates, ArmorBoot MX76 works quickly and effectively to protect data against external threats.The previous generation of ArmorFlash products from Macronix, ArmorFlash MX78, won rapid market acceptance upon its release. It was not only adopted by enterprise customers such as Nvidia and Renesas Electronics, but also won the Taiwan Excellence Award and other top product accolades. ArmorFlash MX78 has been successfully applied to a number of fields, including AI, industrial automation, and automotive electronics. As the newest member of the ArmorFlash family, ArmorBoot MX76 was developed by Macronix to satisfy even more demanding market expectations: designs focused on rapid startup for electronic products and seamless updates through rapid and secure data protection and system verification.C.T. Yeh, Project Manager of Product Marketing at Macronix. Credit: Macronix#Smart integration for high-performance and seamless upgradesArmorBoot MX76 features not only advanced data security technology but also enhanced system compatibility. Yeh noted that the product adheres to the widely adopted SPI interface standard for ease of integration with and seamless migration to existing platforms without major hardware changes, further reducing upgrade costs for customers. Whether in embedded systems, smart homes or IoT devices, users can now enjoy the high performance and security offered by ArmorBoot MX76 without having to make extra changes to their circuitry or install new security components.ArmorBoot MX76 is based on Macronix's advanced production process to deliver consistent product quality and high performance. Exceptional production yield and operating performance make this a solution that combines both security and performance, as well as the ideal choice for equipment upgrades or integration of existing systems. Available capacities range from 256 MB to 1 GB.ArmorBoot MX76 Secure Boot Serial NOR Flash was voted Best Memory Solution of the Year at the 2024 EE Awards and has already received inquiries from a number of Tier 1 vendors. According to Yeh, future applications include industrial control, automotive IoT, healthcare, AI, and even WiFi/Bluetooth devices, so the market outlook for ArmorBoot MX76 is very promising.As the pace of digital transformation continues to speed up, Macronix is not only engaging in continued innovation in memory technology but also paying close attention to market requirements on device startup and update security. Macronix will therefore continue to focus on innovative technologies and work with global customers on the promotion of digital transformation. Even more competitive solutions will be developed for different kinds of future application scenarios to help customers maintain their leadership in a very challenging market environment.

Taipei, Taiwan, March 27, 2025 – As a global provider of rugged industrial computer solutions, Darveen recognizes rugged tablets as the ideal companion for manufacturing. From warehouses to shop floors, these devices enable workers to access key data anytime, significantly boosting operational efficiency. The newly launched RTC-I116 is the perfect embodiment of this vision, helping warehouse staff monitor inventory and assisting maintenance teams in identifying equipment issues to maximize machine uptime.Built to withstand harsh environmentsThe RTC-I116 is designed for demanding industrial settings, meeting IP66 and MIL-STD-810H standards for drop, shock, and water resistance. It operates reliably in extreme temperatures ranging from -20°C to 60°C. Its 11.6-inch FHD (1920 × 1080) widescreen display ensures crisp visuals, allowing operators to view critical data with precision and efficiency.Credit: DarveenSeamless connectivity for optimized operationsPowered by Intel® Core™ i7-1255U/i5-1235U processors, the RTC-I116 supports Bluetooth, Wi-Fi 6E, 5G/4G, and GPS to ensure stable data transmission and real-time communication. These connectivity features enhance navigation, product identification, and logistics tracking, while also supporting equipment monitoring and maintenance, streamlining warehouse and manufacturing workflows.Credit: DarveenHot-swappable battery for continuous operationThe RTC-I116 is equipped with a 58.5Wh dual hot-swappable battery, allowing users to replace batteries while the device remains powered on. This ensures uninterrupted operation, making it ideal for shift-based environments where downtime is not an option.Credit: DarveenFlexible expansion for versatile applicationsTo enhance asset and equipment management, the RTC-I116 offers up to eight I/O ports, enabling seamless integration with various devices for real-time monitoring and diagnostics. It also features a built-in 2D barcode scanner and a modular expansion slot that supports an optional UHF RFID reader, improving material tracking and inventory management for smarter warehouse and production operations.The RTC-I116 also offers a range of optional accessories to enhance adaptability for various field applications, including an office dock, 2-bay battery charger, hand strap, shoulder strap, and stylus.For more information about the Darveen RTC-I116, please visit: https://www.darveen.com/product/11-6-rtc-i116-windows-rugged-tablet-with-intel-core-i-processor/For the Darveen RTC-I116 video, please visit: https://youtu.be/AdOXBV9Ed30?si=Nd34Oi7Iq3uFuc2

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out the world's first HBM4 controller and PHY IP. This test chip was implemented using TSMC's cutting-edge N3P process technology and CoWoS-R advanced packaging technology.The HBM4 IP supports data rates of up to 12 Gbps under all operating conditions. By leveraging a proprietary interposer layout, GUC has optimized signal integrity (SI) and power integrity (PI) to achieve these high speeds for all types of CoWoS technology. Compared with HBM3, GUC's HBM4 PHY delivers 2.5x bandwidth while improving 1.5x power efficiency and 2x area efficiency. In line with previous GUC HBM, GLink, and UCIe IPs, this HBM4 IP integrates proteanTecs' interconnect monitoring solution to provide high visibility for testing and characterizing the PHY while improving in-field performance and reliability for end products.This milestone further strengthens GUC's comprehensive portfolio of advanced IPs, including its 32Gbps UCIe-A and GLink-3D IPs. Together, these offerings deliver a complete 2.5D and 3D total solution, empowering customers to address the most demanding applications in AI, high-performance computing (HPC), and beyond."We are proud to be the first company to have taped out a 12Gbps HBM4 controller and PHY IP," said Sean Tai, President of GUC. "Our commitment to delivering best-in-class 2.5D/3D IPs and services remains strong. By integrating HBM4, UCIe-A, and GLink-3D IPs, we offer a comprehensive solution that meets the evolving needs of the semiconductor industry."GUC HBM4 IP Highlight• Signed off at 12 Gbps in full range of corners and operating conditions• High bus utilization rate: ~90% at random read/write access• Proprietary interposer layout to achieve best SI/PI for all types of CoWoS technology• Embedded per-lane, in-mission mode I/O and Clock performance and health monitoring by proteanTecs

The memory market is undergoing a significant transformation as suppliers pivot from traditional inventory-based models to forecast-driven production.This shift, highlighted in Fusion Worldwide's State of the Industry Report | 2025 | Volume 1, signals tighter supply controls and potential price volatility. For businesses reliant on DRAM, NAND, and memory, understanding these changes is critical to maintaining supply chain resilience and competitive advantage.Memory Market Shifts from Inventory to ForecastingIn recent years, the memory market has been characterized by cycles of oversupply and shortages, leading to price instability. To combat this, memory suppliers are now prioritizing forecast-driven procurement over stockpiling inventory. This strategic shift aims to align production more closely with actual demand, reducing the risk of excess inventory and price crashes.According to Fusion Worldwide's State of the Industry Report, "IC manufacturers, worried about losses, are increasingly mirroring memory supplier tactics from last year by encouraging customers to submit forecasts to secure allocations. Without these forecasts, production cuts may be necessary to maintain profits." This approach reflects a broader industry trend toward tighter supply controls, with suppliers focusing on profitability and stability rather than volume.For businesses, this means longer lead times and more rigid allocation processes, particularly for high-demand products like and NAND flash. Companies that fail to adapt to this new model may face challenges in securing the components they need, especially during periods of heightened demand.What This Means for Procurement StrategiesThe transition to forecast-based supply management has significant implications for procurement teams. With suppliers prioritizing forecasts, businesses must adopt more strategic sourcing practices to ensure a steady supply of memory components. Here are key steps to consider:1.Monitor Pricing Trends Closely With reduced excess inventory, the memory market is likely to experience greater price volatility. Procurement teams should track DRAM and NAND pricing trends closely, using market intelligence tools to anticipate shifts and adjust strategies accordingly.2.Secure Long-Term Agreements In a tighter supply environment, long-term agreements with suppliers can provide stability. By locking in pricing and availability, businesses can mitigate the risk of shortages and unexpected cost increases.3.Diversify Sourcing Strategies Relying on a single supplier or region can be risky, especially in a constrained market. Companies should explore alternative sourcing options, including independent distributors, to access high-speed DRAM and SSD storage from multiple regions.4.Leverage Market Intelligence Staying informed about market trends and supply shifts is essential. Tools like Fusion Worldwide's State of the Industry Report provide valuable insights into pricing, lead times, and emerging risks, enabling businesses to make data-driven decisions.The Role of Market Intelligence in Sourcing StrategiesCompanies that actively track memory market trends and semiconductor supply chain shifts will be in a stronger position to navigate industry changes. Having real-time market intelligence allows procurement teams to:Identify early warning signs of supply shortages. Adjust inventory levels to match anticipated demand. Make data-driven decisions for contract negotiations.Leveraging market intelligence solutions ensures businesses remain agile and well-prepared for market fluctuations.Potential Price Volatility for 2025While the shift to forecast-driven production aims to stabilize pricing in the long term, it also introduces the potential for short-term volatility. Suppliers are taking a more deliberate approach to supply control, reducing excess inventory to avoid price crashes. However, this strategy leaves less room for error if demand surges unexpectedly.For example, a sudden increase in demand for high-capacity memory solutions could strain supply chains, leading to price spikes and extended lead times. Businesses that depend on these components must remain vigilant, using market intelligence to anticipate and respond to fluctuations.Final Thoughts: Preparing for a Tighter Memory MarketThe memory market's shift toward forecast-driven production represents a fundamental change in how suppliers manage supply and demand. While this approach aims to create a more stable and profitable market, it also places greater responsibility on businesses to adapt their procurement strategies.To navigate this evolving landscape, companies must prioritize market intelligence, diversify sourcing options, and secure long-term agreements. By staying proactive and informed, businesses can mitigate the risks of supply constraints and price volatility, ensuring a resilient and cost-effective supply chain.Our State of the Industry report provides a timely synthesis of market intelligence from our sourcing and procurement experts, as well as vetted suppliers. Download Fusion Worldwide's State of the Industry Report here.For more information visit fusionww.com, or follow Fusion Worldwide on LinkedIn, Instagram, WeChat, and X.Authored by:Kok How Yow, Global Commodity Director, Fusion Worldwide

Rugged embedded computer brand Cincoze has added a new 15.6-inch FHD display option for HMI applications in harsh environments to its Display Computing – CRYSTAL product line. Almost 20 new products have been launched at this time, including rugged industrial panel PCs (CV-W115FH/P) and monitors (CV-W115FH/M) suitable for general harsh environments, as well as sunlight readable panel PCs (CS-W115FH/P) and monitors (CS-W115FH/M) designed for high-brightness outdoor environments, providing even more comprehensive options across the CRYSTAL product line.Credit: Cincoze15.6-inch FHD industrial panel PC and monitor for smart manufacturing The Cincoze 15.6-inch industrial panel PC (CV-W115FH/P) and monitor series (CV-W115FH/M) offer exceptional picture quality for industrial applications such as displaying complex SCADA data or image monitoring. This is thanks to its FHD (1920x1080) resolution, 800:1 contrast ratio, and 16.7 million color display, which, when combined with resistive or capacitive touch and a wide 178° viewing angle, provide the optimal user experience. The backlight life of up to 50,000 hours ensures long-term stable operation. The panel PC series has various performance options, including Intel® Atom®, Pentium®, or Core™ to suit specific use cases.Credit: Cincoze15.6-inch FHD sunlight readable industrial panel PC and monitor for outdoor operationThe Cincoze 15.6-inch sunlight readable panel PC (CS-W115FH/P) and monitor (CS-W115FH/M) series are built for harsh outdoor environments, with a 1,200 nits high brightness screen ensuring readability even under direct sunlight outdoors. The series is built to withstand harsh conditions and features an IP65 waterproof and dustproof front panel, a shock-resistant aluminum die-cast front bezel, and a 7H hardness touch surface. They support wide temperatures (-20°C- 70°C) and wide voltages (9-48VDC), and include overcurrent, overvoltage, and ESD protection. The series is UL-certified and complies with the EN62368-1 standard, making it ideal for applications such as outdoor interactive information stations, charging piles, and automatic ticket vending machines.CDS simplifies maintenance and upgradesThe series utilizes Cincoze's exclusive CDS (Convertible Display System) technology for flexible configuration with computer modules (P2000/P1000 series) or monitor modules (M1000 series). This enables the creation of industrial or sunlight readable panel PCs and monitors suitable for industrial environments or outdoor use. The plug-and-play design means only a single module requires replacement during on-site maintenance, effectively shortening downtime, reducing maintenance costs, and facilitating future upgrades.