The year 2025 marks a pivotal moment in the accelerated adoption of artificial intelligence (AI). The rapid uptake of intelligent terminals—such as AI PCs, AI smartphones, and AI servers—has fueled the rise of innovative applications, including generative AI, autonomous driving, AI glasses, and embodied AI. Amid this evolution, storage systems have emerged from the background to take the center stage, serving as a key underpinning for enhancing AI experiences and driving systemic transformation.In the face of the high demands of bandwidth, power consumption, latency, capacity and dimension across diverse AI-driven scenarios, significant breakthroughs have been achieved in new-generation high performance storage technologies like LPDDR5X/DDR5, QLC NAND, LPCAMM, and CXL. Integrated innovations in chip design, controller algorithms, and packaging and testing processes are propelling the industry into a new phase of AI-driven transformation.In this dynamic context, the "Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum)", co-hosted by the Shenzhen Memory Industry Association and the School of Integrated Circuits at Peking University and organized by JWinsights (Shanghai) Technology Co., Ltd., is scheduled to be held on September 24–25, 2025, at the Renaissance Shenzhen Bay Hotel.GMIF2025 is scheduled to take place on September 24–25, 2025, at the Renaissance Shenzhen Bay HotelPhoto: Shenzhen Memory Industry AssociationUnder the theme of "AI Applications, Innovation Empowered", the summit will delve into three key topics, specifically emerging trends in storage technologies, real-world AI applications, and collaborative innovation across the storage industry chain. Representative enterprises across all segments of storage ecosystem, comprising wafer IDM manufacturers, controller and module suppliers, packaging and testing providers, and AI platform vendors, will come together to collectively explore innovation pathways and ecosystem development in the AI era. The key focal points of GMIF2025 include:Trends and Roadmaps of Storage Technologies:Centered on AI-driven storage innovations, the summit will explore industrial progresses in forefront technologies, and further map out the trajectory for storage's enhanced value in the evolving compute architecture.New Opportunities in Storage Driven by AI Applications:Focusing on core AI-based scenarios such as AI PCs, AI smartphones, AI servers, generative AI, autonomous driving, AI glasses and embodied AI, the summit will address emerging storage requirements in terms of performance, power consumption, capacity and form factor, and explore innovation at the intersection of technology and application.Collaborative Innovation Across the Industry Chain:In the context of post-globalization supply chain restructuring, the summit will concentrate on strategic collaboration across the storage industry chain to bridge supply-demand gaps and cultivate a resilient, efficient, and innovation-driven global ecosystem.GMIF2025 Agenda OverviewPhoto: Shenzhen Memory Industry AssociationIndustry Breakdown of Attendees: Based on GMIF2024 DataPhoto: Shenzhen Memory Industry AssociationGMIF2024, successfully held last year, brought together over 30 core industry enterprises for keynote presentations, featured 33 exhibiting companies showcasing more than 150 innovative products, and presented 38 annual awards. The event garnered over 680 million impressions across all channels, attracted more than 1,400 professional attendees, and received widespread acclaim from both industry and the public.During GMIF2024, global live broadcast of memory trends by brands achieved a cumulative viewership of over 76,000 and total exposure exceeding 1 million.Highlights from GMIF2024Photo: Shenzhen Memory Industry AssociationAnnual Awards & Industry RankingsTo recognize and celebrate outstanding enterprises for their remarkable contributions to innovation and development in the global memory industry, GMIF2025 will continue to honor exemplary companies across five award categories: Industry Contribution Award, Terminal Application Award, Solution Award, Technology Innovation Award, and Market Service Award. In addition, the Shenzhen Memory Industry Association (SMIA), in collaboration with the School of Integrated Circuits at Peking University and JWinsights (Shanghai) Technology Co., Ltd., will unveil the highly anticipated Memory Industry Ranking during the summit.Looking back at GMIF2024, a distinguished group of enterprises—including Micron, Western Digital, Solidigm, CXMT, YMTC, GigaDevice, Intel, Arm, Rockchip, UNISOC, Allwinner Technology, Silergy, Victory Giant Technology, Silicon Motion, BIWIN, Skyverse, QUANXING Technology, POWEV, KingSpec, Hemei Jingyi, Tongfang, Weibu Information, SIXUNITED, Heyan Technology, Attach Point Intelligent Equipment, OKN Technology, InnoGrit, Tytantest, iWISEETEC, MICROFROM, Konsemi, LKAUTO, Maxwell, RORZE, ExTripod Electronics, EPS, LANYI, and many others—were recognized with the 2024 Annual Awards for their outstanding contributions to the storage and memory industry.Feedback from Previous AttendeesPhoto: Shenzhen Memory Industry AssociationJoin us at the Fourth GMIF2025 Innovation Summit on September 24-25, 2025, in Shenzhen! Click the link below to register now and secure your seat.Registration link: https://jsj.top/f/KQLpk0

Rugged embedded computer brand - Cincoze's Red Dot Award-winning MXM GPU computer series (GM-1100) has the high performance, compact design, and expansion flexibility that make it the ideal choice for space-constrained Edge AI applications. The GM-1100 series supports the latest 14th Gen. Intel Core processors and NVIDIA MXM GPU modules, providing the ultimate computing performance and graphics processing capabilities for real-time decision-making and high-speed AI Edge computing. The GM-1100 is only 260 x 200 x 85 mm, but it maximizes expansion flexibility and can easily meet the application needs of multiple vertical industries, especially in transportation, manufacturing, and defense.Transportation: Improving Safety and FlowTransportation: Improving safety and flowAirport E-gates and X-ray scanners, powered by the GM-1100, enhance customs clearance efficiency and aid in automating security checks. The GM-1100 efficiently handles multiple tasks simultaneously, performing image processing and real-time analysis by leveraging the combined power of the CPU and GPU. It offers native rich I/O and expandable I/O to support LAN, COM, USB, and DIO interfaces, for flexible connectivity with peripherals such as cameras, passport readers, and gate controllers. Its wide temperature design (-40°C to 70°C), combined with its fanless architecture, can effectively overcome the challenges of high temperatures and dust when installed in an electrical enclosure. It effectively achieves fast and accurate identity recognition and prohibited goods detection, optimizing customs clearance efficiency and overall safety.Manufacturing: Boosting Efficiency and YieldManufacturing: Boosting efficiency and yieldAutomated optical inspection (AOI) and robotic bin-picking systems benefit from the powerful performance and rapid data transfer of the GM-1100, making it an optimal computing solution. The potent AI inference capabilities of the MXM GPU enable swift and precise identification of product defects and object location, significantly boosting inspection and overall operational efficiency. The high-speed I/O interfaces, including up to 10GbE LAN, 20Gbps USB 3.2 Type-C, and an M.2 Key M slot for expansion with high-speed NVMe SSDs, fully meet the high-speed transmission and extensive storage requirements of high-resolution image processing. To address the challenges in installation environments with high electromagnetic interference, the GM-1100 adheres to industrial-grade EMC standards. It has successfully obtained CE, UKCA, and FCC certifications, and complies with ICES-003 Class A level. It supports multiple installation methods, such as wall, side, DIN rail, and VESA, for enhanced deployment flexibility.Defense: Enhancing Intelligence and ReconnaissanceDefense: Enhancing intelligence and reconnaissanceMilitary reconnaissance and information gathering can leverage the rugged design and efficient computing of the GM-1100. Its MXM GPU module enables high-speed parallel computing for real-time image analysis and terrain recognition, facilitating battlefield map construction and mission assessment. The built-in M.2 Key B expansion slot supports a GNSS module for high-precision positioning. Its wide voltage design (9-48V) allows flexible installation in military vehicles, surface vessels, and other mobile equipment, and it is equipped with an IGN (Power Ignition Sensing) delayed power on/off function that prevents system damage and data loss from temporary shutdowns or unstable power. Having passed the MIL-STD-810H shock and vibration test and E-mark vehicle certification ensures the stable operation of the GM-1100 in harsh environments, making it a reliable computing core for military defense systems.

When you're editing 4K videos or running high-resolution AAA games on your laptop, it's easy to overlook the components working quietly in the background to keep everything running smoothly. Modern laptops are expected to deliver high performance while maintaining a compact, lightweight design - posing significant engineering challenges related to power management, thermal control, and limited internal space.Among the components that help address these challenges is the tantalum capacitor. Despite its small size, this component contributes to stable power delivery and efficient operation. Known for its reliability, compact footprint, and resilience under varying environmental conditions, the tantalum capacitor has become a practical choice in the design of high-performance, space-constrained electronic systems like today's laptops.Tantalum capacitors in laptops See How Tantalum Capacitors Become the Laptop's 'Invisible Super Engine'Modern laptops demand compact size, high performance, and thermal reliability. Tantalum capacitors, especially with conductive polymer technology, play a key role in meeting these challenges.1. Fast Voltage Response & EMI SuppressionChallenge: Sudden load spikes during gaming or editing can cause voltage dips and EMI.Solution: YMIN capacitors offer ultra-low ESR, enabling fast response to dynamic loads and clean power delivery. Their wide-frequency filtering reduces CPU-induced noise, ensuring system stability.2. Compact Size for Tight SpacesChallenge: Space is limited in ultrabooks and foldables.Solution: With a 1.9mm ultra-thin profile, YMIN capacitors save up to 40% board space compared to polymer aluminum types—ideal for compact layouts without sacrificing reliability.3. Reliable at High TemperaturesChallenge: Gaming laptops can reach over 90°C, risking capacitor failure.Solution: Rated for 105°C operation, YMIN capacitors withstand thermal stress better than traditional electrolytics, maintaining long-term stability.YMIN Tantalum Capacitor Selection RecommendationsSource: CompanyProduct Advantages:*Low ESR Performance:Supports effective filtering at mid-to-high frequencies and allows fast response to load transients. Capable of handling high ripple currents, it helps maintain voltage stability and reduce switching noise in power delivery networks.*Compact Form Factor with High Capacitance Density:Delivers relatively high capacitance in a low-profile package, making it suitable for space-constrained designs such as ultrabooks and thin laptops where board area and height are limited.*Thermal and Electrical Stability:Operates reliably across a wide temperature range (-55°C to +105°C), with low leakage current and resistance to environmental degradation. In high-temperature conditions (e.g., gaming scenarios), its stable electrical characteristics and inherent self-healing behavior support long-term reliability.SummaryAs laptops advance toward thinner form factors and higher computing performance, the demands on power delivery components continue to increase. Tantalum capacitors have proven effective in addressing challenges such as high-frequency noise suppression, efficient power-capacitance balance, and thermal stability under continuous load.In modern power architectures—where precise, fast, and compact power regulation is essential—tantalum capacitors remain a reliable choice. YMIN's conductive polymer tantalum capacitors support consistent voltage stability across dynamic workloads, helping ensure smooth operation in applications such as video rendering and gaming. Their performance characteristics make them well-suited for integration into compact, high-performance laptop designs.If you have any further questions, please contact us or visit our official website: https://www.ymin.cn/

The internationally renowned 2025 IEEE International Future Energy Challenge (IFEC), a global annual power electronics design competition for undergrad students, recently held its grand finals at Chroma ATE Inc.'s headquarters in Taoyuan, Taiwan. This year's final competition focused on "Isolated DC-DC Converters with Fast Transient Response and Low Noise," challenging students to tackle complex issues such as the stability and interference suppression in high-end energy conversion applications.This year-long competition began with 17 teams from 10 countries in the preliminary review, narrowed down to 12 teams from 9 countries for the mid-term selection, and finally saw 8 teams advance to the finals. Of these, 66 students of seven teams from seven countries traveled to Taiwan for the Grand Finale, co-hosted by Chroma and National Taipei University of Technology, to present their final designs and demonstrate their teamwork. Chroma also contributed to the technical theme conceptualization for IFEC 2025 and provided the venue and crucial test and measurement equipment for the final teams during the four-day intensive competition.Global engineering talent convergesThe seven teams that reached the IFEC finals demonstrated exceptional engineering talent from around the world:*Utah State University (USA)*Warsaw University of Technology (Poland)*Reutlingen University (Germany)*KU Leuven and Hasselt University (Belgium)*Bharatiya Vidya Bhavans Sardar Patel Institute of Technology (India)*National Formosa University (Taiwan)*University of Belgrade (Serbia)Competition highlights and award winnersFollowing rigorous judging, the major awards were announced:*Grand Champion Award (US$10,000): Claimed by Warsaw University of Technology from Poland. Their design was the only one that successfully completed and passed all testing procedures.*Outstanding Performance Award (US$5,000): Won by National Formosa University from Taiwan. This team was unique in achieving system automation, showcasing remarkable technical foresight.Other notable award recipients included:*Innovation Award: Reutlingen University (Germany)*Best Teamwork Award: Bharatiya Vidya Bhavans Sardar Patel Institute of Technology (India)*Outstanding Technical Report Award: KU Leuven and Hasselt University (Belgium)*Educational Impact Award and Outstanding Presentation Award: University of Belgrade (Serbia)Power Electronics and IFEC: A glimpse into the futurePower electronics is a rapidly evolving and critical field, with applications ranging from smartphones and electric vehicles to AI servers and large-scale power grids. As emphasized by Johan Enslin, President of the IEEE Power Electronics Society: "The simple yet powerful idea behind IFEC is to encourage the next generation of engineers in innovation and practical experience in sustainable energy solutions."Since its inception in 2001, IFEC has grown into one of the most respected student competitions in power electronics design globally. In recognition of their founding contributions to IFEC 25 years ago and their ongoing advocacy, Professor Philip Krein from the University of Illinois Urbana-Champaign and Dr. Jason Lai from Virginia Tech were honored with Lifetime Achievement Awards.Chroma ATE's enduring commitment to fostering young talentAs a global leader in power electronics test and measurement solutions, Chroma ATE has been a steadfast sponsor of IFEC since 2016. The successful hosting of this year's competition in Taiwan is a direct result of Chroma ATE's collaborative efforts with National Taipei University of Technology to secure the hosting rights. Through its Taiwan headquarters and global branches in the U.S., China, and Europe, Chroma ATE provided extensive support, including a Chroma 8000 test system, furnishing students with critical tools needed for the competition.Mr. Paul Ying, Chroma ATE's Chief Sustainability Officer and Chairman of Chroma Cultural and Educational Foundation, stated at the awards ceremony: "Chroma ATE is particularly proud to host these finals in Taiwan. This not only supports Chroma ATE but also showcases our role as a true partner in building a global platform for young talent. Through the Chroma Cultural and Educational Foundation, we aim to provide more opportunities for young engineers like these to learn, explore, and succeed." Mr. Ying highlighted that IFEC perfectly aligns with Chroma ATE's mission to encourage young talent to solve real-world energy challenges through creativity, teamwork, and technical excellence.Mr. David Yang, General Manager of Chroma ATE's Measurement Instrument Division, underscored the importance of power electronics across global industries, including consumer electronics, semiconductors, AI servers, renewable energy, and electric vehicles. He encouraged participants to consider career opportunities at Chroma ATE after graduation.Lasting impressions and future outlookIFEC 2025 left a profound impression on many participants. A professor from the University of Belgrade lauded it as "the best IFEC" he had ever experienced, praising the attention to detail, the vibrant atmosphere, and the warmth extended to everyone. Student Shen from National Formosa University in Taiwan noted that IFEC provided him with an opportunity to interact with international students, sparking his interest in pursuing a master's degree in power electronics and broadening his perspective on the field. Leonard Markus, a student from Germany, expressed gratitude, saying, "We felt very welcomed here, learned a lot from professors and fellow students, and Chroma ATE took good care of us." Several students mentioned that they were unfamiliar with Chroma ATE before coming to Taiwan, but would now consider its overseas branches for future job prospects.Professor Katherine Kim of National Taiwan University reminded students that in IFEC, the only failure is not learning anything from the experience. Mr. Ying echoed this sentiment, emphasizing that IFEC is not just about winning, but about growing as a team, as problem-solvers, and as global citizens."In engineering, as in life, failure often teaches us more than success," Mr. Ying said. "Please remember: the connections you build here may extend far beyond this event. Build friendships, ask questions, and continue to be inspired. We are all rooting for you!"Credit: Chroma ATECredit: Chroma ATECredit: Chroma ATECredit: Chroma ATE

Rebellions Inc., a leading AI semiconductor company based in South Korea, today announced a collaboration with Marvell Technology, Inc. (NASDAQ: MRVL) to offer high-performance, energy-efficient AI systems tailored for regionally driven and sovereign-backed AI initiatives across APAC and the Middle East.As AI infrastructure becomes increasingly central to national competitiveness, a shift is underway from standardized, GPU-based architectures toward domain-specific systems built around custom ASICs. This change is being driven not only by global hyperscalers but also by sovereign-backed initiatives and regional cloud providers seeking infrastructure that delivers scalability, efficiency, and control.This collaboration will enable Rebellions to design customer-specific AI accelerators utilizing Marvell® custom platforms—leveraging advanced packaging, high-speed SerDes, and die-to-die interconnects, resulting in a tightly integrated, end-to-end rack solution built for high-performance, energy-efficient AI inference at scale."AI infrastructure is undergoing a fundamental shift—organizations are no longer settling for one-size-fits-all solutions," said Sunghyun Park, CEO of Rebellions. "By collaborating with Marvell, we're combining deep expertise in AI chip design with cutting-edge silicon integration to deliver custom AI infrastructure designed to meet the real-world needs of sovereign entities.""Custom AI infrastructure is key to unlocking the next wave of data center innovation," said Will Chu, Senior Vice President and General Manager of Custom Cloud Solutions at Marvell. "We look forward to collaborating with Rebellions to offer next-generation custom AI infrastructure tailored for performance, efficiency, and scalability."About RebellionsRebellions develops AI accelerators optimized for Large Language Models and large-scale inference, delivering industry-leading energy efficiency. Its flagship chip, REBEL, uses chiplet architecture and 144GB HBM3E memory for massive-scale AI inference. The platform includes software for seamless data center integration. Building on its AI accelerator ATOM's proven mass-production experience since 2024, Rebellions is now backed by strategic investors including SK Telecom, SK hynix, Aramco's Wa'ed Ventures, and KT. Strengthened by its merger with SK SAPEON, Rebellions is Asia's leading independent AI semiconductor platform.

IEC 62443 defines procedures for implementing electronic system security in Industrial Automation and Control Systems (IACS). In response to the growing trend of smart industrial control systems, both industry and governments have introduced cybersecurity regulations and standards. One of the most frequently referenced standards is IEC 62443, proposed by the International Electrotechnical Commission (IEC).Originally developed by the International Society for Automation (ISA) and published by the American National Standards Institute (ANSI), the standard was later adopted by the IEC. Initially known as ANSI/ISA-99 or ISA99, it is now published as ISA-62443-x-y by ISA and IEC 62443-x-y by IEC.Cybersecurity issues in industrial control systems are closely related to the level of computerization or intelligence of the system. Recent government reports indicate that hackers are increasingly targeting critical infrastructure and high-tech manufacturing sectors. They infiltrate external networks and gradually penetrate the networks housing industrial control systems, creating a ripple effect. Preventing cybersecurity vulnerabilities in upgraded systems is a major challenge before transitioning to Industry 4.0. These issues can affect product quality, public health, and safety, potentially causing significant damage.IEC 62443 addresses these concerns by providing security standards for IACS to tackle a wide range of cybersecurity challenges.Overview of IEC 62443The technical specifications of this standard apply to all users of IACS, including organizations involved in operations, maintenance, engineering, component manufacturing, and those affected by or involved in control systems. It emphasizes the importance of collaboration between IT and operations and the role of engineering and manufacturing in ensuring enterprise-wide security. The standard is also crucial for network administrators working with IACS. Here comes a structured figure of the standard for reference and simplified elaboration as follows.Figure 1: IEC 62443 Standard Level CategorySource: IECIEC 62443 is structured into four main categories:1. General: Covers foundational concepts, terminology, and methodologies. It explains the threats and issues in industrial automation systems and introduces a reference model to help organizations analyze and implement protective mechanisms.2. Policies & Procedures: Describes the IT security management system and requirements for asset owners (e.g., factory managers), outlining how to ensure operational safety through management policies and processes.3. System: Provides technical specifications from the perspective of system integrators. It discusses how to ensure integrated automation solutions are secure from cyber threats, including conducting security assessments.4. Component: Focuses on the design and development requirements for control system components. It guides product suppliers on how to develop secure products and ensure the safety of automated equipment.Goals of IEC 62443 and Overview of IEC 62443-4 Certification Requirements and Device CategoriesTable 1: IEC 62443 standard for product design flow and certification requirementsSource: IECIEC 62443 certification involves evaluating, integrating, and maintaining specific product functions or solutions under development. The IEC 62443-4 standards apply to asset owners, system integrators, product suppliers, and certification bodies (including government and regulatory agencies).- System Integrators use the standard to procure IACS-compliant control system components and define the required security levels (SL-T) for different zones.- Product Suppliers use the standard to understand the security level requirements (SL-C) for their components. Even if a component doesn't provide all required capabilities, it may still meet requirements when integrated with higher-level systems.IEC 62443-4 defines component requirements (CR), derived from system requirements (SR) in IEC 62443-3-3, which in turn are based on foundational requirements (FR) from IEC 62443-1-1. CRs may include requirement enhancements (RE), and the combination of CR and RE determines the achievable security level.The four types of component requirements are:• Software Application Requirements (SAR)• Embedded Device Requirements (EDR)• Host Device Requirements (HDR)• Network Device Requirements (NDR)Winbond's Secure Flash Memory SolutionsWinbond, a global leader in semiconductor memory solutions, offers secure flash memory products that meet stringent cybersecurity certification requirements. These high-performance, secure flash memories support:• Secure Boot• Secure Storage• Post-Quantum Cryptography (PQC) authenticated firmware updates• Platform Integrity VerificationThey comply with global security standards such as NIST 800-193, NIST 800-208, EN18031, and are certified under Common Criteria and SESIP (Security Evaluation Standard for IoT Platforms).Winbond's secure flash memory products, W75F, W77Q, and W77T, support the full range of IEC 62443 Security Levels (Target), aligning with major cybersecurity standards.Figure 2: Cybersecurity StandardsSource: WinbondConclusionWinbond's secure flash memory solutions help system manufacturers meet regulatory compliance, enhance platform security, and defend against hardware-based cyberattacks. For more information, visit Winbond Secure Flash Memory or download the latest Hardware Security White Paper..

SK Hynix Inc. (or "the company") announced today that it has recorded KRW22.232 trillion in revenues, KRW9.2129 trillion in operating profit(with an operating margin of 41%), and KRW6.9962 trillion in net profit(with a net margin of 31%) in the second quarter.Both revenues and operating profits stood at all-time highs, beating the previous best results in the fourth quarter of last year.The company (www.skHynix.com) said that an aggressive investment by global big tech companies into AI led to a steady increase in demand for AI memory. Shipments of both DRAM and NAND flash were higher than expected, helping the company log the best quarterly results.SK Hynix expanded sales of 12-high HBM3E in the DRAM space, while registering a growth in sales of NAND for all applications. With the industry-leading competitiveness in AI memory and profitability-first management discipline, the company has maintained a positive earnings trend.With the latest financial results, the company's cash and cash equivalents increased to KRW17 trillion at the end of June, up by KRW2.7 trillion from a quarter earlier. Its debt ratio and net debt ratio stood at 25% and 6%, respectively, as net debt fell by KRW4.1 trillion, compared with the previous quarter.In the second quarter, the inventory level was kept steady as customers increased both memory orders and production of their finished products. Demand for memory is expected to continue to grow as customers plan to launch new products in the second half.Particularly, SK Hynix foresees that increasing competition among big tech companies to enhance inference of AI models would lead to higher demand for high-performance and high-capacity memory products. Ongoing investments by nations to build sovereign AI* would also help generate long-term demand for memory, it said.* Sovereign AI: a nation's ability to build an independent AI system with its own infrastructure, data, talent, and business networkThe company expects the solid performance of its products and mass-production capabilities to help double HBM, compared with a year earlier, to generate stable earnings. It will also ensure the timely provision of HBM4 in accordance with customers' requests to remain competitive.SK Hynix will start the provision of an LPDDR-based module for servers within this year, and prepare for GDDR7 products for AI GPUs with an expanded capacity of 24Gb from 16Gb in a bid to enhance its leadership in the AI memory market with product diversification.For the NAND business, the company will maintain a prudent stance for investments, considering demand conditions and profitability-first discipline, while continuing with product developments in preparation for improvements in market conditions. Particularly, it will expand sales of QLC-based high-capacity eSSD and build a 321-high NAND-based product portfolio to enhance its market leadership.Song Hyun Jong, President and Head of Corporate Center, said that SK Hynix will carry out part of the planned investments preemptively this year for the smooth provision of major products with visible demand for next year, including HBM. "We are on track to meet our goal as a Full Stack AI Memory Provider, satisfying customers and leading market expansion through the timely launch of products with best-in-class quality and performance required by the AI ecosystem."2Q25 Financial Results (K-IFRS), Unit: Billion KRW 2Q251Q25Q/Q2Q24Y/YRevenues22,23217,639.126%16,423.335%Operating Profit9,212.97,440.524%5,468.568%Operating Margin41%42%-1pp33%8ppNet Income6,996.28,108.2-14%4,12070%*Note: Financial information on earnings is based on K-IFRS*Note: Please note that the financial results discussed herein are preliminary and speak only as of July 24, 2025. Readers should not assume that this information remains operative at a later time.

The development of quantum computing is fundamentally reshaping the rules of cybersecurity. Traditional public key encryption mechanisms, such as RSA and ECC (Elliptic Curve Cryptography), rely on the complexity of problems like prime factorization and discrete logarithms for their security. However, what is extremely difficult for classical computers to break security could be effortlessly solved by quantum computers.Background and Challenges of Post-Quantum Cryptography (PQC)This is no longer a distant threat. Tech giants such as Google, IBM, and Intel have already demonstrated prototype quantum processors and continue to expand their qubit performance and maintain system stability. While today's low-qubit quantum computers still cannot break commonly used encryption algorithms in real-time, the cybersecurity community has already entered a stage of "quantum defense" deployment.For government agencies and critical infrastructure, this is an urgent concern. The US National Institute of Standards and Technology (NIST) has launched a Post-Quantum Cryptography (PQC) standardization project and announced the first batch of selected encryption algorithms in 2022. This signals that enterprises and device manufacturers must begin considering long-term protection strategies for firmware, data, and keys under quantum threats.Challenges in the PQC Transition: Firmware and Storage Devices at the ForefrontIn many systems, sensitive data and cryptographic keys are often stored in external non-volatile memory, such as SPI NOR Flash. For example, in embedded devices, servers, and network equipment, these components are responsible for storing firmware and critical decryption keys. Once compromised, the entire platform's trust foundation is at risk.However, most external memory on the market today only offers basic write protection and lacks features such as active encryption, region-specific authorization, or key management capabilities - let alone the computational support and security architecture required for increasingly complex PQC algorithms.In addition, many devices face the following challenges:*Difficulty integrating PQC validation and secure storage mechanisms into existing architectures*Lack of storage components that support multi-stage firmware validation and regional isolation*Firmware storage areas are susceptible to forgery or rollback attacks by adversaries.Therefore, integrating "Secure Flash that meets PQC-era requirements" into existing systems has become a critical step in advancing cybersecurity.Winbond TrustME Secure Flash - W77Q: A PQC-Ready Security SolutionIn response to trends in post-quantum and firmware security, Winbond has developed the TrustME Secure Flash - W77Q series. Designed specifically for Platform Firmware Resiliency (PFR) and hardware-based root of trust, the W77Q also supports the hash-based LMS (Leighton?VMicali Signature) post-quantum signature algorithm, providing a complete and robust security solution for device manufacturers.Highlight 1: Multi-Level Access and Key ManagementW77Q implements hardware-based region-level access control and key authentication systems. It enables the creation of multiple independent memory partitions, each configured with its own dedicated key and encryption rules. This is especially important when integrating PQC encryption workflows, and supports:*Independent hardware verification of each firmware stage (Pre-boot, BMC, UEFI, etc.)*Protection against rollback attacks*Restriction of access to specific memory regions (enforced for authorized users only)This architecture not only protects existing firmware structures but also provides a secure and scalable framework for integrating future PQC key management.Highlight 2: Mirror Design with Auto-Recovery Support (PFR-ready)W77Q features a built-in Recovery image region and supports automatic switching and verification. If the primary firmware becomes corrupted or fails validation, the system can automatically switch to the Golden Image without external intervention, achieving Platform Firmware Resiliency (PFR).This design aligns with the established Protect?VDetect?VRecover architecture is defined by NIST SP 800-193 and integrates seamlessly with major platform root of trust implementations.Highlight 3: LMS Key Pre-Provisioning and HSM Injection to Strengthen Supply Chain Root of TrustIn addition to its built-in secure zones and key management capabilities, W77Q supports the pre-injection of LMS post-quantum key pairs. Winbond can assist OEMs in securely embedding LMS public-private key pairs during wafer test or pre-packaging stages, ensuring each device has a unique and traceable cryptographic identity.The injection of the LMS private key is particularly important: it allows for secure device attestation and traceability. By embedding a unique private key within each W77Q device, only the original device can generate valid LMS signatures. This enables downstream systems to verify both the authenticity of the device and the integrity of its firmware, ensuring that only authorized firmware is executed and that the device is genuine. Such traceability and attestation are essential for establishing a robust root of trust throughout the supply chain, significantly enhancing cybersecurity and mitigating risks of device cloning or unauthorized firmware modification.Furthermore, Winbond supports key injection using Hardware Security Modules (HSMs), offering stronger key protection and verifiable injection processes. This functionality enables customers to establish a secure root of trust during chip manufacturing and assembly, further enhancing supply chain security.A One-Stop Secure Storage Solution to Accelerate the Adoption of Future Security ArchitecturesThe true value of W77Q lies not only in solving the "secure memory" problem, but also in addressing many of the supporting tasks developers would otherwise have to manage themselves:*Ready-to-use APIs for easy integration with firmware verification workflows*Secure key storage and region-level access control are handled by W77Q hardware, saving host resources*Support from a full-fledged security team to provide ISO 26262 and NIST PFR compliance documentation and test reports*Pin-to-pin compatible with standard SPI Flash - no need for additional hardware space, enabling low-cost integrationBy supporting both ISO 26262 for functional safety and ISO/SAE 21434 for automotive cybersecurity, W77Q helps manufacturers address both safety and security compliance requirements in modern embedded and automotive systems.For teams looking to implement functional safety, PQC, or platform firmware resiliency, this is an ideal "security accelerator."Conclusion: Secure Flash Is the First Line of Defense in the Post-Quantum Security EraWith the rollout of NIST PQC standards and the ongoing progress of quantum computing, device manufacturers and system integrators can no longer ignore the risks at the firmware level. Winbond's TrustME Secure Flash - W77Q series offers more than just memory - it provides a foundation of trust that supports system evolution, compliance, and long-term security maintenance.Whether you're an embedded platform developer or a module designer in automotive or industrial control sectors, adopting next-generation Secure Flash aligned with PQC and functional safety standards will be a key step in your cybersecurity transformation journey.To learn more about Winbond's advanced security solutions, visit Winbond's website, contact Winbond directly, or download the latest Hardware Security White Paper.

The Transport Department has given vehicle owners across Maharashtra one final window to upgrade their old number plates. Any car or bike registered before 1 April 2019 must display a High Security Registration Plate (HSRP) before 15 August 2025. From 16 August onward, authority teams may start the inspection across the state, and officials have made it clear that no further extensions will follow. The directive applies to roughly 2.10 crore vehicles, yet only about 23 lakh have switched so far. That gap is large enough for authorities to issue a firm warning that no further extensions will be issued. Read on to learn more about the compliance and the process.Why does HSRP matter?HSRP is more than just a new number plate. It carries built-in security elements that help curb fraud and theft.*Chromium hologram: A small Ashoka Chakra symbol in the top-left corner shatters if anyone tries to peel the plate away.*Laser-etched code: A unique string of numbers links the plate to the central vehicle register, making cloning extremely difficult.*Snap locks: Special rivets break on the first attempt at removal, so a swapped plate cannot be reused without visible damage.Extension timelineThe Transport Department has already relaxed the schedule three times. The order originally announced 31 March 2025 as the cut-off, then shifted to the end of April, later to the end of June, and now to 15 August 2025. Officials say this is the last extension for the HSRP Maharashtra. A confirmed booking made before the deadline counts as proof of intent even if the fitting slot falls afterwards, shielding you from penalties.Risks of Missing the 15 August Cut-offThe following may be the key consequences of negligence:*Fines or seizures under the Motor Vehicles Act, once inspections begin.*Insurance complications if the vehicle is stolen or damaged; some claims may be delayed or rejected.*Lower resale value because buyers may increasingly expect a legally compliant plate.Three-step HSRP booking through ACKOHere are the key steps you will need to follow while booking your HSRP number plate online through ACKO:*Enter your registration number: Visit ACKO's HSRP page and type in the vehicle number. The portal automatically directs you to the authorised supplier for your city or district.*Add key details: On the supplier's site, fill in the engine and chassis numbers from the Registration Certificate. Choose either a centre visit or, if offered, a doorstep installation slot.*Pay and confirm: Complete the online payment, pick a time slot, and keep the confirmation message. If your chosen slot falls after 15 August, that digital receipt may protect you from fines.Tips for a smooth installation of HSRPHere are key tips for a smooth process:*Book early: Appointments fill quickly as deadlines approach.*Carry essential documents. Bring the Registration Certificate and a photo ID on installation day.*Check before you leave: Make sure the hologram is intact, the laser code matches your papers, and the plate sits straight.*Store the receipt: Keep a digital copy on your phone and a printout in the glove box until the transport database updates.Why is getting an HSRP plate immediately important?Here are the key reasons why you should act now:*Avoid penalties: Timely compliance prevents fines, seizures, and needless hassle.*Deter theft: The secure plate lowers the risk of number cloning and illegal resale.*Better slot choice: Early birds may be able to pick convenient time slots and skip long queues.Final wordChanging to an HSRP is a one-time task that usually takes less than an hour, but the benefits last for the life of the vehicle. Maharashtra's Transport Department has drawn a clear line: 15 August 2025 is the final date, and inspections start the very next morning. Book through ACKO today, lock in your HSRP plate and drive with peace of mind when enforcement begins. Waiting only invites crowded centres, higher stress, and the real risk of penalties. The most straightforward path is open right now; use it before the window closes.

Vietnam is changing fast. The country is attracting more foreign investment, especially in manufacturing and artificial intelligence (AI). Big companies from the US, Europe, and Asia are setting up factories and research centers here. This is not just about cheap labor anymore. It's about technology, skills, and new ideas.Foreign investment keeps risingIn the first five months of 2025, Vietnam pulled in over US$18 billion in foreign investment. That's a big jump from last year. Most of this money is going into factories, digital technology, and AI. Real estate is still important, but the focus is shifting. Investors want to build things, not just buy land.The government is making it easier for companies to set up shop. They're fixing rules, building better roads, and supporting new businesses. They want Vietnam to be a place where high-tech companies can grow. This is part of a bigger plan to boost the economy and create more jobs.Why companies are choosing VietnamVietnam's location helps. It's close to China, Japan, and other big markets. Labor costs are lower than in China. The country is part of several trade deals, so it's easier to export goods. These things make Vietnam attractive for companies that want to build electronics, semiconductors, and other tech products.Big names like Samsung, Intel, and Foxconn are already here. Apple is moving some of its manufacturing from China to Vietnam. Google and Meta are expanding too. Even SpaceX and the Trump Organization have announced big investments.But it's not just about foreign companies. Local firms like FPT are growing fast. They're working with global tech leaders like NVIDIA to build AI factories and train workers.AI is more than a buzzwordAI is not just a trend in Vietnam. It's becoming part of daily life and business. The government has set up a national AI strategy. They want to train more people, build research centers, and support startups. The goal is to make Vietnam a leader in AI in Southeast Asia.Vietnam now ranks 5th in ASEAN for AI readiness and 59th in the world. That's a big jump in just a few years. The country is investing in data infrastructure and encouraging universities to teach AI skills. FPT, for example, is working with NVIDIA to build an AI factory. They want 3-5% of the population working in AI in the future.Real-world AI applicationsAI is already making a difference in several areas:*Manufacturing: Factories use AI to manage supply chains, reduce waste, and improve quality. This helps them compete globally. *Healthcare: AI tools help doctors diagnose faster and more accurately. Startups are building AI systems for medical imaging and patient care. *Agriculture: Farmers use AI to monitor crops, predict weather, and manage resources. This boosts yields and cuts costs. *Education: Schools are using AI to personalize learning. Universities are launching new AI courses and research programs. *E-commerce: Online shopping is booming. AI helps companies manage logistics, recommend products, and serve customers better.The semiconductor pushSemiconductors are a big deal. Vietnam wants to be a hub for chip manufacturing, and the industry is expected to be worth over $20 billion by the end of 2025. Companies from the US, Japan, and other countries are building factories here, for example, Amkor just opened a $1.6 billion plant in Bac Ninh. The US and Vietnam have signed agreements to develop the chip industry together.Training workers is a priority. Vietnam aims to train 50,000 semiconductor professionals by 2030. FPT corporation, one of Vietnam's largest technology companies, plans to train 10,000 of them. They have set up new university programs and are working with partners from India and the UK.E-commerce and digital growthVietnam's e-commerce market is now one of the top three in Southeast Asia. In 2024, online sales are expected to hit $16 billion. More people are shopping online, using smartphones, and paying digitally. Big platforms dominate, but smaller websites and social media shops are growing too.AI is helping e-commerce companies run smoother. It's used for everything from managing warehouses to chatting with customers. Experts think AI could add up to $130 billion to Vietnam's economy by 2040, mostly through better productivity and new products.Challenges to watchVietnam's growth story is impressive, but there are real challenges.*Infrastructure: Some rural areas still lack good internet and tech access. This makes it hard for everyone to benefit from new technology. *Skills Gap: There aren't enough trained workers in AI and advanced manufacturing. More training and education are needed. *Regulation: The government is working on better rules for investment and data privacy. But it takes time to get it right. *Origin Fraud: Some companies use Vietnam as a stopover to avoid tariffs, especially from China. This can cause trade problems. The government is trying to crack down on this. *Environmental Concerns: Not all investments are good. Projects that pollute or don't meet safety standards are being watched more closely.What's next for Vietnam?Vietnam is not just a place for cheap assembly anymore. It's becoming a center for high-tech manufacturing and AI. The government, local companies, and foreign investors are all pushing in the same direction. They want to build a strong, modern economy that can compete globally.The country is setting up an international financial center to attract more investment. They are also working to make the business environment more transparent and reliable. This should help build trust and bring in more long-term partners.What Vietnam's growth means for youVietnam's rise in manufacturing and AI is real. The country is attracting more investment, building new factories, and training more people. AI is moving from buzzword to reality, with real impact in factories, hospitals, farms, and schools. The semiconductor industry is growing fast, and e-commerce is booming.But there are still hurdles. Infrastructure, skills, and regulation need more work. The government and businesses know this and are taking steps to fix it.Fusion Worldwide has an office right here in Vietnam. That means we are on the ground, ready to help you source what you need, navigate local markets, and make decisions that support your long-term goals. When you work with us, you are gaining a partner who understands the landscape, speaks the language and is invested in your success.The opportunity isn't just to react to change, but to shape your future supply chain and technology strategy. With the right support, you can turn Vietnam's momentum into your own advantage, today and for the long run.Tony Leong, Fusion Worldwide Senior Director of Business Development, Asia