In an era dominated by cloud-based AI, a growing movement toward edge computing is emerging. Canadian edge AI startup Picovoice offers a full portfolio of voice AI and LLM technologies, distinguishing itself by delivering cloud-level performance directly on edge devices, combining high performance with privacy and low latency.Founded in January 2018 by Alireza Kenarsari, Picovoice aims to accelerate the transition of AI processing to where data is generated – at the user's fingertips.Kenarsari observed the inherent inefficiencies of cloud-dependent AI assistants, questioning the necessity of sending even simple voice commands to distant data centers for processing."If you tell Alexa to turn off the lights, does it really need to go through half of the planet, go to a data center, and come back? Probably not," Kenarsari said. "I knew what was going to happen, so my goal was to accelerate that transition."He envisioned a future where AI could operate more locally, mirroring human intelligence. This vision, combined with his entrepreneurial spirit, led him to establish Picovoice.Kenarsari's journey to Picovoice is marked by a rich blend of experiences. His career began with stints at three different startups in Vancouver, where he witnessed the full spectrum of outcomes from acquisition and IPO to complete failure. This was followed by a role at Amazon, focusing on machine learning-based financial fraud detection. His close interactions with the Alexa unit at Amazon provided him with key insights that would shape his vision for his startup.End-to-end optimizationPicovoice's core technology is distinguished by its end-to-end optimization. The company owns its data pipelines, training mechanisms, and inference engines, enabling it to fine-tune its AI models for optimal performance on edge devices. This approach allows Picovoice to match the accuracy of cloud-based APIs while providing the low latency and reliability crucial for real-time applications.What differentiates Picovoice's solution from other edge-computing competitors? "Many edge deployment solutions use post-training optimization, where a pre-trained model (often open source) is modified to be smaller and faster. This approach has limitations: the original model isn't designed for edge deployment, restricting potential optimizations," explained Kenarsari. "Additionally, reliance on open-source runtimes like PyTorch and TensorFlow limits the optimization techniques available." These limitations make it difficult to achieve cloud-level accuracy on edge devices. That's why Picovoice addresses this by creating its own data pipeline and training mechanism.To empower non-developers to design voice-enabled product interactions, Picovoice has developed a web-based platform that simplifies the creation and customization of voice commands and wake words. It adopts a customer-centric approach, tailoring its business model to suit the unique needs of each client. As Kenarsari notes, "If you're making an AI PC, your constraints are very different compared to someone who is making a $5 million surgical robot."Its solutions are designed to be cross-platform compatible, supporting a wide array of operating systems and hardware configurations from Linux, macOS, Windows, Android, iOS, Chrome, Safari, Edge, and Firefox to NPU, GPU, CPU, MPU, and MCUs. "This versatility is particularly valuable for enterprises with diverse product portfolios," said Kenarsari. This is especially valuable for large enterprises that want to provide consistent user experiences across different devices.Value proposition for the edgePicovoice targets industries where privacy, reliability, and real-time processing are paramount, including consumer electronics, automotive, healthcare, public safety, and government tech. The company's business model is B2B-focused, offering cost-effective solutions for high-volume applications. Its technology is being utilized in various innovative applications, including LLM-based voice assistants, agentic AI, and even NASA's next-generation spacesuits. In public safety, Picovoice's on-device solutions ensure that sensitive data remains secure.Picovoice initially earned recognition by delivering technically advanced solutions that outpaced competitors, gaining credibility among sophisticated technical buyers. As the company evolves, expanding its product portfolio and refining its go-to-market strategy, its value is increasingly recognized by non-technical stakeholders as well. With a commitment to transparency, Picovoice offers open access to its technology and resources. Its flexible pricing model is designed to adapt to the unique needs and scale of each customer.Looking aheadLooking ahead, Picovoice's vision is to power a billion devices with its AI technology. It is actively expanding its team and exploring strategic acquisitions to further its reach and impact.The company remains committed to continuous innovation, investing heavily in research and development to stay at the forefront of the AI revolution.Picovoice has achieved profitability and secured significant multi-year deals with Fortune 100 companies. While the company is not actively seeking fundraising, it is open to strategic acquisitions to expand its team and capabilities.

In an exclusive interview, Mariia Zhuldybina, CEO and co-founder of TRAQC, a Canadian startup, shared her vision for transforming quality control in additive electronics manufacturing. The company is pioneering the use of terahertz radiation to inspect the functionality of printed materials in real-time.Zhuldybina's journey began during her PhD research in terahertz metamaterials, where she visited industrial facilities producing printable electronics. "I was fascinated about the production line and how it is working at huge volume and how many we can produce in a very short time," Zhuldybina said, but she also noticed that quality control methods were outdated. This realization sparked her desire to bring her research to the industry, developing a solution for in-line, non-contact quality control.TRAQC's technology uses terahertz light to measure the functionality of printed materials, similar to how our eyes see different colors of light. "Our system is actually measuring how the signal of terahertz light is reflected which corresponds to actual functionality of the printed production of the printed traces. We do it in a similar way to your eyes, for example exploring a rainbow: what is red what is blue what is green, and we can also do it with terahertz to explore what is good electrical properties, what is bad electrical properties," Zhuldybina explained.Key AdvantagesTRAQC's system offers significant advantages over traditional quality control methods. It can operate at speeds up to 50 meters per minute with 95% precision. In contrast, traditional camera solutions only inspect the surface and cannot assess functionality, while probe methods are manual and can damage the products. According to Zhuldybina, "sometimes people throw away kilometers of printed devices because there was a lack of quality control during the production in line."Applications and MarketTRAQC's technology targets various additive electronics manufacturing sectors, including sensors, RFIDs, NFC antennas, medical devices, wearable devices, and solar cells. The company is particularly focused on the solar energy sector, where there is a growing demand for fast, cheap, and thin solar panels. Zhuldybina emphasized the urgency, stating, "We need to go from producing like 360 gigawatt of solar panels per year to 3,000 gigawatts. We need to jump almost 10 times within five years."Competitive Edge and PricingWhile there are existing quality control methods like probe methods, camera systems, and profilometers, TRAQC's solution offers a more comprehensive approach. "All the solutions are missing something what we complement," Zhuldybina noted. Although TRAQC's hardware, priced at $75,000, is more expensive than a simple multimeter, it provides added value through consistent data collection, AI integration, and real-time feedback. The company also employs a subscription model for its AI-powered services, costing around $3,000 per month.Installation, Scalability, and Taiwan's Supply ChainsTRAQC's system is designed for easy integration into existing production lines, requiring only about 30 minutes for installation. The company is currently raising $1 million in pre-seed funding to scale up production, deploy pilot systems, and accelerate market entry.Recognizing the importance of strategic partnerships, TRAQC is also looking to leverage Taiwan's robust supply chains. "Yes, we are very open for this opportunity, and not only in printable electronics but in terms of the technology which we are using," said Zhuldybina, indicating a dual interest in both printable electronics and the broader technology supply chain in Taiwan.Vision for the FutureLooking ahead, TRAQC aims to become the standard tool for the printed electronics industry, providing a comprehensive solution for quality control and process improvement. The company is also committed to sustainability, with the goal of reducing waste and energy consumption in manufacturing. According to their estimates, a single TRAQC machine can reduce CO2 emissions by 150,000 kilograms of CO2 equivalent.TRAQC's innovative approach has the potential to significantly impact the additive electronics manufacturing industry by improving efficiency, reducing waste, and enabling the production of high-quality products.TRAQC's system offers significant advantages over traditional quality control methodsPhoto: CompanyTRAQC's system is designed for easy integration into existing production linesPhoto: Company

Procero, a company focused on enabling edge AI use cases, is making significant strides in empowering businesses to run AI applications locally and within their own environments. In a recent interview, Board Director Dr. Richard Reiner discussed Procero's mission, its technology's potential, and its views on the evolving AI landscape.Procero's core focus is to enable AI applications, including Large Language Models (LLMs) and other generative AI, to operate on-premise, addressing critical concerns around data privacy, cost-efficiency, and latency. Dr. Reiner highlighted the increasing demand for edge AI solutions, driven by the need to avoid reliance on large, cloud-based environments."The demand for running AI on the edge is very strong, but the availability of edge AI solutions has been limited," Dr. Reiner stated, emphasizing Procero's commitment to enhancing the capability of edge devices to handle more complex AI use cases with greater performance.Procero sees strong potential across several vertical markets, including advanced manufacturing, cybersecurity, network intelligence, telecom-based edge computing, smart mobility, and healthcare. Dr. Reiner pointed out healthcare as a key area where edge AI solutions are crucial due to privacy regulations.Strategic partnerships across the AI ecosystemProcero is actively seeking to collaborate with key players across the AI technology ecosystem. This includes:*Semiconductor companies: Procero aims to partner with companies producing NPUs, GPUs, or TPUs, particularly those focused on edge devices for AI PCs, AI-enabled mobile devices, and IoT devices. Procero's software solution can significantly expand the capability to run AI applications on these systems.*Device OEMs: Procero also targets device Original Equipment Manufacturers (OEMs) that integrate semiconductor and memory technology into finished products like IoT devices, mobile phones, and laptops. The company offers its software to enhance AI capabilities at the device level.*Application vendors: Recognizing the importance of application-specific AI implementations, Procero seeks to collaborate with vendors developing AI-driven applications such as chatbots, image generation, and video generation for various devices. Procero's edge-optimized inference engine can be embedded within these applications to improve performance.Early success and strong IP moatFounded at the end of 2023, Procero has quickly advanced from its R&D phase to having its first commercially available product and is engaging with major companies. The company was founded within a venture lab in Montreal called Tandem Launch, and its technology is based on intellectual property licensed from leading university research institutions as well as additional IP developed within the company.Procero has a strong IP moat with multiple families of issued patents and ongoing patent applications. Dr. Reiner believes this robust IP protection differentiates Procero and safeguards its innovations.Experienced leadership teamProcero boasts a strong leadership team, including CEO Audrey Larocque, who brings extensive experience in venture-backed companies and fundraising, and CTO Dr. Vahe Vardanyan, a seasoned AI expert with over a decade of experience, including a background at one of Canada's leading government research AI institutions and Ubisoft. The team also includes VP of Engineering François Painchaud, who has led engineering teams at companies like Autodesk, Epic Games, and Unity Technologies.Impact of DeepSeek and AI advancementsThe emergence of models like DeepSeek has brought both excitement and controversy to the AI field. While acknowledging the concerns around the training process of DeepSeek, Dr. Reiner highlighted the novel techniques it introduced that have led to efficiency gains."They did introduce a number of novel techniques that lead to gains in efficiency," Dr. Reiner noted, adding that these techniques are being adopted by various organizations.Dr. Reiner confirmed that Procero's inference engine is compatible with and enhances the performance of models like DeepSeek, demonstrating its adaptability and value in the evolving AI landscape.Business model and future visionProcero's business model centers around licensing its technology to companies who will bundle it with their products, including software solutions, devices, and applications. While licensing terms are currently negotiated on a case-by-case basis, Procero is working to establish replicable formulas.Looking ahead, Procero is focused on expanding its hardware platform coverage, optimizing its technology for new processor designs, and increasing its support for various AI model types. The company is also committed to growing its team with top-tier talent and is open to establishing R&D centers globally.With a clear vision and a strong technological foundation, Procero is well-positioned to capitalize on the growing demand for edge AI solutions and drive innovation in the AI era.Procero inference engine solution for edge AI. Credit: ProceroBenefits of Procero inference engine for edge AI. Credit: ProceroThe architecture of the Procero inference engine for edge AI. Credit: Procero

Smiths Interconnect, a leading provider of innovative solutions for critical semiconductor test applications, today announced the launch of DaVinci Gen V, the latest flagship product in its DaVinci series portfolio.The product rigorously tests semiconductor chips during the manufacturing process to ensure they provide ultra-reliable and repeatable performance. This is important because these chips are used in a range of areas essential to everyday life, including AI accelerators, automotive systems, and next-generation 6G communications networks, which are set for global rollout over the next few years.The DaVinci Gen V solves the fundamental industry challenges of impedance tuning – an essential part of circuit design that enables the maximum transfer of signal power – and signal integrity – the measurement of the quality of an electrical signal as it travels through a circuit. By tackling these challenges the DaVinci Gen V ensures reliable, super-high performance in electronic systems and testing.Brian Mitchell, Vice President of Smiths Interconnect's Semiconductor Test Business Unit, said: "This innovation empowers semiconductor manufacturers to test faster, more reliably, and with greater precision – ensuring their products meet the demands of AI, 6G, and next-generation technologies. More than just a product, DaVinci Gen V embodies Smiths Interconnect's commitment to advancing semiconductor testing through continuous innovation."The technical specificationThe product delivers breakthrough high-speed signal transmission performance. It enables unprecedented digital signaling speeds of up to 224 Gbps PAM4 for AI accelerators and beyond 100 GHz for 6G communications – these speeds are crucial for supporting the growing demand for massive data transfer.The product also supports the growing complexity of modern integrated circuits, accommodating a 40% increase in next-generation ASIC (application-specific integrated circuits) sizes. ASICs are powerful computer chips that combine several different circuits all on one chip, in a 'system on a chip' design.As next-generation integrated circuits continue to evolve – doubling in bandwidth and computational power every two years – DaVinci Gen V is designed for seamless integration. It maintains full compatibility with existing test hardware, allowing manufacturers to transition effortlessly, reduce development cycles, and accelerate time-to-market.Brian Mitchell, Vice President of Smiths Interconnect's Semiconductor Test Business Unit.Credit: Smiths Interconnect

SK hynix (or "the company") announced today that it recorded KRW17.6391 trillion in revenues, KRW7.4405 trillion in operating profit (with an operating margin of 42%), and KRW8.1082 trillion won in net profit (with a net margin of 46%) in the first quarter this year.Both revenues and operating profit are the 2nd highest records following last quarter when the company achieved its best quarterly results. Operating margin improved by 1%p compared to the previous quarter to 42%, resulting in 8th consecutive quarterly growth.SK hynix explained that memory market ramped up faster than expected due to competition to develop AI systems and inventory accumulation demand. The company responded to the demand with an expansion in sales of high value-added products such as 12-layer HBM3E and DDR5.The company believes the strong financial results despite a low seasonality reflect its outstanding competitiveness compared to the past. The company plans to focus on enhancing the business fundamentals to achieve distinguished financial outcome, even in times of market correction.Based on the financial result, cash and cash equivalents increased by 0.2 trillion won to KRW14.3 trillion at the end of the first quarter, compared to the end of 2024, leading to an improvement in the debt and net debt ratio to 29% and 11%, respectively.SK hynix will continue to strengthen collaboration with supply chain partners to meet customer needs despite demand fluctuation amid global uncertainties.Due to the characteristics of the HBM market that supply volume is mutually agreed a year in advance, the company maintains its earlier projection that HBM demand will approximately double compared to the last year. As a result, sales of 12-layer HBM3E are expected to favorably increase to account for over 50% of total HBM3E revenues in the second quarter.In addition, the company started to supply LPCAMM21, high performance memory module for AI PC, to customers in the first quarter and plans to supply SOCAMM2, a low-power DRAM module for AI servers, when demand ramps up.1 Low-Power Compression Attached Memory Module (LPCAMM2): LPDDR5X-based module solution that provides power efficiency and high performance as well as space savings. It has the performance effect of replacing two existing DDR5 SODIMMs with one LPCAMM22 Small Outline Compression Attached Memory Module (SOCAMM): A low-power DRAM-based memory module for AI serverFor NAND, the company plans to actively respond to demand for high-capacity eSSD, while maintaining profitability-first operation with cautious approach for investment."In compliance with the 'Capex Discipline', SK hynix will focus on products with demand feasibility and profitability to enhance investment efficiency," said Kim Woohyun, Chief Financial Officer. "As an AI memory leader, we will strengthen collaboration with partners and carry out technological innovation in efforts to continue profit growth with industry-leading competitiveness."�� 1Q25 Financial Results (K-IFRS)*Unit: Billion KRW 1Q25QoQYoY 4Q24Change1Q24ChangeRevenues17,639.119,767.0-11%12,429.642%Operating Profit7,440.58,082.8-8%2,886.0158%Operating Margin42%41%1%p23%19%pNet Income8,108.28,006.51%1,917.0323%�� Financial information of the earnings is based on K-IFRS�� Please note that the financial results discussed herein are preliminary and speak only as of April 24, 2025. Readers should not assume that this information remains operative at a later time.

Footprintku AI, the global leader in electronics digital data services, made headlines at the 2025 AI EXPO with the debut of its groundbreaking DFM-oriented ECAD Library cloud platform. Co-founder YT Chen delivered the keynote address, unveiling how Footprintku's proprietary AI technologies are transforming traditional ECAD library workflows.At the heart of the announcement was Footprintku's ability to digitize unstructured PDF component datasheets—traditionally intended for human reading—into machine-readable formats. With its self-developed Intelligent Digitization Technology (IDT), which integrates image processing, semantic analysis, multiple knowledge bases and AI models, Footprintku automates the extraction and conversion of data that engineers previously had to calculate and input into EDA software manually.A highlight of the event was the live demonstration of FPK SpecLens, a knowledge-based interactive chatbot that made its first public appearance. Through natural language queries, engineers can quickly retrieve and compare data from spec datasheets, drastically reducing the manual effort in handling those documents.Another key innovation introduced was the DFM Assistant, the world's first system to digitize Design for Manufacturing (DFM) data. This tool converts traditionally experience-based DFM knowledge into structured, reusable digital assets—ensuring knowledge retention, improving design consistency, and enhancing quality control across development teams.With years of deep involvement in ECAD Library development and collaborations with top-tier global companies, Footprintku has accumulated extensive expertise in DFM domain. Their platform represents a shift from labor-intensive, error-prone DFM processes to a structured, automated, and programmable solution—enabling users to generate ECAD Libraries tailored to their DFM rules with just a few parameter settings."Footprintku.ai is more than a data platform," said the co-founder YT Chen. "It's a scalable service that shares our technology and years of expertise with the industry. Even companies with limited R&D budgets can adopt automated design workflows, shorten time-to-market, and boost competitiveness."The platform drew strong interest at the expo, with many component suppliers, system integrators, and engineers visiting the booth. Attendees praised its innovation and practicality, with many registering on the spot to gain early access.As Footprintku.ai continues to evolve, it is poised to become an indispensable tool for engineers and a driving force behind digital transformation in the electronics industry.

The explosion of edge AI is reshaping the mission of ultrabooks, transforming them from mere productivity tools into real-time intelligent terminals. From real-time voice translation to generative AI for images and localized large-model inference, higher challenges are proposed for storage systems, that is, delivering high-frequency data throughput while optimizing efficiency in a millimeter-scale footprint. Traditional storage solutions often struggle to balance performance, dimension, and expandability. However, BIWIN Mini SSD introduces a new approach by leveraging technological innovations in spatial reconstruction and modular design, providing ultrabooks with a fresh solution.01 Spatial Reconstruction: Enabling Design Flexibility Through Extreme MiniaturizationIn the quest for every gram and millimeter in ultrabooks, traditional M.2 SSDs have become a bottleneck in space optimization. The bulky physical footprint forces manufacturers into difficult trade-offs between battery capacity, thermal modules, and AI acceleration chips, often leading to compromises in either battery life or performance.Underpinned by advanced LGA packaging technology, BIWIN Mini SSD compresses the storage module to just 15×17×1.4mm, reducing its footprint to only 8.3% of a standard M.2 2280 SSD. This breakthrough miniaturization frees up valuable space inside the device, enabling ultrabooks to achieve more optimized functional integration. It allows for larger batteries to mitigate AI workload power consumption, optimized thermal solutions for sustained high-load performance, and provides room for AI components such as NPU chips and LiDAR sensors, paving the way for advanced on-device AI interactions.Underpinned by advanced LGA packaging technology, BIWIN Mini SSD compresses the storage module to just 15×17×1.4mm. Credit: Biwin02 Modular Revolution: Redefining Storage Expansion LogicMost ultrabooks today feature soldered storage, leaving users stuck with a fixed configuration for the entire lifespan of the device. Manufacturers, in turn, must maintain multiple SKUs to accommodate different storage capacities, adding unnecessary supply chain costs.BIWIN Mini SSD introduces a standardized slot-based plug-and-play structure, simplifying storage upgrades to a three-step process: "open, insert, and lock." This delivers dual benefits. For users, it empowers creators to expand storage capacity on demand and enables developers to quickly set up local AI testing environments. For manufacturers, modular configurations reduce production complexity, minimize after-sales service needs, and reshape product lifecycle management.03 Uncompromised Performance: Matching Mainstream Consumer PCIe SSDsWhile achieving breakthroughs in miniaturization and modularity, BIWIN Mini SSD makes no sacrifices in performance. Powered by a PCIe 4.0 ×2 high-speed interfaces, it delivers sequential read/write speeds of up to 3700MB/s and 3400MB/s, respectively—on par with mainstream consumer-grade M.2 SSDs—while offering capacities up to 2TB. This ensures ultrabooks can achieve "smaller size, uncompromised performance," directly supporting the storage demands of edge AI applications:• Efficient Model Loading: Meets the rapid loading needs of multi-gigabyte AI models, reducing startup latency for local inference tasks.• Stable Data Throughput: Ensures smooth performance in high-load scenarios like real-time 4K/8K video processing and multi-layer rendering in design software.• Low-Power, High-Performance Balance: Utilizes dynamic SLC caching to significantly boost read/write performance while maintaining high output within limited power constraints.While achieving breakthroughs in miniaturization and modularity, BIWIN Mini SSD makes no sacrifices in performance. Credit: Biwin04 From Hardware Innovation to Ecosystem Transformation: Mini SSD Pioneers a New Paradigm for Edge IntelligenceAs the fusion of AI and intelligent terminals accelerates, storage must evolve to enhance device performance and enrich application scenarios across multiple dimensions: scalability, lightweight design, energy efficiency, and operational stability. Leveraging its core strengths in IC design, storage solutions, and advanced packaging and testing technology, BIWIN is well-positioned to meet the diverse needs of customers and markets comprehensively.The technological breakthrough of BIWIN Mini SSD represents a fundamental reinvention of storage solutions for edge AI. This not only marks a major step forward in optimizing physical space within devices but also provides manufacturers with greater design flexibility and expanded capabilities in product definition. More efforts can be concentrated on boosting AI computing power and advancing innovations in human-machine interactions, unencumbered by the compromises traditionally imposed by storage design. Meanwhile, users are afforded the freedom of "expansion on demand," thereby achieving a precise correspondence between their intelligent terminals and individual requirements.

TCL CSOT, a global leader in display technology innovation, is making a significant presence at TouchTaiwan 2025, held from April 16-18, showcasing its electronic paper display solutions under the company's advanced APEX technology brand.Credit: TCL CSOTTCL CSOT's APEX display technology brand continues to push boundaries in visual experience. APEX is built on the brand core of "PACE TO APEX". It is set to deliver a pleasant display experience, reliable vision health, sustainable green and low carbon, and unlimited future imagination for users worldwide. Under the exhibition theme "Forward Together," TCL CSOT presents an impressive array of electronic paper displays that combine ultra-low power consumption, eye protection, and sustainable design, reinforcing the company's commitment to eco-friendly display technologies.The 9.7" E-paper Table Card redefines intelligent office environments with its paper-like display and bistable technology that consumes power only when refreshing, providing over six months of battery life on a single charge. Users can update content conveniently through Bluetooth or NFC connections from mobile devices or PCs.Credit: TCL CSOTTCL CSOT's electronic paper signage solutions, available in various sizes (25.3", 28.3", 31.5", 42", and 75"), all feature full-color display capabilities, reflective imaging for clear visibility without backlighting, and impressive battery life of up to 18 months with approximately 3,000 image refreshes per charge. The 28.3" model incorporates new oxide technology for faster refresh rates, enhancing the user experience while maintaining ultra-low power consumption. These signage solutions support multiple connectivity options, including Wi-Fi, Bluetooth, 4G, and USB for flexible content management.For personal use, the company showcases the 13.3" E-Paper Photo Frame and 4" Electronic Paper Phone Case. Both utilize the same advanced e-paper technology, offering full-color reproduction without the eye strain associated with traditional backlit displays.Credit: TCL CSOTThrough these Electronic Paper Display products, TCL CSOT continues to push the boundaries of display technology, creating more immersive and sustainable visual experiences across all consumer electronics categories while reinforcing its leading position in advanced display solutions.Visit TCL CSOT's YouTube for more information: https://www.youtube.com/@TCLCSOT

The application of artificial intelligence (AI) has emerged as a driving force behind global technological innovation. As AI adoption proliferates, the mastery of semiconductor chip technology becomes paramount for success. The escalating complexity and design costs of chips are fueling the rapid evolution of electronic design automation (EDA) and upstream chip design solutions. Altair, a global leader in computational intelligence, has rapidly established a foothold in EDA and multi-physics simulation tools for electronic systems and the semiconductor industry.In an exclusive interview, Sarmad Khemmoro, senior vice president of Technical Strategy for electronic design and simulation at Altair, highlighted the company's strategic acquisitions to bolster its EDA and multi-physics simulation offerings. Leveraging its Detroit, Michigan roots in the automotive hub, Altair has cultivated 40 years of experience serving major automotive manufacturers with its mechanical systems functional verification and simulation software. Its core clientele spans automotive, aerospace, industrial systems, and consumer electronics. The surge in AI and advanced driver-assistance systems (ADAS) within the smart vehicle sector has propelled Altair's expertise in system-level functional simulation.As electronic designs, including electronic control units (ECUs) and ADAS, increasingly permeate automotive systems, Altair has expanded into electronic system functional verification and automotive printed circuit board (PCB) validation. Emphasizing design for manufacturability (DFM) verification, Altair's solutions encompass simulation and validation across logical, physical, thermal, electrical, and mechanical domains.Altair's EDA Strategy Targets System-Level Functional Verification and SimulationKhemmoro observes that AI is central to the current technological transformation. With a widening talent gap and the rise of intricate and diverse designs, traditional simulation tools often require days to yield results, incurring substantial costs. AI-driven automation is therefore crucial to enhance analysis and simulation efficiency, making AI integration a highly competitive field in EDA.About a decade ago, Altair embarked on expanding its EDA and simulation portfolio. Unlike the established EDA giants, Altair focuses on niche products, particularly system-level EDA verification and simulation tools. A key offering is Altair® PollEx™, a comprehensive suite for PCB design review, analysis, and verification, catering to electrical, electronic, and manufacturing engineers. PollEx PCB Verification detects manufacturing, assembly, and electrical defects early in the design phase, reducing costs and accelerating development cycles.PollEx is an open solution that supports various ECAD, EDA, and CAE file formats, facilitating collaboration among PCB design experts. It enables improved board layout, signal integrity, power integrity, and electromagnetic compatibility (EMC) verification, and seamlessly integrates with multi-physics simulation environments.Multi-Physics Simulation: A Cornerstone for 3D IC Advanced Packaging and PCB DesignAltair's multi-physics simulation solutions, evolving from structural simulation tools, address critical design challenges. Altair® SimLab®, a process-oriented multi-disciplinary analysis platform, automates structural stress, vibration, and drop test performance, delivering accurate and consistent results.The rise of 3D IC design has increased demand for multi-physics simulation and verification of large 3D packaged chips and PCBs. Khemmoro notes the importance of simulating thermal stress at the chip-package level and fluid, thermal effects, fatigue, warpage stress, and EMC at the PCB and system level. These simulations are vital for large electronics systems in automotive, medical, military, and industrial applications, where long lifecycles, harsh environments, and complex supply chains are standard.Altair's AI Studio solution facilitates AI predictive modeling for engineering design, further enhancing PCB design agility.DSim: Cost-Effective ASIC and FPGA Design Simulation and DebuggingAltair's acquisition of Metrics Design Automation and its DSim™ solution expanded its EDA capabilities. DSim leverages cloud-native environments and integrates with major cloud providers (Google Cloud, Microsoft Azure, AWS) to reduce computational costs. Optimized for speed, capacity, and accuracy, DSim, combined with Altair's Silicon Debug Tools®, offers robust functional verification, simulation, and debugging on desktops, servers, or in the cloud, supporting large regression tests.This pay-as-you-go model provides a cost-effective alternative to the expensive IC design verification market. DSim supports ASIC and FPGA digital circuit simulation using System Verilog and VHDL RTL, employing parallel processing for accelerated testing.Altair's strong automotive client base, coupled with its experience serving EMS providers and consumer electronics manufacturers, underscores its industry leadership. As a TSMC Open Innovation Platform (OIP) partner, Altair aims to empower Taiwan's semiconductor and IC design sectors in the AI era.Altair will host its biennial Altair Technology Conference Taiwan in Taipei on May 28, 2025, featuring insights from Altair's CTO, chief engineers, and industry leaders. The conference will explore CAE, AI, and HPC advancements. For details, visit: https://events.altair.com/atc-taiwan-2025/.Altair Technology Conference Taiwan 2025. Credit: Altair

Rugged embedded computer brand — Cincoze, will be at North America's largest automation technology exhibition - Automate 2025 (Booth 232) in Detroit, USA, on May 12–15, 2025. Cincoze will display its range of industrial embedded computing products around the theme of "Edge AI, Smart Integration," encompassing the full spectrum of industrial application environments in four dedicated zones for GPU Computers, DIN-RAIL Computers, Rugged Embedded Computers, and Industrial Panel PCs and Touch Monitors. GPU computer zone: Key for edge AI computingCincoze GPU Computing — GOLD product line provides computing performance and AI inference capabilities to meet the demands of real-time processing and image analysis in rapidly expanding Edge AI applications. Cincoze will showcase the GJ, GM, and GP series for light, medium, and heavy AI applications. The NVIDIA Jetson SoM GPU-equipped GJ series provides low power consumption with efficient AI boost for Light AI applications. The GM series supports MXM GPU modules and offers rich expansion flexibility, making it a long-time customer favorite for mobility or Medium AI applications. The GP series supports up to two 250W high-end GPU cards and has patents for heat dissipation, scalability, and vibration-proof stability, making it the first choice for Heavy AI applications. All series meet EN50121-3-2, E-mark, and MIL-STD-810H standards, ensuring reliable operation in harsh industrial environments. DIN-RAIL computer zone: Performance for smart machinesThe new Cincoze Machine Computing – MAGNET product line provides the compact size, high computing performance, and multiple rich connections for industrial computing in smart machines. The MD-3000 series is the most powerful and complete model in the product line supporting high-performance, the best operating interface, and small size, making it easy to integrate into various control cabinet. The flexible scalable design allows for 2, 4, or 6 expansion boxes, including nearly 20 I/O, storage, and wireless modules to meet the varied connection and function requirements for smart machines. Rugged embedded computers zone: Reliability in harsh environment Cincoze Rugged Computing – DIAMOND product line of industrial computers are designed to face the harsh environmental challenges of edge computing in manufacturing, transportation, maritime, military, and more. The seven series in the DIAMOND line support wide temperatures and voltages, have industrial-grade protections, and enable users to select performance, expandability, size, power consumption, and industry certifications according to application specifications. Every model can be configured to support additional I/O and functions through Cincoze's exclusive modular expansion technology. Industrial panel PCs and touch monitors zone: 250+ options for HMICincoze Display Computing – CRYSTAL product line is for critical HMI solutions across diverse industrial applications. There are nearly 250 combinations across three series, including industrial panel PCs (CV/P series) and monitors (CV/M series) for harsh indoor environments, sunlight readable panel PCs (CS/P series) and monitors (CS/M series) for high brightness outdoor environments, and open frame panel PCs (CO/P series) and monitors (CO/M series) for seamless integration in advanced machine equipment. The CRYSTAL line offers a range of performance, screen size, display ratio, and touch options, includes IP65 dustproof and waterproof front panels, and complies with US UL safety standards, providing a complete and comprehensive selection for any HMI application.AUTOMATE 2025 InformationDateMon. – Thu., May 12 - 15, 2025LocationHuntington Place Convention Center in Detroit, Michigan, USABooth232Opening time· Monday, May 12, 10:00 am – 5:00 pm· Tuesday, May 13, 10:00 am – 5:00 pm· Wednesday, May 14, 10:00 am – 5:00 pm· Thursday, May 15, 10:00 am – 3:00 pm About CincozeCincoze is a brand manufacturer dedicated to providing embedded computing systems for edge computing, AIoT, and critical applications in harsh environments. Its product lines include rugged embedded computers, industrial panel PCs, industrial monitors, and embedded GPU computers. Cincoze products meet the application needs of various vertical markets, especially manufacturing, in-vehicle, railway, transportation, energy, and logistics. Over the years, Cincoze has launched numerous innovative products and has won several patents, awards, and international certifications.