Macronix, a leading global non-volatile memory (NVM) integrated device manufacturer, has launched its all-new ArmorBoot MX76 series flash memory. The ArmorBoot MX76 is designed for rapid initialization of electronic devices in diverse application scenarios. Authentication, data protection, and configuration are all completed simultaneously to provide Macronix customers with the winning edge in very challenging AI environments.Even as digital products become more and more diverse, market expectations on security, startup speed, and version updates have continued to increase as well. ArmorBoot is designed to speed up boot times. It is equipped with the standard SPI interface and supports both 1.8V and 3V for optimal power efficiency. The integration of advanced encryption algorithms, authentication, and data integrity verification technologies ensures data security at every stage of system operation. In addition to rapid authentication when a device is started for the first time, it also protects critical data against external interference during system upgrades and updates.#ArmorBoot MX76: Providing the ultra-fast startup time the market has been clamoring forIn today's highly connected environment, risks such as data leaks, data theft, or systems being paralyzed by hacker attacks have become all too real. Device boot times and data protection during the update process now play a crucial part in protecting system stability and user experience. C.T. Yeh, Project Department Manager of Product Marketing at Macronix, stated that legacy electronic devices are generally unable to provide both security and performance during the startup process. ArmorBoot MX76 was developed to satisfy this particular requirement. The product's high-speed boot capability is combined with encryption technology and a secure boot mechanism to complete the authentication and data verification processes several times faster than legacy solutions. Data integrity and security are also assured at every step.The ArmorBoot MX76 owes its outstanding performance during system updates to its enhanced anti-replay attack mechanism. Protection against unauthorized attacks during version updates or execution of secure commands by the system effectively prevents data tampering, malicious attacks, and virus infections. If the system is subjected to security threats or anomalous situations, the integrated advanced protection mechanism switches rapidly over to a secure mode to maintain system stability and greatly reduce security risks. Whether or not used for initial startup or system upgrades/updates, ArmorBoot MX76 works quickly and effectively to protect data against external threats.The previous generation of ArmorFlash products from Macronix, ArmorFlash MX78, won rapid market acceptance upon its release. It was not only adopted by enterprise customers such as Nvidia and Renesas Electronics, but also won the Taiwan Excellence Award and other top product accolades. ArmorFlash MX78 has been successfully applied to a number of fields, including AI, industrial automation, and automotive electronics. As the newest member of the ArmorFlash family, ArmorBoot MX76 was developed by Macronix to satisfy even more demanding market expectations: designs focused on rapid startup for electronic products and seamless updates through rapid and secure data protection and system verification.C.T. Yeh, Project Manager of Product Marketing at Macronix. Credit: Macronix#Smart integration for high-performance and seamless upgradesArmorBoot MX76 features not only advanced data security technology but also enhanced system compatibility. Yeh noted that the product adheres to the widely adopted SPI interface standard for ease of integration with and seamless migration to existing platforms without major hardware changes, further reducing upgrade costs for customers. Whether in embedded systems, smart homes or IoT devices, users can now enjoy the high performance and security offered by ArmorBoot MX76 without having to make extra changes to their circuitry or install new security components.ArmorBoot MX76 is based on Macronix's advanced production process to deliver consistent product quality and high performance. Exceptional production yield and operating performance make this a solution that combines both security and performance, as well as the ideal choice for equipment upgrades or integration of existing systems. Available capacities range from 256 MB to 1 GB.ArmorBoot MX76 Secure Boot Serial NOR Flash was voted Best Memory Solution of the Year at the 2024 EE Awards and has already received inquiries from a number of Tier 1 vendors. According to Yeh, future applications include industrial control, automotive IoT, healthcare, AI, and even WiFi/Bluetooth devices, so the market outlook for ArmorBoot MX76 is very promising.As the pace of digital transformation continues to speed up, Macronix is not only engaging in continued innovation in memory technology but also paying close attention to market requirements on device startup and update security. Macronix will therefore continue to focus on innovative technologies and work with global customers on the promotion of digital transformation. Even more competitive solutions will be developed for different kinds of future application scenarios to help customers maintain their leadership in a very challenging market environment.

Taipei, Taiwan, March 27, 2025 – As a global provider of rugged industrial computer solutions, Darveen recognizes rugged tablets as the ideal companion for manufacturing. From warehouses to shop floors, these devices enable workers to access key data anytime, significantly boosting operational efficiency. The newly launched RTC-I116 is the perfect embodiment of this vision, helping warehouse staff monitor inventory and assisting maintenance teams in identifying equipment issues to maximize machine uptime.Built to withstand harsh environmentsThe RTC-I116 is designed for demanding industrial settings, meeting IP66 and MIL-STD-810H standards for drop, shock, and water resistance. It operates reliably in extreme temperatures ranging from -20°C to 60°C. Its 11.6-inch FHD (1920 × 1080) widescreen display ensures crisp visuals, allowing operators to view critical data with precision and efficiency.Credit: DarveenSeamless connectivity for optimized operationsPowered by Intel® Core™ i7-1255U/i5-1235U processors, the RTC-I116 supports Bluetooth, Wi-Fi 6E, 5G/4G, and GPS to ensure stable data transmission and real-time communication. These connectivity features enhance navigation, product identification, and logistics tracking, while also supporting equipment monitoring and maintenance, streamlining warehouse and manufacturing workflows.Credit: DarveenHot-swappable battery for continuous operationThe RTC-I116 is equipped with a 58.5Wh dual hot-swappable battery, allowing users to replace batteries while the device remains powered on. This ensures uninterrupted operation, making it ideal for shift-based environments where downtime is not an option.Credit: DarveenFlexible expansion for versatile applicationsTo enhance asset and equipment management, the RTC-I116 offers up to eight I/O ports, enabling seamless integration with various devices for real-time monitoring and diagnostics. It also features a built-in 2D barcode scanner and a modular expansion slot that supports an optional UHF RFID reader, improving material tracking and inventory management for smarter warehouse and production operations.The RTC-I116 also offers a range of optional accessories to enhance adaptability for various field applications, including an office dock, 2-bay battery charger, hand strap, shoulder strap, and stylus.For more information about the Darveen RTC-I116, please visit: https://www.darveen.com/product/11-6-rtc-i116-windows-rugged-tablet-with-intel-core-i-processor/For the Darveen RTC-I116 video, please visit: https://youtu.be/AdOXBV9Ed30?si=Nd34Oi7Iq3uFuc2

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out the world's first HBM4 controller and PHY IP. This test chip was implemented using TSMC's cutting-edge N3P process technology and CoWoS-R advanced packaging technology.The HBM4 IP supports data rates of up to 12 Gbps under all operating conditions. By leveraging a proprietary interposer layout, GUC has optimized signal integrity (SI) and power integrity (PI) to achieve these high speeds for all types of CoWoS technology. Compared with HBM3, GUC's HBM4 PHY delivers 2.5x bandwidth while improving 1.5x power efficiency and 2x area efficiency. In line with previous GUC HBM, GLink, and UCIe IPs, this HBM4 IP integrates proteanTecs' interconnect monitoring solution to provide high visibility for testing and characterizing the PHY while improving in-field performance and reliability for end products.This milestone further strengthens GUC's comprehensive portfolio of advanced IPs, including its 32Gbps UCIe-A and GLink-3D IPs. Together, these offerings deliver a complete 2.5D and 3D total solution, empowering customers to address the most demanding applications in AI, high-performance computing (HPC), and beyond."We are proud to be the first company to have taped out a 12Gbps HBM4 controller and PHY IP," said Sean Tai, President of GUC. "Our commitment to delivering best-in-class 2.5D/3D IPs and services remains strong. By integrating HBM4, UCIe-A, and GLink-3D IPs, we offer a comprehensive solution that meets the evolving needs of the semiconductor industry."GUC HBM4 IP Highlight• Signed off at 12 Gbps in full range of corners and operating conditions• High bus utilization rate: ~90% at random read/write access• Proprietary interposer layout to achieve best SI/PI for all types of CoWoS technology• Embedded per-lane, in-mission mode I/O and Clock performance and health monitoring by proteanTecs

The memory market is undergoing a significant transformation as suppliers pivot from traditional inventory-based models to forecast-driven production.This shift, highlighted in Fusion Worldwide's State of the Industry Report | 2025 | Volume 1, signals tighter supply controls and potential price volatility. For businesses reliant on DRAM, NAND, and memory, understanding these changes is critical to maintaining supply chain resilience and competitive advantage.Memory Market Shifts from Inventory to ForecastingIn recent years, the memory market has been characterized by cycles of oversupply and shortages, leading to price instability. To combat this, memory suppliers are now prioritizing forecast-driven procurement over stockpiling inventory. This strategic shift aims to align production more closely with actual demand, reducing the risk of excess inventory and price crashes.According to Fusion Worldwide's State of the Industry Report, "IC manufacturers, worried about losses, are increasingly mirroring memory supplier tactics from last year by encouraging customers to submit forecasts to secure allocations. Without these forecasts, production cuts may be necessary to maintain profits." This approach reflects a broader industry trend toward tighter supply controls, with suppliers focusing on profitability and stability rather than volume.For businesses, this means longer lead times and more rigid allocation processes, particularly for high-demand products like and NAND flash. Companies that fail to adapt to this new model may face challenges in securing the components they need, especially during periods of heightened demand.What This Means for Procurement StrategiesThe transition to forecast-based supply management has significant implications for procurement teams. With suppliers prioritizing forecasts, businesses must adopt more strategic sourcing practices to ensure a steady supply of memory components. Here are key steps to consider:1.Monitor Pricing Trends Closely With reduced excess inventory, the memory market is likely to experience greater price volatility. Procurement teams should track DRAM and NAND pricing trends closely, using market intelligence tools to anticipate shifts and adjust strategies accordingly.2.Secure Long-Term Agreements In a tighter supply environment, long-term agreements with suppliers can provide stability. By locking in pricing and availability, businesses can mitigate the risk of shortages and unexpected cost increases.3.Diversify Sourcing Strategies Relying on a single supplier or region can be risky, especially in a constrained market. Companies should explore alternative sourcing options, including independent distributors, to access high-speed DRAM and SSD storage from multiple regions.4.Leverage Market Intelligence Staying informed about market trends and supply shifts is essential. Tools like Fusion Worldwide's State of the Industry Report provide valuable insights into pricing, lead times, and emerging risks, enabling businesses to make data-driven decisions.The Role of Market Intelligence in Sourcing StrategiesCompanies that actively track memory market trends and semiconductor supply chain shifts will be in a stronger position to navigate industry changes. Having real-time market intelligence allows procurement teams to:Identify early warning signs of supply shortages. Adjust inventory levels to match anticipated demand. Make data-driven decisions for contract negotiations.Leveraging market intelligence solutions ensures businesses remain agile and well-prepared for market fluctuations.Potential Price Volatility for 2025While the shift to forecast-driven production aims to stabilize pricing in the long term, it also introduces the potential for short-term volatility. Suppliers are taking a more deliberate approach to supply control, reducing excess inventory to avoid price crashes. However, this strategy leaves less room for error if demand surges unexpectedly.For example, a sudden increase in demand for high-capacity memory solutions could strain supply chains, leading to price spikes and extended lead times. Businesses that depend on these components must remain vigilant, using market intelligence to anticipate and respond to fluctuations.Final Thoughts: Preparing for a Tighter Memory MarketThe memory market's shift toward forecast-driven production represents a fundamental change in how suppliers manage supply and demand. While this approach aims to create a more stable and profitable market, it also places greater responsibility on businesses to adapt their procurement strategies.To navigate this evolving landscape, companies must prioritize market intelligence, diversify sourcing options, and secure long-term agreements. By staying proactive and informed, businesses can mitigate the risks of supply constraints and price volatility, ensuring a resilient and cost-effective supply chain.Our State of the Industry report provides a timely synthesis of market intelligence from our sourcing and procurement experts, as well as vetted suppliers. Download Fusion Worldwide's State of the Industry Report here.For more information visit fusionww.com, or follow Fusion Worldwide on LinkedIn, Instagram, WeChat, and X.Authored by:Kok How Yow, Global Commodity Director, Fusion Worldwide

Rugged embedded computer brand Cincoze has added a new 15.6-inch FHD display option for HMI applications in harsh environments to its Display Computing – CRYSTAL product line. Almost 20 new products have been launched at this time, including rugged industrial panel PCs (CV-W115FH/P) and monitors (CV-W115FH/M) suitable for general harsh environments, as well as sunlight readable panel PCs (CS-W115FH/P) and monitors (CS-W115FH/M) designed for high-brightness outdoor environments, providing even more comprehensive options across the CRYSTAL product line.Credit: Cincoze15.6-inch FHD industrial panel PC and monitor for smart manufacturing The Cincoze 15.6-inch industrial panel PC (CV-W115FH/P) and monitor series (CV-W115FH/M) offer exceptional picture quality for industrial applications such as displaying complex SCADA data or image monitoring. This is thanks to its FHD (1920x1080) resolution, 800:1 contrast ratio, and 16.7 million color display, which, when combined with resistive or capacitive touch and a wide 178° viewing angle, provide the optimal user experience. The backlight life of up to 50,000 hours ensures long-term stable operation. The panel PC series has various performance options, including Intel® Atom®, Pentium®, or Core™ to suit specific use cases.Credit: Cincoze15.6-inch FHD sunlight readable industrial panel PC and monitor for outdoor operationThe Cincoze 15.6-inch sunlight readable panel PC (CS-W115FH/P) and monitor (CS-W115FH/M) series are built for harsh outdoor environments, with a 1,200 nits high brightness screen ensuring readability even under direct sunlight outdoors. The series is built to withstand harsh conditions and features an IP65 waterproof and dustproof front panel, a shock-resistant aluminum die-cast front bezel, and a 7H hardness touch surface. They support wide temperatures (-20°C- 70°C) and wide voltages (9-48VDC), and include overcurrent, overvoltage, and ESD protection. The series is UL-certified and complies with the EN62368-1 standard, making it ideal for applications such as outdoor interactive information stations, charging piles, and automatic ticket vending machines.CDS simplifies maintenance and upgradesThe series utilizes Cincoze's exclusive CDS (Convertible Display System) technology for flexible configuration with computer modules (P2000/P1000 series) or monitor modules (M1000 series). This enables the creation of industrial or sunlight readable panel PCs and monitors suitable for industrial environments or outdoor use. The plug-and-play design means only a single module requires replacement during on-site maintenance, effectively shortening downtime, reducing maintenance costs, and facilitating future upgrades.

People growingly rely on their phones for navigating via GPS, communicating via satellite and checking weather forecasts. All these services that make our life more intelligent and convenient are made possible by space technology breakthroughs.Taiwan Accelerator Plus (TAcc+), an international startup program powered by the Industrial Technology Research Institute (ITRI), played a key role in facilitating a space industry delegation to the United Kingdom in March 2025. The program is sponsored by the Small and Medium Enterprise and Startup Administration (SMESA), Ministry of Economic Affairs, and executed by ITRI. SMESA served as the official organizer of the mission, while TAcc+ coordinated the activities and engagements throughout the trip.Taiwan's first team of space industry representatives exhibiting at Space-Comm Expo and holding Taiwan Country Showcase at the event to introduce Taiwan's space industry strength and spark off cross-border partnerships. Credit: ITRIThe Taiwan delegation brought together representatives from the private sector, academia, and government, including companies such as Hon Hai Precision, the Department of Space Science and Engineering at National Central University, and several emerging Taiwan-based space startups. Their participation in Space Comm Expo 2025 aimed to showcase Taiwan's growing space capabilities and foster international cooperation.With the support of ITRI's international partners—including Space South Central, ADS Group, the Department for Business and Trade (DBT), and the British Office in Taipei—the delegation also visited several key organizations in the United Kingdom space sector. These included the UK Space Agency, Airbus, Eutelsat OneWeb, Satellite Applications Catapult, STFC RAL Space, Surrey Satellite Technology Limited, Surrey Space Centre, and the 5G Innovation Centre. These visits offered the Taiwan delegation valuable insights into the United Kingdom space ecosystem and opened the door for future collaboration.This mission aimed to build lasting communication channels, deepen partnerships, and strengthen connections between the space and startup communities of both countries.As the largest and most influential space industry exhibition in the UK, Space-Comm Expo gathered more than 200 exhibitors from all over the world and received 5,900 visitors in 2025. At this year's event, ITRI organized a Taiwan pavilion, themed on 5G/6G, satellite manufacturing and application, Earth observation, and space applications, to showcase Taiwan-based startups' creativity and innovations.ITRI also secured opportunities to have the Taiwan team of exhibitors participate in technology sharing sessions and present their achievements at Space-Comm Expo forums, including Taiwan Country Showcase and the Global Space Industry Showcase. These opportunities allowed Taiwan-based startups to network with exhibitors from other countries and boost their visibility in the global marketplace.Two noteworthy events were held on March 11. The Taiwan Cultural Tea Reception took place at the Space-Comm Expo. UK-Taiwan Night, co-hosted with Space South Central, took place at UCL East. Well attended by government representatives and industry experts from different corners of the world, both events offered opportunities for face-to-face communication and media exposure that helped increase the Taiwan space industry's global visibility and sparked off cross-border partnerships.International SpaceTech Startup Supporting Program 2025 kicking off, welcoming international startups to TaiwanSMESA's International SpaceTech Startup Supporting Program has been running for years. The program has successfully brought a great many international startup teams to Taiwan, including Axiom Space, HEX20, and Reflex Aerospace. They have infused a new energy into Taiwan's space industry development. At the same time as ITRI led the delegation to participate in Space-Comm Expo, SMESA launched the 2025 International SpaceTech Startup Supporting Program, aiming to attract international startups with critical space technologies to Taiwan. The initiative is part of a broader effort to accelerate the upgrade and transformation of Taiwan's space industry. The program will connect selected international startups with Taiwan's space industry ecosystem resources through match-making visits to local companies, POC validations, and exhibition event marketing. Taiwan will serve as their gateway to Asian markets.The International SpaceTech Startup Supporting Program 2025 will focus on international startups endeavoring in communication satellite and system integration, remote sensing and imaging technologies for satellite application, small rocket manufacturing and launching, AI edge computing applications, ground equipment, satellite manufacturing, and other space technologies. The focus on satellite manufacturing is aimed at helping strengthen Taiwan's ability to design, assemble, and make satellites and drive high-performance satellite system development. The focus on remote sensing and imaging technologies for satellite applications is intended to drive advances in remote sensing and imaging technologies for their extended use in environmental monitoring, agriculture, and smart city. The focus on AI edge computing applications is for the purpose of enhancing Taiwan's ability to analyze satellite data and perform real-time computation while creating a diversity of space data application scenarios.On the foundation of the country's robust semiconductor, ICT, and precision machinery sectors, Taiwan's space industry is gaining attention in the global marketplace. Future synergy with international startups' technological strengthwill boost Taiwan's competitiveness in the global space sector and reenergize Taiwan's overall economic development.Visit https://taccplus.com/en/international-program/ for more information.Taiwan-UK Space Delegation being impressed by STFC RAL Space's achievements in large geosynchronous satellite integration and testing technologies. Credit: ITRITaiwan-UK Space Delegation visiting UK Space Agency. Credit: ITRI

Chenbro makes its first appearance at Nvidia GTC 2025, displaying the Nvidia GB300 Grace Blackwell Ultra Superchip compute tray and a full range of AI server chassis solutions based on the Nvidia MGX architecture, including 1U, 2U, and 4U models. At GTC, Chenbro not only highlights its product development expertise but also supports customers in demonstrating next-gen AI servers, promoting mutual growth in the server industry.Full range of Nvidia MGX products to meet enterprise and large CSP data center needsNvidia CEO Jensen Huang unveiled the transformative Nvidia GB300 NVL72 platform at the GTC keynote. Chenbro is showcasing the latest compute trays, featuring Nvidia GB300 and GB200 NVL72 solutions, and accelerated Nvidia ConnectX-8 SuperNIC and Nvidia BlueField-3 DPU networking capabilities, compatible with the NVL72 liquid-cooled rack at GTC. The 2U MGX chassis offers flexible configuration and future compatibility for enterprise applications, while the 4U MGX air-cooled and liquid-cooled chassis are tailored to meet enterprise data center needs.Chenbro CEO Corona Chen stated that with strong R&D and manufacturing capabilities, Chenbro has collaborated with Nvidia to offer a complete AI product line based on the Nvidia MGX modular architecture. Through Open Chassis, JDM/ODM, and OEM services, Chenbro provides server chassis solutions ranging from standardized products to fully customized development that meet the needs of system integrators and brand customers. This supports the diverse deployments of AI, HPC, and big data in data centers and enterprises.Deepening AI product development and creating a win-win collaboration modelChenbro made its debut at GTC, led by CEO Corona Chen. Nvidia GTC is an annual AI grand event that brings together thousands of developers, innovators, and business leaders from around the world to share how AI is driving the next generation of development. She stated that Chenbro has achieved outstanding results in the AI and cloud server sectors. At this year's GTC, several major tech companies showcased products co-developed with Chenbro, highlighting the industry's collaborative, win-win growth.Corona further emphasized that Chenbro will continue to increase its investment in AI server development, ensuring that Chenbro will not disappoint the market. With the localization of product development teams closer to customers and the implementation of a global manufacturing localization strategy, including the establishment of the USA NCT plant and a new factory in Malaysia, Chenbro will be able to meet global customer demands more quickly and accurately. Chenbro's operational goals for this year are expected to continue growing, with AI product development as a key driver.

As edge AI applications experience rapid proliferation, intelligent terminal devices, such as ultra-thin laptops, tablets, and AI edge computing terminals, are facing exponentially growing demands for storage performance and capacity. However, conventional storage solutions are increasingly revealing their inherent shortcomings:Traditional SSD expansion requires case disassembling, a cumbersome process necessitating specialized tools and technical expertise, which elevates after-sales service costs.While memory card solutions offer portability, CF cards are constrained by performance limitations, struggling to meet the high-speed read/write requirements of AI applications. High-end alternatives like CFexpress deliver comparable speeds but are hindered by limited interface compatibility and cost-effectiveness.Embedded storage options (such as eMMC and UFS) lack post-purchase expandability, making it difficult for terminal manufacturers to flexibly respond to users' growing storage needs.Addressing these challenges, BIWIN introduces the Mini SSD—a compact, modular, high-performance storage solution designed to empower terminal manufacturers to overcome the constraints of traditional storage systems and capitalize on emerging opportunities in the edge AI storage market.The BIWIN Mini SSD is featured with advanced LGA packaging processes, minimizing its dimensions to as compact as 15 × 17 × 1.4mm. Credit: Biwin01 Innovative Design for Seamless Storage ExpansionThe BIWIN Mini SSD is featured with advanced LGA packaging processes, minimizing its dimensions to as compact as 15 × 17 × 1.4mm, approximately only 15% of the area of a conventional M.2 2280 SSD, with a significantly thinner profile akin to a mobile SIM card. This drastic size reduction optimizes internal device space, unlocking greater flexibility for layout design, thermal management, and battery capacity enhancements.Building on this compact form factor, the Mini SSD introduces a pioneering "standardized slot-based plug-and-play" architecture to the SSD domain. Users can upgrade to terabyte-scale storage with a straightforward three-step process: open the bay, insert the card, and lock it in place. This tool-free physical upgrade approach revolutionizes the storage expansion experience, alleviating manufacturers from complex after-sales maintenance and inventory challenges while enabling true "storage capacity customization."Building on this compact form factor, the Mini SSD introduces a pioneering "standardized slot-based plug-and-play" architecture to the SSD dom. Credit: Biwin02 Flagship Performance, High-Speed Data Transfer Empowering AI ApplicationsDespite its miniaturized design, the Mini SSD delivers uncompromising performance. Equipped with a PCIe 4.0 ×2 high-speed interface, it achieves sequential read and write speeds of up to 3700MB/s and 3400MB/s, respectively—far surpassing typical memory card solutions and rivaling mainstream consumer-grade M.2 SSDs. This capability ensures seamless performance in high-demand scenarios such as AI model loading, 4K/8K video editing, and large-scale design software operation, fully meeting the stringent storage requirements of edge AI terminals.Flagship Performance, High-Speed Data Transfer Empowering AI Application. Credit: Biwin03 Technology-Driven Innovation for Competitive DifferentiationThe Mini SSD's core strengths stem from BIWIN's industry-leading expertise in storage solution development, IC design, and advanced packaging and testing processes, underpinned by a robust end-to-end supply chain. For terminal manufacturers seeking to differentiate their offerings in the AI era and avoid homogenization in the red ocean market, the Mini SSD presents a compelling pathway:Standardized interfaces and modular design help streamline BOM (Bill of Materials) management, reducing production and inventory costs.User-upgradeable storage capabilities minimize after-sales service demands, enhancing product lifecycle efficiency.Cutting-edge packaging and testing processes ensure stable high-frequency signal transmission and system reliability, elevating overall product quality and competitiveness.

SK Hynix Inc. (or "the company") announced today that it has shipped the samples of 12-layer HBM4, a new ultra-high performance DRAM for AI, to major customers for the first time in the world.The samples were delivered ahead of schedule based on SK Hynix's technological edge and production experience that have led the HBM market, and the company is to start the certification process for the customers. SK Hynix aims to complete preparations for mass production of 12-layer HBM4 products within the second half of the year, strengthening its position in the next-generation AI memory market.The 12-layer HBM4 provided as samples this time features the industry's best capacity and speed which are essential for AI memory products.The product has implemented bandwidth capable of processing more than 2TB (terabytes) of data per second for the first time. This translates to processing data equivalent to more than 400 full-HD movies (5GB each) in a second, which is 60 percent faster than the previous generation, HBM3E.SK Hynix also adopted the Advanced MR-MUF process to achieve a capacity of 36GB, which is the highest among 12-layer HBM products. The process, of which competitiveness has been proved through a successful production of the previous generation, helps prevent chip warpage while maximizing product stability by improving heat dissipation.Following its achievement as the industry's first provider to mass produce HBM3 in 2022, and 8- and 12-high HBM3E in 2024. SK Hynix has been leading the AI memory market by developing and supplying HBM products in a timely manner."We have enhanced our position as a front-runner in the AI ecosystem following years of consistent efforts to overcome technological challenges in accordance with customer demands," said Justin Kim, President & Head of AI Infra at SK Hynix. "We are now ready to smoothly proceed with the performance certification and preparatory works for mass production, taking advantage of the experience we have built as the industry's largest HBM provider."

To cope with the disruptive changes that generative AI is bringing across all sectors, companies today have soaring needs for AI talents with real-world experience, global vision and bilingual proficiency. Following the success of the first AIWave: Taiwan Generative AI Applications Hackathon, held in 2024, DIGITIMES again organizes the 2025 competition with the support from the National Development Council in Taiwan for the purpose of cultivating more world-class AI talents that will invigorate AI development for Taiwan's industries. The 2025 event will take place on April 26-27. Contestants will be able to utilize cloud and generative AI services from Amazon Web Services (AWS), including LLMs such as Amazon Nova, Anthropic Claude 3.7 Sonnet, the generative AI-powered assistant for software development - Amazon Q Developer, as well as the no-code, generative AI app builder - PartyRock. The competition is open to anyone in Taiwan, whether students or professionals.Contestants will be divided into a hacker group and an idea exchange group. They will tackle challenges set by renowned Taiwanese companies including Advantech, Chang Chun Group, Cooler Master, ETMall, Gamania Vyin AI, Taishin Financial Holding, and Walsin Lihwa.To build up competency, DIGITIMES and AWS will also hold preparatory workshops covering enterprise data workshops and generative AI workshops to guide teams in utilizing multi-agent collaboration, multimodal models, and large language model reasoning. A panel discussion on nurturing generative AI talents will also be held alongside AI EXPO 2025 from March 26-28 to broaden contestants' perspectives. There will also be a mentorship session from industry experts. After one month of training, teams will be able to create innovative applications and minimum-viable products in a secure environment using company data."Amid the sweeping generative AI wave, governments and leading high-tech companies around the world are pouring tremendous resources into AI development. To keep up with the strong trend, the Taiwanese government is making efforts toward fostering AI industry growth, strengthening domestic AI research capabilities, promoting cross-border collaborations, and training multi-lingual AI talents. These efforts not only set a clear roadmap for Taiwan's AI development but also signify the Taiwan government's determination to play a part in the global race for AI," noted DIGITIMES.DIGITIMES further commented "By organizing the hackathon and workshops, DIGITIMES aims to help Taiwan's developers and students leverage Taiwan's unique strength to create globally competitive generative AI applications. Taiwan has a well-established high-tech supply chain, an abundance of data resources, and a solid foundation for AI research. It is hoped that through the hackathon, Taiwan will develop innovations that overcome challenges the world faces today and usher in a new generative AI era." AWS remarked "Working with schools, governments and companies through AWS Educate, AWS Academy, Cloud Innovation School, and AWS Training Partner, which are programs for different talent incubation stages, AWS has trained more than 100,000 cloud professionals in Taiwan. For generative AI, AWS also launched AI Ready in 2023, a program that aims to provide free AI training and education resources to two million people around the world by 2025. It also teamed up with online learning platform Udacity to award scholarships to students while working with Code.org to teach students about generative AI.""A new AWS Region is coming to Taiwan in 2025. AWS also plans to invest billions of dollars over the next 15 years in Taiwan to support local digitization and AI developments. AWS hopes that more creative talents will be discovered at the hackathon and that its support will help not only transform Taiwan's industries but also build world-leading Taiwan-based unicorns," added AWS.Online registration for the 2025 AI Wave: Taiwan Generative AI Applications Hackathon is open until March 30, 2025. Both students and professionals are encouraged to register. Click here for more information.