OCZ Technology Group announced its new StealthXStream 600W power supply designed for the value-minded consumer seeking simple, quiet performance.

Taiwan-based IPC makers Aaeon Technology and Axiomtek recently announced AMD Geode LX-based products.

NEC Electronics America has announced the availability of two new metal-oxide-semiconductor field-effect transistor (MOSFET) families that help reduce heat generation in servers, motherboards and notebooks.

Thermaltake Technology recently announced its TMG ND4, a water-cooling solution for Nvidia 8800GTX graphics cards.

Samsung Electronics has announced it has developed an all-DRAM stacked memory package using "through silicon via" (TSV) technology.

VIA Technologies has announced the VIA VT6047 Pico-ITX form factor reference design, a small full-featured x86 motherboard designed for ultra-compact embedded PC systems and appliances.

Dell recently announced its Dell PowerVault LTO-4-120, a Linear Tape-Open drive storage device using the LTO-4 specification.

High Tech Computer (HTC) has announced at the Intel Developer Forum in Beijing that its new mobile computer, the HTC Shift, will be based on Intel's new Ultra Mobile Platform 2007.

Intel detailed more than 20 new products, technology innovations and industry initiatives aimed at making the Internet, computers and consumer electronics devices much more responsive, friendlier and secure, at the ongoing Intel Developer Forum (IDF) in Beijing.

Toshiba Storage Device Division (SDD) has announced collaboration with Intel to provide a family of 1.8-inch hard disk drive (HDD) solutions for the newest-generation ultra mobile PC (UMPC) and MID (mobile Internet device) platform architecture, which made its debut at the Intel Developer Forum (IDF) 2007 Conference in Beijing, China.