VIA Technologies and Everex jointly unveiled the notebook, which features a VIA C7-M processor and will be available through US retailers.The new StepNote NC1501 comes with a Windows Vista Home Basic operating system, a 15.4-inch widescreen display with DiamondBrite technology, a built-in wireless LAN and DVD burner. The notebook is powered by a 1.5GHz VIA C7-M processor, which is designed to provide ultra-low power consumption, advanced security features at a mere 12W peak power.The StepNote NC1501 is expected to aid users in reducing their overall electricity usage while lowering the total cost of ownership. According to the two companies, utilization of VIA Enhanced PowerSaver and TwinTurbo technology allow the notebook to dynamically transition between intermediate power states, providing users with 20% longer battery life than comparable systems.The notebook is available in Wal-Mart stores throughout the US and online through BestBuy.com and WalMart.com at a price of US$499. Everex StepNote NC1501 specifications Item Detail Processor 1.5GHz VIA C7-M processor Operating system: Genuine Windows Vista Home Basic Graphics: VIA Chrome9 HC IGP Memory: 512MB DDR2 533MHz SDRAM Sources: Everex, VIA, compiled by Digitimes, April 2007Everex StepNote NC1501 notebookPhoto: Everex

SiS has announced that its SiS671FX chipset is to be used in the new Fujitsu T671ME-FJ motherboard which recently entered mass production.In order to match the features of Windows Vista, the SiS671FX chipset is designed to meet all the requirements so that the system will be more secure, reliable, and easy to use, SiS claimed. This is one of the most critical advantages of the SiS671FX chipset, and is why Fujitsu has adopted it for its T671ME-FJ motherboard, according to SiS.The Fujitsu T671ME-FJ supports Intel Core 2 Duo, Celeron D, and Pentium 4 processors as well as DDR2 667 memory. For graphics, the SiS671FX chipset delivers the integrated Mirage 3 graphics engine in addition to one PCI Express x16 slot to allow for upgrades.The T671ME-FJ adopts the SiS968 southbridge which adds one PCI Express x1 slot, Serial ATA, and six USB 2.0 ports. Additionally, the T671ME-FJ features 6-Channel Audio and Gigabit Ethernet. Fujitsu T671ME-FJ motherboard specifications Item Detail CPU Intel Core 2 Duo, Celeron D, Pentium 4 Memory DDR2 667 VGA Mirage 3 graphics engine One PCI Express x16 slot Southbridge SiS968 chipset Source: SiS, compiled by Digitimes, April 2007Fujitsu T671ME-FJPhoto: Fujitsu, SiS

OCZ Technology Group announced its new StealthXStream 600W power supply designed for the value-minded consumer seeking simple, quiet performance.The StealthXStream is kept cool with a 120mm fan and features a standard ATX power supply form factor resulting in a compact footprint to accommodate virtually all computer towers. With a sustained output of 600W and four +12V rails to provide uniform distribution of power, the StealthXStream is well-suited for and driving today's higher end systems. The StealthXStream is built to provide sufficient output to power dual GPU and CPU platforms, complete with two PCI-Express cables and a 4/8 CPU auxiliary connector which are wrapped in a flexible mesh promoting a tidy environment inside the case, according to OCZ.The OCZ StealthXStream 600W power supplyPhoto: Company

Taiwan-based IPC makers Aaeon Technology and Axiomtek recently announced AMD Geode LX-based products.Aaeon announced its mini-embedded motherboard PCM-5895, which is based on the AMD Geode LX700, LX800 and LX900 series processors with support for DDR300 memory up to 1GB and DDR400 memory up to 512MB. The PCM-5895 can support LCD TV, CRT TV and has one CAN bus port for car electronics connections, according to sources at Aaeon.The PCM-5895 targets automation, ticketing machines, transportation, gaming and kiosk/POS markets, added the sources.Axiomtek also announced its low-power Internet platform, the NA-100, based on the AMD Geode LX 800 processor and CS5536AD chipset.The NA-100 targets the network security appliance market for small and medium enterprises. The product is modularized to reduce the cost and time spent by system integrators on system development, Internet security software developers and manufacturers, noted sources at Axiomtek. Aaeon PCM-5895 specifications Item Details CPU AMD Geode LX 800 (LX 700/900 optional) Memory DDR300 up to 1GB, DDR400 up to 512MB Source: Company, compiled by Digitimes, April 2007 Axiomtek NA-100 specifications Item Details CPU AMD Geode LX 800 (LX 700 optional) Chipsets AMD Geode CS5536AD Memory 512MB for DDR SODIMM DDR266/333/400 Source: Company, compiled by Digitimes, April 2007Aaeon PCM-5895Photo: CompanyAxiomtek NA-100Photo: Company

NEC Electronics America has announced the availability of two new metal-oxide-semiconductor field-effect transistor (MOSFET) families that help reduce heat generation in servers, motherboards and notebooks.The uPA273xUT1A family is designed for use in the protection circuitry of lithium-ion (Li-Ion) batteries for notebook PCs, and is designed to help prevent heat generation and explosions that may result from Li-Ion battery overcurrent. The second, the uPA272xUT1A family, helps to power CPUs and chipsets in notebooks, desktop PCs and servers, and is designed for use in DC/DC converters, or point-of-load (POL) converters, which must provide clean and reliable power service to chipsets. All of the new MOSFETs are housed in NEC Electronics' proprietary 8-pin HVSON package that fits into the industry-standard SOP8 (small-outline package) footprint and provides efficient heat dissipation while allowing the devices to deliver significantly more power than standard SOP8-based solutions."Our new, highly efficient power MOSFETs meet the industry's most stringent power requirements in high-speed computing applications by combining large current capabilities and high-speed switching performance with low on- state resistance," said Bart Ladd, general manager, standard solutions strategic business unit, NEC Electronics America. "This combined functionality delivers the performance designers demand and the peace of mind they need to be assured that heat generation is being effectively minimized."Fabricated with a 0.25-micron process, the MOSFETs have on-resistances ranging from 2.0 to 7.7 milliohms in the uPA272xUT1A family, and from 2.6 to 3.1 milliohms in the uPA273xUT1A family. The devices also offer superior heat dissipation, allowing only 4.6 watts (W) of power. Unlike lead-frame packages, which are mounted and then covered with resin, the 8-pin HVSON package effectively prevents heat generation by connecting directly to the board, allowing heat to radiate via an exposed frame without the use of resin. As a result, 4.6W of power, approximately 80% more than existing MOSFETs, is available. Furthermore, without the need for resin, package height can be reduced to a maximum of 1mm, 40% thinner than existing MOSFETs, making it possible for designers to reduce the size of batteries in notebook computers.

Thermaltake Technology recently announced its TMG ND4, a water-cooling solution for Nvidia 8800GTX graphics cards.The ND4 waterblock removes heat from the graphics processing unit (GPU) and dissipates it through the Thermaltake TideWater (integrated radiator, reservoir, and mini pump). A silent LED fan equipped on the ND4 makes only 18dBA of noise, and the all copper waterblock and aluminum base dissipate heat from both GPU and memory of the graphics card. A special fan shroud concentrates the airflow and focuses the air towards hotspots for better cooling capability, noted Thermaltake.The TMG ND4 was adopted by Asus to bundle with its 8800GTX AquaTank VGA card. This combination of high-end liquid cooling graphics card was tested to be 11% faster than other 8800GTX cards and at least 12-degrees cooler, according to Thermaltake.The Thermaltake TMG ND4 cooler for Nvidia 8800GTX cardsPhoto: Company

Samsung Electronics has announced it has developed an all-DRAM stacked memory package using "through silicon via" (TSV) technology.The new wafer-level-processed stacked package (WSP) consists of four 512Mb DDR2 chips that offer a combined 2Gb of high density memory. Using the TSV-processed 2Gb DRAMs, Samsung can create a 4GB DIMM. In today's MCPs, memory chips are connected by wire bonding, requiring vertical and horizontal spacing between dies. By contrast, Samsung's WSP technology forms laser-cut micron-sized holes that penetrate the silicon vertically to connect the memory circuits directly with a copper filling, eliminating the need for gaps of extra space and wires protruding beyond the sides of the dies.These advantages permit Samsung's WSP to offer a significantly smaller footprint and thinner package. Inside the new WSP, the TSV is housed within an aluminum (Al) pad to escape the performance-slow-down effect caused by the redistribution layer.Chips are connected via "vias" instead of wire bondsPhoto: CompanySamsung said it could now offer 4GB DIMM via its new TSV technologyPhoto: Company

VIA Technologies has announced the VIA VT6047 Pico-ITX form factor reference design, a small full-featured x86 motherboard designed for ultra-compact embedded PC systems and appliances. The Pico-ITX form factor follows VIA's trend to platform miniaturization. The Mini-ITX form factor, at 17cm×17cm, and which recently celebrated its fifth anniversary as an industry standard, along with Nano-ITX, at 12cm×12cm, 50% of the size of the Mini-ITX were both pioneered by VIA. The Pico-ITX form factor measures 10cm×7.2cm and is also 50% smaller than its predecessor, Nano-ITX. The VIA VT6047 Pico-ITX motherboard was designed to be powered by one of VIA's energy efficient processor platforms, such as the VIA C7 or fanless VIA Eden processor in the 21mm×21mm nanoBGA2 package, combined with VIA system media processors to enable the board to deliver performance in small, low-heat, low-power packages VIA small form factor details Form factor Dimensions (cm) Mini-ITX 17×17 Nano-ITX 12×12 Pico-ITX 10×7.2 Source: VIA, compiled by Digitimes, April 2007 The VIA Pico-ITX form factor measures just 10cm×7.2cmPhoto: Company

Dell recently announced its Dell PowerVault LTO-4-120, a Linear Tape-Open drive storage device using the LTO-4 specification.LTO-4 is the first version to enable device-level encryption, according to Dell, noting that this is important given the portable nature of tape and that backup tapes are often stored at off-site locations. If lost or stolen, encryption would help prevent the data from being accessed.The Dell PowerVault LTO-4-120 offers a native capacity of 800GB and a 50% performance increase over the previous generation of drives. This allows customers to decrease backup windows by 33% and reduce the number of tape cartridges they are currently managing, according to Dell.Standardized LTO technology ensures customers have forward and backward compatibility as well as vendor neutrality. The LTO-4-120 is backward read and write compatible with the previous generation and backward read compatible with media from the prior two generations.Dell expects availability of the drives and media to by April 20 of this year. Pricing for the external standalone Dell PowerVault LTO-4-120 drive starts at about US$4,000. Media pricing begins at about US$200.Dell PowerVault LTO-4-120Photo: Company

High Tech Computer (HTC) has announced at the Intel Developer Forum in Beijing that its new mobile computer, the HTC Shift, will be based on Intel's new Ultra Mobile Platform 2007. "With its revolutionary design, advanced wireless connectivity, and comprehensive software applications, the HTC Shift is strengthened by the power of Intel's innovative Ultra Mobile Platform 2007," said Peter Chou, CEO of HTC. Based on Intel Pentium M architecture with optimizations to significantly extend battery life within smaller form factors, the Intel Ultra Mobile Platform 2007 comprises the Intel A110 processor, Intel 945GU Express chipset, and Intel ICH7U I/O controller hub. The HTC Shift combines the power of Windows Vista with a QWERTY-based keyboard design and 3G connectivity. The HTC Shift provides all the power, functionality and connectivity busy professionals need in a sleek, portable design, claims HTC. The HTC Shift features high-speed global connectivity with Tri-Band UMTS/HSDPA, Quad-Band GSM/GPRS/EDGE, Bluetooth 2.0 and Wi-Fi. Additionally, the HTC Shift leverages Windows Media Player 11 to provide access to music, videos and photos. HTC ShiftPhoto: Company