BenQ on November 27 unveiled its first camcorder, the M1, for immediate launch in the Taiwan market at a recommended retail price of NT$8,990 (US$278), according to the company.M1 features 1080p video recording at 30 frames per second, BenQ pointed out. BenQ M1 specifications Item Detail Image sensor 10-megapixel 1/2.3-inch CMOS Zoom 5x optical, 10x digital Screen 3-inch 16:9 230,000-pixel touch LCD panel Dimension (H x W x D, mm) 63.5 x 44.35 x 112.5 Weight (not including battery and SD card, gram) 210 Source: BenQ, compiled by Digitimes, November 2009BenQ M1Photo: Company

Light, thin, non-glare and warm white – Orbeos is the first OLED light source from Osram Opto Semiconductors for premium quality functional lighting. The new energy-efficient surface-emitting panel is especially suited to applications in the premium segment such as architecture, hotels and catering, offices, private homes and shops.The Orbeos OLED panel has a round lamp surface of 80mm diameter, is only 2.1mm thick and weighs 24g. These limited dimensions ensure plenty of different usage options. With an efficiency of 25lm/W, the panel beats that of conventional halogen lamps.Its warm white color temperature (2,800K, CRI up to 80) matches the warm light of an incandescent lamp and is therefore suited to lighting that is atmospheric and functional at the same time. Especially in homes, museums, restaurants or hotels, OLEDs also rate highly with their pleasant, non-glare light.New design possibilities for architects and lighting plannersOLEDs open up totally new design possibilities for architects, lighting planners and designers – it is possible to create illuminated areas with them such as lit ceilings or partitions. "Our Orbeos adds to the wide range of lighting in the premium segment. Not only do its technical features have an effect here, but first and foremost its completely different appearance," says Markus Klein, senior director SSL at Osram Opto Semiconductors. "Orbeos is a combination of energy savings and aesthetics."The Orbeos OLED panel is the first product developed by Osram on the market. In 2008, the first commercially available "Early Future" table lamp by renowned lighting designer Ingo Maurer with OLED tiles from Osram Opto Semiconductors demonstrated how OLEDs can be used in functional lighting.Long-lasting panel lightingOrbeos can be switched on and off without delay and is continuously dimmable. Unlike LEDs its heat management is simple. The panel contains no mercury and emits no UV or infrared radiation. Its brightness level is usually 1,000cd/m2 with power input of less than a watt. In ideal operating conditions it has a lifespan of around 5,000 hours. Orbeos is available with a frosted glass surface. The panels can be easily mounted using spring contacts.The rapid advance of OLEDs in general lighting has succeeded not least thanks to the technical principles of the "Organic Phosphorescent Lamps for Applications in the Lighting Market" project (OPAL), which is funded by the German Federal Ministry of Education and Research (BMBF).Osram Opto Semiconductors OLED light source, the OrbeosPhoto: Company

Asustek Computer has launched Ion-based netbooks, nettops and all-in-one PCs including the Eee Box PC EB1501 and EB1012, Eee PC 1201N, and Eee Top PC ET2002 in Taiwan.The Eee Box PC EB1012 is the latest version of Asustek's nettop series. The PC supports HD video, HDMI, and casual gaming, highlighted the vendor.The Eee Box PC EB1501 includes a built-in DVD burner, up to 4GB of memory, wireless connectivity and Windows 7 Home Premium.Asustek also launched an Ion-based mini-ITX form factor motherboard, the AT3N7A-I, along with the Ion-based PCs. Equipped with an Intel Atom 330 CPU, the motherboard supports both HDMI output and Blu-ray playback. Meanwhile, the motherboard also features built-in Bluetooth as well as 10 USB 2.0 ports. Asustek Eee PC 1201N netbook specifications Item Detail Display 12.1-inch LED-backlit WXGA screen (1366×768) Operating system Microsoft Windows 7 CPU Intel Atom 330 dual-core processor combined with Nvidia Ion graphics Memory DDR2 SO-DIMM 2GB or 3GB Storage 250GB or 320GB hard drive plus 500GB on Asustek's WebStorage Dimensions (W × L × H, mm) 296 × 208 × 27.3-33.3 Weight (kg) 1.46 (3.22lbs) Colors Black, Silver, Blue, Red Sources: Company, compiled by Digitimes, November 2009Asustek Eee PC 1201N netbookPhoto: Terry Ku, Digitimes, November 2009 Asustek EeeTop PC ET2002T all-in-one PC specifications Item Detail Display 20-inch 16:9 widescreen Operating system Microsoft Windows 7 Home Premium or Windows Vista Home Premium Touch screen Yes CPU and chipset Intel Atom 330 dual-core processor and Nvidia Ion chipset Memory DDR2 SO-DIMM 2GB HDD 250GB or 320GB SATA2 5400-rpm Graphics Integrated graphics units from Nvidia Ion chipset Dimension (W × H × L, mm) 511 × 410 × 53 Weight (kg) 7.2 Color Black, White Sources: Company, compiled by Digitimes, November 2009Asustek EeeTop PC ET2002T all-in-one PC with touchscreen capabilityPhoto: Company Asustek Ion-based EeeBox series nettop specifications Model EeeBox PC EB1012 EeeBox PC EB1501 OS Microsoft Windows Vista Home Premium Microsoft Windows 7 Home Premium CPU Intel Atom N330 dual-core processor Intel Atom N330 dual-core processor Memory Two So-DIMM slots with 2GB DDR2 800 memory can support up to 4GB Two So-DIMM slots with 2GB DDR2 800 memory can support up to 4GB Storage 2.5-inch 250GB SATA hard drive 2.5-inch 250GB SATA hard drive Chipset Nvidia Ion Nvidia Ion Graphics Integrated graphics units from Nvidia Ion chipset Integrated graphics units from Nvidia Ion chipset Dimension (W × H × D, mm) 222 × 178 × 26.9 193 × 193 × 39 Weight (kg) 1.1 1.2 Color White or black White and black Sources: Company, compiled by Digitimes, November 2009Asustek Ion-based EeeBox series nettopPhoto: Terry Ku, Digitimes, November 2009Asustek EeeBox PC EB1012 nettopPhoto: CompanyAsustek EeeBox PC EB1501 nettopPhoto: CompanyAsustek AT3N7A-I mini-ITX motherboardPhoto: Terry Ku, Digitimes, November 2009

San Jose, CA, November 10, 2009 - Aptina announced today the launch of the MT9F001 camera image sensor, the latest addition to its extensive portfolio of high performance image sensor solutions. The sensor's high resolution, high speed snapshot and HD video modes, flexible interface and pre-processing options reflect the new "must have" features manufacturers are looking for in their premier cameras. The new 14-megapixel camera sensor, captures high quality, full HD video (1080p/60fps) while also enabling valuable end-user features manufacturers are seeking for their high performance designs including support for Electronic Image Stabilization (EIS). The MT9F001 image sensor incorporates Aptina's most advanced 1.4-micron pixel using Aptina TM A-Pix technology and a four-lane HiSPiTM (High Speed Serial Pixel Interface) serial data interface to achieve the combination of still image quality and video performance that set it apart from CCD technology.Early customer response to the MT9F001 has been positive. "We are impressed by the performance advancement the MT9F001 sensor represents, both in terms of image quality and in high definition video capability" said Mr. Toshinobu Haruki, General Manager in the DI Division at Sanyo, a leading supplier of hybrid cameras that couple high resolution still capture with high quality video capture." Aptina is clearly focused on continuous improvement to meet the severe demands of the consumer digital camera market," adds Haruki.The Right SolutionAptina A-Pix technology overcomes the challenge of effective photon collection in the photodiodes that small pixels present when using conventional front side illumination (FSI). The result achieved with Aptina's technology is BSI-equivalent sensitivity, but with less crosstalk for lower noise and more accurate color reproduction. When considering such critical performance parameters such as sensitivity, cross-talk, hot pixel count, and manufacturability, Aptina's MT9F001 technology is the right solution for high performance digital consumer camera products."The MT9F001 is a unique image sensor combining a smaller pixel and increased performance," says Sandor Barna, General Manager for Aptina's Camera Business Unit. "This sensor puts into practice Aptina's latest technology, including Aptina A-Pix which maximizes the light gathering of each pixel."High SpeedThe MT9F001 incorporates Aptina's HiSPiTM interface technology which was developed and is owned by Aptina. It is an open access, scalable technology that enables 1080p/60fps performance (and beyond) and has been adopted by a growing number of Aptina Tier 1 business partners to meet the challenges of high speed, low power consumption data transfer. HiSPiTM technology provides distinct benefits for users including open access to a performance focused interface, the ability to support 1080p/60fps today, and the scalability to accommodate higher data rates for the future.The MT9F001 will be in mass production in first-quarter 2010.

Eindhoven, Netherlands - NXP Semiconductors today announced the launch of GreenChip TEA1733(L) - a low-cost IC that increases energy efficiency and standby performance of power supplies under 75W. Designed specifically for low-power computing and communication applications such as netbook adapters, printer adapter and LCD monitor supplies, the TEA1733 is a Switched Mode Power Supply (SMPS) controller IC that enables standby power levels less than 100mW. The GreenChip TEA1733 is the first of a complete series of low-power AC/DC control ICs to be launched by NXP over the next year."With the demand for sleek, light and compact designs increasing by the day, the TEA1733 enables consumers to experience lighter and more compact netbook adapters that save money and consume less power," said Edwin Kluter, marketing director, power solutions, NXP Semiconductors. "The GreenChip TEA1733 enables new levels of energy efficiency in low-power applications. By reducing the number of external components needed, the TEA1733 allows OEMs to become more cost competitive while maintaining a high degree of quality and reliability."To enable higher efficiencies at low standby mode and at all load levels, the TEA1733 requires a very low start-up current of 10µA and consumes a low supply current of 1.25mA. The combination of fixed frequency operation at high output power and frequency reduction at low output power provides high efficiency over the total load range. Due to its high level of integration, the TEA1733 enables a compact and lighter power supply design with reduced number of external components in the SMPS.The TEA1733 is available in a safe restart protection version as TEA1733 and also in a latched protection version as TEA1733(L).With almost 500 million GreenChips already sold, NXP Semiconductors is at the forefront of designing and manufacturing energy efficient solutions for the power supply industry. The GreenChip family makes it easier and more cost-effective for power supply manufacturers to comply with energy efficiency specifications such as 80PLUS and ENERGY STAR. The GreenChip family of ICs is designed specifically for energy saving and has, from its inception, led industry standards in PC power efficiency especially in notebook power efficiency.

Qualcomm and Lenovo Group have announced that Lenovo will incorporate Qualcomm's new Gobi2000 technology into upcoming ThinkPad notebooks in the X, T and W Series beginning in 2010 to enable global 3G connectivity. The Gobi-equipped notebooks will provide business users with extensive wireless broadband access both domestically and internationally by leveraging the wide availability of both EV-DO and HSPA wireless networks around the world."Gobi mobile Internet connectivity will give our business PC users the convenience of using one simple, built-in device to provide mobile broadband access around the world," said Sam Dusi, vice president, worldwide ThinkPad product marketing, Lenovo. "This flexible, multi-carrier solution allows mobile workers to seamlessly connect to new broadband networks as they change locations, while simplifying the work of IT managers, to support users around the globe with a single laptop model."Businesses deploying ThinkPad laptops with Gobi technology will be able to standardize on a single hardware platform that can be deployed globally. Each region has the flexibility to provision 3G connectivity on an as-needed basis and to their preferred carrier based on the coverage and pricing plans available in their area. If an employee relocates to a different region or is traveling outside the home coverage area, Gobi technology supports the ability to switch carriers without having to swap data cards and/or reinvest in a new laptop, reducing the costs to deploy 3G. Gobi technology also includes an integrated GPS receiver for enabling location-based services such as asset tracking, real-time data protection, geo-fencing and navigation.

Hynix Semiconductor has announced Intel validation of 2Gb DDR3 DRAM chips using 40nm-class process technology. The chipmaker said it has begun mass producing the new chips, and expects the validation of RDIMMs to also be completed within before year's end.Hynix's newly-validated products are 2Gb DDR3 SDRAM component, 4GB DDR3 SO-DIMM and 2GB DDR3 unbuffered DIMM (UDIMM) with and operating speed of 1333MHz with 1.5V power supply, according to the company. The chips deliver a maximum data transfer speed of 1867MHz with 16-bit I/O and 3.7Gbps bandwidth.Hynix said the productivity of its 40nm-class 2Gb DDR3 is increased by more than 60% over 50nm-class process technology.In addition, Hynix noted its new 40nm-class 2Gb DDR3 chips reduce power consumption by 40% over the preceding products using 50nm class, about twice the industry average of reduction in terms of power consumption."The current mainstream density has been rapidly transferring from 1Gb to 2Gb for the higher performance servers market. We expect to secure the industry's best features of both 1Gb and 2Gb DDR3 products", said JB Kim, CMO of Hynix.Hynix 40nm 2Gb DDR3Photo: Company

Transcend Information has teamed up with Internet information search and management firm eSobi to offer its 4GB JetFlash V33-series USB flash drives with eSobi software in the Taiwan market, according to the company.The eSobi integrated Internet tool allows users to improve Internet searching, streamline flow-based information, and save and manage findings for later use. It combines an RSS reader, a meta-search engine, a podcast receiver and an information library in one application.Transcend JetFlash V33Photo: Company

AMD has announced the ATI Radeon HD 5970, a new ultra high-end model joining its list of Radeon HD 5000 series graphics card to fully support Microsoft DirectX 11 technology and ATI Eyefinity multi-display technology.Designed to support demanding PC games at ultra-high resolutions and image quality settings, the HD 5970 has unlocked overclocking potential through ATI Overdrive technology. Related graphics cards are now shipping from retailers and available in the channel.The overclocking capabilities of the HD 5970 are enabled by the unique design of the card, which features advanced fan and vapor chamber technologies and a fully vented exhaust to keep the card cool and ensure overclocking headroom using ATI Overdrive technology, claimed AMD.The HD 5970 can drive up to three displays at once, and deliver a maximum resolution of 7680×1600, while ATI CrossFireX technology can leverage the power of multiple graphics processors to deliver even more performance when using ATI Eyefinity technology.The HD 5970 graphics card delivers nearly five teraflops of compute power, ensuring performance in the latest DirectX 11 games, as well as in previous versions of DirectX and OpenGL titles, AMD said, adding that with the graphics core built on 40nm process technology harnessing up to 3,200 stream processors, consumers can enjoy the latest DirectX 11-based games.The HD 5970 can also power down unused GPU resources when not in use automatically, resulting in idle desktop power consumption as low as 42W.The HD 5970 is supported by add-in-board companies including ASK, Asustek Computer, Club 3D, Diamond, Gigabyte Technology, High Tech, Micro-Star International (MSI), Sapphire, Tul/Power Color, Visiontek and XFX, according to AMD.AMD ATI Radeon HD 5970 graphics cardPhoto: Company

Toshiba has announced development of a high-resolution photo-sensitive film (photoresist) essential for future application of extreme ultraviolet (EUV) lithography in semiconductor fabrication, and proved its viability with 20nm-scale generation process technology. The breakthrough will be announced on November 19.Semiconductor circuit patterning requires photoresists that can be used in both positive- and negative-tone processes to secure precise structuring. Toshiba has developed a low molecular resist for EUV generation by employing a derivative of truxene – a low molecular material that is finer and more durable than currently used polymer materials. The company applied this resist to positive tone process, and has now succeeded in applying it to the more demanding task of the negative tone process and forming a test pattern in the 20nm-scale generation.Toshiba said it has established the fundamental composition of a truxene derivative for photoresist, and demonstrated its use as a positive-tone photoresist in EUV generation. The company has also optimized performance by balancing truxene derivative and a cross-linker to maximize the negative photoresist performance. The cross-linker and a photo-acid-generator are required to connect the molecules through a chemical reaction, and their compound ratio was optimized according to the transmittance of the light and reaction speed.Toshiba said it will further improve the performance of the molecular resist and apply it to the fabrication of 20nm-scale generation LSIs. Citing the International Technology Roadmap for Semiconductors (ITRS), the company expects high-volume production of this generation to kick off in 2013.By the time lithography technology advances into 20nm and sub-20nm generations, use of today's argon fluoride laser exposure apparatus and polymer photoresists will no longer resolve circuit patterns precisely and result in roughness in pattern sidewalls. The solution lies in a transition to EUV lithography and photoresist based on low molecular materials.Truxene derivative for photoresistPhoto: CompanyComposition for negative photoresist material: Optimized ratio for truxene derivative to cross-linker is three to onePhoto: Company