Eindhoven, Netherlands - NXP Semiconductors today announced the launch of GreenChip TEA1733(L) - a low-cost IC that increases energy efficiency and standby performance of power supplies under 75W. Designed specifically for low-power computing and communication applications such as netbook adapters, printer adapter and LCD monitor supplies, the TEA1733 is a Switched Mode Power Supply (SMPS) controller IC that enables standby power levels less than 100mW. The GreenChip TEA1733 is the first of a complete series of low-power AC/DC control ICs to be launched by NXP over the next year."With the demand for sleek, light and compact designs increasing by the day, the TEA1733 enables consumers to experience lighter and more compact netbook adapters that save money and consume less power," said Edwin Kluter, marketing director, power solutions, NXP Semiconductors. "The GreenChip TEA1733 enables new levels of energy efficiency in low-power applications. By reducing the number of external components needed, the TEA1733 allows OEMs to become more cost competitive while maintaining a high degree of quality and reliability."To enable higher efficiencies at low standby mode and at all load levels, the TEA1733 requires a very low start-up current of 10µA and consumes a low supply current of 1.25mA. The combination of fixed frequency operation at high output power and frequency reduction at low output power provides high efficiency over the total load range. Due to its high level of integration, the TEA1733 enables a compact and lighter power supply design with reduced number of external components in the SMPS.The TEA1733 is available in a safe restart protection version as TEA1733 and also in a latched protection version as TEA1733(L).With almost 500 million GreenChips already sold, NXP Semiconductors is at the forefront of designing and manufacturing energy efficient solutions for the power supply industry. The GreenChip family makes it easier and more cost-effective for power supply manufacturers to comply with energy efficiency specifications such as 80PLUS and ENERGY STAR. The GreenChip family of ICs is designed specifically for energy saving and has, from its inception, led industry standards in PC power efficiency especially in notebook power efficiency.

Qualcomm and Lenovo Group have announced that Lenovo will incorporate Qualcomm's new Gobi2000 technology into upcoming ThinkPad notebooks in the X, T and W Series beginning in 2010 to enable global 3G connectivity. The Gobi-equipped notebooks will provide business users with extensive wireless broadband access both domestically and internationally by leveraging the wide availability of both EV-DO and HSPA wireless networks around the world."Gobi mobile Internet connectivity will give our business PC users the convenience of using one simple, built-in device to provide mobile broadband access around the world," said Sam Dusi, vice president, worldwide ThinkPad product marketing, Lenovo. "This flexible, multi-carrier solution allows mobile workers to seamlessly connect to new broadband networks as they change locations, while simplifying the work of IT managers, to support users around the globe with a single laptop model."Businesses deploying ThinkPad laptops with Gobi technology will be able to standardize on a single hardware platform that can be deployed globally. Each region has the flexibility to provision 3G connectivity on an as-needed basis and to their preferred carrier based on the coverage and pricing plans available in their area. If an employee relocates to a different region or is traveling outside the home coverage area, Gobi technology supports the ability to switch carriers without having to swap data cards and/or reinvest in a new laptop, reducing the costs to deploy 3G. Gobi technology also includes an integrated GPS receiver for enabling location-based services such as asset tracking, real-time data protection, geo-fencing and navigation.

Hynix Semiconductor has announced Intel validation of 2Gb DDR3 DRAM chips using 40nm-class process technology. The chipmaker said it has begun mass producing the new chips, and expects the validation of RDIMMs to also be completed within before year's end.Hynix's newly-validated products are 2Gb DDR3 SDRAM component, 4GB DDR3 SO-DIMM and 2GB DDR3 unbuffered DIMM (UDIMM) with and operating speed of 1333MHz with 1.5V power supply, according to the company. The chips deliver a maximum data transfer speed of 1867MHz with 16-bit I/O and 3.7Gbps bandwidth.Hynix said the productivity of its 40nm-class 2Gb DDR3 is increased by more than 60% over 50nm-class process technology.In addition, Hynix noted its new 40nm-class 2Gb DDR3 chips reduce power consumption by 40% over the preceding products using 50nm class, about twice the industry average of reduction in terms of power consumption."The current mainstream density has been rapidly transferring from 1Gb to 2Gb for the higher performance servers market. We expect to secure the industry's best features of both 1Gb and 2Gb DDR3 products", said JB Kim, CMO of Hynix.Hynix 40nm 2Gb DDR3Photo: Company

Transcend Information has teamed up with Internet information search and management firm eSobi to offer its 4GB JetFlash V33-series USB flash drives with eSobi software in the Taiwan market, according to the company.The eSobi integrated Internet tool allows users to improve Internet searching, streamline flow-based information, and save and manage findings for later use. It combines an RSS reader, a meta-search engine, a podcast receiver and an information library in one application.Transcend JetFlash V33Photo: Company

AMD has announced the ATI Radeon HD 5970, a new ultra high-end model joining its list of Radeon HD 5000 series graphics card to fully support Microsoft DirectX 11 technology and ATI Eyefinity multi-display technology.Designed to support demanding PC games at ultra-high resolutions and image quality settings, the HD 5970 has unlocked overclocking potential through ATI Overdrive technology. Related graphics cards are now shipping from retailers and available in the channel.The overclocking capabilities of the HD 5970 are enabled by the unique design of the card, which features advanced fan and vapor chamber technologies and a fully vented exhaust to keep the card cool and ensure overclocking headroom using ATI Overdrive technology, claimed AMD.The HD 5970 can drive up to three displays at once, and deliver a maximum resolution of 7680×1600, while ATI CrossFireX technology can leverage the power of multiple graphics processors to deliver even more performance when using ATI Eyefinity technology.The HD 5970 graphics card delivers nearly five teraflops of compute power, ensuring performance in the latest DirectX 11 games, as well as in previous versions of DirectX and OpenGL titles, AMD said, adding that with the graphics core built on 40nm process technology harnessing up to 3,200 stream processors, consumers can enjoy the latest DirectX 11-based games.The HD 5970 can also power down unused GPU resources when not in use automatically, resulting in idle desktop power consumption as low as 42W.The HD 5970 is supported by add-in-board companies including ASK, Asustek Computer, Club 3D, Diamond, Gigabyte Technology, High Tech, Micro-Star International (MSI), Sapphire, Tul/Power Color, Visiontek and XFX, according to AMD.AMD ATI Radeon HD 5970 graphics cardPhoto: Company

Toshiba has announced development of a high-resolution photo-sensitive film (photoresist) essential for future application of extreme ultraviolet (EUV) lithography in semiconductor fabrication, and proved its viability with 20nm-scale generation process technology. The breakthrough will be announced on November 19.Semiconductor circuit patterning requires photoresists that can be used in both positive- and negative-tone processes to secure precise structuring. Toshiba has developed a low molecular resist for EUV generation by employing a derivative of truxene – a low molecular material that is finer and more durable than currently used polymer materials. The company applied this resist to positive tone process, and has now succeeded in applying it to the more demanding task of the negative tone process and forming a test pattern in the 20nm-scale generation.Toshiba said it has established the fundamental composition of a truxene derivative for photoresist, and demonstrated its use as a positive-tone photoresist in EUV generation. The company has also optimized performance by balancing truxene derivative and a cross-linker to maximize the negative photoresist performance. The cross-linker and a photo-acid-generator are required to connect the molecules through a chemical reaction, and their compound ratio was optimized according to the transmittance of the light and reaction speed.Toshiba said it will further improve the performance of the molecular resist and apply it to the fabrication of 20nm-scale generation LSIs. Citing the International Technology Roadmap for Semiconductors (ITRS), the company expects high-volume production of this generation to kick off in 2013.By the time lithography technology advances into 20nm and sub-20nm generations, use of today's argon fluoride laser exposure apparatus and polymer photoresists will no longer resolve circuit patterns precisely and result in roughness in pattern sidewalls. The solution lies in a transition to EUV lithography and photoresist based on low molecular materials.Truxene derivative for photoresistPhoto: CompanyComposition for negative photoresist material: Optimized ratio for truxene derivative to cross-linker is three to onePhoto: Company

SAN DIEGO – November 12, 2009 – Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator of advanced wireless technologies, products and services, today announced that it is sampling a new smartphone chipset family that breaks new ground in mobile performance in the mainstream smartphone tier. The MSM7x30 family features a strong emphasis on multimedia performance, supporting high-definition video recording and playback, exceptional graphics with dedicated 2D and 3D cores, and an overall chip design optimized for a highly responsive, immersive Web experience. The first devices based on the flagship MSM7x30 family of chipsets are expected to launch commercially before the end of 2010."Qualcomm continues to focus on enabling the best possible mobile experiences and this new family of solutions brings an unmatched feature set to the smartphone segment," said Alex Katouzian, vice president of product management for Qualcomm CDMA Technologies. "As the demand for smartphones continues to grow, our innovative technology will enable Qualcomm's device manufacturing partners to deliver products with greater value than ever before."The MSM7x30 family of chipsets, which includes the MSM7230 solution for HSPA+ networks and MSM7630 solution with multi-mode HSPA+/EV-DO Rev. B and SV-DO support, is designed around optimal data throughput and powerful multimedia functionality. The 7x30 has the same market-leading Scorpion CPU as previously commercialized in the Snapdragon QSD8x50 chipset. The 7x30 uses an 800MHz to 1GHz custom superscalar CPU based on the ARM v7 instruction set, delivering exceptionally high-end processing at low power to support features that include:– 720p high-definition video encode/decode at 30 frames per second– Integrated 2D and 3D graphics GPUs with support for OpenGL ES 2.0, and OpenVG 1.1 industry standard APIs– Dedicated low-power audio subsystem supporting 5.1 surround– 12-megapixel camera support – Integrated GPS for location-based services– Support for leading mobile operating systems, including Android, Windows Mobile, Brew Mobile Platform and Symbian– Support for package-on-package memory for reduced board space, optimized power consumption and more responsive performanceThe MSM7x30 family of chipsets is supported by the PM8058 power management integrated circuit and the QTR8600 RF subsystem with integrated Bluetooth and FM radio. The MSM7x30 chipsets will directly interface with Qualcomm's WCN1312 WLAN solution for 802.11 b/g/n.

TOKYO, Japan, November 9, 2009 – Seiko Epson Corporation ("Epson", TSE:6724) today announced that it has developed the world's first* 4K-compatible high-temperature polysilicon (HTPS) TFT liquid crystal panel for 3LCD projectors. Measuring 1.64-inch diagonally, the new panel supports displays with resolutions up to 4096×2160 pixels.Projector applications continue to expand. In addition to being used for business presentations, projectors are gaining wider use in the classroom, in auditoriums and at big events. Meanwhile, demand for high-performance products is expected to grow as more and more households enjoy full HD content via digital broadcasts and high definition video players.With a resolution of nearly 8.85 megapixels, 4K panels offer four times the resolution of full HD (1920×1080), making them ideal for the high resolutions required by special applications such as industrial design, architectural design and simulations, as well as for presentations and projecting four full HD images at the same time.To meet this market demand, Epson employed the latest process and C2 Fine technologies in the new panels and developed a new, original driving method optimized for 4K resolution to achieve high-resolution projected images with outstanding brightness and contrast.Epson is committed to supporting the growing range of projector applications by combining its original technologies to expand and enhance its HTPS lineup with panels that further raise the performance of 3LCD projectors.* Source: Epson research, as of the end of October 2009Panel features- High-resolution 4K-compatible- 1.64": 4K (4096 x 2160 pixels) - the world's first 4K HTPS panel*- Includes Epson's original LCD driver optimized for 4K resolution- Benefits of using C2 Fine: 1. High contrast2. Smooth images3. Jet-black color reproductionC2Fine: An original Epson technology for achieving high-quality, vivid images with high contrast by combining an inorganic liquid crystal alignment layer with vertical alignment technologyPanel specification LCD type C2 Fine (VA inorganic alignment layer) Process technology D7 Effective pixels 4096 x 2160 Panel size (diagonal) 1.64 inch (4.2 cm) Pixel pitch 9 µm Epson 4K compatible HTPS TFT LCD panel for 3LCD projectorsPhoto: Company

The SFH 5712 from Osram Opto Semiconductors detects ambient brightness in the same way as the human eye, and is the only sensor on the market that offers not only standard data rates but also high speed rates of up to 3.4 MHz. Without the need for any additional control commands, an integrated circuit in the sensor automatically provides a measured value between 3 and 65,000 lx twice a second. The sensor has only four connections and takes up very little space, measuring just 2x2x0.7 mm."The benefits of our digital ambient light sensor are obvious," said Dr. Werner Kuhlmann, development manager for silicon detectors at Osram Opto Semiconductors. "The sensor digitally transmits the true lux value so there is no need for complicated formulas to calculate an appropriate value from the output signal. This saves one operation in the application. It is also insensitive to mains-power related 50-60 Hz flickering that is produced for example by fluorescent lamps." With 150 µA during operation and only 1.5 µA in stand-by mode the sensor consumes very little power.The SFH 5712 is primarily intended for mobile applications in which the brightness of the display is constantly adjusted according to available ambient light. This extends the interval between recharges and therefore improves the service life of the devices. The main beneficiaries are cell phones, PDAs, navigation devices, netbooks and laptops. Ambient light adjusted brightness also improves readability.A good legible display on satellite navigation devices is not just highly convenient but also an important safety aspect.Osram has added the first digital ambient light sensor to its product portfolio so it can now offer the right sensor for a wide range of requirements and for every area of application.Osram digital ambient light sensor - the SFH 5712Photo: Company

Geneva, November 04, 2009 – STMicroelectronics (NYSE: STM), the leading supplier of MEMS for consumer and portable applications, has expanded its motion-sensor portfolio with a broad range of thirteen new single- and two-axis gyroscopes. With more than a 50% shrink in volume over previous ST devices, reduced power consumption, and an aggressive price, ST's new high-performance angular-motion sensors open the way to a wide range of innovative consumer applications, including gesture-controlled gaming and pointing devices, image stabilization in digital video or still cameras, and assisted GPS navigation.ST's newest single-axis (yaw) and two-axis (pitch-and-roll, pitch-and-yaw) MEMS gyroscopes fit in miniature packages of 3×5×1 and 4×5×1 mm3, respectively, addressing the size constraints of today's and tomorrow's consumer applications. Power consumption is another key factor, especially in battery-operated devices. Therefore, ST's gyroscopes include a power-down mode (when the entire device is switched off) and a sleep mode, in which part of the circuitry is turned off to significantly reduce power consumption while allowing very fast turn-on time and smart power cycling.ST's new gyroscopes boast excellent stability over time and a wide temperature range (down to 0.02 dps/degrees C), eliminating the need for additional temperature compensation in the application. Measurement precision is ensured with a negligible level of output noise (down to 0.01 dps/sqrt(Hz), and wide bandwidth up to 560Hz, ensuring high accuracy and repeatability.ST's MEMS gyroscope family offers the industry's widest full-scale range, from 30 to 6,000dps, covering a broad spectrum of applications that require high resolution and stability over time and temperature.The robust manufacturing process of ST's 8-inch fab and packaging technology has already successfully built and delivered more than 600 million ST accelerometers in applications ranging from gaming systems to cellular handsets. Like these accelerometers, ST's high-performance MEMS gyroscopes are resistant to mechanical stress and come with improved built-in self-test capability that allows the customer to verify the functioning of the sensor after it has been assembled, without the need to move the board during testing."Today, the gyroscope market for consumer applications is around US$200 million and it is dominated by non-MEMS companies," said Benedetto Vigna, General Manager of STMicroelectronics' MEMS and Healthcare division. "ST's third-generation gyroscopes benefit from the same winning attributes that have helped us conquer the accelerometer market: proven manufacturing technology and robust design. These features will help us trigger the 'consumerization wave' for gyroscopes, and our in-house supply-chain management will enable ST to meet the customer demand."STMicroelectronics new single- (yaw) and two-axis (pitch-and-roll, and pitch-and-yaw) MEMS gyroscopes