Seco will take part in Computex Taipei 2018, the most significant B2B tech show in the whole of Asia as well as the leading global ICT and IoT-centric event with a complete supply chain and ecosystem.The event is organized by the Taiwan External Trade Development Council (TAITRA) together with the Taipei Computer Association (TCA). Each year, the event gathers tens of thousands of visitors from all over the world as well as a flourishing community of startups in the field of embedded computing, semiconductors and the Internet of Things.Seco will showcase a comprehensive range of products at Nangang Exhibition Hall 1, booth No K0102, focused around Seco's cross-platform philosophy and its modular solutions with embedded system form factor standards (Qseven, COM Express, SMARC).Among the many Qseven-based solutions to be presented, the Q7-C26 stands out as a Qseven Rel. 2.1 compliant module with the NXP i.MX 8 application processors. Characterized for its rich M2M interface for managing onboard subsystem as well as the wide connectivity it provides, this solution builds upon the ample scalability granted by the Qseven form factor and the i.MX 8 family. Finally, it distinguishes itself for its high-end multimedia capabilities and, for the cherry on top, it comes up with an integrated GPU which supports up to 2 independent displays. The RAM consists in a soldered down LPDDR4-3200 memory.Still in the realm of Qseven-based solutions, another interesting module based on the same CPU that Seco will present is the Q7-C25. Unlike the Q7-C26, it also enables multicore processing - namely, a dual or quad ARM Cortex-A53 cores general purpose Cortex-M4 processor for real-time applications, combined with a 4Kp60 HEVC decoding with HDR. Built with scalability in mind, it is suitable for contexts such as home automation and vending machines, that is, scenarios requiring advanced security, connectivity and multimedia. Like the Q7-C26 it is designed for industrial-range temperatures (-40 degree C, +85 degree C) and, same as the Q7-C26, it mounts an integrated GPU supporting up to 2 independent displays. As far as the RAM is concerned, it features up to 4GB soldered down LPDDR4-3200 memory.Speaking of SMARC modules, the SM-B71 is a SMARC Rel. 2.0 compliant module with the Xilinx Zynq Ultrascale MPSoC. Unique for its blending of the ARM and FPGA domains, it delivers a flexible ARM FPGA heterogeneous processing in a standard form factor, merging the cost-effective Dual-Core to high-performance Quad-Core ARM Cortex-A53 MPSoCs with GPU/VCU, granting therefore extreme flexibility and vast scalability as well. Finally, it presents a set of dedicated Real-Time ARM Cortex-R5 processors, together with LVDS and DP video interfaces that go up to 4K resolution, and high-speed interfaces. The module is available in the indicative temperature range of -40 degree C up to +85 degree C. In terms of graphics, it mounts an integrated ARM Mali-400 MP2 GPU. As far as the RAM is concerned, it provides up to 8GB DDR4 soldered down.As regards the COM Express solutions, the COMe-C08-BT6 is a COM Express 3.0 Basic Type 6 Module with the Intel 8th generation Core i7 / i5 / Xeon processors (formerly Coffee Lake H). Most notably, it features up to six cores with Intel Hyper-Threading Technology, with the possibility of adding 12 virtual cores, hitting in this manner a maximum of 12 threads. Thanks to the Intel Gen9 LP graphics core architecture, the module can drive up to 3 independent displays simultaneously, with a resolution of 4096x2304 @60Hz, 24bpp tops. Worth mentioning, it also embeds an H.265 / HEVC hardware transcoder which, in combination with the astonishing performance and the multiple video interfaces supported, turns the module into the epitomic platform for gaming, digital signage, HMI, and infotainment. Speaking of the graphics, it mounts an Intel Gen9 LP graphics core architecture - up to 48 execution units.Furthermore, the RAM is a DDR4 with ECC technology, up to 2666 MHz. Interestingly, Seco will also showcase a COM Express solution based on AMD technology, namely the COMe-B75-CT6, i.e. a COM Express Compact 3.0 Type 6 Module with the AMD Ryzen Embedded V1000 processors. Depending on the model that has been chosen, it embeds a maximum of 4 Zen x86 CPU cores, a next-generation technology integrated with the latest Radeon graphics and I/O controller on a single chip. It also features up to a couple of DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory, not to mention a vast array of expansion ports, PCI-Express, Serial Ports, networking and video interfaces. All things considered, it is the ideal solution for medical devices, digital signage and gaming.Last but not least, Seco will also showcase at its booth, together with its educational arm, Seco Lab, its newest creation in the domain of DIY electronics and open-source hardware: the upcoming new UDOO, a maker-oriented single-board computer combined with an Arduino-compatible platform for sensing and programming the physical world. The solution is the latest addition to the UDOO family, a set of SBCs that made a name for itself on Kickstarter and is now used by tens of thousands of users all over the world, including universities and marquee research groups such as CERN. Worth noting, the newest UDOO provides an outstanding computational power, which comes in handy for applications like Computer Vision, Virtual Reality, Augmented Reality, client-side 3D rendering and real-time analysis of big data.Seco to demonstrate new cross-platform solutions and UDOO boards at Computex 2018

Computex 2018 will include 5G for the first time as one of its six exhibition themes, in light of the disruptive possibilities of the new wireless technology, according to the organizers.In late 2017, the world's first specifications for 5G networks were released, ushering in a phase of rapid growth for the next generation of mobile communications. In addition to bigger bandwidth and faster speed, 5G also promises lower latency and a more real-time experience for message transmission.The Computex organizers quoted Gartner as indicating that Internet of Things (IoT) will be the biggest driver for 5G applications, with 20.4 billion connected things in use worldwide by 2020. As one 5G base station can connect one million end devices per square kilometer, the technology is expected to fundamentally change the industry as well as people's lives.This year, leading players will meet at Computex in early June to share insights on the latest trends of technology development as the industry witness the next generation of communications, the organizers said."Modern lifestyles are intertwined with the evolution of the communications industry. Mobile technologies are bringing people closer and constantly expanding our imagination about future technologies. When 1G was introduced in the 1980s, the technology was analog but already a game-changer. 2G went further and adopted digital signals, changing how people communicated by adding text messaging functions. When 3G opened up an era of high-speed data transfer, mobility was no longer a far-fetched idea and smartphones became popular. Both speed and volume of data transfer have improved further with the arrival of 4G networks, as users can even play online games or stream videos on their smartphones," said Walter Yeh, president and CEO of TAITRA, one of the organizers of Computex."Today, everybody is looking forward to the prospect of 5G. Unlike previous telecommunication generations, 5G is so much more than the next generation of mobile technology. It will enable far greater improvements in bandwidth, transfer rate and latency to accelerate AR/VR application adoption and support streaming of higher-resolution 4K videos. It can also be implemented in smart cities, smart homes, IoT, Internet of Vehicles (IoV), and many other applications that are beyond our imagination," said Yeh.Computex 2018 will bring together leading players in the 5G industry like Ericsson, Intel, Sigfox and Qualcomm to demonstrate compelling technologies and open a new page for the global telecom industry, according to the organizers.Ericsson's wireless access technology allows 4G and 5G services to share the same wireless transmitter and same spectrum, so as to dynamically tweak the use of radio frequency spectrum for 4G and 5G. Qualcomm will introduce new devices and technologies for applications in mobile communications, IoT and IoV, including Snapdragon X50 5G modem and 2Gbps LTE modem Snapdragon X24 LTE. Sigfox Taiwan and UnaBiz, a Singapore-based IoT-dedicated network operation, will participate in the exhibition again to promote their open platforms and create a market environment that is energetic and competitive.The 5th Taipei 5G Summit will also be held alongside Computex 2018, showing the world an era of smarter, faster IoT as participants explore issues like 5G service framework and AI applications in 5G.Computex 2018 to showcase IoT potential in 5G eraPhoto: Computex organizers

Yield Microelectronics Corporation (YMC), a Taiwan-based specialty IP provider, and MagnaChip Semiconductor Corporation, a Korea-based foundry, today announced that they have expanded their IP partnership, to include 0.13um BCD & MS multiple time programmable (MTP) non-volatile memory (NVM) intellectual property (IP). The 0.13um MS technology will make the size of memory IP become unprecedentedly small.MagnaChip and YMC had developed powerful process on 0.35um and 0.18um nodes for the past few years. Now, they are dedicated to 0.13um process suited for embedded applications such as autofocus driver, power management IC, etc. YMC will provide enhanced IP vendor services to its global customers through competitive IC designs and NVM performance targeted at next generation mobile and industrial applications.There are several primary advantages of this 0.13um mixed signal (MS) MTP solution, including outstanding read/write operating range down to 1.65V, high reliability due to great construction of dual cell and ECC design, and also the size of 1K bits IP can be 0.061 mm2. In addition, on 0.13um bipolar-CMOS-DMOS (BCD) process, YMC has 16K 32 MTP + 1K EEPROM IP with ECC design, access time can be 40ns in high speed mode. In the near future, YMC and MagnaChip will collaborate to achieve automotive class memory."The continued collaboration between MagnaChip and YMC has produced greater innovation and variety in the types of MTP solutions being offered to customers," said Daniel Huang, the YMC's president. "YMC sees its continued strategic partnership with MagnaChip as a long-term benefit to both YMC's and MagnaChip's customers.""We are delighted to continue this valuable partnership with Taiwanese IP solution leader YMC," said YJ Kim, chief executive officer of MagnaChip. "We believe our collaboration will lead to even more cost-efficient, high-functioning NVM solutions to satisfy the increasingly sophisticated needs of global foundry customers for a growing number of diverse applications."For more information about MagnaChip Semiconductor, please visit www.magnachip.com. For more information about Yield Microelectronics Corporation, please visit www.ymc.com.tw.

Pervasive Displays (PDi), a supplier of e-paper displays, recently announced the launch of a new high resolution 3-color 12-inch Electronic Paper Display (EPD) module featuring an internal timing controller (iTC), the E2B98FS081. The energy efficient, multi-colored display is a good fit for retail ESL (electronic shelf labeling), point of sale, office automation, and healthcare market applications."These new 12-inch EPDs bring the clarity and impact of e-paper displays to a stunning new, larger format," said Scott Soong, CEO of Pervasive Displays. "With sunlight-readability, they're well suited to transportation, public information, and other markets where high visibility is valued."The E2B98FS081 is a 12-inch active matrix TFT three-pigment (black, white and red), E Ink display panel. With a resolution of 103dpi, the display shows crisp, clear graphics and text. As E Ink replicates the optical characteristics of ink and paper, the EPD can be read clearly in ambient light without a backlight, or in direct sunlight, unlike traditional LCD displays. With three color options, the E2B98FS081 can create eye catching informational displays, with colors being used to highlight critical information, product features, or promotions.As a bistable display, the EPD module requires very little power to update an image and can maintain an image without power. Depending on the application, this means the E2B98FS081 can operate for days, weeks or even months on a single charge.The highly integrated E2B98FS081 incorporates many features onboard which help reduce development time as well as cut BOM costs. Whereas many other EPDs rely on external timing controllers, the E2B98FS081 integrates a chip-on-glass timing controller on the display itself, along with a booster circuit to reduce the need for external components.The timing controller stores pre-programmed driving waveforms tuned by Pervasive Displays to provide high performance operation of the EPD. Besides providing strong, reliable optical performance and low energy consumption, the stored waveforms also greatly simplify display development and operation.The high level of integration, thin profile and low power consumption features allow the E2B98FS081 to be used in very small or thin form factors, and in applications without the energy budget for a traditional display.More information about Pervasive Displays: www.pervasivedisplays.com.

Computex 2018 will welcome nearly 70 leading gaming and VR/AR suppliers - including Asustek Computer, Cooler Master, Gigabyte, G.Skill, MSI, Thermaltake, and Zotac - to showcase cutting-edge gaming products and technology coming out of the quickly rising post-PC gaming era, according to the organizers of the annual tradeshow in Taipei.eSports have been rapidly gaining popularity across the globe and bringing new momentum to the PC market in recent years. According to Gartner, while worldwide PC shipments continue to decline, sales of gaming and high-end PCs are still growing as suppliers focus on new selling points like customer experience (CX) and perception of value.Brand marketing dominates as the craze for eSports games and events continues worldwideAfter the Olympic Council of Asia announced that competitive gaming will be added to the official program at the 2022 Asian Games, many countries have officially recognized eSports as legitimate sports. Amid the upward trend of the market value of eSports, PC manufacturers have geared up to serve the growing market, with firms like Audio-Technica Taiwan, AVerMedia, Great Article, JacTek, Nplay, Safe Home and TUL launching high-performance devices to capitalize on the new opportunities, the Computex organizers said.As technologies and product performance continue to evolve, manufacturers scurry to deepen engagement with eSports fans and increase user loyalty by hosting games, sponsoring professional eSports teams or launching eSports brands. For example, high-performance motherboard makers such as Asustek, ASRock, EVGA, and MSI have sponsored extreme overclockers to compete live on stage at the OC World Cup and the OC World Record Stage, using liquid nitrogen at an extreme low temperature of -200 degrees in pursuit of challenging the limits of computer performance.CX is a top priority in the era of Gaming 3.0With immersive experience gaining traction, the gaming industry is shifting its focus from enhancing device specs and designs to building a CX-centric Gaming 3.0 ecosystem, where daily life meets cross-industry applications, such as eSports bars, hotels, and mobile phones, to accommodate a more diversified set of interests.This year, Thermaltake will showcase a high-end, diversified portfolio with the unique design under the theme "SyncALL, Say Hello TT" to enable personalized gaming experience. G.Skill will introduce the newest RGB high-performance memory with compelling, fluid lighting effect, and gaming peripherals like keyboards and mice as the company seeks to integrate software and hardware into premium customized RGB gaming products, the orgainzers said.Meanwhile, Acrox, Adomax, ASRock, Cherry, FSP, HEC/Compucase, KWorld, Linkworld, Solytech and Tesoro will also showcase various gaming devices and peripherals where game fanatics can experience extreme speed and visual effect, the organizers said.eSports market tends to pricy products that drive business transformation"The gaming product category has been a key growth driver of the PC industry in recent years," said Walter Yeh, president and CEO of the Taiwan External Trade Development Council (TAITRA), which co-organizes Computex with the Taipei Comouter Association (TCA)"The fact that users are focusing more on product quality and experience is prompting makers to improve gaming applications and technologies, which in turn has spurred the development of the entire PC industry. Computex will help exhibitors roll out CX-centric gaming peripherals and applications so they can build an all-inclusive supply chain and ecosystem to address the needs of high-end users," he added.Taking place from June 5-9 (June 6-8 for InnoVEX), Computex 2018 will feature a Gaming & VR/AR zone at Taipei Nangang Exhibition Center, Hall 1. During the five-day event, exhibitors of hardware components like motherboards, PC cases, and cooling systems will work with international eSports organizers to demonstrate the diversified development of eSports that are reshaping the PC industry.Gaming 3.0 user experience to dominate at Computex 2018Photo: Computex organizers

Asian Power Devices (APD), a global power supply designer and manufacturer, will participate in the Japan IT Week Spring 2018 exhibition at Tokyo Big Sight from May 9 to May 11. APD will be exhibiting diversified power supply products and research and development results in ESEC Spring exhibition area at booth W12-67 to demonstrate APD's capability of applying high-end technology to power applications to the global market."APD's customer base covers a wide range of applications, including consumer electronics, medical and networking communications. APD's greatest strength is its highly flexible custom-design capabilities that provide a wide range of product specifications," Jason Shen, director of Sales & Marketing, said. He added that APD's power products are in line with the latest energy efficiency and regulatory requirements, and they can develop high-quality customized power products based on customer specifications of special products that smartly respond to market trends.APD plans to showcase a range of network communications, medical and consumer power products and solutions at the exhibition. APD's network communication power supply has low interference features, which can meet the various types of network communication testing and certification requirements when combined with the client's system. This application has been used in other major telecommunication products in Europe, America, Asia, and Australia.Furthermore, with respects to the application of consumer electronics, APD's products are favored by the world's leading consumer electronics manufacturers for its miniaturized design, unique appearance, and multi-functional advantages. The company is also ranked No. 1 globally in the fields of storage and POS printer.In the field of medical applications, there are extremely high safety standards and needs for diversification. APD obtained ISO13485 Medical Devices Quality Management Systems certification in 2015 and complied with the medical safety standard IEC60601. With its high-quality and highly stable power supply products, APD currently produces high ratings and sales results in Japan and the global medical market.For more than 20 years, APD Group has been devoted to the research and development, design and manufacture of power supply products. Nowadays, APD has a research and development team of more than 300 experts and has immense experience in cooperating with top customers in the world. APD can satisfy customers' needs for high-quality customized and diversified products. Over the years, the company has won the unanimous trust of our clients, becoming one of the major suppliers of the world's leading manufacturers.In the future, APD Group will also continue to develop Wireless Charge, Open Frame, and other types of special customized products to provide the clients with higher quality power products and solutions.For more information about Asian Power Devices (APD) Group, please visit http://www.apd.com.tw/en/APD to showcase all series of power products and customized solution at Japan IT Week Spring

Indium Corporation has earned the SMT China Vision Award for its Indium10.1HF solder paste at NEPCON China.The SMT China Vision Award recognizes domestic and international companies with innovative products and technologies in SMT methods, processes, materials, equipment, software, and management services. Each product entry was evaluated based on its creativeness, technological advancement, and contributions to help reduce cost, improve quality, increase efficiency, enhance reliability, ensure safety, and protect the environment.Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to achieve ultra-low voiding, especially in bottom terminated component (BTC) assemblies.In addition to the ultra-low voiding, Indium10.1HF has a variety of characteristics including:- High ECM performance under low standoff components, RF shields without proper ventilation, and components in low-clearance cavities- Solder beading minimization- Very low bridging, slump, and solder balling- Excellent wetting to a variety of common fresh and aged metallizations and surface finishes- High print transfer efficiency with low variationFor more information about Indium10.1HF Solder Paste or Indium Corporation's complete Pb-free solder paste series, visit http://www.indium.com/solder-paste-and-powders/lead-free/Indium10.1HF solder paste wins SMT China Vision Award

Aaeon, a developer of industrial computers and intelligent retail systems, has released an updated version of its Intelligent Vending Development Kit.The kit includes a vending machine controller unit, a separate UP board PC unit to handle the interactive retail functions, a motor for the machine's internal mechanisms, a camera, a QR Code device, and all the cables needed to connect these components. Additional WiFi and Bluetooth connectivity components are also available on request.Aaeon is now offering two versions of its Intelligent Vending Development Kit, but both come with the Windows 10 IoT Enterprise OS and a customer-friendly API pre-installed, the vendor said. The kits also utilize the power of the UP board and its Intel Atom x5-z8350 processor and DDR3L memory to manage a facial recognition program.Accordig to Aaeon, as a customer approaches the vending machine, an image of their face is captured and their age range, gender and mood are detected. Based on the results, a particular set of products are recommended. Crucially, the process happens almost instantaneously, so there is no risk of the customer being inconvenienced.The latest version of the development kit also incorporates Microsoft Azure and Power BI services. With this service, information about every product sold and the gender, age range and mood of each buyer is collated by Azure and broken down by Power BI's data analytics tools. The result is real-time inventory control information and a series of insightful customer behavior reports and charts that operators can access at any time. Users who buy this version of the development kit will also receive a 60-day free trial for the Power BI Pro service."Intelligent vending machines represent the future of automatic retailing," AAEON design manufacturing product manager Brenda Huang said. "Increasingly, customers are both expecting and relying on intelligent, interactive systems, and the data these machines collect will also give businesses an edge over their competitors."

Clientron Corp., a global leading provider of POS, thin client, and embedded systems, will proudly present its latest product innovation including all-in-one POS terminal and POS peripheral with the benefit of reliability, flexibility and functionality at FHA 2018 (Food & Hotel Asia 2018), Asia's most comprehensive international Food & Hospitality Trade Event. This exhibition will take place April 24-27, 2018 in Singapore Expo. Clientron booth is located at Hospitality Technology sector, booth 4K2-03.Demonstrating its leading POS innovation and rich product portfolio, Clientron's displays will include: the innovative PST650 all-in-one POS terminal with a built-in high speed thermal printer and a small, lightweight form factor for counter space savings; the most affordable POS terminal, PT2000, in a fanless design with long life span support to both entry and mainstream POS market segments; and the top-of-the-line POS terminal Ares755 with powerful Intel 7th Core i processors for high-performance options.Furthermore, Clientron will highlight the tower type Bello650 with 15" touch displays in a solid aluminum enclosure; and the Wing series - the butterfly lightweight POS terminal with a flexible dual-hinge stand design. Besides that, there will be the fanless, vent-free Ares650 series with an up-to-date ultra-slim aluminum system enclosure as well as cost-effective PT3200 all-in-one POS terminal for the mainstream POS market. Moreover, many of the extended portfolios of integrated POS peripherals will also be exhibited in this event.For more information about Clientron or its products, please visit us at booth 4K2-03, FHA 2018, or visit Clientron's website: www.clientron.com.Clientron to display its latest POS terminals at FHA 2018

Avnet Asia Pacific will host the Avnet Sigfox Conference 2018 at the Hong Kong Science Technology Park on April 19. The conference will showcase Avnet's enterprise solutions using Sigfox's network technologies to support companies embarking on IoT projects."As the partner of choice for IoT, Avnet is able to provide an integrated ecosystem that connects different parties with the three major types of low-power wide area network (LPWAN) technologies - Sigfox, LoRa and NB-IoT," said Joe Chung, director, solutions development, Avnet Asia. "We can customize solutions and designs, and bundle the required products and services with system integrators, service providers, device manufacturers, cloud platform providers, and components suppliers to simplify complexities of the IoT ecosystem, thereby reducing time to market. Through this integrated approach, we can support and drive IoT initiatives for our customers."Recently, Avnet entered into a global agreement with Sigfox to jointly promote their products and services. With the Sigfox Ecosystem Partner Agreement, Avnet is able to connect different parties to offer a complete end-to-enterprise solution in Sigfox: components from suppliers such as ON Semiconductor, NXP, STMicroelectronics; Sigfox-compliant modules from device manufacturers such as Wisol; connectivity services from network providers including Thinxtra and UnaBiz, and complementing with Avnet's design capabilities to customize IoT solutions. The conference will feature a line-up of speakers from many of these parties.Sigfox's competence in LPWAN makes their technology one of the most widely-deployed networks that serves IoT connectivity and machine-to-machine (M2M) communications. These network technologies are required in most smart city applications, as they are particularly suited for long-distance data transmission (more than 20km). The conference will demonstrate Avnet's capabilities at implementing Sigfox services within Avnet's end-to-end solutions, which in turn help bring customers' ideas to market.Avnet is committed to establishing itself as the partner of choice in the development of LPWAN and IoT solutions through a series of partnerships in Asia. Late last year, Avnet utilized the LoRa platform to work with Cisco on its first visionary smart-city program, "Digital Living Lab," which aims to build a smart and connected Hong Kong. Earlier this year, Avnet also collaborated with local telecommunications firm, 3 Hong Kong, to offer system integration support to start-up companies selected by the firm's "3Innocity" campaign, paving a way towards accessing 3 Hong Kong's expanded Narrowband IoT (NB-IoT) network connectivity.