The HPC-AI Advisory Council, an organization dedicated to high-performance computing (HPC) and artificial intelligence (AI) research, education and outreach, and the National Supercomputing Centre (NSCC) Singapore, have officially kicked off the first APAC HPC-AI Competition that will start on March 27, 2018 and continue through August 2018.University and technical institute teams from the entire APAC region are taking part in the 2018 competition, which includes both creating missions and addressing challenges around AI development and testing, and high-performance computing workloads. The top team will be invited to Germany to participate in the 2019 International HPC- ISC Student Cluster Competition.The new APAC HPC-AI Competition encourages international teams in the APAC region to showcase their HPC and AI expertise in a friendly yet spirited competition that fosters international exchange in the areas of high-performance computing (HPC) and artificial intelligence (AI). To take home top honors, the teams will have to showcase systems of their own design, adhering to strict power constraints and achieve the highest performance across a series of standard HPC and AI benchmarks and applications."Sharing the same underlying technologies and infrastructures, HPC and AI are key enablers for universities, research laboratories and commercial vendors to develop the products and services of tomorrow - from safer cars and airplanes, to accurate weather and storm prediction, to improving peoples' lives and discovering new cures and solutions to problems plaguing Earth," noted Gilad Shainer, chairman of the HPC Advisory Council. "By participating in the APAC HPC-AI competition, team members will harness the power of HPC and AI, while gaining priceless access to a wealth of industry expertise, training and tools and hands-on exposure to a range of technologies and techniques they'll use not only for competition but throughout their careers. ""Our hope is that the competition will promote excellence in the usage of high performance computing in AI. By providing a petascale HPC platform, NSCC can help to bring people with different skillsets and expertise together to solve problems of a scale previously not possible," said Tan Tin Wee, chief executive, NSCC.Visit the 2018 APAC HPC-AI Competition's site for more detailed information and criteria and to submit team entries.

Semiconductor test equipment supplier Advantest Corporation has received a volume-purchase order for its V93000 testers from a leading Chinese designer of application-specific ICs (ASICs). The Beijing-based company will add the new testers to its existing installed base of more than 60 V93000 systems and use them in testing its current products as well as developing customized semiconductors for neural-network applications, including artificial intelligence (AI)."This customer is focused on leveraging its IC-design expertise to accelerate deep learning with innovative, cost-effective and energy-efficient solutions," said Hans-Juergen Wagner, CEO of Advantest Europe. "In addition to working with them, Advantest also provides test solutions to companies that manufacture microprocessors, GPUs and custom devices that are used in today's AI applications. Through our many global partnerships and activities, we are further extending our leadership to provide the best test solutions in this fast-growing market."At the SEMICON China trade show, running March 14-16 at the Shanghai New International Expo Centre, Advantest will exhibit 12 of its advanced products and services for the Chinese semiconductor market in booth #4425, Hall N4. An expert in testing chips for AI applications will be available in the booth to talk with visiting customers. In addition, product displays will include the V93000 platform, which provides the industry's broadest test coverage for leading-edge semiconductors. When equipped with Wave Scale MX and Wave Scale RF channel cards, the V93000 can achieve unprecedented parallelism and throughput, reducing the overall cost of test and pioneering new capabilities to test future generations of IC designs.More information about Advantest Corporation is available at www.advantest.com.

Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) has received a supplier excellence award from iTest Inc., a Silicon Valley-based start-up providing reliable and leading-edge semiconductor testing services, in recognition of the overall value delivered in the first year of the companies' strategic partnership.The award was presented to Todd Delvecchio, director of sales with Advantest, by iTest's CEO Rabbi Islam at the year-end supplier-recognition and customer-appreciation event at iTest's headquarters facility in Milpitas, California.The testing services company has purchased and installed four of Advantest's V93000 test systems, which includes the entire solution set offered by V93000 Smart Scale test systems, to evaluate a variety of devices including network processors, high-bandwidth interfaces and IoT devices for multiple semiconductor companies with operations in Silicon Valley."The first-rate performance and productivity delivered by the V93000 platform is matched only by the dedicated service and support that Advantest has provided this past year," said iTest's Islam. "I'm pleased to report that since the testers were installed a year ago, they have logged zero failures after rigorous usage.""As we move into 2018, we look forward to continuing our successful partnership with iTest," said Advantest's Delvecchio. "It's very gratifying to receive the award, but even more rewarding to see how our test solutions are enabling our customers to grow and become leaders in their market segments."Designed for testing different ICs on a single system, the V93000 platform fulfills the test requirements for a large variety of customers and device types, from engineering through volume production. It is the most cost-efficient test solution for all advanced semiconductor designs including high-speed, radio-frequency, mixed-signal, analog and power ICs. With the tester's universal per-pin architecture, each pin can run with its own clock domain, providing full test coverage by matching the exact data-rate requirements of the device under test. In addition, the V93000 platform's scalability allows it to address a variety of test methodologies and quality requirements, giving it a long usable lifetime for maximum ROI and reduced risk.More information about about Advantest Corporation is available at www.advantest.com.

Benefitting from flourishing growth of automotive electronics and telecommunication markets, Taiwan's No. 1 aluminum electrolytic capacitor manufacturer Lelon Electronics has recently posted 2017 revenue of NT$7.18 billion, up 18% on year, the highest in the company's history.Looking into 2018, burgeoning automotive applications and 5G deployments will continue to fuel growth in the demand for aluminum electrolytic capacitors.Lelon's new production lines of polymer capacitors are scheduled to begin full-scale operation in the second half of 2018, which will satisfy the massive market demand for polymer capacitors. Lelon can expect record-setting revenue for the year with growingly strong market demand and increased production capacity.For the purposes of meeting road safety and environmental protection standards, manufacturers are adding an increasingly large number of electronic control units (ECU) in each automobile. Lelon's automotive-grade aluminum electrolytic capacitors are used in original automotive electronics produced by many tier-1 automotive electronics providers in the world. With power systems used in cars transitioning to 48V, Lelon is also working with several automotive electronics providers to develop aluminum electrolytic capacitors specifically for 48V automotive power systems. The new automotive aluminum electrolytic capacitors will begin shipping this year, which will change the current market dominance by a few American and European manufacturers.Featuring long life, low impedance and high heat resistance, Lelon's automotive-grade aluminum electrolytic capacitors are AEC-Q200 and VDA6.3 compliant. As a result of its continuing efforts in the automotive electronics market over recent years, automotive applications contributed more than 10% of Lelon's aluminum electrolytic capacitor revenue in 2017 and the company expects to see steady increase in the future.Furthermore, telecom operators around the world are stepping up efforts on 5G infrastructure buildup. Lelon has also engaged in collaborations with major manufacturers in China, US and Europe to develop aluminum electrolytic capacitors for 5G base stations. Telecom and network applications account for approximately 20% of Lelon's aluminum electrolytic capacitor revenue. The category can expect to perform even better this year with 5G deployments picking up speed.Targeting automotive electronics and 5G developments in addition to high speed computing, robotics and Industry 4.0 applications, Lelon has been ramping up efforts toward high-end electronics markets in recent years and is benefitting from the efforts. For the year 2018, Lelon will respond to continuingly strong demand for high-end aluminum electrolytic capacitors with new products and added capacity, which will further buoy the company's overall performance.Lelon's products

Indium Corporation has earned the Circuit Assembly New Product Introduction (NPI) Award for its Core 230-RC flux-cored wire at the IPC APEX Expo technical conference on February 27 in San Diego, Calif.The NPI Awards recognize the leading new products for electronics assembly during the past 12 months. Honorees are selected by an independent panel of practicing engineers."Developing Core 230-RC and having the electronics assembly industry recognize it as a leading new product, is truly a great honor," said Tim Twining, Vice President, Marketing. "I am very proud of our team and the work they have done to develop and deliver this high-performance product to our customers."Indium Corporation's Core 230-RC is a new REACH- and RoHS-compliant, J-STD-004B tested and compliant "no-spatter" formula cored wire."In 2017, Indium Corporation sold more than 932 miles (1,500 kilometers) of 0.2 mm diameter flux-cored wire on 114-gram level wound spools," said Eric Slezak, Director of Business Development and Printed Circuit Board Assembly. "Indium Corporation is the only company that can put 1/4 lb. of 0.2 mm cored wire on a level wound spool in volume and ensure no tangling or feeding issues. This enables a more efficient and lengthy robotic soldering process."Core 230-RC delivers an exceptionally impressive 0.09% total flux spatter, as tested per IPC TM-650 2.4.48. "No-spatter" is important so that flux does not contaminate gold fingers or other contacts where it can interfere with circuit board electrical properties, or spatter hot flux on operators' hands. It is available in lead-free, tin-lead, and high-lead cored wires. In lead-free cored wire the available diameters are from 0.008" (0.2mm) up to 0.125" and flux weight content from 1.0% to 4.5%.Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.For more information about Indium Corporation, visit www.indium.com

Indium Corporation will feature its new ultra-low voiding Indium10.1HF Solder Paste - which helps customers Avoid the Void - at Productronica China 2018, March 14-16, 2018, in Shanghai.Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to achieve ultra-low voiding, especially in bottom termination component (BTC) assemblies.Indium10.1HF has a flux chemistry engineered to improve reliability with:- High ECM performance under low standoff components, RF shields without proper ventilation, and components in low-clearance cavities- Solder beading minimization- Very low bridging, slump, and solder balling- Excellent wetting to a variety of common fresh and aged metallizations and surface finishes- High print transfer efficiency with low variationIndium10.1HF is compatible with lead-free alloys such as SnAgCu, SnAg, and other alloy systems favored by the electronics industry. This solder paste is halogen-free per IEC 61249-2-21, test method EN 14582.For more information about Indium Corporation's low-voiding solder pastes, visit www.indium.com/avoidthevoid or see Indium Corporation at booth E2.2330.Indium10.1HF

Innodisk is attending Embedded World from February 27 to March 1 to showcase the newest storage, memory and software innovations aimed at accelerating interconnectivity in the embedded and industrial market.3D NAND to address future market demandsWith higher capacities and extended longevity, 3D NAND holds great promise for the embedded and industrial market. According to Innodisk's Senior Director of Flash, Charles Lee, 2018 will see a distinct increase in demand following the trends of IoT and Industry 4.0. To meet these demands, Innodisk has launched the all-new 3MG5-P 3D NAND SSD series. Innodisk is showcasing this new series along with other flash storage innovations at Embedded World 2018.Durable in-vehicle expansionsCANbus is a true and tested method for in-vehicle networking. Innodisk's CANbus expansion card is also compliant with the J1939 standard, making it suitable for heavy-duty applications while also allowing for a high degree of customization. Stable performance and lasting durability make this module a perfect fit for fleet management applications. Innodisk's booth at Embedded World is displaying a live demo simulating a vehicle dashboard to show the functionalities of the J1939 CANbus module.The fastest industrial-grade DRAMInnodisk's 2666 MT/s DRAM series is currently the fastest industrial-grade DRAM available on the market. These blazing fast modules are designed for labor-intensive server use but are equally suitable for casino gaming, automation and surveillance applications. The modules also consume less power than previous generations and use only high-quality Original ICs.Innodisk's newest solutionsInnodisk is also launching two new NVMe SSD series. OCuLinkDOM is an ultra-small form factor that uses the OCuLink interface and is designed for server boot-up applications. The other is the new high-performance M.2 series, which is available in both 2 and 4 lane PCIe 3.0. To handle the increasing number of edge devices and the growth of IoT, Innodisk has designed iCAP to easily manage storage devices through the cloud. This essentially allows for fewer operators to monitor the rapidly growing number of devices.Innodisk launchs their new product OcuLinkDOM at Embedded WorldInnodisk release 3D NAND product series at Embedded World

W2BI, an Advantest Group company and a supplier of wireless device test automation products, is exhibiting its newest test automation products for the wireless electronics market at Mobile World Congress (MWC) in Barcelona, Spain from February 26 through March 1. Featured will be a new 5G test solution that enables both the network and the device ecosystems to emulate end-to-end use cases to meet interoperability requirements and gain insights into overall system behavior.W2BI will highlight hands-on demonstrations of its test automation systems, including the first public debut of its 5G mmWave test system, which emulates both the 5G network and the device under test, helping to accelerate the R&D and time-to-market of 5G devices and modems. W2BI's new software-centric, end-to-end test system has both the scalability and flexibility to rapidly adapt in the fast-evolving 5G environment. The system integrates radio software layers, including packet core network and test automation management, with a physical layer mmWave transceiver system software-defined radio (SDR) to perform end-to-end, over-the-air 5G tests.W2BI's new 5G mmWave test system gives operators as well as network and device vendors the ability to perform lab-environment verification of system interoperability, performance and functions, in a fully automated mode. The accelerated time-to-market benefits this technology provides is of key importance to our customers. W2BI recently delivered the initial phase of its 5G test system to a major mobile operator.W2BI will also demonstrate its capability to support testing of LTE-M and NB-IoT devices using the highly scalable and portable Micro Line Tester (MLT). MLT leverages cloud technology to test smart devices and IoT technologies. The system lowers the cost of test during the development and production life cycles, provides a high level of scalability and supports 4G, 3G/2G, Wi-Fi, BT and NFC test features.

Clientron Corp., a global leading provider of POS, thin client, and embedded systems, will display its latest POS solutions for the retail market at the world's leading retail show, EuroCIS 2018, from February 27 to March 1, 2018 in Dusseldorf, Germany. At its Booth (Hall 10, Booth E73), Clientron will introduce its innovative POS terminals and various built-in POS peripherals available on the market today in order to meet the demands of omnicommerce experience.At the event, Clientron's displays will include: the innovative PST650 all-in-one POS terminal with a built-in high speed thermal printer and a small, lightweight form factor for counter space savings; the most affordable POS terminal, PT2000, in a fanless design with long life span support to both entry and mainstream POS market segments; and the new Ares755 with powerful Intel 7th Core i processors for high-performance options.Furthermore, Clientron will highlight the tower type Bello series with 9.7" / 12.1" / 15" / 15.6" touch displays in a solid aluminum enclosure; and the Wing series - the butterfly lightweight POS terminal with a flexible dual-hinge stand design. Besides that, there will be the fanless, vent-free Ares650 series with an up-to-date ultraslim system enclosure for the mainstream POS market.For more information about Clientron or its products, please visit us at Hall 10 Booth E73, EuroCIS 2018, or visit Clientron's website: www.clientron.com.Clientron to present its POS innovation at EuroCIS 2018

Clientron Corp., a world-leading supplier of thin client and embedded systems, will proudly introduce the latest technologies and applications in the fields of embedded computing and intelligent solutions at Embedded World 2018, taking place at the Exhibition Centre Nuremberg (No. 3-203, Hall 3) from Feb 27 to Mar 01, 2018 in Nuremberg, Germany.The highlights of Clientron's booth include the 3.5" SBC Board Saber-AL-3500 equipped with high performance Intel Atom E39xx processor family offering triple displays and three RS-232/422/485 COM ports; the Embedded System IT900 featuring the main board with innovative drawer design for easy maintenance and flexible e-Door concept for I/O expansion options to fulfill customized demands; the DIN Rail Box PC Mace-AL-200 featuring rich I/O ports, wide temperature and wide voltage; and Industrial Panel PC Pike-AL-1500SP with 15" fully IP65/IP69K rated protection, fanless & stainless enclosure design for critical environment and the most demanding industrial applications such as food industry. For the high-end platform, the IT900 embedded system supports Intel Core i5-6300U processor with Intel vPro technology to deliver Intel Active Management Technology (Intel AMT) using integrated platform capabilities and popular third-party management and security applications, to allow IT or managed service providers to better discover, repair, and help protect their networked computing assets.At the show, Clientron will demonstrate its intelligent solutions including industrial panel PCs for food industry, and embedded systems for factory automation, DI/DO access control, remote management application, smart parking, smart intersection, digital signage & digital surveillance solutions. To know more about its custom design, manufacturing capabilities and services, please visit Clientron at booth No. 3-203, Hall 3, Exhibition Centre Nuremberg, Embedded World 2018 or visit its website: www.clientron.com.Clientron to exhibit its latest embedded computing and intelligent solutions at Embedded World 2018