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Toshiba and SICC collaborate on SiC technology; alliance with Rohm faces bottlenecks

Chiang, Jen-Chieh, Taipei; Charlene Chen, DIGITIMES Asia 0

Toshiba's semiconductor and electronic components subsidiary, Toshiba Electronic Devices & Storage, has reached a basic agreement with China's silicon carbide (SiC) wafer manufacturer SICC for improving SiC wafer quality and technical cooperation...

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