Benefitting from flourishing growth of automotive electronics and telecommunication markets, Taiwan's No. 1 aluminum electrolytic capacitor manufacturer Lelon Electronics has recently posted 2017 revenue of NT$7.18 billion, up 18% on year, the highest in the company's history.Looking into 2018, burgeoning automotive applications and 5G deployments will continue to fuel growth in the demand for aluminum electrolytic capacitors.Lelon's new production lines of polymer capacitors are scheduled to begin full-scale operation in the second half of 2018, which will satisfy the massive market demand for polymer capacitors. Lelon can expect record-setting revenue for the year with growingly strong market demand and increased production capacity.For the purposes of meeting road safety and environmental protection standards, manufacturers are adding an increasingly large number of electronic control units (ECU) in each automobile. Lelon's automotive-grade aluminum electrolytic capacitors are used in original automotive electronics produced by many tier-1 automotive electronics providers in the world. With power systems used in cars transitioning to 48V, Lelon is also working with several automotive electronics providers to develop aluminum electrolytic capacitors specifically for 48V automotive power systems. The new automotive aluminum electrolytic capacitors will begin shipping this year, which will change the current market dominance by a few American and European manufacturers.Featuring long life, low impedance and high heat resistance, Lelon's automotive-grade aluminum electrolytic capacitors are AEC-Q200 and VDA6.3 compliant. As a result of its continuing efforts in the automotive electronics market over recent years, automotive applications contributed more than 10% of Lelon's aluminum electrolytic capacitor revenue in 2017 and the company expects to see steady increase in the future.Furthermore, telecom operators around the world are stepping up efforts on 5G infrastructure buildup. Lelon has also engaged in collaborations with major manufacturers in China, US and Europe to develop aluminum electrolytic capacitors for 5G base stations. Telecom and network applications account for approximately 20% of Lelon's aluminum electrolytic capacitor revenue. The category can expect to perform even better this year with 5G deployments picking up speed.Targeting automotive electronics and 5G developments in addition to high speed computing, robotics and Industry 4.0 applications, Lelon has been ramping up efforts toward high-end electronics markets in recent years and is benefitting from the efforts. For the year 2018, Lelon will respond to continuingly strong demand for high-end aluminum electrolytic capacitors with new products and added capacity, which will further buoy the company's overall performance.Lelon's products

Indium Corporation has earned the Circuit Assembly New Product Introduction (NPI) Award for its Core 230-RC flux-cored wire at the IPC APEX Expo technical conference on February 27 in San Diego, Calif.The NPI Awards recognize the leading new products for electronics assembly during the past 12 months. Honorees are selected by an independent panel of practicing engineers."Developing Core 230-RC and having the electronics assembly industry recognize it as a leading new product, is truly a great honor," said Tim Twining, Vice President, Marketing. "I am very proud of our team and the work they have done to develop and deliver this high-performance product to our customers."Indium Corporation's Core 230-RC is a new REACH- and RoHS-compliant, J-STD-004B tested and compliant "no-spatter" formula cored wire."In 2017, Indium Corporation sold more than 932 miles (1,500 kilometers) of 0.2 mm diameter flux-cored wire on 114-gram level wound spools," said Eric Slezak, Director of Business Development and Printed Circuit Board Assembly. "Indium Corporation is the only company that can put 1/4 lb. of 0.2 mm cored wire on a level wound spool in volume and ensure no tangling or feeding issues. This enables a more efficient and lengthy robotic soldering process."Core 230-RC delivers an exceptionally impressive 0.09% total flux spatter, as tested per IPC TM-650 2.4.48. "No-spatter" is important so that flux does not contaminate gold fingers or other contacts where it can interfere with circuit board electrical properties, or spatter hot flux on operators' hands. It is available in lead-free, tin-lead, and high-lead cored wires. In lead-free cored wire the available diameters are from 0.008" (0.2mm) up to 0.125" and flux weight content from 1.0% to 4.5%.Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.For more information about Indium Corporation, visit www.indium.com

Indium Corporation will feature its new ultra-low voiding Indium10.1HF Solder Paste - which helps customers Avoid the Void - at Productronica China 2018, March 14-16, 2018, in Shanghai.Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to achieve ultra-low voiding, especially in bottom termination component (BTC) assemblies.Indium10.1HF has a flux chemistry engineered to improve reliability with:- High ECM performance under low standoff components, RF shields without proper ventilation, and components in low-clearance cavities- Solder beading minimization- Very low bridging, slump, and solder balling- Excellent wetting to a variety of common fresh and aged metallizations and surface finishes- High print transfer efficiency with low variationIndium10.1HF is compatible with lead-free alloys such as SnAgCu, SnAg, and other alloy systems favored by the electronics industry. This solder paste is halogen-free per IEC 61249-2-21, test method EN 14582.For more information about Indium Corporation's low-voiding solder pastes, visit www.indium.com/avoidthevoid or see Indium Corporation at booth E2.2330.Indium10.1HF

Innodisk is attending Embedded World from February 27 to March 1 to showcase the newest storage, memory and software innovations aimed at accelerating interconnectivity in the embedded and industrial market.3D NAND to address future market demandsWith higher capacities and extended longevity, 3D NAND holds great promise for the embedded and industrial market. According to Innodisk's Senior Director of Flash, Charles Lee, 2018 will see a distinct increase in demand following the trends of IoT and Industry 4.0. To meet these demands, Innodisk has launched the all-new 3MG5-P 3D NAND SSD series. Innodisk is showcasing this new series along with other flash storage innovations at Embedded World 2018.Durable in-vehicle expansionsCANbus is a true and tested method for in-vehicle networking. Innodisk's CANbus expansion card is also compliant with the J1939 standard, making it suitable for heavy-duty applications while also allowing for a high degree of customization. Stable performance and lasting durability make this module a perfect fit for fleet management applications. Innodisk's booth at Embedded World is displaying a live demo simulating a vehicle dashboard to show the functionalities of the J1939 CANbus module.The fastest industrial-grade DRAMInnodisk's 2666 MT/s DRAM series is currently the fastest industrial-grade DRAM available on the market. These blazing fast modules are designed for labor-intensive server use but are equally suitable for casino gaming, automation and surveillance applications. The modules also consume less power than previous generations and use only high-quality Original ICs.Innodisk's newest solutionsInnodisk is also launching two new NVMe SSD series. OCuLinkDOM is an ultra-small form factor that uses the OCuLink interface and is designed for server boot-up applications. The other is the new high-performance M.2 series, which is available in both 2 and 4 lane PCIe 3.0. To handle the increasing number of edge devices and the growth of IoT, Innodisk has designed iCAP to easily manage storage devices through the cloud. This essentially allows for fewer operators to monitor the rapidly growing number of devices.Innodisk launchs their new product OcuLinkDOM at Embedded WorldInnodisk release 3D NAND product series at Embedded World

W2BI, an Advantest Group company and a supplier of wireless device test automation products, is exhibiting its newest test automation products for the wireless electronics market at Mobile World Congress (MWC) in Barcelona, Spain from February 26 through March 1. Featured will be a new 5G test solution that enables both the network and the device ecosystems to emulate end-to-end use cases to meet interoperability requirements and gain insights into overall system behavior.W2BI will highlight hands-on demonstrations of its test automation systems, including the first public debut of its 5G mmWave test system, which emulates both the 5G network and the device under test, helping to accelerate the R&D and time-to-market of 5G devices and modems. W2BI's new software-centric, end-to-end test system has both the scalability and flexibility to rapidly adapt in the fast-evolving 5G environment. The system integrates radio software layers, including packet core network and test automation management, with a physical layer mmWave transceiver system software-defined radio (SDR) to perform end-to-end, over-the-air 5G tests.W2BI's new 5G mmWave test system gives operators as well as network and device vendors the ability to perform lab-environment verification of system interoperability, performance and functions, in a fully automated mode. The accelerated time-to-market benefits this technology provides is of key importance to our customers. W2BI recently delivered the initial phase of its 5G test system to a major mobile operator.W2BI will also demonstrate its capability to support testing of LTE-M and NB-IoT devices using the highly scalable and portable Micro Line Tester (MLT). MLT leverages cloud technology to test smart devices and IoT technologies. The system lowers the cost of test during the development and production life cycles, provides a high level of scalability and supports 4G, 3G/2G, Wi-Fi, BT and NFC test features.

Clientron Corp., a global leading provider of POS, thin client, and embedded systems, will display its latest POS solutions for the retail market at the world's leading retail show, EuroCIS 2018, from February 27 to March 1, 2018 in Dusseldorf, Germany. At its Booth (Hall 10, Booth E73), Clientron will introduce its innovative POS terminals and various built-in POS peripherals available on the market today in order to meet the demands of omnicommerce experience.At the event, Clientron's displays will include: the innovative PST650 all-in-one POS terminal with a built-in high speed thermal printer and a small, lightweight form factor for counter space savings; the most affordable POS terminal, PT2000, in a fanless design with long life span support to both entry and mainstream POS market segments; and the new Ares755 with powerful Intel 7th Core i processors for high-performance options.Furthermore, Clientron will highlight the tower type Bello series with 9.7" / 12.1" / 15" / 15.6" touch displays in a solid aluminum enclosure; and the Wing series - the butterfly lightweight POS terminal with a flexible dual-hinge stand design. Besides that, there will be the fanless, vent-free Ares650 series with an up-to-date ultraslim system enclosure for the mainstream POS market.For more information about Clientron or its products, please visit us at Hall 10 Booth E73, EuroCIS 2018, or visit Clientron's website: www.clientron.com.Clientron to present its POS innovation at EuroCIS 2018

Clientron Corp., a world-leading supplier of thin client and embedded systems, will proudly introduce the latest technologies and applications in the fields of embedded computing and intelligent solutions at Embedded World 2018, taking place at the Exhibition Centre Nuremberg (No. 3-203, Hall 3) from Feb 27 to Mar 01, 2018 in Nuremberg, Germany.The highlights of Clientron's booth include the 3.5" SBC Board Saber-AL-3500 equipped with high performance Intel Atom E39xx processor family offering triple displays and three RS-232/422/485 COM ports; the Embedded System IT900 featuring the main board with innovative drawer design for easy maintenance and flexible e-Door concept for I/O expansion options to fulfill customized demands; the DIN Rail Box PC Mace-AL-200 featuring rich I/O ports, wide temperature and wide voltage; and Industrial Panel PC Pike-AL-1500SP with 15" fully IP65/IP69K rated protection, fanless & stainless enclosure design for critical environment and the most demanding industrial applications such as food industry. For the high-end platform, the IT900 embedded system supports Intel Core i5-6300U processor with Intel vPro technology to deliver Intel Active Management Technology (Intel AMT) using integrated platform capabilities and popular third-party management and security applications, to allow IT or managed service providers to better discover, repair, and help protect their networked computing assets.At the show, Clientron will demonstrate its intelligent solutions including industrial panel PCs for food industry, and embedded systems for factory automation, DI/DO access control, remote management application, smart parking, smart intersection, digital signage & digital surveillance solutions. To know more about its custom design, manufacturing capabilities and services, please visit Clientron at booth No. 3-203, Hall 3, Exhibition Centre Nuremberg, Embedded World 2018 or visit its website: www.clientron.com.Clientron to exhibit its latest embedded computing and intelligent solutions at Embedded World 2018

Leveraging Taiwan's IT industry forces, the Industrial Bureau of the Ministry of Economic Affairs invited nine vendors from various IT fields, including ThroughTek, Chunghwa Telecom, Everspring and ITRI to represent Taiwan Pavilion for the Mobile World Congress 2018 in late February this year. This year, the Taiwan Pavilion, already well-known for quality hardware manufacturing, will be spotlighting Taiwan's software development capabilities, including cloud-based applications, mobile communications and big data analysis.ThroughTek is the first Taiwan cloud platform vendor to gain recognition and reputation in China and then launched into Europe and US markets. In the past 10 years, with its accumulated years of software technology expertise, ThroughTek has successfully helped Chinese hardware manufacturers to further expand their markets into Europe and the United States. In recent years, more IoT applications have been developed, and ThroughTek, with in-depth software technology background focusing on cloud platform development, has been actively sought out by many European and American brands for direct collaboration.ThroughTek's Kalay cloud platform has a superior peer-to-peer (P2P) connection technology, allowing for IoT products, including IP cameras, doorphone, smart robots, dashcam, and smart home devices to quickly connect to the internet. By using ThroughTek's patented technology of easy setup via QR Code scanning to resolve the complex set-up situation for end users, and help brands improve their user experiences and reduce customer service costs. A successful case study representation is Guardzilla, a well-known IP security camera brand in North America, that launched Guardzilla 360 HD Security Camera in 2017 using ThroughTek's technology, and promptly named as CES Annual Innovation Award Honoree this year. Additionally, Guardzilla 360 and Outdoor HD Camera was the No.1 and No.3 best seller security camera in top three retailers Best Buy, Target, and Walmart in the US.This year, at the MWC Taiwan Pavilion booth, ThroughTek will be demonstrating how its customers has utilized the Kalay Platform solution to transmit and store video data, and provide backend analysis to manage and control device connectivity and other services. ThroughTek will be presenting popular products that use the Kalay Platform solution including Xiaomi Home IP Camera series, Guardzilla's low power consumption doorphone and 360 HD Security Camera; and Furbo Dog Camera from Taiwan-based Tomofun, recently featured on the Ellen Show a well-known talk show in the United States, and Hong Kong-based Vtech's smart home devices. ThroughTek has been continuously chosen by established brands for long term partnership, including China's Xiaomi, Hikvision, Foscam, Raysharp, and European and American brands including Guardzilla, Swann, WWM, Bosch, Lorex, Hesdo, Amped Wireless, Olympia, to name a few. Application areas include security monitoring, smart home, IoV and other in-depth end user IoT applications.There are very few cloud platforms in the market comparable to ThroughTek's Kalay Platform, capable of providing video transmission and storage with high efficiency and low operating costs. Therefore, ThroughTek has unrelentingly focused on image-related solutions, allowing surveillance images from different domains to be instantly viewed, transmitted and stored on the Kalay platform, and improved remote management of hardware devices. At the end of 2017, ThroughTek launched video surveillance solution, "VSaaS 3.0", a new generation of VSaaS across different browsers (including IE, Chrome, Safari, Opera, Firefox) to view live streams. Differentiating from peers that mostly build forwarding (relay) servers requiring increased operating costs, Kalay VSaaS technology uses peer-to-peer (P2P) connection on smartphone app to view live streams , or playback videos stored in the cloud by RTMP, significantly saving on operating costs while offering the best end-user experience.ThroughTek is a one-of-a-kind Taiwan-based company that uses software foundation as the starting point for market strategy in IoT industry and has once again been invited back to headline Taiwan Pavilion at MWC in Spain to demonstrate the latest cloud service solutions. For four days in Barcelona beginning from February 26th, the Taiwan Pavilion's nine companies will work together to showcase the soft power of Taiwan's IT industry. ThroughTek will also present diversified applications of video surveillance in the field of Internet of Things to international buyers. ThroughTek's future development potential is expediential.ThroughTek advances to Barcelona MWC Show headlining at Taiwan Pavilion

Taiwan's National Chiao Tung University (NCTU) has signed a pact with the Indian Institutes of Technology (IIT) to jointly carry out research projects and promote dual-degree programs, in a bid to push for more Indian science and engineering students to study and work in Taiwan to strengthen Taiwan's tech research momentum.This is part of the NCTU's efforts to comply with the government's New Southbound Policy, with the university already engaged in exchanges of teaching resources with IIT campuses in Bombay, Delhi and Madras, according to NCTU sources.Under the contract signed between NCTU president MC Frank Chang and his IIT counterpart, the NCTU will enlist 200 dual-degree doctoral students and 60 bachelor and master's degree students from India per year.Besides, NCTU also plans to set up a semiconductor foundation class and an overseas scientific research center in India, seeking to build connections with high-tech firms and research resources there and solicit more talented Indian students to join Taiwan's high-tech R&D talent cultivation systems.NCTU furthered that the planned research center in India is mainly designed to build an NCTU-IIT tech research and development platform with smart semiconductor as the core foundation, aiming to develop smart ICs for applications to 5G wireless communications, robots, IoT (Internet of Things), biomedicine, electric vehicles and autonomous driving.

Litemax, a display solution provider has launched a new product line based on Intel smart display module (SDM) specification. Intel SDM module specification can reduce power consumption, flexibly integrate with different LCD displays, and quickly create new display solutions, according to the company.Following Intel's SDM specification and reference design, Litemax has launched two in-house-developed SDM boards, the ASDM-APL6 and ASDM-APL5.The ASDM-APL6 is a small SDM board (60x100mm), equipped with Intel Apollo Lake SoC, LPDDR4-2GB and eMMC-32GB on board, one Intel Gigabit Ethernet port, two USB 3.0 ports, and WiFi 802.11ac (M.2) support. The open pluggable M.2 module is designed for low power consumption applications including digital signage, public kiosks, and point-of-sale.The ASDM-APL5 is large SDM board (175x100 mm), equipped with Intel Apollo Lake SoC (6-12W) on board, DDR3L up to 8GB SO-DIMM, one Intel Gigabit Ethernet port, two USB 3.0 ports, one COM and two M.2 Key-E and M slot. Due to more I/O ports and powerful SoC inside, the board is meant for specific and professional applications including point-of-sale, transportation signage and hospitality, Litemax said.Litemax said it also offers many SDM-ready display computing systems for low to high-end vertical applications. At the beginning of 2018, Litemax the released IPPS-3205-SDM1 and IPPS-4355-SDM1, two high-end SDM display computing systems.The IPPS-3205-SDM1 is a 32-inch UHD LCD system, with Litemax Duarpixel LCD, brightness up to 800 nits. It features Litemax's own MaxRGB technology (NTSC up to 94%), and embedded Intel SDM. It is for multi digital signage solutions in retailers, restaurants and infrastructures.The IPPS-4355-SDM1 is a UHD SDM-ready system featuring Litemax Spanpixel LCD display. The aspect ratio of the system is 16:2.2, with brightness of the LCD up to 1000 nits, and NTSC up to 95%. Litemax said the IPPS-4355-SDM1 system is meant to be a turnkey system for public transportation signage."In 2018, Litemax will cooperate with Intel closely and provide more products to support Intel SDM specification," said David King, general manager of Litemax.For more products and systems, please visit Litemax's official website: www.litemax.comLitemax-developed Intel SDM module