COVID-19 goes on a global rampage as 2020 unfolds. As part of the efforts to prevent the spread of the coronavirus, health screening stations are set up at entrances to government buildings, medical institutions, and office complexes to check people's temperatures with forehead thermometers or thermal imaging cameras. However, most thermal imaging systems on the market are not intelligent enough and are susceptible to false alarms.Their accuracy may degrade when they have been in use for an extended period of time. Furthermore, a professional team may be required to set up a thermal imaging system. These all prevent enterprises and institutions from painlessly incorporating temperature screening systems. To help relieve these headaches, ARBOR recently introduced E-Guardian S408, a thermal imaging solution for epidemic prevention. Featuring a smart design to effectively reduce false alarm rate and boost screening rate, plus a small footprint and diverse mounting options, E-Guardian S408 grabbed market attention as soon as it made a debut.According to ARBOR general manager Clark Lien, in the wake of the COVID-19 pandemic, temperature screening systems have virtually become standard equipment of large buildings but most systems currently in use leave a lot to be desired. The problem of false alarms is the most common complaint. Temperature screening systems detect the temperature of the subject using thermal imaging technology and present the distribution of the temperatures on the display. Most systems on the market are unable to target a specific detection area so a false alarm most often occurs when a person holding a hot drink passes the screening station. When such cases keep occurring and there is no temperature calibration reference, the systems will raise false alarms again and again. The cry wolf effect will cause the operators to let their guard down, thus failing to keep the virus out.Aside from the problem of false alarms, current temperature screening systems lack user-friendly interface. They are generally categorized into two types of systems. One comes with powerful functions but requires the supplier to install the system due to a high level of complexity. The other comes with simple functions but can be installed by the user. Both types of systems have their shortcomings. The former needs professional engineers to configure system parameters, while the latter offers no flexibility in their functions.In view of this, ARBOR introduces E-Guardian S408, featuring robust advantages to solve these pain points. According to Lien, ARBOR started out as an industrial PC supplier and has developed strong capability in thermal imaging technology, which is often used in industrial applications. On top of its experience in developing thermal imaging sensors for inspection instruments used at power or petrochemical plants, ARBOR combines factory automation, ICT and thermal imaging sensor technologies to design pioneering epidemic prevention products with an emphasis on enhancing user experience and value-added features. As a result of such efforts, E-Guardian S408 delivers higher-than-expected reliability and quality. As a premium quality product with a competitive price, E-Guardian S408 has been enthusiastically embraced by the market since its launch.ARBOR not only offers E-Guardian S408 at a compelling price, but also designs it to address the problems of existing systems on the market, noted Lien. Featuring quick and easy installation, E-Guardian S408 can be set up using a rack mount or magnetic mount onto a door frame, wall, or other metal surfaces. It also comes with a built-in Human-Machine Interface (HMI) so there is no need for an external display. Following the installation guide, users can get the system up and running within five minutes.Enhanced with AI-based image recognition, E-Guardian S408 can intelligently detect the human body and locate the forehead and temple for temperature measurement. This way, it can avoid checking temperatures of a non-human object and thus reduce the chance of raising a false alarm. It also comes with a built-in calibration unit that can automatically correct temperature parameters to eliminate the problem of degraded accuracy when existing systems are in extended use.Although COVID-19 is gradually getting contained through joint efforts from the public and private sectors, Lien thinks some organizations will continue to have temperature screening systems operating at the entrance. They will become part of people's daily lives. Temperature screening systems that are smarter and easier to configure and operate will help safeguard the world against the virus.Featuring painless usability, smart design, flexible mounting options and compelling pricing, ARBOR's E-Guardian S408 helps safeguard the world against virus.
The mobile vehicles are required high-speed bandwidth and better network coverage for streaming media services in wireless IPTV (Internet Protocol Television) application, however this situation is hard to achieve through IP-based wireless networks, specifically for recreational vehicles (RVs), trucks, and fleets. Proscend's 4G LTE WiFi Cellular Router M330-W has been applied into IPTV solutions in European cities for RVs to enable sufficient bandwidth and to improve better network coverage.The IPTV digital multimedia box through WiFi signal is built inside in the RVs, which made of metal to cause shielding problem and weak signal, because a wireless signal is not easily pass through metal. Moreover, the installation space is strictly limit because many devices are integrated together in a space, including a cellular router, an IPTV digital multimedia player, and a TV display screen. Therefore, designed for ultra-compact and cost-effective features, Proscend's Compact Industrial Cellular Router M330-W is adopted by the customers and integrated with their IPTV digital multimedia box to get stable signal and reliable bandwidth for RVs.Stable SignalProscend's Compact Industrial Cellular Router M330-W is connected with the customized 5-in-1 outdoor magnetic mount roof-top antenna to receive LTE, WiFi, and GPS for combining multiple functions, like playing video streaming over Cellular/WiFi, and guiding the route via GPS simultaneously as well as enhancing more stable signal and better sensitivity. The Cellular Router M330-W can be also connected your digital multimedia box via a RJ45 Ethernet cable for backup support.Reliable BandwidthThe Compact Industrial Cellular Router M330-W supports LTE cellular technology, WiFi wireless connection and Ethernet network to make multiple Internet connections for combined high-quality speed and reliability. With long-distance wireless connectivity and secure VPN tunnels, the Cellular Router M330-W ensures dependable communications and improves the whole RV Internet experience to give you secure, fast and reliable connections.Affordable DeviceThe Compact Industrial Cellular Router M330-W with slim size and lightweight design meets tiny space and easy installation. Compared to expensive satellite TV devices, the Cellular Router M330-W provides competitive price-to-performance ratios to integrate with the IPTV digital multimedia box flexibly and save your cost.Proscend's Cellular Router M330-W with an outdoor 5-in-1 antenna enhances stable signal in IPTV application for RVs
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today extended its record of leading the industry's innovation in specialty Flash memory with the introduction of a more flexible, high-speed read capability in its latest QspiNAND Flash products.Automotive and IoT device manufacturers are increasingly adopting high-performance Single-Level Cell (SLC) NAND Flash as a low-cost alternative at densities of 512Mbits and higher to the NOR Flash traditionally used for code storage.Previous Winbond innovations in high-performance NAND Flash include the Quad SPI-NAND interface, which shares the same 6-pin signals and QSPI command set as Quad SPI-NOR, and the Continuous Read function, which achieves up to a 52MB/s continuous data transfer rate at a 104MHz clock frequency.Now Winbond has created another innovation in high-performance NAND Flash with the introduction of the Sequential Read function in its latest high-performance W25NxxxJW QspiNAND Flash devices. In Sequential Read mode, the QspiNAND Flash products achieve the same 52MB/s maximum data rate at 104MHz as in Continuous Read mode, but with new flexibility to configure the chip's operation. The most important new options are:* Freedom to apply the user's own ECC engine. In Continuous Read mode, a Winbond W25N device only supports its own on-chip 1-bit ECC engine. In Sequential Read mode, users can implement 4-bit, 8-bit or any-bit error correction when enabled by an external ECC engine.* Access to the entire memory array - both the Main Area and the Spare Area - with a single Read command. This is ideal for code shadowing applications in which low latency and fast boot time are particularly important.* Greater flexibility to configure the data arrangement to suit the user's application."By providing for high-speed operation with its Continuous Read function, Winbond had already made QspiNAND Flash a viable option for use in code storage applications, including for code shadowing and execute-in-place operations," said Syed S. Hussain, Director Segment Marketing, Winbond Electronics America Flash Business Group. "Now the addition of Sequential Read means that users can benefit from the same high Read speed of up to 52MB/s while implementing their chosen ECC engine and data access arrangements."The new 1.8V QspiNAND Flash products are available in densities of 512Mb, 1Gb and 2Gb. The 3.0V versions are available in densities of 2Gb and 4Gb. All are manufactured in the company's 12-inch wafer fabrication facility in Taichung, Taiwan. Winbond is expanding capacity to meet new demand expected in both the automotive and IoT market segments.The new W25N QspiNAND Flash devices are offered in compact 8-pin packages - a space-saving format which was not possible for SLC-NAND Flash memory products before Winbond's development of an effective QspiNAND Flash interface. Clock speeds of 104MHz allow the equivalent of 416MHz (104MHz x 4) speed for Quad I/O performance when using the Fast Read Dual/Quad I/O instructions. To provide better NAND Flash memory manageability, the devices perform on-chip bad block management.Key features of the Winbond W25N family of NAND Flash memory products are:Wide Temperature Range* -40 degree C to +85 degree C operating range in Industrial GRADE* -40 degree C to +105 degree C operating range in Industrial plus and Automotive GRADEUnique Memory Architecture* Page Read Time with ECC Enabled: 60μs* Page Program Time: 250μs (typ.)* Block Erase Time: 2ms (typ.)* Fast Program/Erase performance* Supports OTP Memory AreaHigh-Performance QspiNAND Flash* QSPI implementation in 46nm process technology* More than 10-years data retention* 104MHz clock frequency that can support up to 52MB/S continuous data transfer rateSpace Efficient Packaging* WSON8 6x8mm* WSON8 5x6mm* TFBGA24 6x8mm* KGD (Known Good Die)For more information, please visit www.winbond.com.Winbond QspiNAND FlashSequential read, more flexibility
Swissbit, which was created through a management buyout from Siemens Semiconductor in 2001, is the only independent and European supplier of flash-memory products. By integrating its core competencies of data storage, security, and 3D packaging technologies, the company has established a new business unit, Embedded IoT, eyeing the huge opportunities driven by the growing digitization and networking of devices across the Internet of Things.Embracing the IoT EraAs a manufacturer of high quality, real industrial-grade flash storage systems, Swissbit has always taken pride in its ability to store data securely and provide a long storage life.When asked why the new business unit is established, Silvio Muschter, CEO of Swissbit, explains, "For almost ten years, we have integrated safety functions into our products. Initially, it was SD and microSD cards with integrated encryption software to prevent eavesdropping on mobile phones and data protection-compliant memory modules for police bodycams.""Then we asked ourselves a question: are these memory cards with a security solution, or a security solution in the form of a memory card?"It turns out that a right question triggered a change of perspective, which helps Swissbit open up a whole new world of applications and move into a much bigger playing field of IoT.He stresses that the increasing digitization and networking of devices is dramatically increasing the pressure for protection of data and devices, and therefore driving the demand for intelligent security products for embedded IoT solutions."In the future, the most valuable commodity will be data. At Swissbit, we see it as our mission to reliably store and protect this data," Silvio says.Easy to use, hardware-based security productsIn the industrial IoT sector, key issue for customers is: how to protect data and the IP of machines and devices, as well as communication with the cloud.From Swissbit's perspective the question is: how does a 'thing' know that the received data or data queries from another 'thing' are correct, and that the source of a message is really the system component that it claims to be?In order to answer that question and bring real industrial-grade security to IoT systems, Swissbit has developed the hardware-based solutions to ensure that machines can uniquely authenticate themselves in machine-to-machine communication (M2M) via a Secure Element.Silvio explains, by building Secure Elements into memory cards, systems can have non-cloneable identities and become uniquely identifiable M2M communication participants capable of authenticating and sending and receiving cryptographically secure data.Therefore, Swissbit Embedded IoT solutions can be used as a tamper-proof ID card in the networked device such that networked systems can be protected against misuse and 'identity theft' in the future.With years of experiences in developing security products, Swissbit is able to develop and offer customer-specific and application-specific solutions.A recent example is fiscalization: In Germany, cash registers must be equipped with a certified technical safety device (TSE), which includes a certificate as well as a secure element for tamper-proof recording of cash register data. Swissbit offers the first certified and retrofittable solution in microSD card, SD card and USB stick form factors.In fact, alongside custom security solutions, this year Swissbit will also release standard security products with a flash memory as a microSD card and USB stick. These can be used in a wide range of IoT devices, such as video surveillance, telecommunications, automotive technology (e.g. autonomous driving), medical and fiscalization applications, where the recorded data as well as access to the stored data can be protected."Our approach to securing data and communication is particularly compelling," says he. "Especially, where it's not simply a case of networks of completely new machines, but where existing systems need to be retrofitted. Here, our approach offers unprecedented flexibility."New plant to help boost new businessIn addition to storage and security, Silvio emphasizes that 3D packaging is also one of the company's core competences.At the end of 2019, Swissbit opened its new plant in Berlin, with more than 20,000 square meters of land. This triples its production capacities for highly integrated system-in-package devices."At our Berlin plant in Germany, we provide state-of-the-art production capacities – from SMT lines to bonding to 3D packaging. We will use these capacities for our own products and, if customer demand requires, also integrate further functionalities into storage solutions or offer customer-specific form factors."It means that, in addition to storage and safety functions, Swissbit may further integrate additional sensors and radio modules to expand the application possibilities of its Embedded IoT products."The key message is that, we can offer very flexible development and manufacturing services to meet customers' specific requirements for their IoT applications. With the new plant in Berlin, we are optimally equipped for this."Expanding operations in TaiwanFor Swissbit, its successful strategy has always been to look for niches in all of its target markets. These include industrial automation, IoT, telecommunications, automotive technology and medical technology, where small and medium-sized quantities are more likely to be in demand, and where customers value the high product quality and support services.Silvio points out that this strategy also applies to our activities in Taiwan and China. With presence in Taiwan for almost 10 years, Swissbit has expanded its operations in Taiwan last year, aiming to offer innovative and robust IoT solutions to customers in Asia and support them comprehensively throughout the entire product life cycle."One of our unique advantages particularly for our customers in Taiwan and China is that for security applications. Especially for those companies that sell their products to key export markets such as Europe and North America," Silvio stresses.He is optimistic that with Swissbit's comprehensive support network, modular hardware security and close cooperation with local partners as well as regulatory and certification authorities, Swissbit sees itself as a solutions partner to help customers enter these markets."The market for tamper-proof POS systems in Germany or the market for industrial and building automation for manufacturers of edge computing are perfect examples," Silvio indicates. "We look forward to cooperating with local makers more closely to create a win-win situation for both sides by expanding IoT security market together."Silvio Muschter, CEO of SwissbitSwissbit provides a wide range of security products to add HW-based security to your IoT systemSwissbit offers the full portolio of SSDs, storage cards and USB products in all common NAND technologies, with real industrial-grade high qualityWith advanced 3D packaging technology, Swissbit also provides flexible development and manufacturing services to meet customers' specific needs
AU Optronics (AUO) has leveraged its display technologies and teamed up with Space4Money, the company's wholly-owned subsidiary specializing in smart retail software and hardware integration solutions, to deliver interactive Smart Collection Wall and Information Wall displays, officially unveiled at the Orientation Gallery of Taiwan's National Palace Museum.Following the successful completion of smart retail spaces for domestic telecommunications companies, restaurant chains, creative arts and department store brands, AUO leads Space4Money to wield its expertise in product technologies and smart interactive solutions to offer a brand new experience for visitors to the National Palace Museum.To meet the new trends of smart showcasing and digital creative arts, Space4Money has partnered with animation studio Digimax to achieve a melange of technology and humanities with its interactive smart showcase integrating the National Palace Museum's digital archive of artifacts in the Orientation Gallery.Among the installations, the Smart Collection Wall, measuring at 12m in width, is currently the largest of its kind in Asia. The interactive wall uses 20 pieces of AUO's 55-inch high spec video wall displays, boasting high resolution, low reflection, and appealing extreme narrow bezel design.The bezel with displays assembled is a mere 1.8mm wide, forming an almost seamless single large screen for viewers to see a full spread of images. The Smart Collection Wall has an intuitive and friendly user interface and infrared sensor design to allow several users to select, drag and swipe pictures, videos, animations, 360-degree digital models, and writing interpretations of over 300 artifacts at the same time.After accessing the virtual artworks, visitors are encouraged to explore further the actual collections in the museum. On both sides of the Orientation Gallery, the Information Walls, each composed of four 55-inch video wall displays, showcase the latest museum exhibitions and events information for visitors to get a sneak preview.The Smart Collection Wall designed by AUO's groupPhoto: Company
ASM Pacific Technology's (ASMPT) Back-end Equipment Segment has been renamed to Semiconductor Solutions Segment. The other two segments - SMT Solutions Segment and Materials Segment remain unchanged.To stay ahead of the industry curve, we have proactively diversified our product portfolio and technologies into the mid-end deposition space and more recently into data analytics.The acquisition of NEXX on Oct 2018 with their full line-up of deposition tools uniquely positioned ASMPT to offer total interconnect solutions for Advanced Packaging, making ASMPT a leader and preferred partner for Heterogeneous Integration packaging as Moore's law slows down.To provide a pioneering total solution for TCB to customers, ASMPT has embarked on a strategic partnership with a high speed X-ray inspection/ metrology provider to offer an industry's first closed loop TCB-AXI (Thermo Compression Bonder-Automatic X-Ray Inspection) solution that utilizes the power of AI data analytics to achieve faster NPI, improved yields, better reliability and BIC (Best in Class) process control for Heterogeneous IntegrationWe also entered into a strategic collaboration with SAS and by leveraging ASMPT's Industrial IoT solutions, we expect to deliver the most advanced and holistic data analytics solution to our customers with the value of higher productivity, quality and reliability in their manufacturing operations.The renaming to Semiconductor Solutions Segment marks ASMPT's ambitions and continuing quest to deliver the best integrated customer value by strengthening our offering of adjacent products and solutions.We look forward to deepen our long-term partnership with our customers by continually delivering higher value to our customers.Lim Choon Khoon, Senior Vice President of ASM Pacific Technology, Business Unit CEO (IC/Discrete & CIS), Semiconductor Solutions
Industrial PCs (IPC) have been the driving forces for various industries. With the global smartization constantly trending up, businesses resort to digital transformation for sustainable growth, which is highlighting the increasing importance of the role that IPCs play.According to Jerry Chang, Senior Director of DFI Product Planning Division, the new trend spurs new demand, which traditional architectures can no longer keep up with. Smart systems today require IPCs to meet stronger AI computing power, more comprehensive network capabilities, and smaller footprint.IPC designs can be highly industry-specific and purpose-driven, such as healthcare, recreation, and transportation. What distinguishes IPCs from consumer electronics is that various essential specifications greatly factor in when designing and/or customizing IPC products. Nonetheless, Chang told Digitimes that, based on his observation of the market development, there are still some essentials shared by both business and customer settings, which are exactly the above-mentioned three: AI computing power, network capabilities, and smaller footprint.The demand for AI computing and networking emerged on the account of recent years' Artificial Intelligence of Things (AIoT) trend, and it seems that IPCs' computing power hasn't yet stepped farther enough outside general data processing. The ubiquity of AI will bring edge computing to light, and today's IPCs are still not decent enough for that or for the performance level that aligns. Network capabilities on the other hand have become a must in IPCs. OT systems - mostly used in standalone systems - may require network connections, internally at most, with a few cases externally. But the tide has changed. Under the AIoT paradigm, enterprises are now stressing more on the importance of networking to external cloud and servers, which has already shifted the course for IPC design.Despite the importance of the above, IPC downsizing also seeks improvement. "IPC looks for maximum flexibility, and has to be the computing power inside miniature architectures in edge devices, so we will have to optimize that, especially in small form factors, without a question," Chang said. He also showed Digitimes that DFI already on the market has an array of products with the performance level of AI computing, robust network capabilities, and miniature design. Take GHF51 - it recently received major marketing efforts - for example, the 1.8-inch SBC form factor and AMD Ryzen R1000 processor make GHF51 a high-performance unit to support image processing and robotic arm control. For network connectivity, GHF51 also provides multiple high-speed, reliable and secure I/O interfaces to enable flexible expansion and connecting external devices.GHF51, in addition to business and industrial applications, also seems to catch academic attentions for its performance and footprint improvements. Raspberry Pi, academia and research institutions' favorite, is built on ARM-based processors, whereas GHF51, using x86-based AMD Ryzen processors, provides an upgraded alternative. We will see how this breakthrough affects the market.In addition to GHF51, each of DFI SBC series products has its own features respectively, such as ALF51 powered by Intel Atom platforms, "palm-sized" EC90A-AL, AL05P featuring Power over Ethernet (PoE), Freescale-based and "palm-sized" EC900-FS6 with "ultra-wide" operating temperatures, "mini-sized" EB100-KU powered by Intel Core i processors, CS551 with -30 degree C to 80 degree C operating temperature and smart heater triggered below -30 degree C, and a COMe Mini board, WL9A3, with Core i processors. As a tactic move, DFI foresaw the need to expand its portfolio of miniature models, and now they have more similar projects in roadmap.There may be two major reasons in DFI's miniaturization success unseen in its competitors, Chang specifically told Digitimes. One is its experienced system-on-module (SOM) development - the know-how in balancing between high-performance and small-footprint. DFI's long-term commitment to this field is believed to have accumulative values that allow it to build a complete product mix. The other reason is that, as a subsidiary of Qisda Group, DFI has received from a few benefits - the access to Qisda's supply chain that results in reduced cost estimation, and leverages for expanding regions and sectors. These advantages have been enabling system integrators to quickly build systems that combine flexibility and performance, thereby tapping new AIoT opportunities.Feel free to visit the DFI's website for more information.DFI's miniaturization asset lacked by its competitors, according to a senior director of DFI, lies in the experienced system-on-module (SOM) development, key to help system integrators build optimized AIoT systems.
Winbond Electronics Corporation, a global supplier of Flash memories and inventor of the popular Multi-I/O Serial Flash architecture, today announced it is now the top supplier of all NOR Flash memories worldwide.Based on recent market data from WebFeet Research, Winbond took the number-one NOR revenue position in 2019 with a 22.8% market share. In support of this mission, it shipped more than 3 billion Flash memories in 2019, which is the leadership position with 27.3% of all NOR Flash units worldwide. Additionally, Winbond has been the top supplier of Serial NOR Flash since 2012 and has 27.1% market share out of a total revenue of $2.009 B.Meeting the growing flash memory needs of its customers around the world with its own 12-inch wafer fabrication facility in Taichung - Taiwan, it has now planned to start construction of a second 12-inch wafer manufacturing facility in Kaohsiung in Southern Taiwan. This second fabrication facility will make it convenient for further expansion and growth of flash manufacturing at the Taichung facility to meet the demands of new applications of flash memories like AI, Automotive, Storage, Networking and 5G.NOR Flash market, particularly Serial Flash continues to grow"Worldwide Serial NOR Flash shipments will continue to grow from $2 billion in 2019 to greater than $2.89 billion by 2024," said Alan Niebel, founder and CEO of WebFeet Research, Inc. "Winbond, a pioneer in Serial Flash memories and now the leading supplier of NOR Flash that is predominately Serial Flash, is well positioned to take advantage of this market growth with its innovation in both products and packaging ingenuity, broad product portfolio and manufacturing capabilities.""We are extremely pleased with the popularity of our SpiFlash memories and becoming the top NOR Flash supplier worldwide," said J.W. Park, Technology Executive of Winbond Flash Memory. "We anticipate further growth after recovering from 2020 and are ramping production of our products to address a wide range of higher-density applications."Advanced Flash technology for high density applicationsWinbond has shipped more than twenty-billion Serial Flash memories since its SpiFlash product line was launched in 2006. Throughout this time the company has continued to advance its Flash process technology and packaging capabilities. Winbond introduced its first 58nm-based products in 2011 and now offers a broad line of high-density 58nm SpiFlash memories spanning 16Mb to 1Gb densities, 3V and 1.8V power supplies, in a range of packages and known-good-die (KGD) solutions, with plans to move to 4x nm technology by 2021. The 58nm technology provides a more cost-effective, feature-rich and higher-performance solution than the 90nm Flash technology, used primarily for lower-density SpiFlash products ranging from 512Kb to 16Mb as well as for several Automotive applications that have been designed in with key customers.Winbond's Flash business is expected to grow further in 2020 and beyond, as applications demand higher Serial Flash densities. Key applications driving this demand include: mobile phones, set-top boxes, digital televisions, electronic games, wearables and hearables, cable and DSL modems, wireless LANs, networking, automotive, servers, next generation gaming desktops and 5G. Winbond is now offering even higher-density 58nm 512Mb and 1Gb NOR Flash memories in 3V and 1.8V to address the need for higher density memory in the industry. For specific details of products and packages please contact Winbond.About WinbondWinbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM and Code Storage Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.Winbond is headquartered in Central Taiwan Science Park (CTSP) and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong. Based on Taichung and new Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.Winbond ships 3.1 billion units in 2019, and continues #1 position in Serial NOR Flash since 2012
The coronavirus outbreak has deferred the global 5G network rollout, even though demand remains high. Memxpro, a leading industrial DRAM module and SSD solution provider, formally introduces 16 and 32GB native DDR4-3200 memory modules to the global market.Continuing its production, Memxpro's new large-capacity, high-speed DDR4-3200 DIMM series maximizes high-level performance with clock speed improvements that benefit from the DDR3 to DDR4 upgrade. Using Micron DRAM chips and passing rigorous tests, Memxpro offers -40 degree C to +85 degree C wide temperature products for industrial requirements, along with built-in thermal sensor, suitable for 5G facility deployment in harsh environments.Memxpro's DDR4-3200 industrial-grade memory module uses Micron's 1x nm DDR4 DRAM chip technology. In its first rollout, it comes in SODIMM and ECC SODIMM varieties. Featuring native data rates of 3,200 MHz running at 1.2V and impressive overclocking performance, the new DDR4-3200 RAM modules are offered in up to 32GB capacities and target 5G services as a perfect fit for its promising bandwidth and connectivity improvements. With its high reliability and low latency, Memxpro's industrial DRAM modules are utilized by a global first-tier 5G tech manufacturer for their new generation network appliances used in demanding environments, successfully moving 5G technology development forward.IHS key predictions late last year show the 5G value chain will invest an average of US$235 billion annually to expand and strengthen the 5G technology base that will support up to 22.3 million jobs by 2035. It is estimated that 5G will generate US$12.4 trillion in sales by 2035. Taiwan completed 5G spectrum auction early this year and its 5G value chain expected to output $134 billion in 2035. 5G is the last piece of the network for AI, edge computing, big data, and block chain technology application development.The coronavirus outbreak in 2020 has caused a slowdown in the global economy. Once the outbreak gets effectively controlled, economies are expected to rebound significantly and 5G is poised to drive boosted data center demands for digital business and remote working. In the middle to long term, 5G will bring improved service demands in remote smart healthcare, cloud surveillance and monitoring, and smart manufacturing with advanced automation. All of this will help avoid unnecessary large gatherings in the workplace as people adopt new ways of working.In response to technology innovation and high performance needs, Memxpro maintains its effort to offer complete industrial memory module product lines with quality DRAM chips, quality tests, and storage device monitoring tool development. Memxpro is becoming one of the major industrial memory suppliers for 5G, smart IoT, and edge computing application developers.Memxpro's industrial DRAM solutions in 5G improve communications in remote areas
With the rapid rise of Internet of Things (IoT) combining with artificial intelligence (AI) technologies, the emerging application w/ AI engine boosting to be powerful and popular in coming years. To image that the affordable AIoT device can guide people how to enjoy the life, it's so grateful. 1Gb LPDDR3 is the best partner to assist your AI device to get into this market.Like some emerging solutions, especially those eye catching use cases such as video surveillance, smart home applications, and upcoming 8K TVs are boosting semiconductor demands. In view of this, many IC design and chipset suppliers are developing new-generation SoCs with higher performance and expedite Time-To-Market goals in the most cost-effective manner. In addition, from the overall system design perspective, the DRAM that works with the SoC or microcontroller also requires new options to provide better advantages leveraging the existing Specialty DRAM product series.High bandwidth and cost advantages create 1Gb LPDDR3 unique market positionFully understanding these market trends, Winbond Electronics Corporation provides low and middle density memory product families to provide high performance and high speed features to create a successful business model to drive market growth. The existing LPDDR3 and LPDDR4 product lines with specific features to squeeze operation power which is due to LP4x w/ low VDD2=0.6V and FSP(Frequency Set Point) function. For 1Gb x32 LPDDR3, it's the alternative solution for developing high B/W(8.52GB/s) around 0.3W. This move will help Winbond further expand its product portfolio to respond to the diverse AIoT and ultra-high-resolution display application needs.Both Winbond's LPDDR3 and LPDDR4 memory series are completed solution to variety customers. As for data transmission rate getting higher, the lower density memory is adopted like T-Con (Timing Control) of 8K TV panels could leverage LPDDR3 products with x32 or x64 data bandwidth for reaching high performance and cost advantage. These new T-Con chipsets require high speed 1Gb LPDDR3 memories to support key features such as Super Resolution, MEMC and Artificial Intelligence Picture Quality (AI PQ). The LPDDR3 memories used in these SoCs are welcomed by IC design teams.While looking at popular 8K TV T-con SoC design cases, two or four 1Gb DDR3 x16 memory chips are common arrangement. Winbond suggested to use one or two 1Gb LPDDR3 x32 chips to be better one of the cost-performance solution. This approach could provide data throughput of 8.52GB/s or17.04GB/s to fulfill requirements of IC design and semiconductor suppliers. The obvious benefits will have cost, power saving and, at the same time, reduce the extra issues of DRAM pairing concerns within two memory chips.In the other hand, considering AI PQ features, what Winbond offerings are providing two 1Gb LPDDR3 x64 memory chips to replace LPDDR4 options. This will help engineering teams not only gaining further cost reduction benefits but also saving product development time. From engineering perspectives, the migration from LPDDR2 to LPDDR3 is much easier than jumping directly from LPDDR2 to LPDDR4. This is because both LPDDR3 and LPDDR2 having 90% of similarity in circuit design. It will massively help to shorten development times and reduce its Time to Market for innovations of the end products.LPDDR3 will help engineers to expedite time to marketToday's embedded system developers face challenges to upgrade LPDDR2 memory for new embedded SoC chips. Considering the migration path from LPDDR2 to LPDDR4, the IC design teams will need to invest more resources to deal with more critical signal integrity of LPDDR4 specification under tight timing margins. It is taking a great deal of time to verify and test the new design. And this basically will be a high risk situation while the global coronavirus outbreak causing more people lockdown for many countries. And LPDDR3 approach will have unbeaten advantages with 90% similarity design with LPDDR2.Through past 9 months, there are more than 15 Design In & Design Win projects to implement Winbond's 1Gb LPDDR3 memory into the new SoC design including major IC design customers from Taiwan, Japan, South Korea and China in Asia region. The end products will cover AIoT, AI Inference chip, T-Con of 8K TV, AI-enabled video processors, smart speakers, smart video doorbells and mobile POS systems. The great market potential will begin ramping during 2020 and 2021.The trend to use AI technologies to power the smart applications is ushering in a new era for semiconductor devices and embedded systems that will bring many new opportunities but also many challenges. Winbond is a unique Integrated Device Manufacturer that is dedicated to provide niche DRAM solution with complete and competitive services on KGD (Known-Good-Die). This unique product offering is able to provide the best SiP solution by KGD for various applications.With exploiting its advanced design skills and production technologies, Winbond is continually boosting the competitive advantages of its dedicated brand-name products. The completed product series are ranging from Mobile RAM, Specialty DRAM products to Flash memory product lines, which are designed to meet the demands of niche memory market for high-speed memory with low-power consumption. With possession of its own 12-inch wafer fabrication, Winbond keeps pace with the latest technologies to provide cost competitiveness and long-term support for customers.About WinbondWinbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM and Code Storage Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond's headquarters is in Central Taiwan Science Park (CTSP) and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong. Based in Taichung and new Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.Windbond 1Gb LPDDR3
