The rise of the Internet of Things (IoT) creates the use cases from mobile devices to autonomous drones and from surveillance equipment to Advanced Driver-Assistance Systems (ADAS). The intelligent image processing technologies combined with artificial intelligence (AI) are fundamental challenges for today's system designers. Meeting the advanced image processing requirements of new and emerging camera devices typically require advanced and scalable micro controllers and memory chips. These strong demands are even accelerated by the coming Tokyo 2020 Olympics games including the roll-out of 8K TVs, 5G mobile phones and smart edge devices, which has gradually entered the lives of everyone.Furthermore, the enormous market opportunity of cellular 5G base stations and IoT devices continuously boost large memory densities and increase DRAM product value. During the coming 5G hype cycle, the growth of the 5G infrastructure market in North America and China is likely to be propelled by increasing capital spending and strong investment from telecommunications operators. This will increase the demands on wireless communication modules with customized DRAM products, which will equip high-speed, low-power and the fast data-transfer rates memory, for improving user experience.High speed and low power features maintaining competitive edge of Winbond DRAM memoryWinbond's DRAM product portfolio is consisting of Specialty DRAM and Mobile RAM. Specialty DRAM, focusing on low and middle density, features characteristics of high performance and high speed and is widely used by leaders in the consumer, communication, computer peripheral, industrial, and automobile markets. Completed solution can be provided to variety customers. Both Specialty DRAM and Mobile DRAM support for Industrial and automotive application with AEC-Q100, TS16949, ISO9001/14001, OHSAS18001 certificates. The latest DRAM products not only provide high-speed, it also meet the industrial standard and can remain operating under extreme environment temperature ranged from -40 degree C to 105 degree C.Specialty DRAMNowadays, IoT devices are evolving towards the trend of thinner, lighter and less power consumption. In order to remain high performance, the memories used in these devices are required to have features such as high-speed, low-power consumption and downsizing. With its strong experiences and knowledge accumulated over the past few decades, Winbond designed this new product with high compatible ability and stability. It can provide strong performance in various kinds of applications. What's more critical, the most compatible memory must be defined. Winbond has very complete product lines including Specialty DRAM, Mobile DRAM and Flash memory with different densities, speed and operating voltage that can adapt to different applications. With the support of professional engineering team and a self-owned 12 inch FAB, Winbond's products are guaranteed with high quality, production capacity, and can provide all-around high competitive solutions to customers.Mobile DRAM MemoryMobile DRAM Memory is mainly a semiconductor solution to the consumer, computer, communications, and electronics products. Winbond developed the mobile DRAM devices with a low current value, which helps Winbond to extend Mobile DRAM memory applications beyond the mobile phone and tablet market to areas of mobile consumer electronics and mobile communication. Winbond Mobile DRAM devices support x8, x16 and x32 data widths. Major features for the families of products shown in the table below include the following: Sequential or Interleave burst, High Clock rate, Standard Self Refresh, Partial-Array Self Refresh (PASR), Automatic Temperature Compensated Self Refresh Rate(ATCSR), Deep Power-Down (DPD) and Programmable output buffer driver strength. Please refer to the datasheets for specific features. They are ideal for portable multimedia players, wearable devices, automotive applications, consumer electronics, gaming devices, and mobile devices.Low power LPDDR4X and LPDDR4 productsBesides high speed features of the niche memory product demands, Winbond pays great attention to their customers' needs and the development trend of Ultra-Low Power technologies, and has successfully developed a new generation of Mobile DDR products LPDDR4X to fulfill the needs of the emerging applications. LPDDR4X is the first wave of Mobile DDR products that adopts Winbond's self-developed 25nm memory processing technology, which is equipped with full professional features. It includes two series: the JEDEC defined LPDDR4X (VDDQ voltage 0.6V) and LPDDR4 (VDDQ voltage 1.1V), with 2Gb and 4Gb capabilities available. As for data transmission rate, the product series covers 3200MT/s, 3733MT/s, or even reaches 4266MT/s. In addition, KGD (Known Good Die) and 200-ball BGA package are available. Winbond Electronics will push the density of LPDDR4X/ LPDDR4 products to 8Gb in the near future, and add other new features to offer customers the choice of a more complete solution.HyperRAM productsWith the rapid rise of new IoT devices will require new functionality in terms of size, power consumption, and performance. In view of this, many MCU suppliers are developing new-generation MCUs with higher performance and lower power consumption to meet the market demand. HyperRAM is a new technical solution to address this demand. As the technology has been developed for many years and has a clear market position, Winbond Electronics has decided to join the HyperRAM camp and launches 32Mb/64Mb/128Mb density products. This move will help Winbond further expand its product portfolio to respond to the diverse application needs, as well as make the ecosystem more complete through active participation. The current status of Winbond's HyperRAM product line is: 32Mb/ 64Mb are already under mass production; 128Mb is expected to enter mass production in 1Q20 respectively. Products of 24BGA (automotive grade), 49BGA and KGD are available. Among them, size of 24BGA is 6x8 mm2, while that of 49BGA is only 4x4 mm2, which targets the consumer wearable market.KGD product offerings and expertise servicesSeveral customers utilize Winbond's expertise in using memory products in Known Good Die (KGD) for SIP (System In Package) solutions. Winbond has been providing Flash and DRAM KGD for several years since they provide cost and space efficient alternatives to packaged products. Additionally, Winbond also provides KGD services, all technical requests from customers when applying KGD to SiP process are already take under concern in the very beginning. As a result, the new product uses the "one side edge pad" design in order to make it easier to use for the customers, and also reduced the cost.For providing on-line shopping service to audiences in order to purchase series products in time, Winbond builds On-Line Direct Store and e-commerce platform to handle On-Line orders. Free Shipping for each On-Line order amounts reached US$ 150. If you are the first time to place orders via On-Line Direct Store, the extra 12% OFF discount will be applied to have further saving before the end of 2019. The Winbod's on-line shopping site is, https://www.techdesign.com/market/winbond

Both 5G cellular network technology and Internet of Things (IoT) provide advancements in performance to enhance and optimize smart applications. The modern computing resources have created and continued to explore new use-cases and scenarios to gain very popular and powerful with the values leveraging by artificial intelligence (AI) and edge computing technologies.These vast momentums encompass a large market and business opportunities. Therefore use cases are well-suited for things like Augmented Reality (AR), Ultra Low Latency Mission Critical services, Fixed Wired Access networks, Autonomous vehicles and massive IoT applications. All these innovative and smart applications are mainly driven by semiconductor products.In response to demand from security-conscious OEMs, the manufacturers of modern microcontrollers and systems-on-chip (SoCs) commonly equip their products with a broad range of security capabilities: standard, off-the-shelf 32-bit MCUs for mainstream, non-financial applications will today often feature a hardware cryptographic accelerator, a random number generator (RNG) and secure memory locations.But serial Flash memory-the location in which much of an OEM's precious intellectual property (IP) is stored-has traditionally been more vulnerable than the SoC or microcontroller. Security weaknesses in the companion Flash memory to an MCU or SoC expose OEMs to the commercially damaging risk of product theft due to the cloning of reverse engineered PCB designs.For this reason, OEMs today commonly "protect" their code storage hardware with a unique identifier (UID) stored in partitioned memory space in the Flash IC. In truth, however, a UID offers only a trivial barrier to attack. The weakness in this Flash security system is that the UID itself is not secure. It is a permanent, unchanging code number: once read out of memory, it can be used again by a non-authorized host.The solution: secure, dynamic authenticationThe remedy for this problem is easy to design in theory: The UID needs to be different every time the memory is challenged by the host. But the advantage of the fixed UID used today is its ease of implementation: It just needs to be programmed once into the Flash memory, and once into the host controller; then the two values may be simply compared to authenticate the Flash device.So how can the response to a challenge from the host be different every time, yet still recognized by the host? This is the problem that Winbond has set out to solve with its W74M family of Authentication Flash ICs.The basic method by which Winbond secures a memory's identity is through symmetric encryption: both host and memory know the same secret, a "root key". The root key is, however, never directly transmitted between host and memory (the "challenger" and "responder"). Instead, an encrypted message (a Hash-based Message Authentication Code, or HMAC) is generated by a combination of the root key and a dynamic element such as a random number.It shows two other interesting features of the W74M. First, the non-volatile monotonic counter provides a supplementary verification of the memory's authenticity. The counter starts at zero when the root key is established, and a single increment is added in response to a command issued by the host controller, meaning that the counter has a unique value known only to the memory and the host. If the counter value provided by the memory when challenged by the host does not match the host's counter value, the value of the memory's HMAC will not be the same as that computed by the host: This signal to the host processor that the W74M authentication device has been tampered with.The processor can use this knowledge to protect the host system, for instance by preventing the device which has been tampered with from gaining access to the host system's resources.This protection capability is relevant to the second feature: there are four instances of the combination of root key/HMAC/monotonic counter in each W74M device. One instance will be used for authentication of the host device's controller. The other three authentication "channels" are intended for use for example in IoT devices which have to verify their identity in order to gain access to networked services. As shown here, a different root key can be securely stored for each authentication channel, and shared with the relevant host device. This means that the root keys of the host device, of the internet gateway and of the cloud service remain secret: one device has no knowledge of another's root key.The W74M family of authentication Flash devices is available in various densities from 32Mb to 1Gb, in standard packages. This means that secure device designs which today incorporate a NOR/NAND Flash IC for code storage and an external authentication IC can replace these two chips with a single W74M package that fits in a standard Flash socket, offering a bill-of-materials cost and component count reduction while providing the most secure level of authentication.For providing on-line shopping service to audiences in order to purchase series products in time, Winbond builds On-Line Direct Store and e-commerce platform to handle On-Line orders. Free Shipping for each On-Line order amounts reached US$ 150. If you are the first time to place orders via On-Line Direct Store, the extra 12% OFF discount will be applied to have further saving before the end of 2019. The Winbod's on-line shopping site is, https://www.techdesign.com/market/winbond

Samsung Display hosted the Samsung Curved Forum 2019 at the Grand Mayfull Hotel Taipei on November 14 not only to present its achievements in curved display technologies but also to demonstrate its determination to expand market presence beyond the existing gaming market into professional applications. Showcasing a range of 1000R curved monitors featuring breakthrough curvature ratings at the forum, Samsung has established absolute leadership in the industry. Going forward, Samsung will continue to focus efforts toward the gaming market while expanding footprint in the professional display market such as office monitors."Leveraging the value of Samsung curved monitors' unique picture quality and product design and their unparalleled growth potential among display products on the market, Samsung Display is collaborating partners across different industries. To further grow the partnership network, Samsung will continuingly devote resources to curved display technology development so as to maintain leadership in the segment," noted Hyohak Nam, Executive Vice President, Large Display Business, Samsung Display.Samsung Display presented the latest curved display technologies to forum attendeesMore than 300 professionals gathered at the forum, including representatives from world leading monitor brands such as Dell, HP, Acer, Asus and MSI, display manufacturers including TPV, Wistron, Foxconn and Amtran, market research organizations and distribution channels.At the forum, Samsung organized talks given by display researchers, monitor distributors and social media influencers who shared their views on technological requirements, market outlook, distribution channel, and consumer trends with respect to curved monitors.The curved products were exhibited so attendees could experience curved monitors and see the benefits compared to flat screens. Forum attendees were impressed by the demonstration and all spoke highly of the experience especially the superior readability and Immersive gaming on curved monitors.A comprehensive product portfolio targeting gaming and professional display marketsAnother highlight of the demonstration was the debut of multiple curved monitors encompassing 11 different sizes from 27 inches to 49 inches. The exhibition area simulating various use scenarios accentuated curved monitors' unique features by showing the attendees how the products enable a sense of realism, immersion and design that is eminent beyond or above comparison.In addition to featuring up to 240Hz refresh rate, Samsung Display's curved monitors also come with state-of-the-art HDR technology to guarantee the best display quality for the ultimate gaming and viewing experience.For the professional display market, Samsung Display not only introduced the 1000R curvature design suitable for 27-inch and 34-inch monitors but also unveiled 43.4-inch and 49-inch models targeting general office and productivity focused applications. Furthermore, Samsung announced the plan to foray into the B2B office monitor segment that represents 65% of the display market, which may very well fundamentally reshape the business monitor market.Samsung Display stays at the forefront of display technologies, leading the industry all the way from convex CRT screens to curved LCD monitorsIn the days of the cathode-ray tube (CRT), Samsung Display introduced the first and best flat CRT screen featuring its proprietary DYNAFLAT technology. Designed by taking into account the angle of vision and the refraction from the glass surface of the CRT, the screen is flat on the outside and curved on the inside to 'compensate' for refraction effects at the edges of the screen. This changed the way people look at monitor products.Flat panels became the mainstream with the debut of liquid crystal displays (LCD). However, Samsung found the flat panel design is not optimum for all applications of how the human vision works. When people turn their heads, the distance between the screen and their eyes and the angle of vision will change. One of the characteristics of LCD panels is the significant color shifts with the change in the viewing angle, which results in less-than-optimum viewing experience to the user.Curved monitors are designed to improve the viewing quality of flat panels for gamers and business users.Samsung Display invented curved monitors and since then has been driving advances in product technology and market development. Aiming to push the curvature to 1000R, Samsung has engaged in years of technology research and market development. As part of its product R&D, Samsung conducted tests with a large number of users and found the mainstream 1800R curvature unsatisfactory. In fact, 1000R curvature more closely matches the human eye's natural field of view and thus can provide a more immersive surround viewing experience guaranteed to wow the users.However, smaller curvature introduces more production challenges. This is why the advances in curvature of monitor products on the market stops at 1800R. Having made a breakthrough in panel technology, Samsung is able to bring 1000R curved monitors to reality and present an improved user experience for business users and gamers.Leveraging its technological edge and strategic planning, Samsung Display is determined to establish dominance in the curved monitor marketAccording to a market research report by WitsView, sales of curved monitors have maintained steady growth since they came to the market in 2015. More than 10 million units of curved monitors have been sold so far in 2019 and total sales are estimated to top 15 million units in 2020.Securing leadership in the curved display market, Samsung Display is ambitious about its sales target. Not only will it step up efforts toward the goal of selling 9 million curved monitors for the year but it will also endeavor to bring revolutionary changes to users' viewing experience.The Samsung Display team at the Samsung Curved Forum 2019, taking place at the Grand Mayfull Hotel Taipei on November 14Hyohak Nam, Executive Vice President, Large Display Business, Samsung DisplayAt the forum participated by more than 300 industry professionals, Samsung Display showcased a range of 1000R curved monitorsSamsung Display's curved displays at the event, marking its foray into the B2B market

Proscend has established a long-term strategic partnership with Airtel, an Indian mobile telecommunications operator. Bharti Airtel is a well-known Indian global telecommunications services enterprise, and contributes to the betterment of society for many years. This year in October, Proscend participated in the 11th edition of Airtel Delhi Half Marathon. More than 100 enterprises have engaged in this social public welfare to help underprivileged children and young people of local country with quality education.In recent years, Airtel has actively adopted the IP67 outdoor industrial LTE cellular router developed by Proscend and integrated with MPLS technology to expand the scale of telecommunications services in Indian market. Proscend initially focuses on SHDSL and VDSL2 P2P equipment and becomes one of the leading providers in this field. Furthermore, Proscend has the key hardware and software core technologies of LTE and xDSL, including LTE mission-critical cellular communications and Long Reach Power over Ethernet extension switches. With customer-oriented customized design and technical support services, our worldwide customers have put their trust in Proscend.Proscend is looking forward to growing with our global partners and actively develops secure, hardened, and reliable industrial-grade and carrier-grade networking products and solutions to enable Internet of Things (IoT) connectivity and implement in various applications, covering smart surveillance, smart transportation, utilities, power stations, energy, factory automation, and smart cities, etc.The staff of Proscend attend the 11th edition of Airtel Delhi Half Marathon

Artificial Intelligence (AI) is paving the way for a more advanced, sophisticated and future-proof applications. Most global organizations view AI technology as a long-term strategic priority for innovation to reap the benefits of business growth and success. Meanwhile, the adoption of AI technology to create use cases combines with the internet of things (IoT) across the globe is presently outrunning the speed. While these two broad concepts collide, the multiple data sources have emerged and required immense computing services to process large volumes of streaming data.Driven by the Ministry of Science and Technology, the AI Cloud Platform named Taiwan Computing Cloud (TWCC), was implemented by the NCHC (National Center of High-performance Computing) together with three Taiwan-based high-tech enterprises, such as Taiwan Mobile, ASUS and Quanta Computer to build "Taiwania 2" supercomputer system. TWCC runs on the strength of Taiwania 2 to provide the services to education and academic research institutes in June 2019. And it continues to expand the services to industries in October of the same year aiming to make it a powerful tool to fulfill the needs of science and technology innovation. The first "made in Taiwan" AI supercomputer, Taiwania 2, is a milestone in Taiwan's promotion of AI as a core tenet of its future development.At the opening session in the Tech Summit hosted by NCHC on October 17th 2019, Deputy Minister of Ministry of Science and Technology Hsu Yu-chin stated that government funded TWCC service will lead to massive speedups for tasks to support high performance computing and AI workloads at scale. This powerful AI supercomputer investment will dramatically enhance performance for AI applications and further push the boundaries of industrial digital transformation by providing massive computation and storage services. He hopes to see TWCC spurring advanced technological research and development to increase Taiwan's economic competiveness.The launch of TWCC service is also supported by global tech giants including NVIDIA and IBM engineering teams through several intensive cooperation programs to build hardware and software development platforms for supporting industrial projects. Shepherd Shi, NCHC Director General, takes the opportunity to thank them to join the projects. Since May 2019, the TWCC have been providing services to reach 90% of computation capacity and accumulated 8 million GPU cores per hour for training machine learning framework and testing various algorithms.Compared with other AI public cloud service providers, TWCC delivers world-class service quality and has leading edge in terms of speed and performance, Shepherd Shi adds. Developers can quickly build their working environment with high efficiency and cost advantage over current methods. TWCC service gives users in industries, academia, and research fields more timely and more cost effective computing services.The live demo during the presentation of Shepherd Shi shows a successful use case of Taiwan wind turbines green energy project for adjusting an optimum pitch angle of rotor blades and operate the sites with increased efficiency. This powerful prediction scheme is developed by NCKU to use high-speed parallel computing resource provided by TWCC. In the conference, there are 11 standout products showcasing in booth to display the commercialization of research results from cutting-edge R&D firms or startups.High-tech and academic research projects facing challenges from multiple data sources and big volume issuesProfessor Sean Smith, director of National Computational Infrastructure of Australia (NCI Australia), gives the first keynote speech. He shares recent development of high performance computing and national computation infrastructure in Australia. Funded directly by Australian Government, the data center construction was initiated in August 2011, and was completed in September 2012 because of the high demands of weather forecast study and advanced geographic research projects. In November 2019, the second supercomputer system will be launched and start to provide the service. Both the first and second set of supercomputer systems are all designed and built by Fujitsu.Based on the analysis of the service usage of HPC resource in NCI Australia, the biggest part of research organization is universities taking 29%. And the largest category of research topics is the Earth and Earth System Science occupying 38%. Smith highlights those research projects consume lots of parallel processing and computing resources because dealing with the challenges of multiple data sources and big data volume. Taking the Geographic Information System (GIS) project as an example, the research datasets are growing massively every year. The data comes from different satellite systems of US, EU and Australia. And there are even more data from extra IoT devices or sensors. The current top 3 datasets are Earth-Observation Data, Genomic Data and Climate Model Data. Each of them to perform data processing and big data analytics requires power computation and storage features.Facing the challenges of data complexity and big volume issues, NCI Australia is delivering "data as a service" for tackling the challenges. The National Environmental Research Data Interoperability Platform (NERDIP) is the interface to provide an integrated platform for users to access datasets managed at NCI Australia. The building blocks of NERDIP include Data Storage Infrastructure, Data Discovery Standards and Conventions, and also the Data Access Services which allow users from government organizations, academia and industrial communities to access the data services for advanced research projects.Successful leveraging global trend of AI and Big Data analytics relying on human interaction with data resultsThe second keynote speech is presented by Jing Shyr, IBM Fellow Emeritus. She focuses on the relationship between Big Data and AI. From her long experience for doing Big Data Analytics projects for more than 30 years, she shares a first-hand view of data challenges. There are so many new forms of data sources, especially generated by IoT devices or sensors today. AI applications are the trend we need to leverage for handling and analyzing a large volume of data to produce useable results, Jing Shyr highlights.She continues to describe how smart analytics works. It is starting from data preparation. Then the creation of automated data modeling is paving the way for data prediction and analytics. The entire process flow shows why Automated Machine Learning (autoML) is so hot that it becomes a must for most of software vendors. Finally, the data results come to lead a solution to solve the problem by understanding the data insight.It's important that data is less often about telling a specific answer and more like starting a guided conversation and letting the users find the answer that fits their needs. That's the reason why it's important to offer conversation between human and data analytics, since the Big Data Analytics project is mostly relying on iteration between human and data results.As AI applications are getting more popular and massive Auto AI solutions are widely noticed, developing technology for Big Data Analytics is still critical. One of the key elements is that data scientists and data engineers' skills are in high demand. Working closely with a good data scientist will drive better results and unveiling better solutions, Jing Shyr continues. The modern AI applications including self-driving car, facial recognition or characterized advertising are all important use cases to solve human problems and live a better life.Building Taiwan AI ecosystems to accelerate industrial digital transformationThe panel discussion session invites guests to focus on the topics of building AI ecosystem to accelerate digital transformation for Taiwan industries. Speaking in the first, Shepherd Shi points out that TWCC is creating an important platform to share the AI research results to enable Taiwan industry to grasp new business opportunities. Through the TWCC service with dedicated and secured networking, storage and high performance computing environments, it will ensure that the research results find their way into the industrial sector and create a business model.Peter Wu, general manager of ASUS Cloud Corporation, also sees TWCC service as an important national investment for Taiwan to create a good chance to allow Taiwan enterprises to gain a good reputation to build a supercomputer system. The important thing is the software capability has been well recognized by global tech communities and leading players. It will help Taiwan ecosystem partners have important growth opportunities to win the high performance computing system, building a benchmark apart from the role of hardware manufacturers in the old time.Allen Liou, VP of Taiwan Mobile, focuses on the business opportunity of 5G network services. The AI system is the "Brain" to enable a broad range of smart applications for enterprises and end users. The AI innovation will be a key enabler to change the landscape of Telecommunication, media, retail, e-commerce, finance, and medical industries.The AI-enabled drones are becoming a game changer for the company like Coretronic Intelligent Robotics Corporation (CIRC), said General Manager Andy Hsin. It helps CIRC to capture the new business models to offer versatile security applications and services. And this change is showing the great possibility to transform a hardware manufacturer to a service provider.Cheng-Hong Cho, CEO of Institute for Information Industry (III), highlights the importance for building ecosystems to form a value-adding network of partners and collaborative organizations. This will be an important competitive advantage not only leveraging AI becoming leading edge in scientific research, but also helping industries to accelerate digital transformation. And TWCC service will become fertile ground for more AI development teams to nourish and grow into world-class organizations.Guests at TWCC Forum (from left to right): Cheng-Hong Cho, CEO, Institute for Information Industry; Sean Smith, director, NCI Australia; Jacky Hsu, CTO, IBM Taiwan; Mike Yang, SVP, Quanta Computer; Eunice Chiu, global VP and Taiwan GM, NVIDIA; Yu-chin Hsu, deputy minister, Ministry of Science and Technology; Yeong-her Wang, president, NARL; Shepherd Shi, director general, NCHC; Robert Chin, Asus GM, Server Business Unit; Jing Shyr, IBM fellow; Alen Chen, VP of Pre-Sales Department, SAS Taiwan; Andy Hsin, GM, Coretronic Intelligent Robotics Department; and Hsi Ching Lin, deputy director general, NCHC.Shepherd Shi, director general of NCHCSean Smith, director of NCI AustraliaJing Shyr, IBM fellowGuests at panel discussion (from left to right): Andy Hsin, GM, Coretronic Intelligent Robotics Department; Jacky Hsu, CTO of IBM Taiwan; Peter Wu, GM of Asus Cloud Corporation; Shepherd Shi, director general of NCHC; Allen Liou, VP of Taiwan Mobile; Alen Chen, VP of Pre-Sales Department at SAS Taiwan; Cheng-Hong Cho, CEO of Institute for Information Industry; and Nicole Hsiao, the moderator.

STAr Technologies Inc, a leading supplier of semiconductor test probe cards, today announced the introduction of its new MEMS type micro-Cantilever probe card - STAr Aries Sigma-M, designed and developed specifically for CMOS Image Sensor (CIS) testing. The Aries Sigma-M probe card is suitable for testing of highly parallel large-array multi-DUT CIS devices to increase productivity with greatly reduce cost-of-test.Attributed to the demand of mobile devices such as smart phones and new applications such as autonomous driving vehicle, the CIS market is growing exponentially with continuous improvement in resolution, frame rate and communication speed. These market trends have led to smaller chip size CIS that requires high-speed (up to 6 Gbps) tests under long test time.STAr Technologies always exceeded customers demand to increase test performance with reduce test cost that results in increasing productivity and efficiencies. To meet future test requirements for CIS devices, the Aries Sigma-M probe cards use micro-Cantilever MEMS probes with minimum pitch of 60um and up to 15000 pins that support testing of up to 64 devices in parallel. The Aries Sigma-M revolutionary structure further reduces test setup time, enable different devices to be tested under same probe card over wide varying temperature up to 150degC and testing speed of 3.5Gbps with future upgrade to 6Gbps."We are happy to introduce the new CIS probe cards based on MEMS processes with micro-cantilever probes. We believed that the new Aries Sigma-M probe cards will exceed both market and technology trends by improving test efficiencies and reducing cost-of-tests," said Dr CL Lou, CEO of STAr Technologies.STAr Aries Sigma-M probe card is specifically designed for CMOS image sensor

With the rapid rise of automotive electronics, industrial 4.0, and smart home applications, new IoT edge devices and human-machine interface devices will require new functionality in terms of size, power consumption, and performance. In view of this, many MCU suppliers are developing new-generation MCUs with higher performance and lower power consumption to meet the market demand. In addition, from the overall system design perspective, the RAM that works with the MCU also requires new options to provide better advantages than those of the existing SDRAM and pSRAM.HyperRAM, which supports the HyperBus interface, is a new technical solution to address this demand. HyperBus technology was first unveiled by Cypress in 2014, and the company launched its first HyperRAM product in 2015. As the technology has been developed for many years and has a clear market position, Winbond Electronics has decided to join the HyperRAM camp and launches 32Mb/64Mb/128Mb density products. This move will help Winbond further expand its product portfolio to respond to the diverse application needs, as well as make the ecosystem more complete through active participation.Benefits of using HyperRAMHans Liao, Technology Manager of DRAM Market at Winbond, said, "Low pin count, low power consumption, and easy control are the three key features of HyperRAM that make it can significantly improve the performance of end devices."He explained that the computing power, data processing and image display functions of traditional MCUs are limited. However, the new IoT devices for automotive, industrial, smart home, and wearable often adopt touch panel as image control interface, or require stronger edge computing functions for image processing and speech recognition. Therefore, the new-generation higher performance, lower power MCU market is emerging.For IoT applications, various design considerations such as low cost, low power consumption, and computing efficiency must be met in order to gain widespread adoption in the market. Especially, for battery-powered devices such as smart speakers and smart meters, battery life has become the key to the success of the product, in addition to the rich IoT function and easy-to-use human interface. This makes low power consumption increasingly important. To achieve long battery life, in addition to using power consumption MCU, the other low-power peripheral components should also be considered, and HyperRAM is designed for this.Take Winbond's 64Mb HyperRAM as an example, the power consumption of Standby is 90uW@1.8V, while that of the same capacity SDRAM is about 2000uW@3.3V. More importantly, power consumption of HyperRAM has only 45uW@1.8V in Hybrid Sleep Mode, which is a significant different from the Standby mode of SDRAM. On the other hand, if Low Power SDRAM is adopted, the form factor is still bigger than HyperRAM. That makes it not an ideal solution as Low Power SDRAM requires larger PCB area.In addition, HyperRAM has only 13 signal pins, which can greatly simplify the PCB layout design. It also means that when designing end products, allowing MCU to have more pin out for other purposes or using MCU with fewer pins for better cost-effectiveness is made possible.Simplifying control interface is another feature of HyperRAM. Based on pSRAM architecture, HyperRAM is a self-refresh RAM. Moreover, it can automatically return to standby mode. Therefore, system memory is easier to use, and the development of firmware and drivers is also simplified.New force of HyerRAM ecosystemSierra Lai, Director of DRAM Marketing Division at Winbond, added that the process nodes of MCU are moving from 55nm, 40nm to 28nm, or even 16nm. Although its size can meet the IoT miniaturization trend, it still needs to use new generation external memory as a data buffer to address the higher computing capabilities required by IoT applications.However, the development of traditional SDRAM and pSRAM have matured and cannot be optimized for emerging IoT applications. Also, the DRAM process migration is based on the new generation JEDEC DDRx/LPDDRx products. Winbond's HyperRAM, which adopts 38nm process node, will continue to move toward 25nm. Considering the long-term supply requirements for automotive and industrial applications, the advanced process nodes of Winbond's HyperRAM can meet customers' longevity product lifecycle.Therefore, from the perspective of overall system design and product life, HyperRAM has become an ideal choice for emerging IoT devices. "We saw the market demand, so we decided to develop HyperRAM products to provide customers with another choice," Sierra Lai stressed. "The maturity of its ecosystems is of course an important factor for us to move into."At present, in addition to Cypress, leading MCU companies such as NXP, Renesas, ST, and TI have already provided MCUs that support HyperBus interface, and their new products will continue to support in the future. Meanwhile, its development platform of control interface is ready. Cadence, Synopsys and Mobiveil have also begun to provide HyperBus memory control IP, which can accelerate IC vendors' design cycle. As a result, compared to other Octal RAMs, HyperRAM has the most mature application environment. HyperRAM will also be incorporated into JEDEC standard in the future, becoming a JEDEC compatible technology.After Winbond joined the HyperRAM camp, it will become the third supplier in the market in addition to Cypress and ISSI, which can provide customers with more choices.Sierra Lai believed that the low pin count and low power characteristics of HyperRAM will bring significant advantages to IoT devices. As the market gradually heats up, more customers will begin to adopt this new generation memory.The current status of Winbond's HyperRAM product line is: 32Mb has entered mass production; 64Mb and 128Mb are expected to enter mass production in 4Q19 and 1Q20 respectively. Products of 24BGA (automotive grade), 49BGA and KGD are available. Among them, size of 24BGA is 6x8 mm2, while that of 49BGA is only 4x4 mm2, which targets the consumer wearable market.HyperRAM, which supports the HyperBus interface, is a new technical solution to address this demand

Digi-Key Electronics, a global electronic components distributor, has announced it will sponsor seven upcoming Microchip Masters events in November and December as the Gold Sponsor for all three China events, the Silver Sponsor for the India event, the Platinum Sponsor for the Korea event, and the Silver Sponsor for the two Taiwan events."We are thrilled to support the work of the Microchip Masters premiere technical training events," said David Stein, vice president, global supplier management for Digi-Key. "The Masters events continue to arm system design engineers of every level with the information and hands-on training they need to scale the learning curve and get their products to market faster. The mission of the Microchip Masters could not align more with the values and mission of Digi-Key, and we're proud to be a part of these events."The Microchip Masters conferences are held annually for embedded control engineers around the globe. The training sessions and classes cover a broad range of topics and are taught by Microchip's own application and design engineers."Attendees have consistently conveyed Microchip Masters is the premier technical training event in the industry," said Ken Pye, Microchip's vice president of worldwide applications. "We appreciate the sponsorships of Digi-Key and thank them for helping our mutual customers learn how to differentiate their end products across the many different markets we serve."Digi-Key Electronics will sponsor the following events:- Seoul, Korea: November 5-8, 2019 (Platinum Sponsor)- Wuhan, China: November 6-8, 2019 (Gold Sponsor)- Shenzhen, China: November 13-15, 2019 (Gold Sponsor)- Taipei, Taiwan: November 14-15, 2019 (Silver Sponsor)- Shanghai, China: November 20-22, 2019 (Gold Sponsor)- Taichung, Taiwan: November 28-29, 2019 (Silver Sponsor)- Bangalore, India: December 3-6, 2019 (Silver Sponsor)

Karamba Security, a world-leading provider of embedded cybersecurity for connected machines, today announced a collaboration with Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions and a pioneer in certified secure memories, to enhance embedded software security in automotive and other connected industries. OEMs and tier ones use Karamba's embedded cybersecurity solutions for connected systems to protect their software and reduce vulnerability exposures. Under the new partnership, Karamba will offer enhanced hardware security with the use of Winbond's secure memories.The Karamba and Winbond collaboration will provide cybersecurity offerings that leverage Winbond's TrustME secure flash memories with Karamba's embedded security policy. Winbond's family of secure memories combines its world class NOR flash manufacturing process and state-of-the-art hardware security technology. The company's offerings range from the world's first and most secured EAL5+ Common Criteria certified flash memory device to cost effective EAL2 and Arm PSA certified memory devices.Winbond's secure memory with tamper resistance allows Karamba's Runtime Integrity security to focus on performance excellence, automatically hardening the full image of the connected system and preventing modification of the factory settings."Teaming with a pioneer in certified secure memories enables us to improve security while maintaining the high-performance characteristics required in automotive and industrial systems," said Ami Dotan, Karamba Security's co-founder and CEO. "More than ever, autonomous vehicles, industry 4.0 controllers, and enterprise IoT edge devices need security technology that is embedded in them and which does not impact performance. Partnering with Winbond, with its certified secure memories, strengthens our commitment to offer state-of-the-art cybersecurity solutions and increases customer trust in our solutions."Karamba's Control Flow Integrity (CFI) is becoming an industry requirement in automotive embedded systems and is expanding to other industries, making this collaboration a natural one," said Hung-Wei Chen, Director of Winbond Secure Flash Memory Marketing."Security is everyone's business, and every layer must take part in securing the overall system, so memory with built-in security is becoming indispensable. Winbond's Common Criteria certified production site guarantees secured production, software programing, and key provisioning for connected systems. Partnering with Karamba complements our security offerings and allows us to provide comprehensive solutions to our customers."Learn more by visiting Karamba Security at AutoISAC Summit on October 23-24th in Plano, Texas.About Karamba SecurityKaramba Security provides industry-leading embedded cybersecurity solutions for connected systems. Product manufacturers in automotive, Industry 4.0, IoT, and enterprise edge rely on Karamba's automated runtime integrity software to self-protect their products against Remote Code Execution (RCE) cyberattacks with negligible performance impact. After 32 successful engagements with 17 automotive OEMs and tier 1s, product providers trust Karamba's award-winning solutions for compliance and increasing their brand competitiveness when protecting their customers against cyberthreats.More information is available at www.karambasecurity.com and follow us on Twitter @KarambaSecurity.About WinbondWinbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM and Code Storage Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.Winbond's headquarters is in Central Taiwan Science Park (CTSP) and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong. Based in Taichung and new Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.Winbond's TrustME secure flash memories with Karamba's embedded security policy

PrimeVOLT has introduced numerous flagship new PV Inverters, fully demonstrating the R&D and production capabilities of Taiwan at the 2019 Energy Taiwan trade show.Having been active in the solar energy industry for many years, PrimeVOLT took advantage of this opportunity to introduce four new single-phase PV inverters - 3kW, 3.6kW, 5kW, and HV-5kW. Aside from a significant improvement in efficiency, the new models are lighter in weight and more compact, bestowing more than 20% weight and volume reduction compared to previous models.To satisfy the customer requirements of large-scale, land-based solar power plant in Taiwan, PrimeVOLT launched its 60kW and 75kW high power three-phase flagship PV Inverters, which have become the spotlight of the exhibition and impressed visitors so much. Following the launch of 40kW PV inverter in 2018, the new 60kW and 75kW PV inverters come with four MPPTs and are capable of maximizing power generation in each PV array, so that the entire power generation could be tracked and enhanced effectively.Additionally, PrimeVOLT has implemented measures to ensure that no power loss occurs during reactive power compensation (PF0.9), preventing a decrease in PV inverter output while static VAR compensators are in operation. This feature guarantees steady income of PV power for each PrimeVOLT's user.Exclusive aluminum die casting technique that withstood on-site testingDifferentiating from traditional PV inverter produced through welding of stainless steel and is therefore prone to erosion and water damage, PrimeVOLT PV inverter is manufactured using its signature aluminum die casting technology. Having acquired both IP65 (dust and water resistance) and IEC salt-spraying certification, the uni-body design ensures optimal efficiency even though the solar power plant is located in high salt spray and high humidity environment.Offering the fastest and most comprehensive services, PrimeVOLT gains business opportunitiesApart from offering product that is 100% designed and manufactured in Taiwan, the PrimeVOLT team offers professional advice on the optimal capacity and complementary hardware requirements for the initial stages of power plant planning and works with customers in finding the optimal solution. PrimeVOLT's expertise has earned widespread praise from customers over the years. In addition, PrimeVOLT elaborated local service network satisfies the needs of customers by providing on-site service within 48 hours from notice.For more information on PrimeVOLT's products, please visit: www.primeVOLT.comPrimeVOLT's at Energy Taiwan 2019