TAIPEI, TAIWAN – Taiwan is set to host the Best AI Awards 2025, an international competition designed to drive innovation in Artificial Intelligence (AI) and Integrated Circuit (IC) Design. Advised by the Ministry of Economic Affairs (MOEA), organized by the Department of Industrial Technology, and hosted by the Taipei Computer Association (TCA), this event offers a highest grand prize of NT$1,000,000 (approx. US32,000).Open to students and experts worldwide, the competition will accept submissions from early March to April 8, 2025. Winners will be invited to Taipei for a physical presentation for the final round in early May 2025, with top participants receiving a special visa to work in Taiwan and access to expert training opportunities. Taiwanese participants are encouraged to collaborate with local teams, fostering greater industry connections.The Best AI Awards 2025 focuses on two core themes: AI Applications and IC Design. Participants are encouraged to submit groundbreaking proposals with strong potential for real-world industry adoption. This competition serves as a unique platform to showcase talent, connect with industry leaders, and explore career opportunities in Taiwan's thriving tech ecosystem. Full details and application guidelines can be found on the "Best AI Awards 2025" official website.Taiwan's commitment to AI talent & innovationTaiwan's Minister of Economic Affairs, Kuo Jyh-huei, highlighted the nation's global leadership in chip and server manufacturing, with its AI software rankings expected to enter the world's top 14 by year-end. To secure a strong AI workforce, the government aims to cultivate 200,000 AI professionals within four years, driving innovation and industry-academia collaboration.The "2+4" talent program further supports global talent, especially students from Southeast Asia, by offering tuition subsidies, living allowances, and career training in Taiwan's high-tech industries.For AI and IC innovators, the Best AI Awards 2025 is more than a competition—it's a gateway to Taiwan's dynamic tech landscape.

AI semiconductor company DEEPX (CEO: Lokwon Kim) has been steadily increasing its global marketing efforts since introducing sample chips for international customer evaluation. Now, DEEPX is ramping up the supply of mass-production chips, paving the way for broader commercial opportunities across global markets.Last month at CES 2025 - one of the world's largest electronics trade shows - DEEPX was recognized as a "must-visit company" by the event's organizer, the Consumer Technology Association (CTA), shining a spotlight on the global market. During the show, over 16,000 visitors stopped by the DEEPX booth, resulting in more than 100 requests for mass-production chip samples—strong indicators of the company's expanding commercial prospects.During CES, DEEPX showcased various applications of its chips in edge devices for smart cities, smart factories, and robotics, as well as in industrial equipment and edge servers for global enterprises. Demonstrations and on-site meetings were held with a wide range of customers and partners from the United States, Taiwan, Japan, and Europe. In addition, major Korean corporations, government officials, and investors visited the booth on tours to get a firsthand look at DEEPX's technological strengths.Among the highlights, DEEPX successfully ran its first-generation mass-production chips using AI algorithms developed by:–Hyundai-Kia Motor Robotics Lab (robot platform)–Inventec (smart factory)–POSCO DX (smart factory & logistics automation)–LG U+ (industrial and urban security)This demonstration underscored the critical role of on-device AI semiconductors - beyond cloud-based approaches - in ushering in a new era of AI.DEEPX also directly compared its solution to NVIDIA's Jetson Orin, a GPU-based edge platform, demonstrating approximately 10 times the power efficiency and 20 times the price/performance efficiency of its own NPU-based product. By also conducting a 'butter benchmark' test against other leading global NPU technologies, DEEPX demonstrated its advantage in power efficiency, thermal management, and operational stability - critical factors for on-device AI.To illustrate its broad compatibility, DEEPX showcased integrations with application processor (AP) systems-including NXP, Renesas, TI, Broadcom, Rockchip, and Intel-as well as small form factor computing solutions such as the popular Raspberry Pi. The company also demonstrated interoperability with partner industrial PCs and leading workstation and server systems from HP, Dell, Supermicro, Lenovo, Inventec, and others, highlighting the versatility and scalability of its solution.Looking ahead, DEEPX will partner with LG U+ at MWC (Mobile World Congress) in Barcelona from March 3 to demonstrate on-device AI solutions powered by its first-generation chip. DEEPX will also host its own booth to showcase the roadmap for its DX-M2 on-device AI semiconductor, designed for large language models.Following MWC, DEEPX will head to Embedded World on March 11 in Nuremberg, Germany, where its products will be showcased at partner booths - including Micron, Raspberry Pi, AAEON, DFI, Portwell, SEEED, Biostar, Advantech, and Network Optix - as well as DEEPX's own stand. The company will conduct additional live demos and meet with potential customers to explore new business opportunities.

Darveen Co., Ltd., a global provider specializing in rugged industrial computer solutions, is pleased to announce its participation in Embedded World 2025, one of the largest global platforms for the embedded community. The event will take place in Nuremberg, Germany, from March 11 to 13, 2025. Visit Darveen at Hall 3, Booth 3-230 to explore our latest rugged computing solutions designed for a wide range of vertical industries, including in-vehicle environments, marine applications, industrial edge computing, and mobile workforce operations.Stop by our booth to discover our newest product lineup, including:In-vehicle computing solutionsDarveen's in-vehicle solutions are purpose-built for demanding vehicle environments, featuring all-in-one vehicle mount computers with integrated monitors and in-vehicle box PCs. Engineered for reliability, these solutions offer wide temperature and wide voltage support, along with rugged designs, making them ideal for trucks, forklifts, cranes, mining vehicles, agricultural vehicles, and buses. With MIL-STD-810H/G compliance and M12 connectors, our solutions are well-suited for transportation, logistics, warehousing, and port terminal operations.Rugged tablets, RTC seriesDarveen will showcase its rugged RTC Series tablets, available in sizes ranging from 8" to 11.6". A key highlight is the recently launched RTC-I116, featuring a high-brightness 1,000-nit display, hot-swappable dual batteries, and a range of expansion options—perfect for boosting productivity in field operations. The Android OS version of the RTC Series is also available. These versatile tablets are suitable for industries such as manufacturing, law enforcement, firefighting, energy, and logistics.Marine computing solutionsDarveen is introducing a new marine-grade computer powered by a 13th Gen Intel Core processor. Designed for high-performance marine applications, it features 4x NMEA 0183 ports and 8x isolated GPIO ports, ensuring stable connectivity with various ship instruments and systems. Whether managing electronic chart display and information systems (ECDIS) or handling complex vessel-specific applications, this solution delivers exceptional performance and reliability at sea.Industrial edge computing solutionsBeyond vertical-specific solutions, Darveen will also present its latest industrial embedded computers and HMI panel PCs, designed to handle the challenges of edge computing in harsh industrial environments. These high-performance solutions support smart factories and industrial automation, enabling real-time data processing and control.Darveen's comprehensive product portfolio serves diverse industries with customized solutions tailored to specific application needs. As a trusted provider, we are committed to accelerating our customers' time-to-market with innovative, high-quality computing solutions.Join us at Embedded World 2025 and experience the future of rugged computing firsthand!

BIOSTAR, a leading manufacturer of IPC solutions, motherboards, graphics cards, and PC peripherals, is set to showcase its latest industrial computing and edge AI computing solutions at the upcoming Embedded World 2025. The event will take place from March 11-13, 2025, at Nurnberg Messe, Nurnberg, Germany, with BIOSTAR's booth located at 2-321, Hall 2.At Embedded World 2025, BIOSTAR will spotlight its edge computing solutions powered by Intel CPUs, including AI-driven platforms tailored for industrial automation, smart cities, and HMI (Human-Machine Interface) applications. Key highlights will include 3.5" SBCs, NVIDIA Jetson Orin platforms, and industrial-grade systems engineered for scalable, efficient, and robust performance.As an essential player in the IPC and edge AI industries, BIOSTAR continues to lead the way in providing scalable, efficient, and powerful computing solutions. BIOSTAR's diverse portfolio includes products across multiple form factors, including ATX, Mini iTX, SBC, and embedded industrial computers, ensuring versatility and adaptability for various use cases.Credit: BIOSTARIn addition, with the successful cooperation at CES 2025, BIOSTAR will partner with DEEPX again at the exhibition to integrate AI technologies into its edge computing solutions, further solidifying its leadership in Edge AI platforms. The collaboration with renowned AI chip solution providers underscores BIOSTAR's critical role in shaping the future of intelligent computing.Credit: BIOSTARBIOSTAR is excited to welcome industry professionals, IPC innovators, and tech enthusiasts to join them at Embedded World 2025. The exhibition will feature the latest advancements in edge AI and industrial computing technology, showcasing BIOSTAR's commitment to pushing the boundaries of innovation to address the evolving demands of smart industries. Attendees are welcome to apply for FREE tickets using ew25543325, the BIOSTAR invitation code, and invited to visit booth 2-321, Hall 2, to experience firsthand how BIOSTAR's cutting-edge solutions transform industrial applications through enhanced AI computing capabilities.

In recent years, API attacks—especially those involving shadow APIs— have become an increasing concern. Some of the most destructive types of API attacks include command injection and malicious program uploads, which can grant attackers remote control over hosts and have already led to significant cybersecurity incidents.Additionally, AI-driven attacks are rapidly emerging as a major threat. Hackers are now leveraging AI tools to create sophisticated malware and attack vectors, further escalating security risks.Supply chain vulnerabilities have also become a widespread cybersecurity challenge. Supply chain attacks occur when enterprises are infiltrated through compromised third-party software or hardware provided by external partners. In many cases, companies outsource software development, but their vendors inadvertently incorporate compromised third-party components. These issues are difficult to detect yet have severe and far-reaching consequences. In recent years, RayAegis has also identified compromised third-party components in multiple ATM systems.RayAegis: A Pioneer in Cybersecurity InnovationRayAegis has been at the forefront of cybersecurity and artificial intelligence (AI) for years. As early as 2017, at the IEEE conference in San Jose, USA, RayAegis publicly demonstrated an advanced AI theory designed to detect zero-day vulnerabilities. To this day, AI systems deployed across various countries continue to uncover emerging zero-day attacks, providing robust security defenses.RayAegis also integrates this cutting-edge technology into red team exercises and penetration testing services, helping enterprises strengthen their security posture.Key Global Cybersecurity ChallengesRayAegis has identified several pressing cybersecurity challenges facing enterprises today:Shadow APIs remain widespread: Many organizations unknowingly purchase products that contain shadow APIs, which attackers can exploit to upload malware or gain unauthorized access to systems.Obfuscated OWASP TOP 10 attacks bypassing WAFs: Attackers are using advanced obfuscation techniques to evade Web Application Firewalls (WAFs), allowing threats such as obfuscated JavaScript, SQL injection, XSS, and OS command execution to bypass defenses and compromise backend systems.Failure to detect new, customized malware: Traditional antivirus solutions have limitations. RayAegis has observed that once enterprises are infected with new malware, they often struggle to prevent further threats, including data exfiltration, lateral movement, and system intelligence gathering.Inadequate access controls: Attackers can exploit weak access controls to retrieve unauthorized user information, access internal databases, or leverage critical internal services.LLM vulnerabilities in OWASP TOP 10 (https://genai.owasp.org/llm-top-10/): These vulnerabilities may expose sensitive system information and pose new security risks.RayAegis' AI-Driven Security SolutionsTo address the evolving landscape of cybersecurity threats, RayAegis not only provides professional security services but also develops AI-powered solutions to help enterprises mitigate risks:SandSphere: A sandbox solution that scans files and evaluates the security of supply chain software, including detecting embedded backdoors.UTDS-API: An API inventory system that identifies unmanaged APIs and detects zero-day vulnerabilities.Malware Protection Effectiveness Testing: Assesses an organization's ability to defend against cyber threats by simulating attacks to determine if hackers can extract system information or cause further damage.Credit: RayAegisRayAegis is a global cybersecurity leader, providing cutting-edge security solutions to major banks, government agencies, and enterprises worldwide. Visit the website for more information: https://www.rayaegis.com/english/

Semiconductor testing plays a crucial role in the supply chain, with industry players prioritizing factors such as test speed, cost, signal measurement accuracy, one-stop test capabilities, and software support. Chroma ATE holds a key position in the global ATE (Automated Test Equipment) market, offering a diverse range of solutions and maintaining a strong global presence. Recently, the company hosted a Semiconductor Test Equipment User Conference in Hsinchu, Taiwan, where it shared its 2025 hardware and software test solution roadmap with customers.Commitment to growth with customers: A comprehensive solution blueprint for global expansionGeorge Chang, president of Chroma ATE's Semiconductor Test Business Unit, highlighted in his opening speech that Chroma has been engaged in the semiconductor sector for over 20 years. With an installed base of more than 4,300 test systems worldwide, the company serves markets across Asia, Europe, and the Americas. Chroma's product lines can be categorized into five segments: digital, analog, mixed-signal, interface solutions, and software. The company is also actively developing next-generation products for applications in RF, power, and audio testing.George Chang, president of Chroma ATE's Semiconductor Test BU, stated that as of November 2024, Chroma's global installed base of semiconductor ATE exceeds 4,300 systems. Credit: Chroma ATEFocusing on hardware test platforms with wide range of test boards to meet diverse needsFor wireless solutions, Roger Huang, vice director of the Application Engineering Department at Chroma Group subsidiary Adivic Technology Co., introduced the Chroma 3680 HDRF2 test board. Huang noted that the Chroma 3680 platform natively supports testing of a wide range of chips, but when combined with the HDRF2, it can meet extensive wireless and RF (radio frequency) testing needs, including Wi-Fi 6, BT 5.0/BLE, GPS, and wide-area IoT technologies. Chroma is already developing its successor model, the HDRF3, to address standards such as Wi-Fi 6E/7 and 5G FR1. The company has also developed solutions specifically tailored for the 5G mmWave spectrum. The 30GHz range is addressed by the existing Chroma 3680 HDRF2, while the 48GHz range is supported by the MP5808 model paired with the mmWaveBox, catering to 5G FR2, FR3, and low-earth orbit (LEO) satellite applications.For power-related chip testing, Spancer Lee, senior manager of Product Marketing at Chroma's Semiconductor Test BU, highlighted the pivotal role of the Chroma 3650 platform. Lee noted that since launching the 3650 platform back in 2002, Chroma has continuously evolved its solutions to meet market demands for power management. The company introduced various test boards and solutions to complement the 3650, culminating in the release of its successor, the Chroma 3650-S2, in late 2022. Chroma is also preparing to unveil a new product, the HTMU board, further demonstrating its commitment to addressing diverse voltage and current combinations for power chip testing. The testing needs of third-generation semiconductors with high-voltage specifications can be effectively met by stacking Chroma's HVVI boards.Lee also mentioned that as the design of power chips becomes more complex and the manufacturing process evolves, the timing information and related parameters to be measured for power chips become more challenging. Chroma ATE launched these test boards, together with the Chroma 3650-S2, to meet the testing needs of the new generation of power chips.In the mixed-signal domain, Blair Fan, associate product manager at Chroma's Semiconductor Test BU, focused on the company's roadmap for audio mixed-signal solutions. Fan pointed out that the Bluetooth headset and speaker market is expected to grow at a compound annual growth rate (CAGR) of approximately 20% from 2024 to 2029, reaching a total market value of $38.2 billion. From a product design perspective, challenges in Bluetooth and audio applications include the integration of digital and analog testing, as well as cost control to maintain chip profitability. Chroma addresses these challenges with the Chroma 3380 platform paired with the MXADO module board.Minimizing platform conversion time using large language models (LLMs) Beyond hardware, Chroma has also made significant strides in software solutions. Ray Hsu, software engineer at Chroma's Semiconductor Test BU, explained that in the long run, semiconductor manufacturers will inevitably transition between test platforms. This process typically requires around 140 hours of additional software migration time. However, Chroma leverages Large Language Models (LLMs) to reduce this to just 5 hours. He further explained that the conversion process involves two stages: the first uses LLMs for processing and the second uses Retrieval-Augmented Generation (RAG) technology. Parameter adjustments and removal of unnecessary parameters are still required to ensure ideal conversion results.Hsu emphasized that while conversion is not 100% perfect and still requires manual refinement, it saves substantial amounts of time compared to traditional methods, which is of great benefit to customers.In addition to introducing its next generation of semiconductor test solutions, Chroma invited strategic partners Dr. Chen Wei-yang from TMY Technology and Mr. Tai Yu-che of the R&D and simulation department at Keystone Microtech to share relevant insights on their collaborative advancements.To sum up, Chroma ATE offers a diverse range of solutions covering digital, analog, and mixed-signal testing in the global ATE market. At the recent user conference held in Hsinchu, Chroma unveiled its 2025 roadmap for hardware and software solutions. The company showcased an array of test equipment, including the Chroma 3650, 3680, and the newly launched HDRF series, catering to power management, high-frequency testing, and wireless technology applications.Amid evolving US-China trade dynamics, Chroma is deepening its localized services while utilizing AI technologies like LLM and RAG to shorten software migration times and enhance testing efficiency. Looking ahead, Chroma ATE is poised to continue integrating innovative technologies to meet the testing needs of next-generation semiconductors, foster growth alongside customers, and strengthen its global market presence.Live demonstration of the Chroma 3680 Advanced SoC Test System. Credit: Chroma ATEChroma's Semiconductor Test Equipment User Conference attracted nearly 200 industry professionals. Credit: Chroma ATE

STMicroelectronics' L99MH98 8-channel gate driver brings patented features for building automotive motor drives without sensing resistors, reducing power dissipation and the bill of materials.The L99MH98 can drive four external full bridges, eight half bridges, or single high-side/low-side powering mechanisms such as seat-position adjusters, window lifters, sunroofs, pumps, seatbelt pre-tensioners, and other actuators. The L99MH98 can also drive resistive loads such as heaters, and the internal circuitry contains a charge pump whose output can control a reverse-battery protection MOSFET.While the drivers can control both logic-level and standard-level MOSFETs, extended gate current capability, programmable up to 120mA, permits driving large numbers of external MOSFETs. Three-stage gate control, which applies the gate signal in three steps, helps to minimize electromagnetic emissions.Designed to provide each MOSFET's drain-source voltage (VDS) to an analog-digital converter (ADC), the L99MH98 leverages indirect current measurement to replace sensing resistors. This ST-patented technique calculates the drain current in each MOSFET by combining the measured VDS with RDS(on) predicted using sensed temperature. The system is calibrated at manufacture to find the nominal RDS(on) values, enabling predictions to be made using the MOSFETs' resistance-versus-temperature curves.A further feature, also ST-patented, is the programmable multi-failsafe function that enhances reliability by turning off bridges individually to protect against faults while allowing unaffected bridges to operate normally. Multi-failsafe detects faults, including supply overvoltage, high-side over/under voltage, thermal warning, charge-pump failure, and VDS-monitoring failure, and selectively turns off functions such as diagnostics, watchdog and charge pump depending on fault type.The L99MH98 is AEC-Q100 qualified and meets ISO 26262 criteria for functional-safety applications up to safety integrity level (ASIL) B.Available now in a VFQFN48L package with wettable flanks and exposed underside cooling pad.

The crypto industry, much like the finance industry, is a very competitive one. Although the most popular cryptocurrencies, like Bitcoin (BTC) and Ethereum (ETH), are US-based, Asia is pushing hard to become a leading competitor with projects like TRON (TRX), VeChain (VET), and NEO. As of February 2025, US crypto projects are still outperforming their Asian competitors in both market capitalization and institutional backing. What this means is that investors and businesses prefer US cryptos over any other options.One way to compare the two markets is to look at the fundamentals. How good and innovative are the technologies upon which crypto projects are developed? In the US, Ethereum is making waves with its Ethereum 2.0, a project that is meant to help it scale up even further with minimal energy consumption. It also has multiple Layer-2 solutions like Arbitrum and Optimism to make transactions much cheaper and faster.Solana is another project following in the steps of Ethereum 2.0. Its Layer-2 project, Solaxy, has raised over $19 million in its presale, showing that US investors will always go for crypto picks with big growth potential.Meanwhile, apart from TRON, Asian crypto projects like NEO and ICON are still struggling to gain momentum in Asia, let alone globally. Some of the challenges these projects face include scalability, interoperability (exchanging data between platforms), security, and regulatory compliance.China, for example, has been tough on crypto for over a decade. In 2013, it banned all banks from carrying out crypto transactions. In 2017, it prohibited Initial Coin Offerings (ICOs). And finally, in 2021, it declared that all things crypto be illegal. Since then, developers have had to move to crypto-friendly countries like Singapore to mine or trade cryptos. For investors, these are red flags, which is why they are yet to be widely adopted in the region.On the contrary, US cryptos have institutional and government backing. For example, the world's largest asset manager, Blackrock, has Bitcoin-related investment products for its investors. This is a major endorsement of the US crypto from an industry giant that is respected globally.Also, in January 2024, the Securities and Exchange Commission (SEC) approved spot Bitcoin exchange-traded products (ETPs). Then, early in February 2025, President Trump signed an executive order for the creation of a sovereign wealth fund that has sparked a lot of speculations as to whether the US will finally move to invest in Bitcoin. All of these are green flags that motivate investors to gravitate towards US cryptos over any other.Looking at the numbers according to CoinMarketCap, 80% of the top 10 cryptos by market cap are US-based. Bitcoin alone holds a 60% dominance and a whopping US$1.9 trillion in market cap. Bitcoin is clearly the leader of the crypto space, followed by Ethereum, with a 10% dominance. Asian cryptos TRON, VeChain, and NEO rank 10th, 40th, and 89th, respectively, on the same chart among all cryptos. Whichever way you look at it, US cryptos outpace Asian cryptos.

The tech world has been buzzing with excitement this week as key players in the industry revealed updates and innovations that will shape the way we interact with mobile technology. From Samsung's major announcements during its Galaxy Unpacked event to Google's enhancements in Android software and Oppo's efforts in foldable devices, the advancements demonstrate how technology is constantly fine-tuned to meet user needs.For individuals who often test their devices through demanding apps or entertainment platforms, like using tested SG casinos on Android devices, these updates highlight the importance of powerful, seamless performance in everyday scenarios. According to iGaming expert Pride Kazunga, online casinos in Singapore bring the thrill of the casino floor directly to Android mobile devices.These platforms offer players many advantages, such as access to thousands of games, robust security measures, and support for a wide range of fast, safe, and transparent transaction methods, including cryptocurrency and e-wallets, ensuring players receive faster payouts effortlessly.Kazunga's review of these platforms emphasizes the value of high-performing smartphones that can handle fast gameplay, smooth graphics, and reliable connectivity. As the latest advancements in mobile technology continue to push boundaries, these devices ensure users can enjoy uninterrupted entertainment while exploring the top-rated platforms.At the forefront of the week's developments is Samsung's Galaxy S25 series, which introduced three models: the S25, S25+, and the high-performing S25 Ultra. A standout feature of this new lineup is its AI-driven operating system, designed to make interactions feel more intuitive and personal. With the introduction of One UI 7, Samsung has focused on integrating advanced AI into the core experience, simplifying complex tasks and creating a more natural flow for users. TM Roh, President of Samsung Electronics' Mobile eXperience Business, described the improvements as a significant leap forward in how users engage with their devices.Adding intrigue to the event, Samsung also teased the S25 Edge, a slimline device crafted to appeal to users seeking a more compact yet powerful phone. Though showcased at the event, hands-on access was restricted, fueling curiosity about its real-world capabilities. While this sleek design has drawn attention, some experts have highlighted a growing challenge in the industry: as phones reach their technological and physical limits, breakthroughs are often incremental rather than transformative. Battery life remains a notable concern, with manufacturers working within the confines of current technology to extend usage without sacrificing portability.Meanwhile, Google took the opportunity to share updates on Android's evolution, with several features specifically tailored for the Galaxy S25 series. One of the most noteworthy announcements was the rollout of LE Audio, a Bluetooth advancement aimed at improving accessibility for individuals with hearing impairments. This feature enables hands-free calls, personalized audio adjustments, and smooth connections to hearing aids, making smartphones even more user-friendly for a broader audience. Alongside accessibility improvements, Google announced refinements to its AI assistant and search functions, reflecting a commitment to making technology smarter and more responsive.The competition in foldable devices continues to intensify, as Oppo previewed its Find N5, one of the thinnest foldables on the horizon. This device represents Oppo's dedication to refining the design of foldables while maintaining functionality, though limitations like the physical size of the USB-C port still present challenges. Oppo's strides in this space signal the rising interest in foldable technology, which appeals to users seeking versatility without the bulk of traditional devices.As Samsung and Oppo refine hardware, Google is looking ahead with the Pixel 11, set for a 2026 release. Early leaks suggest new AI capabilities powered by the Tensor G5 chipset, focusing on speed, performance, and software optimization to strengthen Google's position in the premium smartphone market. These updates show how manufacturers are innovating to meet consumer needs.

iMQ, the innovator of embedded microcontrollers and security ICs, today announced that the entropy source generation engine for the security ICs has complied with the SP800-90B standard and attained NIST Entropy Source Verification (ESV) certification. The certified entropy source generation technology has been fully deployed in the iMQ security products series: SQ71xx and HQS60xx.NIST official website: IMQ Certifications."We are pleased to announce that iMQ has passed NIST ESV certification. This provides our customers with the assurance that iMQ is a secure, reliable, and trusted security solution provider", said Bo Cheng, CEO of iMQ. This certification provides the highest level of security certification for entropy sources to ensure that the random number generator complies with the NIST CMVP FIPS 140-3 international specification.Since April 1, 2022, NIST announced that a new Cryptographic Module Verification Program (CMVP) certification only accepts the security requirements of cryptographic modules as specified in FIPS 140-3. In December 2022, NIST further announced that an ESV certificate must be presented for CMVP certification submission. Since then, NIST ESV certification has become the ticket for manufacturers to achieve CMVP FIPS 140-3 certification. The ESV is a rigorous validation that requires extensive testing and validation. iMQ is dedicated to developing and delivering security ASICs and solutions to customers, and this certification is a testament to that commitment.