Integrated Service Technology (iST), a specialist in IC materials analysis, has reported a 10.2% increase in revenue year-over-year from January to May, thanks to robust reliability...

In helping TSMC maintain its leading edge, the government has approved funding support for a spate of R&D projects undertaken by academic research teams, aiming to fill related...

Taiwan-based Alchip Technologies, dedicated to supplying ASICs, has reiterated its close collaboration with significant North American clients, which will become evident in the third...

With its crucial CoWoS (chip on wafer on substrate) backend technology in high demand for AI GPU chips, TSMC's long-established "one-stop-shop" advantage for advanced chips manufacturing...

TSMC's 3D Fabric advanced packaging and testing plant, AP6, has officially started operation. Advanced packaging and testing providers have indicated that the 3D Chiplet and System-on-Integrated-Chip...

TSMC has reported revenue increased 19.4% sequentially to a four-month high of NT$176.54 billion (US$5.74 billion) in May 2023.

The GaN (gallium nitride) patent disputes between the US and China have existed for a long time, but not until recently did the American vendor Efficient Power Conversion Corp. (EPC)...

TSMC's Advanced Backend Fab 6, the foundry's first all-in-one automated advanced packaging and testing fab to realize 3DFabric front-end to back-end process and testing services integration,...

Data center manufacturers are keen on diversifying their AI GPU suppliers. Advanced Micro Devices (AMD) intends to reap the most benefits with its Instinct MI300 series, offering...

Yongin City in Gyeonggi province of South Korea is poised to become the world's largest semiconductor hub, as it will accommodate an enormous national semiconductor park to be established...

TSMC has confirmed intentions to establish a joint venture fab in Germany, but aims for a high shareholding to prevent production capacity from being controlled. The Taiwan-based...

Apple's innovative UltraFusion packaging architecture relies on TSMC's 3DFabric packaging platform, according to industry sources.

TSMC has revealed the latest progress of its German fab plan at its shareholder meeting held today.

TSMC held its shareholders' meeting today, where chairman Mark Liu stated that the company has faced various global challenges in recent years, including the US-China trade war, climate...

TSMC has placed rush orders for CoWoS packaging equipment in order to meet surging demand for Nvidia's AI chips, according to sources at fab toolmakers.