TSMC has readied plans to build new CoWoS (Chip on Wafer on Substrate) capacity at its manufacturing complex in the Central Taiwan Science Park (CTSP) to meet a rapid surge in demand...

Upon implementation of the European Chips Act, TSMC and Intel are enticed to make substantial investments in Europe, whereas Samsung Electronics maintains a wait-and-see attitude...

Samsung Electronics is aggressively incorporating artificial intelligence (AI) to improve its DRAM design and wafer fabrication yield, aiming to boost its product competitiveness...

Trade unions are expected to pose a challenge to TSMC and Intel as they look to build and operate local fabs in Germany, according to market sources.

Talent shortages have become a universal issue in the semiconductor industry worldwide. In Taiwan's ecosystem, the gender ratio imbalance is severe. Leading semiconductor companies...

As the world is pursuing net-zero carbon emissions, there has been a drastic surge in demand for green power and net-zero emission raw materials, pushing up their supply and construction...

In the era of globalization, economic scale and efficiency are crucial factors in production and manufacturing, and Taiwan, with its limited land and dense population, has maximized...

TSMC is expected to continue its leadership in wafer foundry with strong momentum coming from AI chips using its 7nm and more advanced manufacturing nodes. TSMC is making Nvidia's...

TSMC has seen its capacity utilization rates for advanced processes below 7nm rebound slowly since June, and is poised to embrace a new wave of chip demand growth in 2024 as major...

As geopolitical competition and the concept of national security gain a technological dimension, fueled by US-China rivalry and the post-pandemic supply chain disruption, semiconductors,...

TSMC, ASE Technology and Tongfu Microelectronics (TFME), as well as test interface specialists WinWay Technology and Chunghwa Precision Test Tech (CHPT) are all gearing up for shipments...

According to Reuters, citing sources, silicon IP vendor Arm is in talk with at least ten companies to bring one or more anchor investors in Arm's initial public offering...

Samsung Electronics and SK Hynix have revealed the latest development trends for advanced logic chips technology and memory products at recent technology symposiums, with the former...

AMD, Broadcom, Marvell, and Nvidia are among the largest consumers of TSMC's CoWoS (Chip-on-Wafer-on-Substrate) backend technology,

Taiwanese foundries, OSATs, and other chipmakers are bracing for a surge in demand for AI high-performance computing (HPC) processors from US-based fabless vendors, such as Advanced...