The 34th Academia Sinica academician and honorary academician election recently welcomed 28 new members, including Douglas Yu, Vice President of Pathfinding for System Integration...
Innolux Corporation, a leading display panel manufacturer, is undergoing a significant transformation as it ventures into the semiconductor field with its Fan-Out Panel Level Packaging...
TSMC's quarterly investors conference is scheduled for July 18, with market attention focused on topics such as AI chip demand, the foundry's expected price increase, and capital...
Indian semiconductor startup Silizium Circuits is a promising company receiving support from the Taiwan government and stationed at the Tainan site of Taiwan Tech Arena (TTA-South),...
After two failed attempts at entering the discrete GPU market, Intel attempted another comeback in 2017 by recruiting Raja Koduri from AMD to head a development team, which led to...
As Apple prepares to launch its first AI smartphone in September, the third quarter is expected to see a surge in stocking demand. This has not only pushed TSMC's market value to...
As more tech firms are developing their proprietary chips for AI servers, semiconductor manufacturers, including IC backend houses, are likely to benefit from the opportunities.
The "2024 Semiconductor Talent Development Program," a joint effort of the German government of Saxony, National Taiwan University, and TSMC, has born the first batch of fruits.
India-based IC design house and IP provider MosChip Technologies secured a deal to design a homegrown HPC chip made by TSMC, amid India's indigenization efforts in the AI era.
As Apple touts its emphasis on privacy in cloud computing for its upcoming Apple Intelligence, market watchers expect a surge in demand for cloud AI chips since Apple will need to...
Despite increasing numbers of graduates from electrical engineering, electronics, and optoelectronics programs trained by six universities joining the industry, Taiwan still faces...
At the TSMC 2024 Japan Technology Symposium held on June 28, besides discussing the previously announced A16 chip technology, TSMC also revealed that it achieved revenue growth in...
According to recent market rumors, major mobile SoC makers Apple, Qualcomm, and MediaTek will all adopt the more advanced N3E process for their flagship mobile SoCs in the second...
Advanced packaging for Silicon Photonics (SiPh) and Co-Packaged Optics (CPO) has emerged as an additional forward-thinking trend, following CoWoS, InFO, and SoIC.
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