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Tuesday 25 August 2026
Novosense encoder launch highlights China's push into robot joint sensing
Chinese analog and mixed-signal chipmaker Novosense Microelectronics has introduced the NSM350x series, a Hall-based magnetic encoder designed for high-precision angular measurement in robot joints and industrial motion-control systems, reports Sina Finance.
Tuesday 25 August 2026
Infineon buys India-based C2i Semiconductors to bolster AI data center power systems
Infineon Technologies has agreed to acquire Bangalore-based C2i Semiconductors, a move that strengthens its position in power delivery for AI data centers and highlights India's growing role in chip design. The deal could shape how global operators manage rising energy demand, efficiency pressures, and next-generation computing workloads.
Tuesday 25 August 2026
Nvidia Groq 3 LPX enters full production for faster agentic AI inference

Nvidia said its Groq 3 LPX inference accelerator is now in full production, a move that could speed up agentic AI systems used worldwide for coding, reasoning, and other tasks. The company said the platform is designed to improve responsiveness, lower latency, and support growing demand for real-time AI applications.

Tuesday 25 August 2026
SpaceXAI to use Nvidia Vera CPUs for faster agentic AI at scale

SpaceXAI plans to deploy Nvidia's new Vera CPUs to speed up agentic AI workloads, a move that could influence how advanced AI systems are built and run worldwide. The partnership also extends toward orbital computing, signaling a broader shift in where future AI infrastructure may be located.

Tuesday 25 August 2026
IBM unveils dual-architecture mainframe chip to run Arm, z/OS, Linux workloads

In an August 24 press release, IBM announced that it is developing the first dual-architecture mainframe processor, a move that could let global enterprises run Arm-native and IBM workloads on the same future systems. The milestone may broaden software choices, accelerate AI adoption, and reshape mission-critical computing for banks, governments, and large cloud operators worldwide.

Tuesday 25 August 2026
Broadcom's debt push signals AI compute is becoming Wall Street asset class
The AI infrastructure race is entering a phase where access to silicon is no longer the only constraint. As compute demand expands into multi-gigawatt projects, the industry is increasingly confronting a second bottleneck: how to finance hardware and data-center capacity at the scale frontier-model developers now require.
Tuesday 25 August 2026
SK Hynix and Alibaba tackle the next AI bottleneck: getting more value per chip
The AI infrastructure race has been marked by a near-fixated drive to expand AI-powered buildouts, as demand for increasingly complex chip configurations pushes against the physical and economic limits of scalability.
Monday 24 August 2026
Xiaomi taps TSMC to make chips for foldables, AI and autonomous driving
Xiaomi is expanding its in-house semiconductor push from smartphones into AI acceleration and autonomous driving, unveiling three Xring processors that deepen its reliance on TSMC manufacturing while reducing dependence on external chip suppliers.
Monday 24 August 2026
Advanced packaging substrates hit limits; ceramic cores rise to challenge glass materials
As hardware demands for artificial intelligence continue to surge, beyond increased size and complexity in chip packaging, advanced packaging substrates face mounting challenges: larger package footprints, higher layer counts, lower warpage, and higher accuracy. However, relying solely on incremental upgrades to traditional manufacturing processes is hitting a physical wall. This bottleneck is compelling the industry to evaluate next-generation core layer materials.
Monday 24 August 2026
Nvidia's strikes US$6B licensing deal with Poolside to accelerate Nemotron models
Nvidia reportedly struck a US$6 billion deal with startup Poolside to license its technology and hire much of its staff. The technology and personnel will reportedly support the chipmaker's Nemotron models in a bid to compete with China's strength in open-source models, but the deal also puts Nvidia in competition with some of its biggest customers.
Monday 24 August 2026
Taiwan semiconductor materials hit golden opportunity
Rising concerns over potential supply chain chokepoints for critical raw materials have driven the formation of the SEMI Taiwan Materials Alliance. Wei-Wang Chen, General Manager of Everlight Chemical and Chairman of the Taiwan Chemical Industry Association (TCIA), noted that Taiwan boasts the world's largest tier-one customer demand alongside the most stringent process specifications. This unique position, he stated, presents a "once-in-a-century golden opportunity" for local semiconductor material development.
Monday 24 August 2026
MediaTek, GUC, Alchip escalate funding war as global ASIC race demands deep capital
Custom Application-Specific Integrated Circuit (ASIC) chips backed by hyperscalers are set for a mass-production boom starting late 2026, with next-generation projects already in full swing across development and supply-chain reservation. Industry insiders note that chipmakers have entered an era of all-out fundraising warfare, racing to secure capital, capacity, and key clients.
Monday 24 August 2026
AI chip roadmaps force faster changes in data-center design, Cadence says
Rapid changes in the power and thermal requirements of AI accelerators are forcing data-center designers to incorporate chip-level information earlier in the planning process, according to Cadence Design Systems. This is narrowing a gap that once separated semiconductor development from facility engineering.
Monday 24 August 2026
ASE's Huang urges AI profits to fund R&D for CPO, PLP

As chip processes move to 2nm and advanced packaging accelerates heterogeneous integration, semiconductor materials are shifting from a supporting role in the supply chain to a critical factor in technological breakthroughs. SEMI has announced the formation of the "SEMI Semiconductor Materials Alliance," bringing together 35 materials, equipment, wafer fabrication, packaging, and testing companies, as well as industry, government, academia, and research organizations, including Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics Corporation (UMC), ASE, and Micron Technology, to speed material validation for emerging technologies such as co-packaged optics (CPO) and panel-level packaging (PLP), with the goal of accelerating mass production.

Monday 24 August 2026
Jeilin shifts upmarket as high-end image SoCs drive margins higher
Jeilin's move into higher-end image-processing chips is reshaping its revenue mix and boosting profitability, with implications for cameras, security devices, and drones used by customers worldwide. The Taiwan-based chip designer said new products, tighter cost controls, and broader market reach are helping it compete in a consolidating industry.
Monday 24 August 2026
AI compute race heads toward space as MediaTek executive says 1 million H100s will be mid-tier by 2030
Speaking at DIGITIMES' "AI on Chips: Semiconductor Industry Outlook Forum," MediaTek senior director Bor-Sung Liang said AI development is shifting from individual large language models (LLMs) toward collaborative teams of AI agents with different roles and capabilities. He also revisited the seven-layer AI architecture he previously proposed, contrasting it with NVIDIA CEO Jensen Huang's five-layer "cake."
Monday 24 August 2026
Agentic AI opens new era for humanoid robots, shipments to jump fourfold by 2030

Humanoid robots have entered a clear new phase since agentic AI emerged in 2025, with DIGITIMES analyst Zouhao Shen saying the category is now moving toward a three-tier hardware architecture of the brain, cerebellum, and peripheral nerves. He said the shift is reshaping the market and setting the stage for rapid growth through 2030.

Monday 24 August 2026
Research Insight: ASIC shipments projected to overtake GPU by 2027 as AI reshapes memory
ASIC and GPU shipments will reach a "golden cross" in 2027, with ASIC shipments expected to surpass GPU shipments for the first time at 15.3 million units, DIGITIMES Intelligence analyst Stella Weng said. She also said AI is driving a "qualitative change" in memory architecture inside AI servers.
Saturday 22 August 2026
Interview: Arbe Robotics on why radar is needed for autonomous driving and beyond
Autonomous driving technology is maturing, and a future in which cars entirely drive themselves is quickly approaching in the rearview mirror. Yet safety and trust remain crucial barriers to overcome before fully autonomous driving becomes a reality, and a key part of this is the "eyes" of the car.
Friday 21 August 2026
Cambricon advances sixth-gen AI silicon, broadens support for DeepSeek, Qwen and GLM
Cambricon Technologies chairman and president Chen Tian-shi said the company's sixth-generation AI processor and instruction set remain under development, with the next-generation platform targeting large-model training and inference while improving programmability, ease of use, performance, power efficiency and chip area.
Friday 21 August 2026
Xiaomi's Xring O3 nears launch on TSMC N3P, testing its in-house chip strategy
Xiaomi is preparing to take its in-house smartphone silicon further upmarket, with founder and chairman Lei Jun confirming that a new generation of its Xring chip is on the way. Supply-chain sources say the chip has already returned from fabrication, completed initial power-on testing and moved into the device integration stage.
Friday 21 August 2026
TIER IV and Renesas team up on open AI-native computing platform for autonomous vehicles
A new collaboration between TIER IV and Renesas could shape how self-driving and software-defined vehicles are built worldwide, as automakers seek more flexible platforms for AI-driven features. The effort aims to combine open-source software, advanced chips, and scalable tools that may accelerate safer mobility across markets from Asia to Europe to North America.
Friday 21 August 2026
Charts: TSMC's share of Taiwan chip manufacturing revenue falls to 81.8% as memory makers scale up
Foundry leader Taiwan Semiconductor Manufacturing Company (TSMC) grew 37% year to date — and still lost four percentage points of the sub-sector's revenue share, because the other 26 manufacturers grew more than twice as fast.
Friday 21 August 2026
DIGITIMES's Colley Hwang warns Taiwan AI data center capacity lags South Korea

The inference economy has arrived, and Taiwan's tech industry must transition from the "knowledge economy" to the "inference economy," DIGITIMES chairman Colley Hwang said on August 20 at a forum exploring future trends in the semiconductor industry. He also warned that Taiwan's AI data center capacity is about one-sixth of South Korea's.

Thursday 20 August 2026
Taiwan chip designers see automotive demand rebound
Major European and US companies and Taiwan-based IC design firms are seeing a notable recovery in automotive chip demand so far in 2026, spanning smart cockpit platforms, advanced driver-assistance systems (ADAS), analog ICs, display driver ICs (DDIs), Ethernet chips, camera-sensing chips, audio chips and interface chips.