At the Hygon-initiated HAIC 2025 Artificial Intelligence Innovation Conference in Kunshan from December 17 to 19, Hygon Information Technology unveiled a "dual-chip strategy," positioning its DCU accelerator and CPU as a tightly integrated foundation for China's next phase of AI infrastructure.
A Japanese startup originating from Waseda University, Power Diamond Systems (PDS), showcased its diamond-based semiconductors at SEMICON Japan 2025, presenting for the first time an evaluation system that confirmed the devices' operation after packaging.

