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Friday 10 April 2026

AD Technology eyes KRW1T revenue with 2nm CPU platform after shift from TSMC to Samsung DSP

South Korean IC design firm AD Technology transitioned from the TSMC Value Chain Alliance (VCA) to become one of Samsung's Design Solution Partners (DSPs) in 2019. After overcoming initial challenges, the company has returned to profitability and now aims to surpass KRW1 trillion (US$673.2 million) in revenue by 2029 or 2030 through its self-developed 2nm server platform, ADP620.

Friday 10 April 2026

Cmsemicon seeks suppliers to expand MCU production as supply tightness remains primary limitation

Shenzhen China Micro Semicon (Cmsemicon) chairman and general manager Yang Yong announced that the microcontroller unit (MCU) market is gradually recovering and that prices are gradually rebounding. However, the main problem at present remains tight supply, he said during the company's 2025 annual results and dividends briefing held on April 9.

Friday 10 April 2026

Realtek posts 39% revenue surge as new SerDes demand drives growth

Realtek's stronger-than-expected March and first-quarter 2026 revenues signal important implications for global supply chains and device makers, showing pull-ins in PC shipments and diversified demand that could affect component sourcing, pricing, and competition in networking, automotive, and AI chip markets worldwide over the coming quarters, as well as investor sentiment.

Friday 10 April 2026

Taiwan accelerates SiPh and materials breakthroughs for next-gen AI computing

Taiwan is stepping up its global semiconductor leadership with a coordinated push into silicon photonics (SiPh) and advanced materials, aiming to meet surging demand for faster, more energy-efficient AI computing while strengthening domestic technological autonomy.

Friday 10 April 2026

Spingence and Advantech accelerate AI edge deployment plans in South Korea manufacturing

In response to strong demand for data security and on-premises AI deployment within South Korea's manufacturing and semiconductor sectors, Taiwanese AI company Spingence Technology is aggressively expanding into the South Korean market starting this year through its enterprise edge large language model (LLM) platform, Edgestar.

Friday 10 April 2026

Intel–Google alliance reframes AI infrastructure around CPUs

A newly expanded collaboration between Intel and Google signals a key shift in AI infrastructure: CPUs are back at the center of the conversation. Both companies emphasized that the partnership spans multiple generations of Intel's Xeon processors and includes co-development of custom infrastructure silicon. Financial terms and deployment timelines were not disclosed, but the scope points to a long-term alignment, not a one-off supply deal.

Friday 10 April 2026

Amazon signals chip export ambitions as in-house silicon business tops US$20 billion run rate

Amazon's custom chip business has surpassed an annual revenue run rate of more than US$20 billion, CEO Andy Jassy said in his annual shareholder letter, according to The Information. The figure reflects the rapid adoption of Amazon Web Services' (AWS) in-house silicon portfolio, including Graviton CPUs and Trainium AI accelerators, which are currently sold exclusively through AWS cloud services.

Friday 10 April 2026

Anthropic reportedly explores in-house chip design amid rapid revenue growth and evolving AI compute stack

Anthropic is exploring the possibility of designing its own AI chips, though the effort remains at a very early stage, Reuters reported, citing three sources familiar with the matter. "The plans are in early stages, and the company may still decide only to buy AI chips and not design any," Reuters reported, adding that the startup has not yet committed to a specific architecture or assembled a dedicated semiconductor team.

Friday 10 April 2026

AUO eyes CPO and LEO satellites as Innolux pushes FOPLP growth

AUO and Innolux are accelerating their expansion beyond traditional display panels, with Innolux's non-display revenue surpassing 51% in 2025, mainly driven by automotive applications. AUO also aims to obtain a non-display revenue share exceeding 50% in 2026.

Friday 10 April 2026

Transcom Technology sees flat 2026 revenue after Taiwan budget delays, but India order may broaden international reach

Transcom Technology expects flat full-year revenue for 2026 amid stalled progress in Taiwan's defense budget, which is potentially delaying deliveries of Gong-3 and Gong-4 missile systems. A first mass-production order for a high-frequency SSPA module from an Indian client, however, could help the company expand its international revenue share to 30%.

Thursday 9 April 2026

Haptic touchpads and AI vision chips propel Elan's early 2026 growth

Taiwan-based touch IC design leader Elan Microelectronics announced its March 2026 and first-quarter revenue figures, posting robust growth despite a traditionally slow season.

Thursday 9 April 2026

Aspeed and ASMedia propelled to top IC design ranks

Although Taiwanese firms have largely missed the core AI chip development battlefield, a few with critical technological barriers have broken through—most notably Aspeed and ASMedia. These two companies boast remarkable profitability and capital market performance that even outpace MediaTek, Taiwan's largest IC design firm. Significantly, their founding management teams mostly originated from the once-dominant PC chipset giants Silicon Integrated Systems (SiS) and VIA Technologies.

Thursday 9 April 2026

Why global chipmakers want to join TSMC's certified supply chain

TSMC's long-established supplier verification and management system is gradually becoming an industry standard, attracting major players worldwide. Samsung Electronics, Intel, Japan's Rapidus, China's Semiconductor Manufacturing International Corporation (SMIC), Hua Hong Semiconductor, Nexchip Semiconductor, and even Tesla CEO Elon Musk are actively engaging with Taiwan's semiconductor supply chain.

Thursday 9 April 2026

Cyient Semiconductors closes US$85M majority stake in Kinetic Technologies, accelerating India-led power IC scale

India-based Cyient Semiconductors' US$85 million majority investment in Kinetic Technologies could expand end-to-end power semiconductor design and production capabilities from India, offering global customers broader access to custom silicon, ASSP products, and enhanced engineering and manufacturing resources, and accelerate deployment of advanced power management solutions across computing and industrial markets worldwide.

Thursday 9 April 2026

China accelerates semiconductor equipment localization; Korean firms eyeing Taiwan as orders slip

In response to US semiconductor sanctions and to accelerate AI industry development, China is aggressively promoting localization in semiconductor manufacturing. While South Korean equipment makers initially viewed this as an opportunity to expand in the Chinese market, the gradual implementation of a "50% localization rule" is now beginning to impact orders. Rapid technological progress by Chinese equipment vendors is expected to further squeeze foreign suppliers' presence in China.

Thursday 9 April 2026

Intel–Terafab collaboration highlights potential role for 18A in next-generation AI manufacturing

The collaboration between Intel and Elon Musk under the Terafab initiative is emerging as a potential catalyst for demand for Intel's most advanced manufacturing node, 18A, even as key details of the partnership remain undisclosed.

Thursday 9 April 2026

Geopolitics and AI is redrawing the global chip packaging landscape

The AI computing boom is reshaping where semiconductors get packaged. Geopolitical pressure and supply chain diversification are pushing capacity well beyond its traditional strongholds in Taiwan and China.

Wednesday 8 April 2026

DIGITIMES analyst discusses Apple's Siri evolution, AI agent trends, and Samsung's 2nm reality

In his podcast, DIGITIMES senior analyst Luke Lin discussed Apple's upcoming evolution of Siri. The new version is expected to integrate Google's Gemini and allow users to select their preferred chatbot, including ChatGPT, Claude, or xAI's Grok. While some market analysts suggest Apple may use this approach to control distribution and charge listing fees, Lin is skeptical of that interpretation.

Wednesday 8 April 2026

China's AI and cloud firms step up use of domestic chips

China's leading AI and cloud companies are shifting toward domestically produced AI chips, a move with global implications for supply chains, technology competition, and cloud services. The trend could reduce demand for foreign semiconductors while accelerating China's practical deployment of AI on homegrown platforms, affecting international vendors and developers alike.

Wednesday 8 April 2026

Taiwan warns of Beijing's covert push to poach AI and chip talent

According to the latest report submitted by Taiwan's National Security Bureau to the Legislative Yuan, China is increasingly targeting Taiwan in an effort to circumvent international technological restrictions. Beijing has set its sights on Taiwan's high-tech sectors—particularly artificial intelligence (AI), semiconductors, and precision machinery—seeking to lure companies to establish operations or maintain a presence in China under the framework of its 15th Five-Year Plan.

Wednesday 8 April 2026

Hygon revenue jumps 68% on AI compute demand, expands CPU–GPGPU platform

China's domestic compute chipmaker Hygon Information Technology reported strong earnings growth, underscoring its rising role in China's AI and data center infrastructure buildout.

Wednesday 8 April 2026

Analysis: ASML earnings preview; SK Hynix and TeraFab already facing EUV capacity difficulties

Compared to short-term geopolitical turbulence, the AI megatrend represents a once-in-a-generation business opportunity. In the past, TSMC often took the lead during earnings season in releasing industry outlooks. This time, ASML will hold its earnings call for the first quarter of 2026 a day earlier on April 15, and is expected to outline how memory manufacturers and new large-scale logic foundries will reshape the semiconductor manufacturing landscape.

Wednesday 8 April 2026

Broadcom, Google, and Anthropic alliance faces MediaTek competition

Broadcom recently announced two major partnership developments. The first is with Google on its Tensor Processing Unit (TPU) application-specific integrated circuits (ASICs), with the collaboration set to extend through 2031. This means that Broadcom will continue to generate related revenue from multiple future generations of Google's TPU products.

Wednesday 8 April 2026

Intel and Musk's Terafab revive IDM collaboration as chipmaker pushes turnaround

Intel's industrial ecosystem is converging on a vertically integrated chip model, as Intel joins the Terafab project led by SpaceX, xAI, and Tesla—marking both a revival of the IDM approach and a potential turning point in Intel's turnaround strategy.

Wednesday 8 April 2026

Commentary: China's AI chip dilemma revisits a familiar semiconductor fork in the road

The global AI race is no longer just about who builds the fastest chip. Increasingly, it is about who writes the rules.

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