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Thursday 17 September 2026
Samsung expands SRAM, IP to speed chip development

Memory shortages and pricing pressures are reshaping Samsung Electronics' foundry intellectual property (IP) development, as faster AI chip refresh cycles push customers to demand stronger process competitiveness, faster development, and better-prepared infrastructure including IP. Samsung is responding by expanding memory design options, IP, and development tools through its Samsung Advanced Foundry Ecosystem (SAFE) program.

Thursday 17 September 2026
AI's memory appetite is squeezing the electronics industry from the bottom up, Intel warns

Fast-moving advances in chip production have spurred a semiconductor boom, markedly altering the manufacturing scope of the broader high-tech industry.

Thursday 17 September 2026
Chip equipment, materials suppliers lead India investment pledges ahead of SEMICON India 2026

Foreign commitments timed around SEMICON India are moving deeper into the supply chain. In the three days before the 2026 edition opened on September 17, Lam Research, Applied Materials, and Fujifilm announced India plans worth a combined INR144 billion (US$1.50 billion), covering silicon components, chip equipment, and process chemicals rather than chip production itself.

Thursday 17 September 2026
Onsemi puts power density at the center of its next-decade strategy

Onsemi is seeking to capture more value from AI, electrification, and automation by expanding from individual semiconductors into integrated power systems. Its strategy for the next decade centers on improving power density: delivering more power in less space while managing heat, efficiency, and reliability.

Thursday 17 September 2026
Lam Research plans US$1 billion India manufacturing expansion
Lam Research plans to invest INR100 billion (approx. US$1.04 billion) in India over the next several years, adding its first silicon component manufacturing facility in the country and expanding its advanced research and development operations.
Thursday 17 September 2026
Musk hints at Tesla-SpaceX merger, but the companies are already converging underneath
The broader high-tech landscape has wondered for years about the subtle transactions and movements unfolding underneath the enormous technology ecosystem Elon Musk has stitched together amid a rapidly expanding business reach across AI-driven industries.
Thursday 17 September 2026
South Korea's chip boom lifts 2027 corporate tax above KRW200 trillion

South Korea's semiconductor boom is spilling over from corporate profits into government tax revenue. Corporate tax revenue for fiscal 2027 is projected to reach KRW216.7 trillion (about US$160 billion), up 113.9% from the 2026 supplementary budget, topping KRW200 trillion for the first time and, after 15 years, overtaking income tax as the country's largest tax source.

Thursday 17 September 2026
Jensen Huang's Galaxy Z Fold8 spotlights Nvidia-Samsung ties

Nvidia CEO Jensen Huang has again been photographed using Samsung Electronics' latest foldable phone, the Galaxy Z Fold8, after being seen with a Galaxy Z Fold7 earlier in 2026. The latest sighting has drawn fresh attention to the close partnership between Samsung Electronics and Nvidia.

Thursday 17 September 2026
Charts: Memory chip designers carry Taiwan's IC design rebound
Taiwan's IC design sector is growing fast, but the gains are concentrated in memory. Combined January–August 2026 revenue at the 105 listed chip designers tracked by DIGITIMES reached NT$1.15 trillion, up 29.6% from a year earlier. Five memory-related companies added two-thirds of the NT$261.8 billion increase.
Thursday 17 September 2026
Huawei aims to become 'China's Nvidia,' rules out building satellites or spacecraft

Huawei's internal Heart Voice Community recently published minutes from a discussion between Guo Ping, chairman of Huawei's supervisory board, and newly hired employees, offering a glimpse into the company's ambitions in AI, computing, semiconductors, and future technologies.

Wednesday 16 September 2026
Analysis: Jensen Huang is in Trump's ear; what it means for Taiwan's chip supply chain
"The narrative is much more practical," Nvidia CEO Jensen Huang said of China's approach to artificial intelligence (AI) at the All-In Summit 2026, contrasting it with US warnings about AI bringing civilization to an end.
Wednesday 16 September 2026
Nvidia's Jensen Huang expected to attend Trump-Xi Summit as tech and trade take center stage
US President Donald Trump and Chinese President Xi Jinping are scheduled to meet on September 24 in Washington for a state dinner now dubbed the "G2 Summit". The meeting follows a turbulent economic period marked by an April 2025 tariff surge where both nations raised levies above 100% before reaching a temporary stalemate. Alongside traditional trade discussions and potential climate change or pandemic prevention talks, technology leadership, export controls, and regulatory frameworks are set to dominate the agenda.
Wednesday 16 September 2026
Samsung Exynos regains share as Galaxy phones test 2nm

Samsung Electronics' in-house Exynos application processors (APs) are steadily regaining lost ground in the global smartphone market. Samsung's share of the global smartphone AP market rose to 9% in the second quarter of 2026, up 2 percentage points from the previous quarter and 3 percentage points from a year earlier, marking a second straight quarterly increase.

Wednesday 16 September 2026
MediaTek keeps Dimensity 9600 Pro on HBPoP as cost drives decisions

MediaTek officially unveiled the Dimensity 9600 Pro on September 15, 2026, drawing significant industry attention to its choice of packaging technology. In media interviews ahead of the launch, MediaTek acknowledged that the Dimensity 9600 Pro skips the latest wafer-level multi-chip module (WMCM) technology used by rivals, opting instead to retain its existing high-bandwidth package-on-package (HBPoP) solution.

Wednesday 16 September 2026
Beyond 2nm: Dimensity 9600 Pro gives MediaTek a bigger role in mobile AI
MediaTek has officially launched the Dimensity 9600 Pro, introducing a major architectural overhaul for its 2026 flagship mobile chip. Beyond the shift to a 2nm process, the new platform adopts a 2+3+3 all-big-core CPU configuration, upgrades its cache architecture, and doubles its NPU resources with a dual-NPU design to support increasingly demanding AI workloads.
Wednesday 16 September 2026
South Korean NPU startups face validation hurdle in push for global sales

South Korea's neural processing unit (NPU) startups are moving from chip development toward commercial deployment, but limited experience operating at scale remains a major hurdle to winning global customers.

Wednesday 16 September 2026
ITRI showcases AI robots, drones to push commercialization in southern Taiwan

The Industrial Technology Research Institute (ITRI) held its ITRI Innovation Day on September 15 in Tainan, Taiwan, bringing together research groups and startup teams to highlight 25 cross-disciplinary technologies in AI, smart robotics, and unmanned vehicles. The event was designed to move more research and development results into industrial use through demonstrations, business matchmaking, and an innovation market.

Wednesday 16 September 2026
DeepSeek to hire its first CFO as it aims for public listing, expands workforce

DeepSeek is reportedly set to hire Wentao Yan, a partner at venture capital firm GL Ventures, as its first CFO. If the appointment takes place, it would happen at an important time for the Chinese AI startup as it seeks to go public, begins a large expansion of its workforce, and invests in chipmaking and computing capacity.

Wednesday 16 September 2026
DIGITIMES Insight: Taiwan's small IC design firms face a weaker second half after rebound

Taiwan's smaller IC design firms posted a strong revenue recovery in the first half of 2026, but the gains may prove difficult to extend. DIGITIMES said higher prices and early customer buying lifted sales, even as consumer demand remained soft. The second half now looks exposed to weaker momentum.

Wednesday 16 September 2026
Amodei's AI slowdown call is unlikely to dent chip demand, industry sources say

Anthropic CEO Dario Amodei's call to slow frontier AI development has stirred debate over safety, but chip industry sources say global demand for AI infrastructure is likely to keep rising. For readers worldwide, the larger issue is not whether AI spending stops, but how quickly it spreads across clouds, devices, and industries.

Tuesday 15 September 2026
China's Guoxin Micro buys its way into power-chip manufacturing

Unigroup Guoxin Microelectronics plans to acquire WeEn Semiconductors for CNY1.9 billion (≈ US$283 million), giving the Chinese specialty IC supplier in-house wafer manufacturing and a faster route into power semiconductors.

Tuesday 15 September 2026
MediaTek unveils first 2nm chip to run 30 billion AI models on phones arriving this quarter

MediaTek has become the first merchant silicon vendor to announce a 2-nanometer smartphone processor, unveiling the Dimensity 9600 Pro on Tuesday as the industry races to run heavy artificial intelligence models entirely within the thermal and memory envelopes of a handheld device.

Tuesday 15 September 2026
Beyond H100: China's GPU makers chase scale, not just parity

China's domestic GPU industry is entering a tougher phase: matching high-end accelerator performance is no longer enough. Vendors must now combine competitive chips with interconnects, software stacks, and clusters capable of training increasingly large AI models.

Tuesday 15 September 2026
Sivers Semiconductors positions laser arrays as solution to copper's limits

At this year's China International Optoelectronic Expo (CIOE), Sivers Semiconductor brought two products to its booth that trace the trajectory of the optical networking industry: a 1.6T pluggable optical transceiver currently ramping toward mainstream adoption, and a prototype module built for external light source (ELS) architectures, a technology that could define the next generation of data center interconnects.

Tuesday 15 September 2026
TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
TSMC's 3nm, 2nm, and CoWoS advanced packaging capacity remained in short supply in late 2026's third quarter, as changes in major customer orders and front-end and back-end supply models prompted the foundry to adjust its advanced capacity allocation. Supply chain sources said Nvidia and Apple continue to dominate TSMC's advanced process and packaging resources, while AWS has recently expanded AI chip tape-outs, giving Annapurna more 3nm capacity.