As artificial intelligence pushes computing systems toward unprecedented processing demands, another technological bottleneck is becoming increasingly difficult to ignore: the energy and time required to store, retrieve, and move data.

WinWay Technology, a semiconductor test-interface supplier, reported a slight decline in October revenue as holidays reduced shipping days and customer project adjustments affected deliveries. However, AI demand kept annual growth above 62%, while new projects involving AI, ASICs, GPUs, and CPUs are expected to offset seasonal weakness and support future operations.

As the global semiconductor industry continues to focus on Nvidia, Intel is looking beyond GPUs to determine where next-generation computing architectures will go. In an interview with Japanese publication PC Watch, Intel chief technology officer Pushkar Ranade outlined the company's technology roadmap, spanning advanced process technology, AI accelerators, quantum computing, neuromorphic computing, silicon photonics, in-memory computing, and new materials.

Rising power demand at AI data centers is driving demand for power semiconductors used in server power supplies, grid equipment, and chip-level power delivery. Infineon Technologies is positioning its silicon (Si), silicon carbide (SiC) and gallium nitride (GaN) portfolio for a shift toward 800V DC architectures, solid-state transformers and vertical power delivery, addressing different voltage, power and efficiency requirements as it expands its AI infrastructure business.

Infineon Technologies and Solum have agreed to expand cooperation on high-voltage direct current (HVDC) power systems for artificial intelligence data centers, as rising computing demand increases pressure on operators worldwide to improve efficiency, power density, and reliability. The partnership will cover intermediate bus converters, battery backup units, and power supply units.

The race to build powerful quantum computers has long revolved around an unfamiliar set of engineering challenges: maintaining delicate quantum states, operating complex cooling systems, and scaling processors far beyond the capabilities of today's experimental machines.

Himax Technologies expects fourth-quarter 2026 revenue decline after automotive customers reduced orders following inventory restocking, highlighting the volatility of semiconductor demand tied to vehicle exports. The display-chip maker forecast sequential revenue falling 22% to 26%, while maintaining that automotive timing-controller sales and longer-term smart-vehicle opportunities remain on a growth path.

Washington's case for letting Nvidia sell H200 chips to China rested on case-by-case national-security screening. A New York Times investigation published on November 7 suggests that the screening cleared companies whose listed offices stood empty and whose owners have ties to firms on the US trade blacklist. The findings sharpen doubts over whether the licensing channel can keep advanced AI hardware away from restricted entities.

Nvidia is pitching South Korea's factories as the proving ground for robots trained in simulation. At its AI Day Seoul 2026 event on November 9, the company detailed physical AI projects with Hyundai Motor Group, Doosan Robotics, LG Electronics, and SK Hynix, and signed an autonomous driving agreement with Kakao Mobility, even as a controversy surrounding chief executive Jensen Huang hung over the gathering.

Andy McLean, CEO of the UK Semiconductor Centre (UKSC), told DIGITIMES that strong AI growth is driving demand for energy-efficient processors, high-speed connectivity technologies such as photonics, and advanced power management. He said the UK's strengths in optics and other technologies make this a unique moment to advance its semiconductor industry.

Surging demand for advanced packaging driven by artificial intelligence (AI) has turned chip-on-wafer-on-substrate (CoWoS) from an "interesting" technology into a headache, making it an urgent priority for MediaTek to secure wafer, packaging, and substrate capacity, said company deputy GM of advanced packaging Shang Hou.

Higher memory prices caused by tight supply weakened demand for consumer electronics, while investment in Wah Hong Industrial's thermal management division weighed on overall third-quarter performance. The company is accelerating development in AI cooling, semiconductor materials, and other high-value applications to reduce its exposure to market cycles.

Qualcomm and MediaTek, the two leading smartphone SoC makers, are turning their attention to cloud AI ASICs as the global smartphone market faces what could be its sharpest decline on record in 2026. At their latest earnings briefings, cloud AI dominated the discussion, while smartphone operations took a back seat.

King Yuan Electronics (KYEC) general manager Gauss Chang said the company's plan to establish a US testing facility in Texas remains on schedule despite concerns that a shift in control after the US midterm elections could alter AI policy. He said KYEC's long-term investment strategy is unlikely to be disrupted by short-term political changes.

Madison Huang, Nvidia CEO Jensen Huang's eldest daughter and the company's senior director of marketing for Omniverse and robotics products, has canceled her entire visit to South Korea, including a planned meeting with South Korean Deputy Prime Minister and Minister of Science and ICT (MSIT) Bae Kyung-hoon. Nvidia cited only "family reasons" for the cancellation.

US President Donald Trump said on November 8 that Jensen Huang should remain CEO of Nvidia, hours after the chipmaker's board opened an independent investigation into whether Huang had been the target of a foreign intelligence effort following his admission of an affair with a woman US officials suspect of spying for China.

Taiwanese power management IC (PMIC) supplier Global Mixed-mode Technology (GMT) sees a potential slowdown in cloud AI spending as an opportunity to ease wafer capacity constraints and rising memory prices that have weighed on consumer electronics demand.

From quantum computers built on conventional silicon to semiconductor light sources promising a new generation of secure communications, the breadth of innovation on display at the UK's National Quantum Technologies Showcase offered a striking glimpse into an industry pushing beyond the established boundaries of computing.

Infineon Technologies is betting on RISC-V scalability with AURIX RC1, its first RISC-V-based microcontroller (MCU) platform, unveiled this week. A single instruction set lets the platform span everything from very small controllers to real-time vehicle computers and robotic motion controllers, so RC1 can serve automotive, robotics, and industrial customers at the same time.

As artificial intelligence reshapes global chipmaking, the UK's strength in design, materials and research is being tested by a longstanding challenge: turning technological breakthroughs into scalable commercial products.

Three US lawmakers asked Nvidia CEO Jensen Huang to attend a closed-door meeting to discuss his interactions with former Megaspeed executive Alice Huang. The request followed recent reports alleging that Alice Huang had fed intelligence to the Chinese government and had developed a "close relationship" with Jensen Huang.

Debt held by Taiwan's science park operating funds reached NT$163.54 billion (approx. US$4.97 billion) as of the end of September 2026, while the National Science and Technology Council (NSTC) remains confident that rising operating cash flow will accelerate repayment. The government continues to develop and expand science parks to meet industry demand, including new sites and expansions across Taiwan.

Qualcomm has completed initial hardware validation of its high-bandwidth compute (HBC) memory architecture, which will form a key part of its next-generation Dragonfly data-center AI accelerators. The company aims to deliver a lower-cost, more energy-efficient alternative to sixth-generation high-bandwidth memory (HBM4) for AI inference workloads requiring high bandwidth and large buffers.

South Korean chip designer LX Semicon posted its first quarterly operating loss since going public in 2010, as weak demand for display chips and pricing pressure from electronics manufacturers weighed on earnings. The company also nominated a new CEO to lead its turnaround efforts.

Taiwan and the UK are deepening technology ties as supply-chain restructuring and industrial security reshape semiconductor strategy. A new bilateral arrangement covers semiconductors, space, communications, net zero, and AI standards, while cooperation could link British research strengths with Taiwan's manufacturing and testing capabilities across more of the chip lifecycle.