MediaTek has reportedly landed major orders for Google TPU products in recent years, even appearing to challenge Broadcom's position. At a recent earnings call, MediaTek also raised its 2027 ASIC market share target to 15% to 20%, and industry watchers largely credit that goal to the breadth of MediaTek's ASIC services.

Less than a week after LG Group and Nvidia signed a strategic memorandum of understanding (MOU), Madison Huang, Nvidia's senior director of product marketing for Omniverse and robotics, is reportedly preparing to visit South Korea and head directly to one of LG's key robotics R&D sites.

High-bandwidth memory (HBM), a core component in AI semiconductors, has drawn fresh scrutiny after former Intel CEO Pat Gelsinger called it "lousy" at a recent AI summit in Paris. SK Hynix, the market leader in this type of memory, also said it is not the final answer to AI memory bottlenecks, underscoring the industry's push to find a next-generation memory architecture beyond HBM.

Hygon Information posted a 66.5% increase in first-half 2026 revenue as accelerating artificial intelligence deployment and stronger demand for domestically developed computing chips lifted sales of its high-end processors.

For years, the logic of AI infrastructure has been straightforward: move more data, push more power, transmit more signals, remove more heat.

Intel has priced the largest equity raise in its history, selling 210,526,315 shares of common stock at US$95 per share to raise roughly US$19.67 billion in net proceeds, according to a prospectus supplement filed with the US Securities and Exchange Commission.

PixArt's latest results signal how shifting demand across consumer electronics and emerging sensor markets can reshape profitability for suppliers worldwide. The Taiwanese IC design company said strong sales from game consoles and other product lines lifted revenue in the second quarter of 2026, even as higher costs and a weaker product mix weighed on margins.

China's high-end AI chip market could become almost entirely domestic in 2026, with local solutions expected to take nearly 90% of sales and leave Nvidia, AMD and other overseas suppliers with about 10%.

The technical feasibility of co-packaged optics (CPO) has been demonstrated repeatedly at major industry conferences in recent years. At the 2026 OCP APAC Summit, however, Ayar Labs CEO Mark Wade shifted the focus from whether CPO works to whether it can scale commercially.