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Monday 1 June 2026

AI infrastructure hits copper limits, foundries lock down silicon photonics capacity through 2028

Generative AI is moving at a speed scaling past critical computation thresholds, initiating a shift from a "chip-centric to an interconnect-centric" architecture era. The physical limitations of legacy copper cabling have created a severe, industry-wide obstacle that is disrupting financial and operational roadmaps, prompting companies to lock down silicon photonics foundry capacity through 2028.

Monday 1 June 2026

India roundup: EMS providers face margin pressure as Anthropic steps up local hiring

India's technology ecosystem is seeing parallel expansion across AI software adoption, electronics manufacturing, and semiconductor investment. Anthropic is scaling its India leadership to capture enterprise demand, while manufacturers move into higher-margin products. At the same time, Wi-Fi 7 production and fresh chip funding highlight deepening industrial capability across the ecosystem.

Sunday 31 May 2026

Aspeed and Lattice announce partnership on programmable server management chip

Aspeed Technology and Lattice Semiconductor have formed a strategic partnership that could reshape how servers are managed in data centers worldwide. The collaboration aims to combine platform control and programmability into a single chip, a move that may help operators adapt more quickly to changing AI, cloud, and infrastructure demands.

Saturday 30 May 2026

Terafab explained: SpaceX outlines space-optimized chips and AI megafab plan in IPO filing

SpaceX's IPO prospectus details an early-stage "Terafab" initiative to build large-scale AI chip manufacturing capacity. Still, the company warns of significant execution uncertainty, unfinalized partnerships, and capital intensity risks. The plan, still in preliminary form, depends on future agreements and could face delays, cost overruns, and supply-chain constraints.

Friday 29 May 2026

Airoha deepens focus on networking and wireless edge AI

Airoha Technology is sharpening its strategy around global networking and edge AI chips, aiming to expand its customer base and strengthen its competitive moat. The MediaTek subsidiary is targeting infrastructure, audio, and positioning markets with products already shipping, in production, or advancing through development milestones that could matter to users and operators worldwide.

Friday 29 May 2026

Arm deepens ties with Taiwan chip designer QBit around edge AI and cybersecurity

Arm EVP and Chief Commercial Officer Will Abbey visited QBit Semiconductor's Taiwan headquarters on May 27, signaling deeper cooperation that could shape future chip design for edge AI, physical AI, and quantum-computing cybersecurity. The visit highlights how platform alliances are increasingly influencing next-generation computing architectures for global technology markets.

Friday 29 May 2026

MediaTek weighs price hikes, reaffirms TSMC partnership

MediaTek held its shareholders' meeting on May 29. Addressing the company's future outlook, Chairman Ming-Kai Tsai said that while the mobile phone market in 2026 has performed below expectations due to a sharp rise in memory prices, MediaTek's market share in various connectivity chips has increased significantly. He also noted that the company began generating revenue from AI data centers in 2026.

Friday 29 May 2026

CPO to become the next major growth driver, says GSEO; future volumes could rival smartphone lenses

Genius Electronic Optical (GSEO) held its shareholders meeting on May 29, with chairman Jones Chen and president Ying-Li Guo in attendance. GSEO reported standalone revenue of NT$20.89 billion (approx. US$665.7 million) in 2025, up 13% from NT$18.496 billion in 2024. Consolidated revenue reached NT$24.989 billion, increasing 8% from NT$23.187 billion in 2024. Earnings per share (EPS) came in at NT$32.84, slightly lower than the previous year's NT$38.35.

Friday 29 May 2026

From cloud to factory floor: KETI outlines four directions shaping next-gen physical AI chips

As AI moves from cloud environments into factories and physical systems, semiconductor design is being reshaped by new demands in speed, energy efficiency, and on-site learning. At a recent system-semiconductor seminar in South Korea, Seong-jun Jang, a research center director at the Korea Electronics Technology Institute (KETI), outlined four key architectural directions for future AI chips aimed at supporting industrial "physical AI."

Friday 29 May 2026

India's C2i Semiconductors tapes out AI power chip as investors back scaling of data center power technology

C2i Semiconductors has advanced its power management technology with the tape-out of a chip designed for AI infrastructure, while also securing fresh venture backing to expand development and scale production. The developments underscore growing investor interest in addressing power delivery bottlenecks in data centers, driven by accelerating AI workloads.

Friday 29 May 2026

EU seeks to spur government buying of homegrown chips

The European Commission wants governments to buy chips from EU startups as Brussels seeks to reduce the bloc's reliance on US and East Asian suppliers, Reuters reported, citing a document it has seen.

Friday 29 May 2026

Qualcomm bets on US$300 laptops as memory costs squeeze PC makers

Qualcomm Technologies is pushing its Windows-on-Arm strategy into lower-cost laptops with a new Snapdragon C platform, betting that PC makers squeezed by rising memory costs will look for alternatives to traditional x86 chips in the entry-level market.

Friday 29 May 2026

Analysis: ASIC market tightens as capacity becomes key battleground for cloud chips

Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply tighten worldwide. For readers across global tech markets, the shift means access to manufacturing capacity, not just chip design, is becoming the main determinant of who can supply the next wave of AI hardware.

Friday 29 May 2026

Malaysia's Oppstar revises AI chip deal, formalizes US$2.9 million design contract

Oppstar Bhd has restructured the delivery framework of an artificial intelligence chip development project with a Yokohama-based client, replacing an earlier tripartite arrangement with separate design services agreements and formalizing a US$2.9 million contract for its engineering scope, according to The Edge Malaysia.

Friday 29 May 2026

Morgan Stanley: Supply constraints to drive next phase of the AI boom

As the global buildout of artificial intelligence infrastructure accelerates, Taiwan's technology industry has emerged as one of the most closely watched hubs in the world. Ahead of COMPUTEX 2026, Morgan Stanley held its Asia AI Summit in Taipei for the first time, underscoring the island's central role in the global semiconductor supply chain and the AI investment cycle.

Friday 29 May 2026

DeepX targets wider NPU partnerships at Computex 2026

South Korean fabless chip-design company DeepX is using Computex 2026 to broaden partnerships around its neural processing units, or NPUs, as it pushes low-power AI chips for industrial and edge applications.

Friday 29 May 2026

SmartSens, Unisoc team up on Micro LED optical interconnects for AI computing

Chinese CMOS image sensor supplier SmartSens Technology announced on May 26 that it has entered into a strategic partnership with Chinese IC design company Unisoc to jointly develop Micro LED-based high-speed optical interconnect technology, targeting applications in AI computing clusters, smart vehicles, and industrial vision.

Thursday 28 May 2026

FuriosaAI and Broadcom partner on AI inference platform for agentic computing era

South Korean AI chip startup FuriosaAI has announced a partnership with Broadcom to develop a next-generation AI inference platform aimed at large-scale agentic AI deployments, as demand grows for infrastructure optimized for AI reasoning and high-volume inference workloads.

Thursday 28 May 2026

Huawei chip chief says post-Moore race is no longer just about nanometers

As Moore's Law nears its limits, Huawei is promoting its "Tau (τ) Law" as a post-Moore chip framework that shifts the focus from nanometer process nodes to shorter signal transmission times across electronic systems.

Thursday 28 May 2026

Apple's entry-level push puts pressure on Windows notebook makers

Apple's introduction of the MacBook Neo has intensified competition in the low-end notebook market, putting pressure on Windows-based manufacturers across both education and consumer segments, according to industry executives and analysts.

Thursday 28 May 2026

Peking University's true-3D EDA tool gives Huawei's LogicFolding chip roadmap critical design link

Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap.

Thursday 28 May 2026

Nvidia's Rubin CPX plans clouded as Groq gains bigger inference role

Nvidia's plan to launch Rubin CPX, an inference-focused graphics processing unit for its Vera Rubin platform, has become increasingly uncertain as supply-chain activity around the product appears to have stalled, according to The Elec.

Thursday 28 May 2026

Commentary: China's AI chip certification becomes new market gatekeeper

China has brought AI chips into its national security and reliability evaluation framework for the first time, turning what looks like a product certification process into something more consequential: an emerging gatekeeping system for AI computing infrastructure.

Thursday 28 May 2026

Synopsys flags mixed regional trends as China growth contrasts with weaker Western demand

Synopsys reported divergent regional performance in the second quarter, with China showing sequential growth while North America and Europe declined, as demand patterns for semiconductor design tools and simulation software remained uneven across end markets.

Thursday 28 May 2026

Huawei Tau Law series 3: Global chip experts split over China's post-Moore push

Huawei's "Tau (τ) Scaling Law," unveiled at ISCAS 2026 on May 25, has become a global semiconductor flashpoint, drawing scrutiny from financial institutions, media outlets, chip analysts, and research firms.

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