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Wednesday 30 September 2026
ASE Technology buys Singapore factory for AI chip testing expansion
ASE Technology Holding's Singapore unit has approved the purchase of a factory in Yishun Industrial Park from Dutch LED maker Lumileds Singapore for about US$68.44 million, or about NT$2.152 billion. The site is intended to support future capacity expansion.
Wednesday 30 September 2026
Jensen Huang, Lisa Su join Tsinghua University advisory board, putting AI chip leaders closer to Beijing

Nvidia founder and CEO Jensen Huang and AMD chair and CEO Lisa Su have joined the advisory board of Tsinghua University's School of Economics and Management (SEM), putting two of the global AI chip industry's most prominent executives on the Beijing-based body.

Wednesday 30 September 2026
DeepSeek brings software tools to Huawei's Ascend 950 to take on Nvidia
DeepSeek is bringing more of the software used to develop its AI models to Huawei Technologies' Ascend 950 processors, deepening cooperation as Chinese technology companies seek to reduce reliance on Nvidia's hardware and CUDA software ecosystem.
Wednesday 30 September 2026
AMD's Lisa Su reportedly revisiting South Korea in October to deepen HBM4, NPU ties
Advanced Micro Devices (AMD) CEO Lisa Su is reportedly set to visit South Korea again in October 2026, after her March 2026 trip, which formally launched next-generation AI memory cooperation with Samsung Electronics. The planned visit is expected to broaden that push, with meetings lined up with South Korean AI chip companies and government officials as AMD deepens its AI semiconductor alliance in the country.
Wednesday 30 September 2026
Broadcom-Toppan venture opens Singapore's first high-end FC-BGA substrate plant
Advanced Substrate Technologies (AST), a joint venture between Japan's Toppan Holdings and Broadcom, officially opened a manufacturing facility in Singapore on September 29, 2026, the first in the country capable of producing high-end flip chip ball grid array (FC-BGA) substrates. The approximately 95,000-square-meter plant in the Jurong Lake District is the Toppan Group's first such facility outside Japan and is targeting the start of high-value manufacturing by late 2026, the companies said.
Wednesday 30 September 2026
Meta reaches agreements with Firmus on securing AI compute in Southeast Asia
Meta reached several agreements to source AI compute capacity from Firmus, an Australian neocloud, which will lease GPU compute capacity at its AI factories in Southeast Asia. The deal is said to support Meta's AI expansion across the Asia-Pacific region, while Firmus notches another order from a major customer in the run-up to a potential public listing.
Tuesday 29 September 2026
Column: Why Micron's US$250M venture fund is about more than HBM margins—Taiwan has a stake in it
Micron unveiled the Micron Ventures Paradigm Fund, a US$250 million venture vehicle, in mid-August 2026, as the memory maker pairs more than US$25 billion in fiscal 2026 capex with a pledge to invest more than US$250 billion in the US by 2035. The fund is designed to give Micron an early look at technology shifts, position it for next-generation AI architectures, and strengthen its strategy to reduce memory-cycle volatility.
Tuesday 29 September 2026
Samsung bonus plan to lift South Korea talent race

Samsung Electronics' Device Solutions division is set to announce the calculation and payout rules for its special management performance bonus in late September, after a holiday break. The move comes as SK Hynix continues recruiting experienced talent, underscoring how pay systems and workplace conditions have become key to attracting and retaining workers at South Korea's semiconductor giants.

Tuesday 29 September 2026
GF's MIPS bets on RISC-V physical AI, expands into autos and data centers
MIPS, a GlobalFoundries (GF) unit, said it has completed its integration with the ARC unit acquired from Synopsys earlier this year and is using the move to position RISC-V for physical AI, while expanding from AIoT into automotive and data center applications. MIPS said the strategy lowers the barrier for global customers to adopt GF platforms across process technologies and has pushed GF and MIPS to become the world's second-largest processor IP provider.
Tuesday 29 September 2026
Chips make up nearly half of South Korea's September exports; China, Hong Kong account for 52% of them
Semiconductors made up nearly half of South Korea's exports in the first 20 days of September, while China and Hong Kong combined accounted for more than half of the country's chip shipments in August, underscoring the growing concentration of the latest export surge by both product and destination.
Tuesday 29 September 2026
Trump-Xi state dinner puts tech titans at the head table, spotlighting Taiwan's quiet supply chain clout

Chinese President Xi Jinping and his wife, Peng Liyuan, arrived at the White House on the evening of September 24 US time to attend a state dinner hosted by US President Donald Trump and First Lady Melania Trump.

Tuesday 29 September 2026
AMD pays US$8.2 billion for Fei-Fei Li's 3D world-modeling startup to shape future AI chips
AMD has agreed to acquire World Labs, the San Francisco AI research startup led by Fei-Fei Li, in an all-stock deal valued at about US$8.2 billion. The chipmaker says it wants the startup's model expertise to shape its future hardware, software and systems.
Monday 28 September 2026
Nvidia adds a record US$150 billion to its stock buyback
Nvidia's board has approved an extra US$150 billion for the company's share repurchase program. That raises the total still available for buybacks to US$235 billion. The company said on September 28 that it is the largest increase to a buyback authorization in history, and it expects to spend the full amount by the end of fiscal 2028.
Sunday 27 September 2026
Keysight pushes design-to-deployment standard for AI cluster validation

As AI applications expand rapidly across industries, testing and validation have become essential to moving innovation from R&D into real-world use. Gartner's latest forecast puts global AI spending at US$2.7 trillion in 2026, up 49.5%, and about US$3.6 trillion in 2027.

Sunday 27 September 2026
Beijing escalates domestic chip drive with Broadcom audits

China is intensifying its push to replace foreign technology across critical computing infrastructure, targeting high-speed networking hardware alongside foreign AI accelerators.

Friday 25 September 2026
Interview: Intel director talks physical AI, business models, and robotics' future
Physical AI is accelerating like never before. Autonomous intelligent machines can walk, run, fly, swim, and assemble car parts in under a minute. New advances in AI models and technologies like dexterous hands are also pushing the boundaries of how smart and useful humanoids can be.
Friday 25 September 2026
From ISM 1.0 to Semicon 2.0—India's chip subsidy overhaul draws early interest, raises the bar for investors
India's new semiconductor incentive regime is putting more capital at risk for manufacturers, but the first wave of investment commitments suggests lower subsidies have not stopped companies from considering fresh projects.
Thursday 24 September 2026
LG sharpens focus on data centers, robotics, chip materials

LG Group is sharpening its focus on data centers, robotics, semiconductor materials, and enterprise AI as the South Korean conglomerate refines how it allocates capital across businesses moving toward commercialization at different speeds.

Thursday 24 September 2026
Nscale's biggest customer: a Singapore unit with US$1,000 in capital, owned by ByteDance's AI brand holder
Nscale, the UK AI cloud company preparing a US listing at a reported US$35 billion valuation, got nearly three-quarters of its 2025 sales from a Singapore company. Singapore and US records reviewed by DIGITIMES show that company's parent owns the trademarks for ByteDance's AI models and products outside China.
Thursday 24 September 2026
Beijing Eswin heads for HK IPO as RISC-V growth shifts to autos, industrial chips
Beijing Eswin Computing Technology has cleared its Hong Kong Stock Exchange listing hearing, moving closer to becoming the market's first listed RISC-V-focused chip company.
Thursday 24 September 2026
Qualcomm splits flagship mobile SoCs into more tiers
Qualcomm is launching two flagship platforms in 2026—the Snapdragon 8 Elite Gen 6 and the Snapdragon 8 Elite Extreme Gen 6—signaling a new era of finer-grained flagship mobile SoC segmentation. The move has raised questions about whether pricier flagship phones are on the way.
Thursday 24 September 2026
Qualcomm pushes Snapdragon PCs further into Linux, GoogleBook as AI shifts to the device edge

Qualcomm used the second day of its Snapdragon Summit 2026 to underline a broader shift for Snapdragon-powered PCs, announcing Linux support for the Snapdragon X2 Series while highlighting Googlebook laptops powered by the Snapdragon X Elite. The moves signal growing momentum for Qualcomm's PC business across operating systems and new AI-focused form factors.

Thursday 24 September 2026
TSMC locks in 3-6% wafer out price hikes for 2027

TSMC is reportedly planning another wafer foundry price increase, with supply chain sources saying its order visibility now extends to 2030. According to the sources, the company plans to adjust wafer prices from January 2027 across different processes, with hikes of about 3-6% as tight capacity and strong AI demand keep customers in line.

Thursday 24 September 2026
Qualcomm bets on earphones as the voice gateway for personal AI
Qualcomm used its keynote on the second day of Snapdragon Summit 2026 to argue that earphones, glasses, and other wearables will shape the next phase of AI computing. For global consumers and device makers, the shift could redefine how people access assistants, services, and cloud-connected tools on the move.
Thursday 24 September 2026
Qualcomm adopts 'offset PoP' packaging to cool new flagship phone SoC
Qualcomm unveiled two flagship mobile platforms at the Snapdragon Summit 2026, including the Snapdragon 8 Elite Extreme Gen 6, which changes its packaging approach to improve heat dissipation. During a media Q&A, Qualcomm Senior Vice President and General Manager of Mobile Handsets Chris Patrick said the new package still falls under existing Package on Package (PoP) technology, but the memory is no longer stacked directly above the die and is shifted to the side to create a thermal path.