Qualcomm used the second day of its Snapdragon Summit 2026 to underline a broader shift for Snapdragon-powered PCs, announcing Linux support for the Snapdragon X2 Series while highlighting Googlebook laptops powered by the Snapdragon X Elite. The moves signal growing momentum for Qualcomm's PC business across operating systems and new AI-focused form factors.
TSMC is reportedly planning another wafer foundry price increase, with supply chain sources saying its order visibility now extends to 2030. According to the sources, the company plans to adjust wafer prices from January 2027 across different processes, with hikes of about 3-6% as tight capacity and strong AI demand keep customers in line.
Microsoft is changing how companies evaluate their generative AI investments, as the technology evolves from its beginnings as a productivity tool into deeper uses in core business workflows. In addition to token consumption and model costs, Microsoft Taiwan general manager Sean Pien points out that corporations are also examining how AI actually benefits workflows and innovation, making return-on-investment (ROI) evaluations harder to judge solely on the basis of time or labor savings.
Meta's new AI agent, Muse, has leapt to the top of app charts roughly two weeks after its release. Its popularity has helped push up chip stocks by focusing attention on the importance of CPUs for agentic AI.
DeepSeek CEO Liang Wenfeng said during a call with investors that he aims to rely on Huawei chips to train the startup's models in the future, and that a batch of training chips from Huawei are set to begin arriving at his company as early as the fourth quarter of 2026.
MediaTek has introduced a new chip aimed at premium, ultra-portable Googlebook devices, underscoring how next-generation AI, battery life, and wireless performance could shape consumer computing worldwide. The Dimensity CX C10 Max is built for thinner systems, faster multitasking, and privacy-focused Gemini features in markets beyond Asia.
More technical details on 2026 mobile systems on a chip (SoCs) from major vendors are emerging, and the biggest changes in chips such as Apple's A20 Pro and MediaTek's Dimensity 9600 Pro are clearly concentrated in the neural processing unit (NPU). Qualcomm also published a technical article on NPU development on September 10, saying its next-generation NPU will expand shared memory capacity to improve access efficiency and speed for model data, helping mobile AI maintain fast response times.
