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Monday 1 June 2026

Eight PC brands commit to Nvidia-MediaTek RTX Spark as AI agent laptops take shape for fall

Nvidia CEO Jensen Huang unveiled RTX Spark at Computex Taipei this morning, announcing a new superchip designed to power a generation of Windows laptops and compact desktops built around on-device AI agents. The announcement, made at GTC Taipei on May 31, comes as Computex 2026 opens in Taipei with AI hardware dominating the show floor. Devices from major PC manufacturers are expected to ship this fall.

Monday 1 June 2026

Nvidia expects AI boom to keep supply tight beyond 2027

Nvidia chief executive Jensen Huang said the artificial intelligence industry is entering a rapid growth phase that could keep revenue rising sharply into 2027, while supply-chain bottlenecks are likely to persist as demand continues to outstrip capacity.

Monday 1 June 2026

AI spillover puts CPUs and ASICs on Computex stage

Computex 2026 will open under the theme "AI Together," with attention shifting beyond Nvidia's training-focused hardware to AI computing, robotics, smart mobility, and next-generation technologies. The event is likely to highlight a wider set of suppliers as AI moves deeper into inference, edge applications, and custom chips.

Monday 1 June 2026

US moves to block Nvidia AI chips from reaching Chinese firms overseas

The US Commerce Department has moved to close a potential export-control loophole that may have allowed Chinese technology companies to obtain advanced AI chips, including Nvidia's Blackwell processors, through subsidiaries outside China, according to Reuters.

Monday 1 June 2026

Nvidia courts Korea's industrial giants ahead of Computex

Nvidia chief executive Jensen Huang's pre-Computex meetings in Taipei are drawing close attention from South Korean companies seeking a bigger role in the global AI supply chain. With demand for AI infrastructure rising, their interest reflects how the next phase of AI development could shape worldwide competition, partnerships, and technology access.

Monday 1 June 2026

MediaTek touts One MediaTek strategy, upbeat on ASIC ASPs

MediaTek held a media event ahead of Computex, with several top executives taking part as the company highlighted progress in AI data centers and its broader "One MediaTek" strategy. The event opened with Rahul Sandil, newly appointed general manager of global marketing and communications, followed by speeches from president and COO Joe Chen, corporate vice president of the data center and compute business group Vince Hu, and vice president and general manager of the auto business Mike Chang.

Monday 1 June 2026

Taiwan gains partial US Section 232 relief, seeks tariff-free semiconductor quotas

Taiwan has secured preferential treatment under US Section 232 tariffs for most exports other than semiconductors after months of negotiations with Washington, but uncertainty remains over proposed semiconductor measures. With chips accounting for the bulk of Taiwan's exports to the US, Taipei is seeking tariff-free quotas and company-specific exemptions before any new duties are imposed.

Monday 1 June 2026

Analysis: Huawei's Tau Law masks a bigger target — TSMC's node gap and Nvidia's compute moat

Huawei's Tau Law is being framed in China as a new semiconductor principle, but its strategic value may lie beyond catching TSMC in process nodes. The real question is whether Huawei can combine LogicFolding, optical interconnects, and system-level scaling to reduce China's reliance on Nvidia.

Monday 1 June 2026

MediaTek eyes AI glasses, PCs, and home servers as computing shifts beyond the cloud

MediaTek said it expects artificial intelligence (AI) to move from centralized cloud systems into consumer devices, home servers, and new products such as AI glasses. The shift could reshape global demand for chips, data privacy, and device design, as companies race to build the next wave of AI hardware.

Monday 1 June 2026

Skymizer launches HTX301 decode-first accelerator to bring large-model inference on-premises

Skymizer said it unveiled HTX301, a decode-first accelerator chip for on-premises AI inference, at COMPUTEX 2026, to shift large-model serving away from cloud GPU racks and onto single PCIe cards that enterprises can run in their own environments. The firm announced a partnership with Taiwan's Institute for Information Industry to upgrade Taiwan's AI industry from edge AI to enterprise on-prem AI, and executives framed the product as aimed at regulated, low-latency settings such as hospitals, banks, government agencies, and factories where data must remain on-site.

Monday 1 June 2026

AI infrastructure hits copper limits, foundries lock down silicon photonics capacity through 2028

Generative AI is moving at a speed scaling past critical computation thresholds, initiating a shift from a "chip-centric to an interconnect-centric" architecture era. The physical limitations of legacy copper cabling have created a severe, industry-wide obstacle that is disrupting financial and operational roadmaps, prompting companies to lock down silicon photonics foundry capacity through 2028.

Monday 1 June 2026

India roundup: EMS providers face margin pressure as Anthropic steps up local hiring

India's technology ecosystem is seeing parallel expansion across AI software adoption, electronics manufacturing, and semiconductor investment. Anthropic is scaling its India leadership to capture enterprise demand, while manufacturers move into higher-margin products. At the same time, Wi-Fi 7 production and fresh chip funding highlight deepening industrial capability across the ecosystem.

Sunday 31 May 2026

Aspeed and Lattice announce partnership on programmable server management chip

Aspeed Technology and Lattice Semiconductor have formed a strategic partnership that could reshape how servers are managed in data centers worldwide. The collaboration aims to combine platform control and programmability into a single chip, a move that may help operators adapt more quickly to changing AI, cloud, and infrastructure demands.

Saturday 30 May 2026

Terafab explained: SpaceX outlines space-optimized chips and AI megafab plan in IPO filing

SpaceX's IPO prospectus details an early-stage "Terafab" initiative to build large-scale AI chip manufacturing capacity. Still, the company warns of significant execution uncertainty, unfinalized partnerships, and capital intensity risks. The plan, still in preliminary form, depends on future agreements and could face delays, cost overruns, and supply-chain constraints.

Friday 29 May 2026

Airoha deepens focus on networking and wireless edge AI

Airoha Technology is sharpening its strategy around global networking and edge AI chips, aiming to expand its customer base and strengthen its competitive moat. The MediaTek subsidiary is targeting infrastructure, audio, and positioning markets with products already shipping, in production, or advancing through development milestones that could matter to users and operators worldwide.

Friday 29 May 2026

Arm deepens ties with Taiwan chip designer QBit around edge AI and cybersecurity

Arm EVP and Chief Commercial Officer Will Abbey visited QBit Semiconductor's Taiwan headquarters on May 27, signaling deeper cooperation that could shape future chip design for edge AI, physical AI, and quantum-computing cybersecurity. The visit highlights how platform alliances are increasingly influencing next-generation computing architectures for global technology markets.

Friday 29 May 2026

MediaTek weighs price hikes, reaffirms TSMC partnership

MediaTek held its shareholders' meeting on May 29. Addressing the company's future outlook, Chairman Ming-Kai Tsai said that while the mobile phone market in 2026 has performed below expectations due to a sharp rise in memory prices, MediaTek's market share in various connectivity chips has increased significantly. He also noted that the company began generating revenue from AI data centers in 2026.

Friday 29 May 2026

CPO to become the next major growth driver, says GSEO; future volumes could rival smartphone lenses

Genius Electronic Optical (GSEO) held its shareholders meeting on May 29, with chairman Jones Chen and president Ying-Li Guo in attendance. GSEO reported standalone revenue of NT$20.89 billion (approx. US$665.7 million) in 2025, up 13% from NT$18.496 billion in 2024. Consolidated revenue reached NT$24.989 billion, increasing 8% from NT$23.187 billion in 2024. Earnings per share (EPS) came in at NT$32.84, slightly lower than the previous year's NT$38.35.

Friday 29 May 2026

From cloud to factory floor: KETI outlines four directions shaping next-gen physical AI chips

As AI moves from cloud environments into factories and physical systems, semiconductor design is being reshaped by new demands in speed, energy efficiency, and on-site learning. At a recent system-semiconductor seminar in South Korea, Seong-jun Jang, a research center director at the Korea Electronics Technology Institute (KETI), outlined four key architectural directions for future AI chips aimed at supporting industrial "physical AI."

Friday 29 May 2026

India's C2i Semiconductors tapes out AI power chip as investors back scaling of data center power technology

C2i Semiconductors has advanced its power management technology with the tape-out of a chip designed for AI infrastructure, while also securing fresh venture backing to expand development and scale production. The developments underscore growing investor interest in addressing power delivery bottlenecks in data centers, driven by accelerating AI workloads.

Friday 29 May 2026

EU seeks to spur government buying of homegrown chips

The European Commission wants governments to buy chips from EU startups as Brussels seeks to reduce the bloc's reliance on US and East Asian suppliers, Reuters reported, citing a document it has seen.

Friday 29 May 2026

Qualcomm bets on US$300 laptops as memory costs squeeze PC makers

Qualcomm Technologies is pushing its Windows-on-Arm strategy into lower-cost laptops with a new Snapdragon C platform, betting that PC makers squeezed by rising memory costs will look for alternatives to traditional x86 chips in the entry-level market.

Friday 29 May 2026

Analysis: ASIC market tightens as capacity becomes key battleground for cloud chips

Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply tighten worldwide. For readers across global tech markets, the shift means access to manufacturing capacity, not just chip design, is becoming the main determinant of who can supply the next wave of AI hardware.

Friday 29 May 2026

Malaysia's Oppstar revises AI chip deal, formalizes US$2.9 million design contract

Oppstar Bhd has restructured the delivery framework of an artificial intelligence chip development project with a Yokohama-based client, replacing an earlier tripartite arrangement with separate design services agreements and formalizing a US$2.9 million contract for its engineering scope, according to The Edge Malaysia.

Friday 29 May 2026

Morgan Stanley: Supply constraints to drive next phase of the AI boom

As the global buildout of artificial intelligence infrastructure accelerates, Taiwan's technology industry has emerged as one of the most closely watched hubs in the world. Ahead of COMPUTEX 2026, Morgan Stanley held its Asia AI Summit in Taipei for the first time, underscoring the island's central role in the global semiconductor supply chain and the AI investment cycle.

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