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    PentaPro Materials: the new entrant in TSMC's supply chain with NT$3 billion second plant expansion
    12h 29min ago
    Why TSMC is giving old fabs billion-dollar makeovers
    12h 29min ago
    BMW China leads 2026 EV price war with significant discounts
    12h 29min ago
    DRAM prices surge spark speculative stockpiling as demand continue to rise
    12h 29min ago
    China's energy storage price war threatens AI infrastructure safety
    12h 29min ago
    Samsung dethroned: TCL seize CES spotlight
    12h 29min ago
    NEWS TAGGED IC DESIGN, DISTRIBUTION
    Tuesday 6 January 2026
    Nvidia showcases end-to-end AI stack from deskside supercomputers to autonomous driving
    At CES 2026, Nvidia unveiled a suite of AI innovations spanning data center, enterprise, robotics, and autonomous vehicles. Highlights include the Rubin six-chip AI platform, DGX...
    Tuesday 6 January 2026
    CES 2026: Qualcomm unveils Snapdragon X2 Plus platform to power next-generation Copilot+ PCs

    Qualcomm unveiled the Snapdragon X2 Plus platform at CES 2026, expanding its Snapdragon X Series lineup for Windows 11 Copilot+ PCs....

    Tuesday 6 January 2026
    Nvidia at CES: Alpamayo, Rubin, and the rise of reasoning AI
    On January 5, Nvidia CEO Jensen Huang opened the company's CES keynote in Las Vegas by welcoming the live and global audience, wishing attendees a Happy New Year, and setting expectations...
    Monday 5 January 2026
    Weekly news roundup: TSMC widens 2 nm edge as South Korea boosts chip spending; Huawei eyes memory bottlenecks
    These are the most-read DIGITIMES Asia stories in the week of Dec 29 - Jan 4.
    Monday 5 January 2026
    Taiwan fortifies silicon shield with 2026 push to set global chip agenda
    As AI server and semiconductor companies look set to close out a profitable 2025, recent Chinese military encirclement exercises and live-fire drills around Taiwan have once again...
    Monday 5 January 2026
    TSMC's CoWoS outsourcing to ASE and Amkor challenges Samsung
    As its most advanced packaging lines are operating at full capacity, TSMC has transferred part of its advanced packaging orders to outsourced semiconductor assembly and test (OSAT)...
    Monday 5 January 2026
    Trump orders divestment of EMCORE chip assets, tightening US scrutiny of foreign semiconductor deals
    US President Donald Trump has ordered the divestment of certain semiconductor assets of EMCORE Corporation following a national security review that identified risks linked to foreign...
    Monday 5 January 2026
    India roundup: OSAT players claim legacy packaging price parity

    Indian OSAT players aim for price competitiveness on par with Malaysian rivals, as L&T Semiconductor...

    Monday 5 January 2026
    Taiwan IC design industry faces intensifying G2 pressures in 2026
    Taiwan's integrated circuit (IC) design sector faces intensified challenges as 2026 begins that may push its global revenue ranking to third place, largely due to competitive pressures...
    Saturday 3 January 2026
    Analysis: Chip boom squeezes device makers as surging component costs threaten margins
    The global semiconductor market is projected to reach US$1 trillion as early as 2026, significantly ahead of previous industry forecasts targeting 2030. The World Semiconductor Trade...
    Friday 2 January 2026
    South Korea's semiconductor bill risks weakening competitiveness as rivals roll out cash subsidies
    South Korea's ruling and opposition parties have reached a preliminary consensus on the Semiconductor Special Act, though its passage may be delayed until 2026, and the law faces...
    Friday 2 January 2026
    Budget delays risk sidelining Taiwan in 2026 silicon photonics and CPO takeoff, NSTC warns
    Taiwan's National Science and Technology Council (NSTC) has raised concerns that prolonged delays in budget approvals could cause Taiwan to miss the critical 2026 global takeoff for...
    Friday 2 January 2026
    CES 2026 set to highlight AI innovations with major tech companies unveiling new products
    The Consumer Technology Association (CTA) has announced that artificial intelligence (AI) will be the central theme of CES 2026, under the banner "AI Forward." The event will emphasize...
    Friday 2 January 2026
    China sees 2025 chip IPO surge as domestic AI and tech ambitions accelerate
    Chinese semiconductor companies are returning to the initial public offering (IPO, including additional and rights offering) market in force, raising funds that are critical for the...
    Thursday 1 January 2026
    Samsung reportedly explores side-by-side chip packaging for next-gen Exynos

    Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its Exynos processors,...

    2/118 pages
    Research Report Database
    BIZ FOCUS
    Jan 6, 16:39
    MSI Unveils Full Lineup of AI Products at CES 2026
    Tuesday 6 January 2026
    SK hynix Showcases Next Generation AI Memory Innovation at CES 2026
    Tuesday 6 January 2026
    Mobilint Brings Award-Winning Edge AI Hardware to the Global Stage at CES 2026
    Tuesday 6 January 2026
    Skyted's Sound Bubble at CES 2026
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