The technological rivalry between China and the US escalated further on September 12, when the US Department of Commerce's Bureau of Industry and Security (BIS) added 23 Chinese companies,...
On September 11, Chinese media reported that Huawei's semiconductor unit HiSilicon has entered a new leadership phase. Eric Xu resigned as chairman, with Jeffrey Gao assuming the...
At the recent Hot Chips 2025 conference, Nvidia detailed its latest GB10 system-on-chip (SoC) architecture, representing a miniaturized application of the Blackwell GPU architecture...
Taiwan-based passive components manufacturer Yageo Corporation announced on September 11 that it plans to acquire up to 28.5% of power IC designer Anpec Electronics via a public tender...
At the OktoberTech Taipei event held on September 11, 2025, Infineon Technologies AG unveiled key developments in its automotive electronics portfolio, with CEO Jochen Hanebeck and...
At a SEMICON Taiwan forum on Quantum computing, IBM Japan CTO and Vice President Norishige Morimoto detailed how AI's growing complexity—estimated to have surged by more than...
Manish Mehta, vice president of Marketing and Operations for Broadcom's Optical Systems Division, delivered a keynote address at SEMICON Taiwan 2025 focused on heterogeneous integration...
China is accelerating its drive for homegrown AI semiconductors. JPMorgan forecasts Huawei will ship 600,000–650,000 AI chips in 2025, while Cambricon Technologies is on track...
Huawei Technologies senior executive Eric Xu has stepped down as the legal representative and chairman of subsidiary HiSilicon Semiconductor. He will be succeeded by Jeffrey Gao.
Intel has confirmed to South Korean media that it will proceed with its semiconductor glass substrate commercialization plans as originally outlined, dismissing reports of potential...
Since the beginning of 2025, despite disruptions from US President Donald Trump's trade protectionism, the AI wave has driven American cloud service providers (CSPs) to continuously...
In 2024, the Taiwanese government announced the launch of a 10-year NT$300 billion (approx. US$9.89 billion) Taiwan Chip-based Industrial Innovation Program (Taiwan CbI), marking...
The 26th China International Optoelectronic Exposition (CIOE 2025) opened in Shenzhen on September 10, attracting over 3,800 global companies across communications, optics, lasers,...
In a keynote speech delivered at the SEMICON Taiwan 2025, NXP CEO Kurt Sievers stressed that AI has ushered the semiconductor industry into a period of exponential expansion. Addressing...
