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NEWS TAGGED IC DESIGN, DISTRIBUTION
Friday 17 April 2026
Tesla AI5 reaches tape-out; SK Hynix memory spotted in early sample

Tesla has reached the tape-out stage for its next-generation AI chip, AI5, marking a milestone in its in-house semiconductor development...

Friday 17 April 2026
Interview: Semidynamics expands from SoC to rack-level solutions, targeting memory-intensive AI inference
Spain-based AI chip startup Semidynamics has recently seen a wave of positive developments. Its first chip, fabricated on TSMC's 3nm process, has successfully completed tape-out, and...
Friday 17 April 2026
SK Hynix invests in RISC-V chip designer Semidynamics

SK Hynix has invested in Semidynamics, a Spanish fabless chip designer, as part of a push to expand its presence in the artificial intelligence...

Friday 17 April 2026
EU Chips Act 2.0 expected by late May, with stronger domestic focus
Since early 2025, the European Union (EU) has been actively shaping its next-generation semiconductor strategy. Recent reports indicate that the EU Chips Act 2.0 is set to be officially...
Thursday 16 April 2026
MCU demand pull-in lifts first-quarter sales, inflation risk clouds outlook

The traditional off-season for consumer electronics showed unexpected strength in the first quarter of 2026, with microcontroller (MCU)...

Thursday 16 April 2026
China's homegrown GPU startups gain ground in global AI chip race

China's domestic GPU industry is entering a new phase of rapid commercialization, as leading startups post strong revenue growth while...

Thursday 16 April 2026
Tesla AI5 tape-out signals dual sourcing with Samsung, TSMC

Tesla has finalized the design of its next-generation AI5 chip, marking a milestone in its in-house semiconductor development. CEO Elon...

Thursday 16 April 2026
Cadence, Nvidia deepen AI partnership to reshape chip design and robotics
Cadence Design Systems and Nvidia have expanded their partnership to accelerate the use of artificial intelligence (AI) across semiconductor design, robotics, and large-scale AI infrastructure,...
Thursday 16 April 2026
Samsung System LSI talent exits raise risks for Exynos and image sensors
A wave of departures among core engineers at Samsung Electronics' System LSI division is raising concerns over a potential leadership gap at its non-memory chip unit, particularly...
Thursday 16 April 2026
TSMC says Applied Materials and JSR form top-tier chipmaking team
Japanese materials giant JSR has established an advanced planarization process solution joint research center in Taiwan, with JSR representative director and CEO Hank Hori personally...
Thursday 16 April 2026
Analysis: Nvidia links RISC-V to NVLink with SiFive investment

Agentic AI is pulling CPUs back to the center of the AI stack, turning them into a renewed battleground for chipmakers. After Arm moved...

Thursday 16 April 2026
Rockchip reports record results, scales AIoT chips across industries
China-based chip designer Fuzhou Rockchip Electronics posted record full-year 2025 results, with AIoT processors driving growth across automotive, robotics, and industrial markets.
Thursday 16 April 2026
SkyeChip IPO signals Malaysia's push into high-value chip design
Malaysia-based semiconductor design firm SkyeChip has appointed Maybank Investment Bank and CIMB Investment Bank as underwriters for its planned Main Market listing, according to a...
Thursday 16 April 2026
Spain aims to boost chip design, photonics, and quantum tech influence
The Spanish ICT Association (AMETIC) has been actively promoting Spain's standing in the domestic technology industry. Albert Anglarill, director of AMETIC's Catalonia office, said...
Wednesday 15 April 2026
ASML posts solid 1Q26 as AI-driven demand lifts outlook
ASML reported first-quarter 2026 results in line with expectations, signaling continued momentum from surging artificial intelligence (AI) demand and strengthening semiconductor industry...