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NEWS TAGGED IC DESIGN, DISTRIBUTION
Friday 21 August 2026
Cambricon advances sixth-gen AI silicon, broadens support for DeepSeek, Qwen and GLM
Cambricon Technologies chairman and president Chen Tian-shi said the company's sixth-generation AI processor and instruction set remain under development, with the next-generation...
Friday 21 August 2026
Xiaomi's Xring O3 nears launch on TSMC N3P, testing its in-house chip strategy
Xiaomi is preparing to take its in-house smartphone silicon further upmarket, with founder and chairman Lei Jun confirming that a new generation of its Xring chip is on the...
Friday 21 August 2026
TIER IV and Renesas team up on open AI-native computing platform for autonomous vehicles
A new collaboration between TIER IV and Renesas could shape how self-driving and software-defined vehicles are built worldwide, as automakers seek more flexible platforms for AI-driven...
Friday 21 August 2026
Charts: TSMC's share of Taiwan chip manufacturing revenue falls to 81.8% as memory makers scale up
Foundry leader Taiwan Semiconductor Manufacturing Company (TSMC) grew 37% year to date — and still lost four percentage points of the sub-sector's revenue share, because the...
Friday 21 August 2026
DIGITIMES's Colley Hwang warns Taiwan AI data center capacity lags South Korea

The inference economy has arrived, and Taiwan's tech industry must transition from the "knowledge economy" to the "inference economy,"...

Thursday 20 August 2026
Taiwan chip designers see automotive demand rebound
Major European and US companies and Taiwan-based IC design firms are seeing a notable recovery in automotive chip demand so far in 2026, spanning smart cockpit platforms, advanced...
Thursday 20 August 2026
Asia Optical eyes Metalens, CPO, and AI cooling opportunities; digital camera shipments to surpass 4 million units
Asia Optical delivered strong second-quarter financial results while accelerating its strategic expansion across optical technologies. Key growth drivers include Metalens and Co-Packaged...
Thursday 20 August 2026
Fudan Microelectronics profit jumps 339%, FPGA localisation gains traction
Shanghai Fudan Microelectronics Group reported a sharp first-half earnings increase in 2026, helped by stronger semiconductor demand, rising sales across its chip portfolio and investment...
Thursday 20 August 2026
Robotics leaders present future of physical AI, but also deployment challenges
Tech leaders converged at the 2026 International Robotic Forum on August 19, where they laid out their visions for the evolution and next stages of physical AI. They noted that a robot's...
Thursday 20 August 2026
WPG sees chip supply remaining tight into 2027, plans NT$15 billion convertible bond sale

Taiwan-based IC distributor WPG Holdings expects AI-driven semiconductor demand to remain strong into 2027, with capacity tight across...

Thursday 20 August 2026
Sunplus expects automotive orders to rise in 3Q26 as memory costs threaten demand

Taiwanese IC design house Sunplus Technology expects its automotive orders to strengthen further in the third quarter of 2026, but warned...

Thursday 20 August 2026
AI chip strategies echo StarCraft factions as memory bottleneck reshapes the race

The global semiconductor ecosystem is facing an unprecedented shortage of memory chips, with hardware growth increasingly constrained...

Wednesday 19 August 2026
Nvidia H200 chips reach China as imports remain limited
ByteDance and Tencent have each received about 10,000 Nvidia H200 processors in mainland China in recent weeks, the Financial Times reported, marking the clearest sign yet...
Wednesday 19 August 2026
Taiwan seeks shift from drone supplier to strategic partner in entering US market
Industry figures and analysts from Taiwan and the United States gathered on August 19 at an international unmanned aerial vehicles (UAVs) forum to discuss how Taiwan can move beyond...
Wednesday 19 August 2026
Socionext taps Intel 18A-P process for high-performance compute chiplet development
Custom System-on-Chip (SoC) designer Socionext has selected Intel Foundry's 18A-P process node to build its next-generation custom silicon, aiming to accelerate workloads across data...