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NEWS TAGGED IC DESIGN, DISTRIBUTION
Monday 31 August 2026
Nvidia takes US$3.5 billion of MediaTek's record US$3.9 billion convertible bond
MediaTek has completed pricing on US$3.9 billion of overseas convertible bonds, more than NT$120 billion and what the company says is the largest overseas CB ever issued in Taiwan's...
Monday 31 August 2026
Marvell sees 2027 acceleration in scale-up optics
Marvell said on its fiscal second-quarter of 2027 earnings call that customers are actively planning to deploy scale-up optical solutions as early as 2027, with demand for near-package...
Monday 31 August 2026
Nvidia demand nearly doubles as supply meets only 70%
Nvidia reported second-quarter revenue for fiscal year 2027 of US$96.22 billion, a 106% year-over-year increase, driven by a 117% surge in data center revenue to US$89 billion. With...
Monday 31 August 2026
Agentrys, agentic chip design startup backed by MediaTek, raises US$24.5M in funding
Chip design company Agentrys announced last week that it raised US$24.5 million in funding from backers including MediaTek. It is one among an emerging crop of startups using agentic...
Monday 31 August 2026
MetaX posts first-half profit while China's AI GPU rivals split
MetaX posted its first half-year profit since listing, with rising GPU shipments and the mass production of its C600 accelerator strengthening its commercial position while China's...
Saturday 29 August 2026
Qualcomm's HBC play pulls Samsung and SK hynix into a new race beyond HBM
The AI infrastructure race has spent the past few years fixated on high-bandwidth memory as one of the most indispensable building blocks of accelerated compute. Yet as model sizes,...
Friday 28 August 2026
ASIC makers see CSP orders stay strong through 2028
The four major US cloud service providers (CSPs) have already rewritten their 2026 capital expenditure records, and ASIC vendors are increasingly confident that demand will remain...
Friday 28 August 2026
Apple's M6 marks a transitional step before wider 2nm adoption
Apple on August 25 unveiled the M6 and M5 Ultra chips without holding a launch event, with the M6 becoming the company's first processor built on TSMC's 2nm process and debuting in...
Friday 28 August 2026
Anthropic sets sights on custom hardware to fuel AI ambitions, reportedly eyed $7B MatX deal
In an effort to accelerate its custom silicon initiative and curb reliance on external hardware suppliers, artificial intelligence developer Anthropic held discussions to acquire AI...
Friday 28 August 2026
AI packaging race heats up: Taiwan OSATs plan US$14.6 billion capex

The AI investment cycle is spreading from leading-edge wafer fabrication into semiconductor packaging and testing, with Taiwan's largest...

Friday 28 August 2026
Huawei's Ascend 910C sold out in China, but Nvidia's H200 supply gap persists
Huawei's Ascend 910C is already sold out in China, but domestic chips still cannot fully replace Nvidia's H200s. The shortage matters beyond China because AI compute constraints, pricing,...
Friday 28 August 2026
Nvidia forms PAC to expand Washington lobbying
According to Bloomberg, Nvidia has formed a federal political action committee (PAC), expanding its Washington presence as governments debate artificial intelligence rules...
Friday 28 August 2026
Nvidia's upbeat outlook points to tighter AI supply chains ahead
Nvidia's latest earnings and forecast suggest AI demand remains far ahead of available supply, with implications for memory, power, cooling, and networking worldwide. The chipmaker's...
Friday 28 August 2026
Samsung diverges from TSMC on FOPLP: retains 415×510mm panel size, targets 2028 mass production
Samsung Electronics' packaging technology lead, Lee Hee-seok, outlined the company's advanced semiconductor packaging roadmap at Advanced Semiconductor Packaging & Chiplet Show...
Friday 28 August 2026
Exclusive: IC design faces wire bonding bottleneck in 2027
Surging AI chip demand continues to outstrip TSMC's advanced packaging capacity. At the same time, massive AI server shipments are driving up demand for CPUs, networking equipment,...