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    Alibaba’s Zhenwu V900 and Huawei’s Ascend 960 move ahead, narrowing Nvidia’s compute gap
    Sep 23, 17:49
    Qualcomm expands flagship SoC lineup to give OEMs more flexibility
    Sep 23, 17:49
    United Renewable Power plans US plant, expands overseas sales and space solar business
    Sep 23, 17:49
    Trump policies heighten US auto industry fears over Chinese EV makers
    Sep 23, 17:49
    Interview: IMAPS chairman says TSMC’s CoWoS was a key lesson in advanced packaging
    Sep 23, 17:49
    NEWS TAGGED IC DESIGN, DISTRIBUTION
    Wednesday 23 September 2026
    MediaTek, Qualcomm target Googlebook with Arm push
    Preorders have officially opened for "Googlebook," Google's new laptop category purpose-built for Gemini Intelligence. IC design powerhouses Qualcomm and MediaTek announced their entry...
    Wednesday 23 September 2026
    Ascend 950 clears higher security bar in China's latest chip assessment: who else qualified?
    China has tightened the security and reliability framework around its domestic computing stack, with the latest official evaluation placing Huawei's Ascend 950 at Level II and Kunlunxin's...
    Wednesday 23 September 2026
    Lightmatter launches an optical module that cuts AI cluster fiber in half
    US photonics company Lightmatter has launched an optical module that sends and receives data over a single strand of fiber. The company says this halves the cabling needed to connect...
    Tuesday 22 September 2026
    SiPearl delivers first homegrown server chips for Europe's exascale supercomputer
    SiPearl, a fabless company backed by the European Union and France, has delivered the first Rhea1 CPU samples to Bull for integration into Europe's JUPITER supercomputer, moving the...
    Tuesday 22 September 2026
    Meta's AI agent Muse tops app charts, driving AMD's market cap past US$1 trillion

    Meta's new AI agent, Muse, has leapt to the top of app charts roughly two weeks after its release. Its popularity has helped push up...

    Tuesday 22 September 2026
    DeepSeek bets on Huawei chips for model training as Nvidia's China sales slip

    DeepSeek CEO Liang Wenfeng said during a call with investors that he aims to rely on Huawei chips to train the startup's models in the...

    Tuesday 22 September 2026
    DEEPX targets smart glasses with low-power NPU, eyes 6G AI RAN
    South Korean AI semiconductor company DEEPX is reportedly conducting a proof of concept with a US smart glasses company to test whether its low-power neural processing unit (NPU) can...
    Tuesday 22 September 2026
    MediaTek unveils Dimensity CX C10 Max for premium Googlebook devices

    MediaTek has introduced a new chip aimed at premium, ultra-portable Googlebook devices, underscoring how next-generation AI, battery...

    Tuesday 22 September 2026
    MediaTek launches Dimensity CX brand for laptops, starting with a 3nm chip for Googlebook
    MediaTek has launched the Dimensity CX C10 Max, the first chip in a new family called Dimensity Compute Experiences (CX), and is aiming it at Googlebook laptops.
    Tuesday 22 September 2026
    AI inference demand surges as training slowdown talk fades
    Calls to slow frontier AI model training have sparked debate across the AI semiconductor industry, but executives at the AI Infra Summit in Santa Clara, California, said the real buildout...
    Monday 21 September 2026
    Rebellions chips process over 4 billion tokens a day for SK Telecom
    South Korean AI chipmaker Rebellions has expanded its neural processing units (NPUs) across four commercial SK Telecom services, with the infrastructure now processing about 14 million...
    Monday 21 September 2026
    India roundup: Semicon India 2026 puts commercial production and supplier investment in focus
    India's semiconductor push is moving from policy to production, with new government funding, supplier investments, rising deal activity and expanding equipment, materials, testing...
    Friday 18 September 2026
    Winbond cements server NOR lead with Infineon deal
    Winbond Electronics is expanding its NOR Flash footprint and has agreed to pay US$1.12 billion in cash to acquire Infineon's NOR Flash and F-RAM businesses, a move that will lift it...
    Friday 18 September 2026
    Corning to raise display glass substrate prices 15% from 4Q26
    Corning, the US glass substrate supplier, will raise prices for its yen-denominated display glass substrate products by 15% or more worldwide starting in the fourth quarter of 2026,...
    Friday 18 September 2026
    Mobile SoC battle for 2026 centers on NPUs

    More technical details on 2026 mobile systems on a chip (SoCs) from major vendors are emerging, and the biggest changes in chips such...

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    BIZ FOCUS
    Sep 23, 08:00
    The Robot in the Supply Chain
    Tuesday 22 September 2026
    Macronix Secure Memories Build Hardware Defenses for EU CRA
    Tuesday 22 September 2026
    GUC Announces 2nm 16 Gbps HBM4E IP
    Tuesday 22 September 2026
    AI Drones Advance Industrial Inspection, Suntek Unlocks New Market Opportunities
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