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Tuesday 27 January 2026
Lightmatter partners with GUC and Cadence to break AI bandwidth barriers
Lightmatter has announced parallel collaborations with Global Unichip Corp. (GUC) and Cadence to accelerate the deployment of Co-Packaged Optics (CPO) in data centers. By integrating...
Tuesday 27 January 2026
Taiwanese chipmakers eye Europe and US as visual AI market in China gets saturated
Taiwanese semiconductor companies specializing in visual AI technologies are pivoting away from the Chinese market, increasingly focusing on Europe and the US amid growing challenges...
Tuesday 27 January 2026
US shows endorsement of Taiwan industry by granting MFN status on Section 232 tariffs, Taiwan officials say
Taiwan's finance minister and central bank governor have welcomed the US promise to extend most-favored-nation treatment under Section 232 tariffs, calling it a strong endorsement...
Tuesday 27 January 2026
Chinese GPU startup Iluvatar CoreX lays out roadmap targeting Nvidia's Rubin
Chinese GPU startup Iluvatar CoreX has unveiled a multi-generation product roadmap that it says could see its fourth-generation architecture surpass Nvidia's upcoming Rubin platform...
Tuesday 27 January 2026
Apple, Qualcomm rethink heavy reliance on TSMC as costs rise

Even as TSMC retains a clear technological lead in advanced process nodes, Apple and Qualcomm are reassessing how heavily they rely...

Tuesday 27 January 2026
Microsoft's Maia 200 volumes set to jump more than tenfold from Maia 100 levels, DIGITIMES says
Microsoft introduced Maia 200 on January 27, 2026, its latest in-house AI accelerator, as part of a broader effort to optimize cloud infrastructure for inference-heavy workloads. Analysts...
Tuesday 27 January 2026
Nvidia pours US$2 billion into CoreWeave for AI infrastructure expansion
Nvidia and cloud computing firm CoreWeave have announced an expanded partnership to build more than 5 gigawatts of AI "factories" by 2030, aiming to support the rapid growth of artificial...
Tuesday 27 January 2026
Commentary: Behind the scenes of Jensen Huang's China trip
While global political and economic elites were still exchanging remarks at the World Economic Forum (WEF) in Davos, Nvidia CEO Jensen Huang exited and flew straight to Shanghai.
Tuesday 27 January 2026
Microsoft launches Maia 200 AI chip, mass production progress draws attention
Microsoft officially introduced its second-generation AI accelerator, Maia 200, on January 27, marking its continued efforts in chip development since 2019. The new chip emphasizes...
Monday 26 January 2026
Lisa Su's toughest call: scrapping AMD's server roadmap

Jodi Shelton, co-founder and CEO of the Global Semiconductor Alliance (GSA) and Shelton Group, recently launched a new podcast,

Monday 26 January 2026
HVDC 800V supply chain gains attention as cloud AI seeks better power efficiency, but entry barriers remain high
The growing emphasis on power efficiency in cloud AI computing has drawn focus to the high-voltage direct current (HVDC) 800V supply chain, presenting notable opportunities and challenges...
Monday 26 January 2026
Memory innovation demand urgent as startups and SMEs gain opportunities
The memory industry is currently facing significant demand shortfalls, bringing renewed attention to the long-developed concept of "compute-in-memory." Leading memory manufacturers...
Monday 26 January 2026
Cmsemicon enters NOR Flash with first SPI NOR chip, expands beyond MCUs
Cmsemicon Semiconductor has released its first low-power SPI NOR Flash chip series, marking the Shanghai-listed chip designer's initial entry into the non-volatile memory segment....
Monday 26 January 2026
MIPS expands RISC-V processor platform with ARC IP integration

MIPS is repositioning itself within the RISC-V ecosystem following the integration of the ARC Processor IP business acquired from Synopsys,...

Monday 26 January 2026
MIPS accelerates S8200 RISC-V NPU timeline

MIPS has accelerated the development timeline of its S8200 neural processing unit, a RISC-V–based NPU designed for real-time, low-latency...