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NEWS TAGGED IC DESIGN, DISTRIBUTION
Thursday 1 January 2026
Samsung reportedly explores side-by-side chip packaging for next-gen Exynos

Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its Exynos processors,...

Thursday 1 January 2026
AI competition moves beyond LLMs into distribution and hardware channels
As frontier AI models reach practical usability, competition is shifting from incremental improvements in model performance to a broader battle over distribution, application integration,...
Wednesday 31 December 2025
India's L&T Semiconductor to unveil partnerships in cellular IoT modules and power devices at CES
L&T Semiconductor Technologies is expected to outline a partner-led expansion into cellular IoT modules at CES, positioning India as a future manufacturing base and sourcing option...
Wednesday 31 December 2025
GigaDevice Semiconductor seeks up to HK$4.68B in Hong Kong listing

Chinese chip designer GigaDevice Semiconductor is pressing ahead with plans to list its shares in Hong Kong, seeking to raise as much...

Wednesday 31 December 2025
Samsung reportedly plans 50% HBM output surge through 2026

Samsung Electronics plans to boost its high-bandwidth memory (HBM) production capacity by approximately 50% through late 2026, according...

Wednesday 31 December 2025
Top tech topics in 2025 (2): turbulent year for end-device and downstream applications
2025 proved turbulent for downstream applications and end-user devices. Tariffs and geopolitical tensions dominated the first half, while AI gained momentum later in the year. Global...
Wednesday 31 December 2025
Nvidia in 2025: 10 defining moments that shaped the AI giant
It is difficult to imagine any company exerting greater influence on the AI industry in 2025 than Nvidia. The market closely tracks CEO Jensen Huang's every move—whether he...
Wednesday 31 December 2025
YMTC pushes for equipment localization despite elusive profitability
As China's leading 3D NAND maker, Yangtze Memory Technologies (YMTC) has recently been regarded as the most aggressive company in promoting the adoption of domestic equipment. Its...
Wednesday 31 December 2025
Taiwanese network IC designs to benefit from rising telecom restocking in 2026
Market inventory destocking in the networking supply chain is nearing its end, with telecom operators significantly increasing restocking for network infrastructure since the second...
Wednesday 31 December 2025
The chip industry in 2025: Boom, rivalry, and a fragile new order
In 2025, generative AI investments are reshaping the global semiconductor industry. Nvidia, TSMC, and their supply chains emerge as the biggest winners. But the boom brings new challenges...
Wednesday 31 December 2025
Analysis: America's new 'Manhattan Project' puts AI at the center of power

When the Manhattan Project mobilized the full weight of the American state in 1945 to unlock atomic energy, it revealed something humanity...

Wednesday 31 December 2025
ByteDance balances Nvidia, Huawei chips in China's localization squeeze

ByteDance is planning to procure a mix of Nvidia H200 accelerators and Huawei Technologies Ascend chips to meet its growing artificial...

Tuesday 30 December 2025
ARTERY Tech eyes drones, high-end MCUs before 2026 IPO

Taiwan-based microcontroller supplier ARTERY Technology is sharpening its focus on edge artificial intelligence and drone-related applications...

Tuesday 30 December 2025
Chinese GPU provider Lisuan Technology begins shipping self-developed 7G100 GPU
Chinese GPU developer Lisuan Technology has started shipping its 7G100 GPU, marking a significant step toward commercialization. Reported by Jiemian News, the GPU uses TSMC's...
Tuesday 30 December 2025
China's Univista rides domestic EDA surge to push for IPO
Univista Industrial Software Group filed for initial public offering guidance on December 26, seeking capital to support the development of domestic semiconductor design tools in...