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    Taiwanese suppliers expand China capacity with AI components in focus
    3h 37min ago
    Commentary: YMTC IPO highlights strong profits but three hurdles remain
    3h 37min ago
    Foxconn's China investment returns lead Taiwan peers on AI and HPC demand
    3h 37min ago
    Nvidia and SK Hynix diverge on CPO as 3D optics-centric design may arrive after 2030
    3h 38min ago
    Tactical drone market shifts as startups and incumbents compete and cooperate
    3h 38min ago
    NEWS TAGGED IC DESIGN, DISTRIBUTION
    Monday 24 August 2026
    Xiaomi taps TSMC to make chips for foldables, AI and autonomous driving
    Xiaomi is expanding its in-house semiconductor push from smartphones into AI acceleration and autonomous driving, unveiling three Xring processors that deepen its reliance on TSMC...
    Monday 24 August 2026
    Advanced packaging substrates hit limits; ceramic cores rise to challenge glass materials
    As hardware demands for artificial intelligence continue to surge, beyond increased size and complexity in chip packaging, advanced packaging substrates face mounting challenges: larger...
    Monday 24 August 2026
    Nvidia's strikes US$6B licensing deal with Poolside to accelerate Nemotron models
    Nvidia reportedly struck a US$6 billion deal with startup Poolside to license its technology and hire much of its staff. The technology and personnel will reportedly support the chipmaker's...
    Monday 24 August 2026
    Taiwan semiconductor materials hit golden opportunity
    Rising concerns over potential supply chain chokepoints for critical raw materials have driven the formation of the SEMI Taiwan Materials Alliance. Wei-Wang Chen, General Manager of...
    Monday 24 August 2026
    MediaTek, GUC, Alchip escalate funding war as global ASIC race demands deep capital
    Custom Application-Specific Integrated Circuit (ASIC) chips backed by hyperscalers are set for a mass-production boom starting late 2026, with next-generation projects already in full...
    Monday 24 August 2026
    AI chip roadmaps force faster changes in data-center design, Cadence says
    Rapid changes in the power and thermal requirements of AI accelerators are forcing data-center designers to incorporate chip-level information earlier in the planning process, according...
    Monday 24 August 2026
    ASE's Huang urges AI profits to fund R&D for CPO, PLP

    As chip processes move to 2nm and advanced packaging accelerates heterogeneous integration, semiconductor materials are shifting from...

    Monday 24 August 2026
    Jeilin shifts upmarket as high-end image SoCs drive margins higher
    Jeilin's move into higher-end image-processing chips is reshaping its revenue mix and boosting profitability, with implications for cameras, security devices, and drones used by customers...
    Monday 24 August 2026
    AI compute race heads toward space as MediaTek executive says 1 million H100s will be mid-tier by 2030
    Speaking at DIGITIMES' "AI on Chips: Semiconductor Industry Outlook Forum," MediaTek senior director Bor-Sung Liang said AI development is shifting from individual large language models...
    Monday 24 August 2026
    Agentic AI opens new era for humanoid robots, shipments to jump fourfold by 2030

    Humanoid robots have entered a clear new phase since agentic AI emerged in 2025, with DIGITIMES analyst Zouhao Shen saying the category...

    Monday 24 August 2026
    Research Insight: ASIC shipments projected to overtake GPU by 2027 as AI reshapes memory
    ASIC and GPU shipments will reach a "golden cross" in 2027, with ASIC shipments expected to surpass GPU shipments for the first time at 15.3 million units, DIGITIMES Intelligence analyst...
    Saturday 22 August 2026
    Interview: Arbe Robotics on why radar is needed for autonomous driving and beyond
    Autonomous driving technology is maturing, and a future in which cars entirely drive themselves is quickly approaching in the rearview mirror. Yet safety and trust remain crucial barriers...
    Friday 21 August 2026
    Cambricon advances sixth-gen AI silicon, broadens support for DeepSeek, Qwen and GLM
    Cambricon Technologies chairman and president Chen Tian-shi said the company's sixth-generation AI processor and instruction set remain under development, with the next-generation...
    Friday 21 August 2026
    Xiaomi's Xring O3 nears launch on TSMC N3P, testing its in-house chip strategy
    Xiaomi is preparing to take its in-house smartphone silicon further upmarket, with founder and chairman Lei Jun confirming that a new generation of its Xring chip is on the...
    Friday 21 August 2026
    TIER IV and Renesas team up on open AI-native computing platform for autonomous vehicles
    A new collaboration between TIER IV and Renesas could shape how self-driving and software-defined vehicles are built worldwide, as automakers seek more flexible platforms for AI-driven...
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    BIZ FOCUS
    Aug 24, 08:00
    STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
    Thursday 20 August 2026
    Corning-IRICO Trade Secret Case Enters New Phase
    Thursday 20 August 2026
    PGC Helps Startups Accelerate ASIC Development with Turnkey Services
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