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    VIS joins CoWoS chain with TSMC-backed Singapore interposer foundry
    3min ago
    Anthropic strikes massive cloud pact with Google, highlighting AI industry concentration
    27min ago
    Personal feud between Elon Musk and OpenAI cracks open in court as IPO plans loom
    41min ago
    AEM CEO says AI upends semiconductor testing
    55min ago
    NEWS TAGGED IC DESIGN, DISTRIBUTION
    Wednesday 6 May 2026
    GlobalWafers reports weaker quarter as expansion weighs on margins

    GlobalWafers said on May 4 that its first-quarter performance reflected a transitional period, as short-term cost pressures and capacity...

    Wednesday 6 May 2026
    VIS sees stronger growth in the AI boom and pricing power
    Buoyed by robust demand for artificial intelligence and the early success of price increases, Vanguard International Semiconductor Corporation (VIS) is projecting a stronger performance...
    Wednesday 6 May 2026
    GlobalWafers outlines 2026 recovery path, highlights tightening 12-inch wafer supply
    GlobalWafers expects the current semiconductor cycle to bottom in the first quarter of 2026, with both the speed and breadth of recovery exceeding prior expectations, as artificial...
    Wednesday 6 May 2026
    AMD earnings call: AI is turning CPUs back into the main event

    AMD's fiscal first-quarter 2026 earnings call was not just a victory lap for another data center beat. It was a strategic argument from...

    Wednesday 6 May 2026
    MediaTek unit Airoha targets AI networking surge with triple optical growth
    MediaTek subsidiary Airoha Technology said its first-quarter 2026 performance met expectations, driven by continued improvement in product mix and accelerating demand across its optical...
    Wednesday 6 May 2026
    RichWave sees Wi-Fi 7 growth outrunning memory price pressure
    Radio frequency (RF) front-end chip maker RichWave said on May 4 that Wi-Fi 7 momentum will remain very strong in the first quarter of 2026, even as rising memory and component costs...
    Wednesday 6 May 2026
    Analysis: The US$2.5 billion smuggling case hanging over Supermicro's US$40 billion year
    Supermicro CEO Charles Liang used the opening of his fiscal third quarter of 2026 earnings call to address a topic unrelated to revenue or margins: the DOJ indictment of former employees...
    Wednesday 6 May 2026
    TV panel prices stall as China cuts output to defend prices
    The LCD TV panel market has shifted sharply from aggressive stocking to defensive procurement as global sports-event demand fades, pre-stocking cycles for China's 618 shopping festival...
    Wednesday 6 May 2026
    AMD lifts outlook as AI demand fuels data center growth
    On May 5, AMD reported first-quarter 2026 results that exceeded expectations, supported by strong demand for artificial intelligence (AI) infrastructure, according to company data...
    Wednesday 6 May 2026
    Southeast Asia faces fab gap as chipmaking remains concentrated in China and Taiwan
    Global semiconductor sales are projected to reach US$1 trillion this year and could double to US$2 trillion by 2035, driven by rapid growth in AI data centers. But the boom is also...
    Tuesday 5 May 2026
    Tesla AI5 dual sourcing may not mean equal weight for Samsung
    Tesla CEO Elon Musk has confirmed that the company's in-house AI5 chip has completed design tape-out and entered a critical pre-production validation stage. The move has drawn renewed...
    Tuesday 5 May 2026
    South Korea eyes memory-led AI order against Nvidia
    As AI shifts from training to inference and from single-task use to multi-agent collaboration, South Korea's semiconductor industry is seeking to recast the market around memory rather...
    Tuesday 5 May 2026
    Ardentec's Longtan plant to start AI ASIC testing in 3Q26
    Ardentec's Longtan plant is set to begin taking AI ASIC wafer-probing orders in the third quarter of 2026, as the semiconductor testing provider moves to capture spillover demand from...
    Tuesday 5 May 2026
    Google's TPU push hits Nvidia's neocloud grip

    Google's effort to expand its tensor processing units (TPU) beyond its own cloud is meeting resistance from some of the AI infrastructure...

    Tuesday 5 May 2026
    Another Qualcomm exec joins Intel to lead PC and physical AI unit
    Intel has announced that it has appointed Alex Katouzian as head of its Client Computing and Physical AI Division. With this hire, Intel seeks to align its consumer PC business with...
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    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook