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NEWS TAGGED IC DESIGN, DISTRIBUTION
Tuesday 27 January 2026
Commentary: Behind the scenes of Jensen Huang's China trip
While global political and economic elites were still exchanging remarks at the World Economic Forum (WEF) in Davos, Nvidia CEO Jensen Huang exited and flew straight to Shanghai.
Tuesday 27 January 2026
Microsoft launches Maia 200 AI chip, mass production progress draws attention
Microsoft officially introduced its second-generation AI accelerator, Maia 200, on January 27, marking its continued efforts in chip development since 2019. The new chip emphasizes...
Monday 26 January 2026
Lisa Su's toughest call: scrapping AMD's server roadmap

Jodi Shelton, co-founder and CEO of the Global Semiconductor Alliance (GSA) and Shelton Group, recently launched a new podcast,

Monday 26 January 2026
HVDC 800V supply chain gains attention as cloud AI seeks better power efficiency, but entry barriers remain high
The growing emphasis on power efficiency in cloud AI computing has drawn focus to the high-voltage direct current (HVDC) 800V supply chain, presenting notable opportunities and challenges...
Monday 26 January 2026
Memory innovation demand urgent as startups and SMEs gain opportunities
The memory industry is currently facing significant demand shortfalls, bringing renewed attention to the long-developed concept of "compute-in-memory." Leading memory manufacturers...
Monday 26 January 2026
Cmsemicon enters NOR Flash with first SPI NOR chip, expands beyond MCUs
Cmsemicon Semiconductor has released its first low-power SPI NOR Flash chip series, marking the Shanghai-listed chip designer's initial entry into the non-volatile memory segment....
Monday 26 January 2026
MIPS expands RISC-V processor platform with ARC IP integration

MIPS is repositioning itself within the RISC-V ecosystem following the integration of the ARC Processor IP business acquired from Synopsys,...

Monday 26 January 2026
MIPS accelerates S8200 RISC-V NPU timeline

MIPS has accelerated the development timeline of its S8200 neural processing unit, a RISC-V–based NPU designed for real-time, low-latency...

Monday 26 January 2026
Weekly news roundup: strategy shifts, supply chain realignments, scaling limits
Below are the most-read DIGITIMES Asia stories from the week of January 19-25, 2026.
Monday 26 January 2026
India roundup: India's semiconductor ambitions face hurdles echoing SEA as local IC design sector strives to grow
With Micron's ATMP facility moving into commercial production and fresh investments from domestic players, India's semiconductor push is gaining firmer footing. However, despite its...
Sunday 25 January 2026
Nvidia's China AI chip share falls to 8% as local rivals ramp up

Tighter US export controls on advanced artificial intelligence chips are accelerating China's push to develop domestic chip technologies...

Sunday 25 January 2026
Fan motor demand drives growth for Taiwan analog chip makers
As 2026 begins, demand for fan motors remains strong. On top of continued cooling needs driven by cloud servers, new fan upgrade and increased usage requirements are emerging across...
Friday 23 January 2026
SEALSQ, Gujarat govt, and Kaynes SemiCon sign MoU to establish India's first secure post-quantum semiconductor center
SEALSQ Corp, a developer of semiconductors and post-quantum technology solutions, announced on January 21, 2026, that it has signed a non-binding Memorandum of Understanding (MoU)...
Friday 23 January 2026
ASE Group's USI merges with EugenLight to expand silicon photonics module capacity in Vietnam
ASE Group's co-packaged optics (CPO) strategy is close to complete. In addition to launching advanced packaging solutions that integrate optical engines (OE) and application-specific...
Friday 23 January 2026
India's semiconductor ambitions face hurdles echoing SEA as local IC design sector strives to grow
At the recent World Economic Forum in Davos, India's IT Minister outlined the country's efforts to boost its semiconductor industry, highlighting the emergence of 24 Indian IC design...