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NEWS TAGGED IC DESIGN, DISTRIBUTION
Thursday 24 September 2026
LG sharpens focus on data centers, robotics, chip materials

LG Group is sharpening its focus on data centers, robotics, semiconductor materials, and enterprise AI as the South Korean conglomerate...

Thursday 24 September 2026
Nscale's biggest customer: a Singapore unit with US$1,000 in capital, owned by ByteDance's AI brand holder
Nscale, the UK AI cloud company preparing a US listing at a reported US$35 billion valuation, got nearly three-quarters of its 2025 sales from a Singapore company. Singapore and US...
Thursday 24 September 2026
Beijing Eswin heads for HK IPO as RISC-V growth shifts to autos, industrial chips
Beijing Eswin Computing Technology has cleared its Hong Kong Stock Exchange listing hearing, moving closer to becoming the market's first listed RISC-V-focused chip company.
Thursday 24 September 2026
Qualcomm splits flagship mobile SoCs into more tiers
Qualcomm is launching two flagship platforms in 2026—the Snapdragon 8 Elite Gen 6 and the Snapdragon 8 Elite Extreme Gen 6—signaling a new era of finer-grained flagship...
Thursday 24 September 2026
Qualcomm pushes Snapdragon PCs further into Linux, GoogleBook as AI shifts to the device edge

Qualcomm used the second day of its Snapdragon Summit 2026 to underline a broader shift for Snapdragon-powered PCs, announcing Linux...

Thursday 24 September 2026
TSMC locks in 3-6% wafer out price hikes for 2027

TSMC is reportedly planning another wafer foundry price increase, with supply chain sources saying its order visibility now extends...

Thursday 24 September 2026
Qualcomm bets on earphones as the voice gateway for personal AI
Qualcomm used its keynote on the second day of Snapdragon Summit 2026 to argue that earphones, glasses, and other wearables will shape the next phase of AI computing. For global consumers...
Thursday 24 September 2026
Qualcomm adopts 'offset PoP' packaging to cool new flagship phone SoC
Qualcomm unveiled two flagship mobile platforms at the Snapdragon Summit 2026, including the Snapdragon 8 Elite Extreme Gen 6, which changes its packaging approach to improve heat...
Thursday 24 September 2026
Alibaba Zhenwu V900 joins Huawei Ascend 960 in race to fill Nvidia's China AI compute gap
Alibaba has formally unveiled its self-developed Zhenwu V900 AI chip at the 2026 Apsara Conference, with CEO Eddie Wu describing the T-Head Semiconductor-designed processor as "China's...
Thursday 24 September 2026
Qualcomm's PickNik deal brings robotics software to its edge AI push
MoveIt's integration with Qualcomm's Dragonwing and Arduino platforms could give robot builders a more direct route from on-device AI to motion planning and control, while also testing...
Thursday 24 September 2026
Trump-Xi pre-summit watch: H20 setbacks and Ascend gains reshape China's Nvidia calculus
Ahead of the Trump-Xi summit, the key semiconductor question is no longer simply how much Nvidia hardware Washington will allow China to buy.
Thursday 24 September 2026
Microsoft reframes AI ROI calculations, keeps in-house ASICs for internal use

Microsoft is changing how companies evaluate their generative AI investments, as the technology evolves from its beginnings as a productivity...

Wednesday 23 September 2026
MediaTek, Qualcomm target Googlebook with Arm push
Preorders have officially opened for "Googlebook," Google's new laptop category purpose-built for Gemini Intelligence. IC design powerhouses Qualcomm and MediaTek announced their entry...
Wednesday 23 September 2026
Ascend 950 clears higher security bar in China's latest chip assessment: who else qualified?
China has tightened the security and reliability framework around its domestic computing stack, with the latest official evaluation placing Huawei's Ascend 950 at Level II and Kunlunxin's...
Wednesday 23 September 2026
Lightmatter launches an optical module that cuts AI cluster fiber in half
US photonics company Lightmatter has launched an optical module that sends and receives data over a single strand of fiber. The company says this halves the cabling needed to connect...