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    Weekly news roundup: Google diversifies custom chips, TSMC share falls, SK Hynix deepens HBM co-design
    7min ago
    Half of GenAI projects stall at PoC as data gaps widen
    8min ago
    Jinpao Precision anticipates 2H26 growth from AI orders, aerospace progress
    11min ago
    AI packaging demand exposes supply-chain gaps for Taiwan materials makers
    19min ago
    India targets domestic mobile phone design capabilities with new US$7.5 billion manufacturing scheme
    22min ago
    MIT study finds AI image attribution weakens as training data grows
    29min ago
    NEWS TAGGED IC DESIGN, DISTRIBUTION
    Monday 24 August 2026
    AI compute race heads toward space as MediaTek executive says 1 million H100s will be mid-tier by 2030
    Speaking at DIGITIMES' "AI on Chips: Semiconductor Industry Outlook Forum," MediaTek senior director Bor-Sung Liang said AI development is shifting from individual large language models...
    Monday 24 August 2026
    Agentic AI opens new era for humanoid robots, shipments to jump fourfold by 2030

    Humanoid robots have entered a clear new phase since agentic AI emerged in 2025, with DIGITIMES analyst Zouhao Shen saying the category...

    Monday 24 August 2026
    Research Insight: ASIC shipments projected to overtake GPU by 2027 as AI reshapes memory
    ASIC and GPU shipments will reach a "golden cross" in 2027, with ASIC shipments expected to surpass GPU shipments for the first time at 15.3 million units, DIGITIMES Intelligence analyst...
    Saturday 22 August 2026
    Interview: Arbe Robotics on why radar is needed for autonomous driving and beyond
    Autonomous driving technology is maturing, and a future in which cars entirely drive themselves is quickly approaching in the rearview mirror. Yet safety and trust remain crucial barriers...
    Friday 21 August 2026
    Cambricon advances sixth-gen AI silicon, broadens support for DeepSeek, Qwen and GLM
    Cambricon Technologies chairman and president Chen Tian-shi said the company's sixth-generation AI processor and instruction set remain under development, with the next-generation...
    Friday 21 August 2026
    Xiaomi's Xring O3 nears launch on TSMC N3P, testing its in-house chip strategy
    Xiaomi is preparing to take its in-house smartphone silicon further upmarket, with founder and chairman Lei Jun confirming that a new generation of its Xring chip is on the...
    Friday 21 August 2026
    TIER IV and Renesas team up on open AI-native computing platform for autonomous vehicles
    A new collaboration between TIER IV and Renesas could shape how self-driving and software-defined vehicles are built worldwide, as automakers seek more flexible platforms for AI-driven...
    Friday 21 August 2026
    Charts: TSMC's share of Taiwan chip manufacturing revenue falls to 81.8% as memory makers scale up
    Foundry leader Taiwan Semiconductor Manufacturing Company (TSMC) grew 37% year to date — and still lost four percentage points of the sub-sector's revenue share, because the...
    Friday 21 August 2026
    DIGITIMES's Colley Hwang warns Taiwan AI data center capacity lags South Korea

    The inference economy has arrived, and Taiwan's tech industry must transition from the "knowledge economy" to the "inference economy,"...

    Thursday 20 August 2026
    Taiwan chip designers see automotive demand rebound
    Major European and US companies and Taiwan-based IC design firms are seeing a notable recovery in automotive chip demand so far in 2026, spanning smart cockpit platforms, advanced...
    Thursday 20 August 2026
    Asia Optical eyes Metalens, CPO, and AI cooling opportunities; digital camera shipments to surpass 4 million units
    Asia Optical delivered strong second-quarter financial results while accelerating its strategic expansion across optical technologies. Key growth drivers include Metalens and Co-Packaged...
    Thursday 20 August 2026
    Fudan Microelectronics profit jumps 339%, FPGA localisation gains traction
    Shanghai Fudan Microelectronics Group reported a sharp first-half earnings increase in 2026, helped by stronger semiconductor demand, rising sales across its chip portfolio and investment...
    Thursday 20 August 2026
    Robotics leaders present future of physical AI, but also deployment challenges
    Tech leaders converged at the 2026 International Robotic Forum on August 19, where they laid out their visions for the evolution and next stages of physical AI. They noted that a robot's...
    Thursday 20 August 2026
    WPG sees chip supply remaining tight into 2027, plans NT$15 billion convertible bond sale

    Taiwan-based IC distributor WPG Holdings expects AI-driven semiconductor demand to remain strong into 2027, with capacity tight across...

    Thursday 20 August 2026
    Sunplus expects automotive orders to rise in 3Q26 as memory costs threaten demand

    Taiwanese IC design house Sunplus Technology expects its automotive orders to strengthen further in the third quarter of 2026, but warned...

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    BIZ FOCUS
    Aug 20, 11:00
    Corning-IRICO Trade Secret Case Enters New Phase
    Thursday 20 August 2026
    PGC Helps Startups Accelerate ASIC Development with Turnkey Services
    Thursday 20 August 2026
    Chroma's Proprietary ASIC Technology Reshapes the Semiconductor Test Landscape
    Thursday 20 August 2026
    Henkel Launches LOCTITE ABLESTIK CDF900 Series Conductive Die Attach Film
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