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NEWS TAGGED IC DESIGN, DISTRIBUTION
Wednesday 1 July 2026
AI chip startup Rebellions' acquisition of SqueezeBits signals push beyond hardware

South Korean AI chip designer Rebellions said on June 30 that it is acquiring AI inference optimization company SqueezeBits, as part...

Wednesday 1 July 2026
India Semiconductor Mission 2.0 reportedly clears Finance Ministry hurdle as govt highlights first-phase progress

India's proposed second phase of the India Semiconductor Mission (ISM 2.0) has reportedly taken a key step forward, clearing the Finance...

Wednesday 1 July 2026
SK Hynix talent hunt targets HBM's next frontiers while drawing Samsung employees' attention

SK Hynix's latest senior hiring drive has reignited debate in South Korea's semiconductor industry, with the move seen as more than...

Tuesday 30 June 2026
IC design firms brace for uncertain peak season as prices rise
The 2026 peak season for IC design firms remains unclear, with global readers likely to feel the effects through pricier smartphones, PCs, and other devices. Supply-chain costs are...
Tuesday 30 June 2026
Expected MCU price hike drives early 1H26 pull-ins

Microcontroller customers are accelerating shipments into the first half of 2026 as higher production costs ripple through the supply...

Tuesday 30 June 2026
Arm says it tops 50% share in hyperscale cloud as x86 grip slips

Arm Holdings says its chip architecture has crossed the 50% threshold in the hyperscale cloud market, a milestone in a segment long...

Monday 29 June 2026
Baidu subsidiary Kunlunxin seeks US$50B IPO valuation, asks investors to buy its chips

Kunlunxin, the semiconductor subsidiary of Chinese search engine giant Baidu, is targeting a US$50 billion valuation for its Hong Kong...

Monday 29 June 2026
BYD's 4nm smart-driving chip signals deeper EV supply-chain integration

BYD plans to install its first in-house smart-driving chip in a Denza production model in 2027, marking a key step in the Chinese automaker's...

Monday 29 June 2026
Weekly news roundup: South Korea takes physical AI push from policy to practice; Europe aggressively pursues non-red supply chains
Below are the most-read DIGITIMES Asia stories from the week of June 22-28, 2026:
Monday 29 June 2026
Onsemi's Synaptics acquisition intensifies competition for physical AI leadership
Onsemi's acquisition of Synaptics underscores how global chipmakers are racing to build broader edge AI platforms, with implications that could ripple through data centers, industrial...
Monday 29 June 2026
Qualcomm stirs AI data center competition with CPUs, ASICs, and accelerators
Qualcomm officially unveiled its Dragonfly data center platform at this week's annual investor day, laying out a four-pronged push into cloud AI that spans SerDes, PAM4 DSP, and other...
Sunday 28 June 2026
2nm advanced process waste surges 13x, Techzone targets semiconductor ESG waste treatment market
As advanced semiconductor processes rapidly transition from 28nm to 3nm and 2nm nodes, more frequent chemical cleaning procedures are driving an increase in demand for liquid chemical...
Saturday 27 June 2026
Apple's reported 1.4nm roadmap signals prolonged race for advanced-node capacity
Apple is reportedly considering adopting 1.4nm process technology for its flagship smartphone SoCs as early as 2028, implying that flagship chips built on the 2nm generation could...
Saturday 27 June 2026
MediaTek frames orbit compute and NTN as next strategic R&D priorities
MediaTek hosted MARC Workshop 2026 on June 24 through the MediaTek Advanced Research Center (MARC), recognizing the year's university-industry collaboration outcomes while outlining...
Friday 26 June 2026
Qualcomm's Dragonfly push highlights shift from mobile chips toward cloud AI
Qualcomm used its Investor Day to formally launch Dragonfly, a new data center product line aimed at cloud AI, and set out an ambitious revenue path that would shrink its dependence...