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NEWS TAGGED IC DESIGN, DISTRIBUTION
Wednesday 7 October 2026
Low-cost terahertz SoC takes shape as Taiwan advances next-generation communications
As the global communications industry moves toward the 6G era around 2030, front-end modules supporting frequency ranges such as D-band at 130-150GHz and W-band at 77-95GHz have become...
Wednesday 7 October 2026
Semicon 2.0 widens focus beyond fabs: Dassault Systèmes pitches virtual twins to India's chipmakers
Dassault Systèmes is pitching its virtual twin software as the link between India's chip design base and the factories and packaging plants now being built under the country's...
Wednesday 7 October 2026
Rapidus adds Malaysian chip designers to its semiconductor network
Japan's Rapidus is widening its semiconductor push with help from four Malaysian IC design firms, a move that could strengthen chip-development support for customers worldwide. The...
Wednesday 7 October 2026
Marvell raises 2028 revenue outlook to US$20 billion as AI connectivity expands
Marvell Technology is betting that the next phase of AI infrastructure growth will require substantially more networking and optical connectivity, raising its fiscal 2028 revenue outlook...
Tuesday 6 October 2026
Cerebras' stock slide stops after Sam Altman calls it 'close partner'
Cerebras' stock rebounded by 9% after OpenAI CEO Sam Altman gave reassurance that the two companies are close partners days after a report cast doubt on their relationship, causing...
Tuesday 6 October 2026
Taiwan bets on SiPh, CPO to tackle AI data center power bottlenecks
Taiwan's National Science and Technology Council (NSTC) has launched two research programs targeting silicon photonics (SiPh) and next-generation AI data center power systems, seeking...
Tuesday 6 October 2026
Apple, Qualcomm renew patent deal, iPhone modem shift deepens
Qualcomm announced on September 24 that it has renewed its global patent licensing agreement with Apple, with the new contract set to take effect on April 1, 2027. The terms and value...
Tuesday 6 October 2026
Skyworks closes Qorvo deal, forming US RF and analog powerhouse
Skyworks Solutions (Nasdaq: SWKS) has completed its combination with Qorvo, creating a US-based supplier of high-performance radio frequency (RF), power management, and analog and...
Tuesday 6 October 2026
Qualcomm takes Arm to trial again, with billions in royalties at stake
Qualcomm and Arm opened a five-day trial in US federal court in Delaware on October 5, with Qualcomm seeking to stop paying Arm royalties for up to five years, a remedy potentially...
Tuesday 6 October 2026
Qualcomm says Huawei patent deal not tied to LogicFolding, rejects net-payer claims
Correction, Oct. 6, 2026: An earlier version of this story, citing Bloomberg, reported that Qualcomm had agreed to license patents related to Huawei's LogicFolding...
Tuesday 6 October 2026
MIPS deepens RISC-V ties with China despite US-China tech tensions
Despite intense technology competition between the US and China, cooperation between the two sides on the open-standard RISC-V architecture continues to deepen, with US intellectual...
Tuesday 6 October 2026
Samsung ramps Exynos 2700 wafer production as second-gen 2nm rollout advances
Samsung Electronics has reportedly begun front-end wafer mass production of its next-generation Exynos 2700 mobile application processor, with production volume planned at more than...
Monday 5 October 2026
Kyushu's chip expo expands as Japan adds a chip design focus
Japan's Kyushu Semiconductor Industry Exhibition, known as K-Semi, grew 36% at this year's edition in Fukuoka, held from September 30 to October 1, 2026, as chip makers expanded their...
Monday 5 October 2026
Taiwan teams accelerate 2D semiconductor transfer with published research in Nature
Researchers in Taiwan are intensifying efforts to turn 2D semiconductor materials from basic science into practical applications, with a series of studies published in Nature...
Monday 5 October 2026
Huawei counters chip-node limits with Ascend, SuperPoD and τ law
Huawei is increasingly framing its semiconductor strategy around a simple constraint: if advanced process nodes remain limited, more performance must come from architecture, interconnect...