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NEWS TAGGED IC DESIGN, DISTRIBUTION
Monday 26 January 2026
MIPS expands RISC-V processor platform with ARC IP integration

MIPS is repositioning itself within the RISC-V ecosystem following the integration of the ARC Processor IP business acquired from Synopsys,...

Monday 26 January 2026
MIPS accelerates S8200 RISC-V NPU timeline

MIPS has accelerated the development timeline of its S8200 neural processing unit, a RISC-V–based NPU designed for real-time, low-latency...

Monday 26 January 2026
Weekly news roundup: strategy shifts, supply chain realignments, scaling limits
Below are the most-read DIGITIMES Asia stories from the week of January 19-25, 2026.
Monday 26 January 2026
India roundup: India's semiconductor ambitions face hurdles echoing SEA as local IC design sector strives to grow
With Micron's ATMP facility moving into commercial production and fresh investments from domestic players, India's semiconductor push is gaining firmer footing. However, despite its...
Sunday 25 January 2026
Nvidia's China AI chip share falls to 8% as local rivals ramp up

Tighter US export controls on advanced artificial intelligence chips are accelerating China's push to develop domestic chip technologies...

Sunday 25 January 2026
Fan motor demand drives growth for Taiwan analog chip makers
As 2026 begins, demand for fan motors remains strong. On top of continued cooling needs driven by cloud servers, new fan upgrade and increased usage requirements are emerging across...
Friday 23 January 2026
SEALSQ, Gujarat govt, and Kaynes SemiCon sign MoU to establish India's first secure post-quantum semiconductor center
SEALSQ Corp, a developer of semiconductors and post-quantum technology solutions, announced on January 21, 2026, that it has signed a non-binding Memorandum of Understanding (MoU)...
Friday 23 January 2026
ASE Group's USI merges with EugenLight to expand silicon photonics module capacity in Vietnam
ASE Group's co-packaged optics (CPO) strategy is close to complete. In addition to launching advanced packaging solutions that integrate optical engines (OE) and application-specific...
Friday 23 January 2026
India's semiconductor ambitions face hurdles echoing SEA as local IC design sector strives to grow
At the recent World Economic Forum in Davos, India's IT Minister outlined the country's efforts to boost its semiconductor industry, highlighting the emergence of 24 Indian IC design...
Friday 23 January 2026
Intel’s “better than guidance” quarter comes with a catch
Intel's latest financials highlight a fragile turnaround: while AI-linked data center demand and early traction in advanced manufacturing offer strategic promise, weak margins, volatile...
Friday 23 January 2026
Lip-Bu Tan faces Intel's first real bottleneck of the AI era
Intel outlined an increasingly AI-centric roadmap across client PCs, data centers, and manufacturing. Still, executives cautioned that tight supply and early-stage foundry ramps continue...
Friday 23 January 2026
Intel slows its most ambitious node—and signals where the real battle is for now
Intel is sharpening its manufacturing strategy around yield improvement, selective capital spending, and differentiated advanced packaging, while keeping major 14A capacity investments...
Thursday 22 January 2026
GlobalWafers chair sees Taiwan's semiconductor edge, says AI is irreversible
On January 21, 2026, GlobalWafers chairwoman Doris Hsu spoke to the media about the recent US-Taiwan tariff agreement, which lowers Taiwan's reciprocal tariffs to 15% without stacking...
Thursday 22 January 2026
Cloud ASIC shipments set to surge in 2026; memory capacity remains key risk
2026 is shaping up as a breakout year for cloud application-specific integrated circuit (ASIC) shipments. Not only has Broadcom secured mass production projects with multiple major...
Thursday 22 January 2026
Google's TPU strategy said to give Inventec larger role in AI server manufacturing

Servers built around custom AI chips, known as application-specific integrated circuits (ASICs), have emerged as a focal point of the...