Semicon Taiwan 2026

Semicon Taiwan 2026 took place on September 2-4, 2026, at TaiNEX 1&2, Taipei, with the event tagline of "Transform Tomorrow".

Semicon Taiwan 2026 took place on September 2-4, 2026, at TaiNEX 1&2, Taipei, with the event tagline of "Transform Tomorrow". Pre-event forums began in August 31.

Over 100,000 industry professionals from 65 countries participated in this year's event.

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IN THE NEWS

Tuesday 1 September 2026

SK Hynix touts up to 5.15x inference gains with custom HBM

SK Hynix is pushing computation deeper into high-bandwidth memory (HBM), saying a custom HBM architecture that places compute functions...

Tuesday 1 September 2026

Samsung eyes early 2027 LPDDR5X-PIM production, touts 3.8x performance gain

Samsung Electronics is targeting mass production of its LPDDR5X processing-in-memory (PIM) solution in late 2026 or early 2027, moving the technology closer to commercialization as...

Tuesday 1 September 2026

Imec CEO: AI era pushes broader ties between chip, model and CSP players

Imec CEO Patrick Vandenameele said during a media briefing at SEMICON Taiwan 2026 that the Belgian research center is broadening its collaboration base in the AI era, extending beyond...

Tuesday 1 September 2026

ASE CEO describes AI resource squeeze as a short-term problem

AI's early-stage growth is creating a short-term squeeze on land, talent, capital, and power in Taiwan, but there is no such thing as a world that cannot do without Taiwan, ASE Technology...

Tuesday 1 September 2026

Marvell CTO: power and density bottlenecks are driving CPO adoption in AI data centers

Speaking at the Silicon Photonics Global Summit ahead of Semicon Taiwan 2026, Marvell Technology CTO Radha Nagarajan highlighted that the core focus for upgrading connectivity in the...

Tuesday 1 September 2026

Samsung Electro-Mechanics takes glass substrates to Semicon Taiwan

As AI packages grow larger, the next substrate battleground is rapidly extending from traditional organic materials to glass. Samsung Electro-Mechanics (SEMCO) will make its first...

Tuesday 1 September 2026

ASML says High NA EUV has reached its first high-volume logic product

ASML told a SEMICON Taiwan audience that its High NA EUV platform has been used for a high-volume logic product for the first time, a threshold the company frames as the point at which...

Tuesday 1 September 2026

SEMI lifts 2028 wafer fab equipment forecast to US$220 billion

SEMI has raised its forecast for global wafer fab equipment (WFE) sales in 2028 to US$220 billion, up from about US$200 billion projected in July, as stronger investment in advanced...

Tuesday 1 September 2026

Imec maps chip scaling to 2040, says AI's next gains need full-stack integration

Imec has extended its advanced semiconductor roadmap into the early 2040s, arguing that sustained AI scaling will depend on closer integration across logic, memory, interconnects and...

Tuesday 1 September 2026

Cisco: CPO is ready for mass deployment amid surging AI data-center demand

For global cloud operators and network vendors, Cisco said co-packaged optics (CPO) is moving from lab promise to commercial necessity as AI data centers strain power budgets and bandwidth...

Tuesday 1 September 2026

Semicon Taiwan 2026 to spotlight AI-driven semiconductor supply chain shifts

Semicon Taiwan 2026 is set to open soon as Semiconductor Equipment and Materials International said AI is pushing a new wave of technology upgrades across the global chip industry...

Monday 31 August 2026

TSMC tackles the AI I/O wall with two COUPE bandwidth paths and deeper heterogeneous integration

TSMC is sharpening its silicon photonics (SiPh) roadmap to address the widening gap between AI compute growth and chip-to-chip data movement, unveiling two bandwidth-scaling paths...

Monday 31 August 2026

TSMC sees SiPh going mainstream in 2027

Silicon photonics (SiPh) will become mainstream in 2027, with market share topping 50%, as AI scale-out drives explosive growth in optical transceiver demand, said K.C. Hsu, TSMC's...

Monday 31 August 2026

ASE: CPO scale-out demands deeper supply-chain coordination for mass production

SEMICON Taiwan 2026 kicked off its pre-show program with the Silicon Photonics Global Summit.

Monday 31 August 2026

France draws Taiwanese investment projects worth EUR7.5 billion

Taiwanese investment projects announced or under implementation in France are worth about EUR7.5 billion (approx. US$8.7 billion), according to the French Office in Taipei, led by...

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