Semicon Taiwan 2026

Semicon Taiwan 2026 took place on September 2-4, 2026, at TaiNEX 1&2, Taipei, with the event tagline of "Transform Tomorrow".

Semicon Taiwan 2026 took place on September 2-4, 2026, at TaiNEX 1&2, Taipei, with the event tagline of "Transform Tomorrow". Pre-event forums began in August 31.

Over 100,000 industry professionals from 65 countries participated in this year's event.

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IN THE NEWS

Tuesday 1 September 2026

SEMI lifts 2028 wafer fab equipment forecast to US$220 billion

SEMI has raised its forecast for global wafer fab equipment (WFE) sales in 2028 to US$220 billion, up from about US$200 billion projected in July, as stronger investment in advanced...

Tuesday 1 September 2026

Imec maps chip scaling to 2040, says AI's next gains need full-stack integration

Imec has extended its advanced semiconductor roadmap into the early 2040s, arguing that sustained AI scaling will depend on closer integration across logic, memory, interconnects and...

Tuesday 1 September 2026

Cisco: CPO is ready for mass deployment amid surging AI data-center demand

For global cloud operators and network vendors, Cisco said co-packaged optics (CPO) is moving from lab promise to commercial necessity as AI data centers strain power budgets and bandwidth...

Tuesday 1 September 2026

Semicon Taiwan 2026 to spotlight AI-driven semiconductor supply chain shifts

Semicon Taiwan 2026 is set to open soon as Semiconductor Equipment and Materials International said AI is pushing a new wave of technology upgrades across the global chip industry...

Monday 31 August 2026

TSMC tackles the AI I/O wall with two COUPE bandwidth paths and deeper heterogeneous integration

TSMC is sharpening its silicon photonics (SiPh) roadmap to address the widening gap between AI compute growth and chip-to-chip data movement, unveiling two bandwidth-scaling paths...

Monday 31 August 2026

TSMC sees SiPh going mainstream in 2027

Silicon photonics (SiPh) will become mainstream in 2027, with market share topping 50%, as AI scale-out drives explosive growth in optical transceiver demand, said K.C. Hsu, TSMC's...

Monday 31 August 2026

ASE: CPO scale-out demands deeper supply-chain coordination for mass production

SEMICON Taiwan 2026 kicked off its pre-show program with the Silicon Photonics Global Summit.

Monday 31 August 2026

France draws Taiwanese investment projects worth EUR7.5 billion

Taiwanese investment projects announced or under implementation in France are worth about EUR7.5 billion (approx. US$8.7 billion), according to the French Office in Taipei, led by...

Monday 31 August 2026

Tescan Connects Buried Defect Localization to Nanoscale Analysis at SEMICON

Tescan will participate in SEMICON Taiwan 2026 from September 2 to 4 at Booth R8201, 4F, Taipei Nangang Exhibition Center Hall 2 (TaiNEX 2). Under the theme "Streamlined...

Thursday 27 August 2026

Samsung signals zHBF push as memory race moves beyond HBM

Samsung Electronics is signaling a push into high bandwidth flash (HBF), extending its next-generation memory ambitions beyond HBM as rivals move to establish a new NAND-based memory...

Thursday 27 August 2026

Ligitek skips 800G, targets 1.6T silicon photonics

Ligitek Electronics, a Taiwan-based LED packaging maker, has expanded in recent years into semiconductor system-in-package (SiP) and silicon photonics. The company said AI-related...

Thursday 27 August 2026

ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026

Global technology and innovation leader ASMPT will showcase its advanced packaging portfolio at SEMICON Taiwan 2026, taking place from September 2 to 4 in Taipei. At...

Wednesday 26 August 2026

Star Trade to highlight power services for chips and AI at Semicon Taiwan 2026

Star Trade, a unit of HD Renewable Energy, is set to debut at Semicon Taiwan 2026 next week, offering power trading and energy management services for semiconductor and AI infrastructure...

Monday 24 August 2026

iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026

Interested in solving microcrack issues in through-glass via (TGV) fabrication? Want to learn how to supply 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor...

Thursday 20 August 2026

Henkel Launches LOCTITE ABLESTIK CDF900 Series Conductive Die Attach Film

Henkel Adhesive Technologies today announced the launch of Loctite ABLESTIK CDF900, its next-generation conductive die attach film (cDAF) series, at SEMICON Taiwan 2026...

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