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Semicon Taiwan 2026
Semicon Taiwan 2026 took place on September 2-4, 2026, at TaiNEX 1&2, Taipei, with the event tagline of "Transform Tomorrow".
Semicon Taiwan 2026 took place on September 2-4, 2026, at TaiNEX 1&2, Taipei, with the event tagline of "Transform Tomorrow". Pre-event forums began in August 31.

Over 100,000 industry professionals from 65 countries participated in this year's event.

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IN THE NEWS
Wednesday 2 September 2026
World Diamond Technology accelerates mass production of 300 mm diamond wafers

As AI, high-performance computing (HPC), and advanced packaging continue to move toward higher levels of power integration, chip power consumption is rising rapidly....

Wednesday 2 September 2026
Take Control of Your Process: Onto Innovation at SEMICON Taiwan 2026

This year's SEMICON Taiwan will be packed with discussions about artificial intelligence and the on-wafer challenges it's creating, where the advanced node and emerging...

Wednesday 2 September 2026
DAS Introduces ALCEA for Integrated NOx Treatment in Semiconductor Fabs

DAS Environmental Expert GmbH today announced the launch of ALCEA, a new secondary abatement solution for nitrogen oxide (NOx) emissions in semiconductor manufacturing...

Wednesday 2 September 2026
SiliconAuto Expands into Physical AI at SEMICON Taiwan 2026

At SEMICON Taiwan 2026 Booth T9116, SiliconAuto will showcase automotive-grade silicon solutions for Physical AI, developed through collaboration across Taiwan's world-leading...

Wednesday 2 September 2026
Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates

Interested in knowing how to solve the microcrack problem in through-glass via (TGV) fabrication? Interested in knowing how to supply 1,000 Watts, 1 Volt and 1,000 Amperes...

Wednesday 2 September 2026
Keywave Technology innovative radar sensors spark a smart sensing revolution

Keywave Technology is a fabless semiconductor company founded in December 2022 that specializes in radio frequency (RF) integrated circuit (IC) design and advanced radar...

Wednesday 2 September 2026
Manz Asia Broadens ECD Platform for Mass Panel-Level Packaging

Rapid evolution of High-Performance Computing (HPC) and artificial intelligence chips for Hyperscalers and tech giants continue pushing large sized silicon demands. As...

Wednesday 2 September 2026
Global quantum industry accelerates as Taiwan eyes Asia hub
As quantum commercialization gathers pace worldwide, Taiwan is linking up with multiple countries to push for an Asia hub for quantum technology, industrial applications, international...
Tuesday 1 September 2026
SK Hynix touts up to 5.15x inference gains with custom HBM

SK Hynix is pushing computation deeper into high-bandwidth memory (HBM), saying a custom HBM architecture that places compute functions...

Tuesday 1 September 2026
Samsung eyes early 2027 LPDDR5X-PIM production, touts 3.8x performance gain
Samsung Electronics is targeting mass production of its LPDDR5X processing-in-memory (PIM) solution in late 2026 or early 2027, moving the technology closer to commercialization as...
Tuesday 1 September 2026
Imec CEO: AI era pushes broader ties between chip, model and CSP players
Imec CEO Patrick Vandenameele said during a media briefing at SEMICON Taiwan 2026 that the Belgian research center is broadening its collaboration base in the AI era, extending beyond...
Tuesday 1 September 2026
ASE CEO describes AI resource squeeze as a short-term problem
AI's early-stage growth is creating a short-term squeeze on land, talent, capital, and power in Taiwan, but there is no such thing as a world that cannot do without Taiwan, ASE Technology...
Tuesday 1 September 2026
Marvell CTO: power and density bottlenecks are driving CPO adoption in AI data centers
Speaking at the Silicon Photonics Global Summit ahead of Semicon Taiwan 2026, Marvell Technology CTO Radha Nagarajan highlighted that the core focus for upgrading connectivity in the...
Tuesday 1 September 2026
Samsung Electro-Mechanics takes glass substrates to Semicon Taiwan
As AI packages grow larger, the next substrate battleground is rapidly extending from traditional organic materials to glass. Samsung Electro-Mechanics (SEMCO) will make its first...
Tuesday 1 September 2026
ASML says High NA EUV has reached its first high-volume logic product
ASML told a SEMICON Taiwan audience that its High NA EUV platform has been used for a high-volume logic product for the first time, a threshold the company frames as the point at which...