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Semicon Taiwan 2026
Semicon Taiwan 2026 took place on September 2-4, 2026, at TaiNEX 1&2, Taipei, with the event tagline of "Transform Tomorrow".
Semicon Taiwan 2026 took place on September 2-4, 2026, at TaiNEX 1&2, Taipei, with the event tagline of "Transform Tomorrow". Pre-event forums began in August 31.

Over 100,000 industry professionals from 65 countries participated in this year's event.

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IN THE NEWS
Monday 7 September 2026
Machine builders flood SEMICON 2026 to grow local chip tools
Taiwan's machinery industry is pushing to turn its semiconductor advantage into a domestic equipment supply chain, as more than 100 member companies join SEMICON Taiwan 2026 and the...
Sunday 6 September 2026
Hiwin Mikrosystem targets SiPh inspection gear as capacity expands 20%, order visibility extends to 2Q27
Driven by the shift from copper to optical interconnects, silicon photonics (SiPh) and co-packaged optics (CPO) are moving rapidly toward mainstream adoption, fueling demand across...
Sunday 6 September 2026
I-Chiun eyes Nvidia Vera Rubin supply chain as thermal business nears half of sales
I-Chiun Precision Industry is accelerating its shift from LED lead frames into high-end thermal solutions, with thermal products now accounting for 40-45% of revenue. The company expects...
Sunday 6 September 2026
TEL sees AI-driven packaging, memory demand reshaping Taiwan strategy
Tokyo Electron's Taiwan president said AI is pushing semiconductor demand into new areas, with advanced packaging, DRAM, high-bandwidth memory, and NAND flash all gaining momentum...
Sunday 6 September 2026
Tongtai doubles semiconductor orders on AI data-center demand
Facing rapid demand expansion across the semiconductor and AI industries, Tongtai Group (TT Group) has aggressively promoted an import-substitution and localization strategy in recent...
Sunday 6 September 2026
Podcast highlights: SoIC vs CoWoS, HBM5 hybrid bonding, and EMIB-T's yield problem
In a podcast, DIGITIMES analyst Luke Lin said hybrid bonding is drawing fresh attention at SEMICON Taiwan 2026 and could become a key driver of advanced packaging capacity expansion...
Sunday 6 September 2026
Google's quantum boss says five years; his engineer says not so fast
Quantum computing has a trust problem. When a quantum machine produces an answer no ordinary computer can feasibly produce, there is no obvious way to tell whether the answer is ri...
Saturday 5 September 2026
Semicon Taiwan 2026: A windmill in the die bonder, and a Dutch bet on photonics
Dutch equipment maker ITEC used Semicon Taiwan to promote a die-bonding architecture that it says triples throughput over earlier versions of the design by removing the largest source...
Saturday 5 September 2026
Taiwan semiconductor output targets NT$8 trillion
As Semicon Taiwan kicked off at the Taipei Nangang Exhibition Center, the Ministry of Economic Affairs (MOEA) announced that, based on forecasts compiled from multiple research institutions,...
Saturday 5 September 2026
Topco targets optical comms, cooling as copper gives way
System integration remains a key hurdle as the AI chip industry pushes for higher power efficiency and faster transmission speeds, drawing intense attention to when short-reach optical...
Saturday 5 September 2026
TSMC's 3D packaging roadmap: engineering AI chips to think like the human brain
TSMC is steering the future of artificial intelligence toward high-density three-dimensional advanced packaging designed to mimic the architectural connectivity of the human brain,...
Saturday 5 September 2026
SiPh, optical lens demand ignite laser race
Silicon photonics (SiPh) is emerging as a core theme at SEMICON Taiwan 2026, and while the sector is still in an early, fast-growing stage, production-line investments are already...
Saturday 5 September 2026
Google TPU splits training, inference as CPU becomes next focus
As AI model training, inference, and AI agent workloads continue to grow, AI accelerators are increasingly being optimized for different tasks. Amin Vahdat, Google's senior vice president...
Saturday 5 September 2026
Jmem Tek's PQC security chip nears mass production
Taiwanese IC design startup Jmem Tek showcased its in-house physical unclonable function (PUF) and post-quantum cryptography (PQC) hardware security technologies at SEMICON Taiwan...
Friday 4 September 2026
Cisco targets zero engineers writing code by end-October
AI is forcing companies to rethink not only how software is built but how quickly ageing systems must be replaced, with Cisco warning that increasingly capable frontier models are...