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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Friday 19 October 2018
Flat panel makers slowing down construction of 10.5/11G fabs
China-based flat panel makers Chongqing HKC Optoelectronics Technology (HKC) and China Electronics Corporation (CEC) both reportedly have held off on their original plans to build...
Friday 19 October 2018
TSMC expects 7nm chip sales to account for 10% of 2018 revenues
Taiwan Semiconductor Manufacturing Company (TSMC) is set to tape out more than 50 chip designs with its 7nm process technology by the end of 2018, and over 100 chip designs with both...
Thursday 18 October 2018
Taiwan IC design houses to see revenues fall in October
Taiwan-based IC design houses are expected to post over 10% sequential decreases in October revenues, as shipments during the first week of the month were affected by China's National...
Thursday 18 October 2018
CIS demand from handset, automotive sectors set to boom in 2019
CMOS image sensor demand (CIS) is set to boom for application to triple-lens camera phones and automotive electronics in 2019, prompting leading CIS maker Sony to expand capacity...
Thursday 18 October 2018
Communications rise to represent largest portion of foundry sales
With tremendous growth of smartphones over the past decade, foundry sales to the communications market have soared and are now forecast to account for about 3x more than IC foundry...
Thursday 18 October 2018
Chipbond enters Huawei smartphone supply chain
Chipbond Technology has entered the supply chain for Huawei's smartphones by providing chip-on-film (COF) packaging for OLED panel driver ICs, according to industry sources.
Thursday 18 October 2018
Xilinx promoting acceleration solutions for datacenter servers in China
At its recent forum in Beijing, Xilinx introduced its FPGA-based acceleration solutions designed for artificial intelligence (AI) and data center applications. Dubbed Alveo, the acceleration...
Thursday 18 October 2018
Qualcomm extends Wi-Fi to 5G with 60GHz 802.11ay solutions
Qualcomm Technologies has announced a family of 60GHz Wi-Fi chipsets, the QCA64x8 and QCA64x1, delivering 10+ gigabit-per-second (Gbps) network speeds and wire-equivalent latency.
Thursday 18 October 2018
Samsung starts production of 7LPP with EUV
Samsung Electronics has started wafer production of its 7nm LPP with extreme ultraviolet (EUV) lithography technology, according to the company.
Thursday 18 October 2018
Wafer shipments forecast to set new highs through 2021, says SEMI
Worldwide shipments of polished and epitaxial silicon wafers are forecast to total 12.445 billion square inches in 2018, exceeding the market high set in 2017, according to SEMI....
Wednesday 17 October 2018
MediaTek to roll out 12nm Helio P70 mobile chip in October
MediaTek is expected to roll out its new Helio P70 mobile SoC built using a 12nm process technology later in October, aiming to maintain the shipment momentum of its mobile chips,...
Wednesday 17 October 2018
Flexium, Unimicron fined for environmental violations in China
Taiwan-based Flexium Interconnect and Unimicron Technology have both been fined for violating environmental regulations in Kunshan, China.
Wednesday 17 October 2018
CEATEC Japan 2018 opens
CEATEC Japan 2018 opened on October 16, with the four-day event showcasing the country's growth strategies and Society 5.0, its vision of a super-smart community of the future in...
Wednesday 17 October 2018
China recruiting engineering talent in Taiwan IC design industry
Senior engineers and executives at Taiwan-based IC design houses are being targeted by China-based firms looking to enhance their homegrown technology capability, according to industry...
Tuesday 16 October 2018
Innolux names new vice chairman, president
Innolux has appointed its president Robert Hsiao as vice chairmanship and also promoted its vice president James Yang to president, effective immediately, according to an announcement...