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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Tuesday 18 June 2019
Renesas says next-generation AI chips achieves processing performance of 8.8 TOPS/W
Renesas Electronics has announced it has developed an AI accelerator that performs CNN (convolutional neural network) processing at high speeds and low power to move towards the next...
Tuesday 18 June 2019
Nvidia brings Cuda to Arm
Nvidia has announced its support for Arm CPUs. Nvidia is making available to the Arm ecosystem its full stack of AI and HPC software - which accelerates more than 600 HPC applications...
Monday 17 June 2019
Korea flexible OLED panel production capacity to increase over 20% in 4Q19, says Digitimes Research
The combined capacity of flexible OLED panels of 6G and below processes of Samsung Display and LG Display is expected to expand 22.2% on year in the fourth quarter of 2019 thanks...
Monday 17 June 2019
Panel order visibility shortened, says AUO chairman
The persistent US-China trade dispute has not only shortened the order visibility for panel products at the moment but should also have lingering effects during the peak season in...
Monday 17 June 2019
MediaTek reiterates sales guidance for 2Q19
Mobile SoC specialist MediaTek expects its sales for the second quarter of 2019 to come within the guidance given previously of 13-21% sequential growth.
Friday 14 June 2019
Highlights of the day: Optimism for 5G development
The US ban on Huawei does not seem to have dampened the industry players' interests in 5G, with many still expecting explosive growths to come soon. Handset vendors remain as keen...
Friday 14 June 2019
Compeq remains positive about any-layer HDI PCB demand
Compeq Manufacturing remains focused on growing its business in the any-layer HDI PCB segment, despite unfavorable global trade conditions that may deter customer demand.
Friday 14 June 2019
ASMedia to finish tape-outs for PCIe 4.0 chip solutions by end-2019
Taiwan's ASMedia Technology is expected to complete tape-outs for PCIe 4.0 interface chip solutions by the end of 2019, seeking to strive for more contract design orders from AMD...
Friday 14 June 2019
U-Best Polymer to kick off hard coat film shipments for flexible OLED in 4Q 19
Taiwan-based polymer materials supplier U-Best Polymer Industry has come with clear hard coat films for flexible OLED panel applications with volume shipments likely to kick off in...
Friday 14 June 2019
X-Fab and Efabless announce Raven open-source RISC-V microcontroller
X-Fab Silicon Foundries, an analog/mixed-signal and specialty foundry, and crowd-sourcing IC platform partner Efabless, has announced the silicon availability of the Efabless RISC-V...
Friday 14 June 2019
Chip demand for 5G phones ramping up
Taiwan-based IC design houses have seen brand handset vendors slow down their pace of orders for 4G models, but start ramping up demand for new-generation 5G devices, according to...
Thursday 13 June 2019
HannStar Board conservative about 2H19
PCB maker HannStar Board, after enjoying a significant increase in orders with short lead time in the second quarter of 2019, has turned conservative about orders for the second half...
Thursday 13 June 2019
Broadcom announces Trident 4
Broadcom has announced sampling of its StrataXGS Trident 4 BCM56880 switch series, deliveringwhat it calls the industry's highest Ethernet switching performance combined with compiler-programmable...
Thursday 13 June 2019
Global fab equipment spending to rebound with 20% growth in 2020, says SEMI
Global fab equipment spending will rebound in 2020, growing 20% to US$58.4 billion after dropping 19% to US$48.4 billion in 2019, according to SEMI.
Thursday 13 June 2019
Qualcomm expanding investments in Taiwan
Qualcomm has begun implementing its commitment to expanding investments in Taiwan, enhancing its collaboration with local companies and academic organizations after reaching a settlement...