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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Monday 29 October 2018
Samsung developing FOPLP for wearable devices
Samsung Electro-Mechanics (SEMCO) under the Samsung group has been engaged in the development of fan-out panel-level packaging (FOPLP) technology for the production of application...
Friday 26 October 2018
Globalfoundries, Chengdu government realign JV strategy
Globalfoundries and the Chengdu municipality have signed an amendment to their investment and cooperation agreement. Based on market condition changes, Globalfoundries' renewed focus...
Thursday 25 October 2018
IPC makers suffering from processor supply shortfall
IPC makers are reportedly joining PC and notebook suppliers to feel the pinch of supply shortfalls of processors from Intel, especially those with super-low voltage and low power...
Thursday 25 October 2018
North America semi equipment industry billings continue to decline
The three-month average of worldwide billings of North America equipment manufacturers registered a sequential decrease for the fourth consecutive month in September 2018, reaching...
Wednesday 24 October 2018
MediaTek unveils Helio P70 bringing AI to mid-range devices
MediaTek has announced the launch of the Helio P70 system-on-chip (SoC), with an enhanced AI engine combined with CPU and GPU upgrades. The Helio P70 also comes with upgraded imaging...
Wednesday 24 October 2018
TV panel prices to drop faster in November
The current downward adjustments of TV panel prices which began in October are likely to accelerate in November amid rising supply.
Wednesday 24 October 2018
Chip shipments for all-screen smartphones start ramping up
Shipments of chip solutions for all-screen smartphones, such as TDDI solutions, optical fingerprint identification chips and touch controller chips, have started growing fast as chipmakers...
Wednesday 24 October 2018
Chipmakers advancing 5G chips rollout by one quarter
As leading brand vendors are set to roll out 5G-based smartphone models in the first half of 2019, chipmakers such as Qualcomm and MediaTek have advanced the launch schedules for...
Wednesday 24 October 2018
Qualcomm intros smaller 5G NR mmWave antenna module
Qualcomm Technologies has announced what it calls the smallest additions to its QTM052 mmWave antenna module family of fully-integrated 5G NR millimeter wave (mmWave) modules for...
Tuesday 23 October 2018
Chipmakers keen to expand 5G offerings beyond smartphones
As 5G commercialization is set to kick off in 2019, global chipmakers including Qualcomm, Intel, MediaTek and UNISOC (Spreadtrum & RDA) are looking to expand their 5G solutions...
Tuesday 23 October 2018
Arm expands DesignStart program for Linux embedded designs
Arm has expanded its DesignStart program to include the Cortex-A5 CPU, Arm's low-power and Linux-capable application processor, according to the processor IP vendor. Developers can...
Monday 22 October 2018
Flat panel makers to see impact from oversupply in 2019, says AUO chairman
Flat panel makers are expected to see their operating results vary widely in 2019 as they adopt different approaches in strategy, market and product development to address the challenge...
Monday 22 October 2018
Serious talent shortage posing challenges for China IC development
Despite China's semiconductor industry aggressively carrying out diverse development projects, increasingly serious talent shortage is casting clouds over the development, making...
Monday 22 October 2018
Consortium formed in China to rev up development of RISC-V processors
More than 50 IC designers, academic units and research bodies in China have recently established the China RISC-V Industry Consortium, seeking to develop the country's independent...
Friday 19 October 2018
Foxconn affiliate debuts on TWSE
Fitipower Integrated Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in LCD driver ICs, started trading on the mainboard of the Taiwan Stock...