Global supply chain: China market

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IN THE NEWS

Saturday 8 November 2025

WT Microelectronics sees strong 2026 growth on rising AI data center demand

WT Microelectronics expects strong momentum from AI-driven data centers to continue through 2026, citing surging global demand for computing and communications products.

Saturday 8 November 2025

Column: Quantum sensing moves closer to commercial reality

Quantum sensing, one of the three pillars of quantum technology alongside quantum computing and quantum communication, is rapidly advancing...

Saturday 8 November 2025

Anthropic bans Chinese-controlled entities from accessing Claude models

US AI startup Anthropic has enforced a new policy prohibiting Chinese-controlled entities from using its Claude series models, prompting ByteDance's Singapore-based IDE platform Trae...

Friday 7 November 2025

China temporarily halts export controls on rare earths, graphite, and other strategic materials

China's Ministry of Commerce (MOFCOM) and the General Administration of Customs announced on November 7 that they will suspend the implementation of several export control measures...

Friday 7 November 2025

Nvidia faces Washington heat over alleged Huawei ties

US lawmakers are ramping up scrutiny of China's AI and semiconductor sectors, tightening oversight from corporate ties to capital flows to reinforce Washington's edge in the global...

Friday 7 November 2025

Novatek braces for revenue dip in 2025, bets on AI ASICs to drive recovery

Novatek Microelectronics, Taiwan's top display driver IC (DDI) supplier, held its earnings call with CEO Steve Wang outlining the company's market outlook. He said the stronger New...

Friday 7 November 2025

TAITRA leads 270 firms to US auto shows for EV and smart vehicle opportunities

Amid the global trend toward automotive electrification and smartification, the Ministry of Economic Affairs (MOEA) has commissioned the Taiwan External Trade Development Council...

Friday 7 November 2025

AAEON eyes 3-5 year edge AI surge amid rising NA market challenges

As the edge AI market rapidly heats up, creating growth opportunities for the industrial PC (IPC) sector, AAEON expects demand to enter a phase of explosive growth within the next...

Friday 7 November 2025

China's Hua Hong sees profit fall over 50% on rising fab, R&D costs

Hua Hong Semiconductor, one of China's top wafer foundries, reported a steep profit drop for the first three quarters of 2025, citing higher costs from new production lines and rising...

Friday 7 November 2025

Catcher Technology enters AI server chassis market

Driven by growing demand for AI servers, Catcher Technology has joined the competitive server chassis components arena. Chairman Hung Shui-shu said the server segment is still in...

Friday 7 November 2025

SanDisk reportedly hikes NAND prices 50% as memory module makers post strong results

Memory prices have sharply rebounded in the third quarter of 2025, supported by increases in both volume and unit prices, boosting financial results for leading memory module manufacturers...

Friday 7 November 2025

Volkswagen China launches first SOC chip for L3 autonomous driving

Long seen as a global automaker struggling to yield meaningful results from its massive investments in vehicle electronics and electrification,...

Friday 7 November 2025

Cambricon hit with US$590M lawsuit from former CTO over stock buyback dispute

Chinese AI chipmaker Cambricon Technologies is facing a massive legal battle. The company's former chief technology officer, Liang Jun, has filed a lawsuit seeking CNY4.3 billion...

Friday 7 November 2025

Memory price surge amid supply tightness pressures Chinese smartphone makers

The surge in AI computing has led to a significant price increase in DRAM and NAND Flash, with major manufacturers raising prices by up to 30% in late 2025, putting cost pressure...

Friday 7 November 2025

CXMT adopts SK Hynix's MR-MUF tech to close China's HBM gap by 2026

China's DRAM maker CXMT plans to start mass production of fourth-generation high-bandwidth memory (HBM3) in 2026 using mass reflow molded underfill (MR-MUF) packaging, the same technology...

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