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Thursday 22 January 2026
Tripod Technology targets over NT$5B in 2026 capex for Vietnam, China expansion

PCB maker Tripod Technology said full-year 2025 revenue reached a record high, and it expects stable momentum heading into 2026 despite ongoing inventory adjustments among automotive customers. Strong demand from server and memory module applications is driving a steady increase in utilization rates, allowing first-quarter operations to defy traditional seasonality and remain in line with the previous quarter's revenue level.

Thursday 22 January 2026
Taiwan PCB direct shipments to the US remain limited
The US has lowered the tariff rate on Taiwan to 15%, and it will not be stacked with the most-favored-nation (MFN) tariff rate. This places Taiwan on the same baseline as Japan, South Korea, and EU countries. It is also better than the previously agreed rates of 19% and 20% for Thailand and Vietnam, respectively. Regarding semiconductor tariffs derived from Section 232, as long as the products are supplied for use by cloud service providers (CSPs), government agencies, and other such purposes, they meet the exemption conditions set by the US. This means that Taiwan's AI products exported to the US are essentially unaffected and benefit from zero-tariff preferential treatment.
Wednesday 21 January 2026
Research Insight: High-end fiberglass cloth supply tightens as server demand spotlights Nittobo

As next-generation AI server platforms enter volume deployment, supply chain constraints are extending beyond high-bandwidth memory (HBM). Bottlenecks are increasingly emerging in printed circuit boards (PCBs) and critical upstream materials, according to DIGITIMES analysis.

Wednesday 21 January 2026
AI demand boosts Unimicron and Nan Ya PCB profits in December 2025
The IC substrate industry is accelerating its recovery into a new bull cycle, driven by steady growth in AI-related application demand. At the same time, price increases are gradually taking effect, benefiting companies like Unimicron and Nan Ya PCB, which reported doubled profits for December 2025.
Wednesday 21 January 2026
Thailand emerges as ASEAN PCB hub with Zhen Ding Tech's US$2.1B investment
Thailand's Board of Investment (BOI) recently approved a major investment plan led by Zhen Ding Tech (ZDT), the world's largest printed circuit board (PCB) manufacturer, in partnership with local firm Saha Pathana Inter-Holding (SPI). The project involves approximately THB65 billion (US$2.1 billion) to establish advanced PCB production capacity, aiming to position Thailand as a key PCB manufacturing center in Southeast Asia.
Tuesday 20 January 2026
AI server watch: AI servers lift Taiwan supply chain broadly in 2025, gains center on ODM/EMS, cooling, optical
Taiwan's AI server supply chain delivered broad-based growth in 2025, fueled by surging generative AI and cloud data center spending, but the biggest gains clustered around two areas: system-level integration led by original design manufacturer (ODM)/electronics manufacturing services (EMS) manufacturers, and a set of high-power, AI-specific components—especially thermal solutions, rack hardware, and high-speed optical interconnect.
Monday 19 January 2026
SSD controllers face five challenges as NAND shortage drives sky-high prices
NAND flash prices have increased dramatically. Supply and demand are unlikely to ease this year as AI technology giants and large cloud service providers (CSPs) aggressively purchase high-capacity SSDs. At the same time, a severe shortage of fiberglass cloth has also emerged, which is expected to push SSD controller prices upward as well. The NAND shortage will be severe enough to set new record highs for market prices, potentially creating five major challenges for controller manufacturers, who must accelerate their strategies to compete in AI and enterprise server markets.
Monday 19 January 2026
Glass fiber supply crunch hits AI hardware and Apple's 2026 devices
The global AI boom is pushing electronics supply chains to their limits. While shortages of advanced chips and memory have drawn most attention, a less visible constraint is emerging: high-end electronic-grade glass fiber cloth, a core reinforcement material used in chip substrates and printed circuit boards (PCBs).
Monday 19 January 2026
Optics manufacturers strengthen ties with semiconductor firms in silicon photonics race, Asia Optical among targets
Industry speculation about collaboration between optics manufacturers and semiconductor companies to bolster their silicon photonics (SiPh) capabilities is gaining ground. Following Largan Technology chairman Enping Lin's comments during a recent earnings call, Asia Optical chairman I-Jen Lai confirmed that Asia Optical is also a potential participant in this trend.
Monday 19 January 2026
Yageo implements chip resistor price increase amid rising precious metal costs
Yageo, a major Taiwanese manufacturer of passive components, has informed customers it will raise prices on specific chip resistors (R-Chip) products starting February 1, citing escalating costs of silver, ruthenium, and palladium. The increase follows prior hikes in related components by Yageo subsidiaries KEMET and Pulse.
Monday 19 January 2026
Advantest ATE lead times remain tight as AI and memory markets expand
As demand strengthens in markets such as GPUs and high-bandwidth memory (HBM), Japan-based Advantest said orders for semiconductor automated test equipment (ATE) remain stable, with average product lead times exceeding six months. The company expects that once the newly expanded assembly capacity is fully in place in 2026, order backlogs will be further alleviated.
Monday 19 January 2026
Taiwan PCB industry gearing up for record investment driven by AI cloud computing
Taiwan's printed circuit board (PCB) industry is entering a new growth cycle fueled by a surge in cloud artificial intelligence (AI) computing orders. Manufacturers are ramping up capex sharply in 2026 to expand high-end server capacity and accelerate the transformation of AI-related products. Industry experts project total capital spending to reach unprecedented levels, led by several major firms making multi-billion-dollar investments.
Monday 19 January 2026
Taiwan polarizer firms pivot to medical, semiconductor, and niche markets amid China oversupply
Large-scale capacity expansions in China have led to severe oversupply and price erosion issues in the global polarizer industry, causing Taiwanese firms to struggle as losses mount. In response, Taiwanese polarizer makers are pivoting toward high-value products as the local industry transitions toward new ventures.
Monday 19 January 2026
Taiwan's DDI chipmakers fight for survival beyond displays

Taiwanese DDI vendors rode a post-pandemic growth wave, but demand turned increasingly uncertain in 2025. Weak consumer end markets, slowing specification upgrades, and intensifying competition from Chinese rivals have sharply raised pressure on local suppliers.

Monday 19 January 2026
Persistent shortages of advanced glass fiber cloud the AI chip outlook

Demand for AI chips is expected to remain strong in 2026, keeping the spotlight firmly on persistent shortages of high-end glass fiber cloth—an essential material in advanced circuit boards and chip packaging.

Monday 19 January 2026
Ardentec utilization rate rises through 2025 on chip testing demand from networking, automotive, and storage sectors
Semiconductor testing company Ardentec reported steady utilization growth through 2025, driven by strong chip-testing orders from the networking, automotive, and storage markets. The firm's fourth-quarter revenue reached an annual high, slightly exceeding its own guidance provided in the previous quarter.
Saturday 17 January 2026
Yageo secures full voting control of Shibaura Electronics after Tokyo delisting

Taiwan-based passive component maker Yageo said Japan's Shibaura Electronics was officially delisted from the Tokyo Stock Exchange on January 13. Following the completion of the share consolidation, Yageo now holds 100% of the voting rights in Shibaura Electronics as of January 15.

Friday 16 January 2026
TSMC predicts rising advanced process costs; consumer SoCs may struggle to keep up
At its earnings call on January 15, 2026, TSMC signaled that its capital expenditures for 2026 will increase to US$52-56 billion, far exceeding market expectations. On top of demand for new capacity buildouts, the company also emphasized during the call that development costs for each new advanced process node have risen significantly compared to the previous generation. While TSMC stressed that it will not adopt opportunistic price hikes, it will continue to insist on earning the appropriate value for its technology.
Thursday 15 January 2026
PlayNitride teams up with Brillink to build optical interconnect platform
As Micro LED moves into non-display application opportunities, PlayNitride Technologies announced a partnership with Brillink Technologies, a leader in two-dimensional array optical coupling technologies, to jointly develop a next-generation optical interconnect platform capable of meeting the needs of AI and high-performance computing (HPC). The collaboration integrates three core segments: high-efficiency Micro LED emitter arrays, ultra-high-sensitivity GeSi avalanche photodiode (APD) arrays, and two-dimensional array vertical couplers (2D-AVC). Compared with traditional active electrical cables (AEC), the platform is expected to achieve longer transmission distances, lower power consumption, and higher bandwidth density.
Thursday 15 January 2026
China's WUS to build US$300m optical-electrical PCB hub for AI systems
WUS Printed Circuit (Kunshan) Co. plans to invest up to US$300 million in a high-density optical-electrical printed circuit board (PCB) project aimed at supporting next-generation packaging and interconnect requirements for AI servers, high-performance computing (HPC), and advanced networking systems.
Wednesday 14 January 2026
Gold Circuit Electronics sees record revenue on ASIC server orders, plans Taiwan expansion
PCB manufacturer Gold Circuit Electronics (GCE) posted a record-high full-year consolidated revenue in 2025, surging more than 50% year-over-year, driven by a ramp-up in ASIC server customer orders in the second-half of 2025 that significantly boosted networking and server shipments.
Wednesday 14 January 2026
Samsung will adopt South Korea-made mask blanks to EUV process to reduce reliance on Japan
Samsung Electronics is set to introduce South Korea-made mask blanks into its extreme ultraviolet (EUV) process starting as early as the second quarter of 2026. According to ET News and The Elec, Samsung is in the final evaluation stages of its EUV mask blanks with local supplier S&S Tech and is expected to be completed by January 2026, or by February at the latest. This is the first time Samsung will use domestically produced mask blanks in its EUV process.
Wednesday 14 January 2026
HTSI gets boost from probe cards and engineering services

Hermes Testing Solutions Inc. (HTSI), a provider of semiconductor wafer testing solutions, said demand for flexible and highly customized testing equipment is increasing as advanced process nodes continue to shrink and packaging architectures become more complex.

Wednesday 14 January 2026
Realtek and Phison compete to enter Nvidia's AI supply chain as memory tech upgrades
An internal structural photo of Nvidia's Quantum-X Photonics silicon photonics (SiPh) switch revealed that its solid-state drive (SSD) controller chip was branded with the iconic Realtek crab logo. Although it usually keeps a low profile and does not comment on specific partners, this is an indication that Realtek has officially entered the market. Taiwanese IC design companies are expanding into the cloud AI domain through memory-related technologies, driving upgrades throughout the industry.
Tuesday 13 January 2026
Top 10 chart: Taiwan OSAT sector posts broad 2025 revenue gains as AI testing offsets weak consumer recovery
Taiwan's outsourced semiconductor assembly and test (OSAT) industry closed December 2025 with a pattern that investors have increasingly come to expect: revenue growth was widespread on a year-on-year basis, but performance gaps between end markets widened. Demand tied to AI servers and high-performance computing (HPC) continued to concentrate the strongest momentum in advanced testing and select advanced packaging programs, while more mature consumer-facing segments remained choppy.