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Monday 6 July 2026
Foxconn posts NT$821.8 billion June revenue as AI momentum stays strong
Hon Hai Precision Industry (Foxconn) reported consolidated revenue for June 2026 on July 5, with continued demand for AI servers and cloud networking products driving record performance. Revenue for June, the second quarter, and the first half of 2026 all reached record highs for the corresponding periods.
Monday 6 July 2026
Kingboard raises CCL prices again as AI demand tightens PCB material supply
Rising demand for AI servers and high-performance computing (HPC) continues to drive price increases across the upstream PCB materials supply chain.
Monday 6 July 2026
LandMark Optoelectronics posts record revenue in June, expands for post-2028 growth

LandMark Optoelectronics (LMOC) posted record-high single-month revenue in June 2026 and is stepping up its expansion plans to prepare for demand beyond 2028, as silicon photonics (SiPh) revenue is expected to triple in 2026. The optical communications epitaxial wafer (epi-wafer) maker said revenue rose for the eleventh consecutive month, reflecting tighter capacity and stronger data center demand.

Monday 6 July 2026
Samsung Electro-Mechanics, Sumitomo Chemical to form glass-core venture for chip substrates

Samsung Electro-Mechanics signed a final agreement on July 2 with Sumitomo Chemical's Korean subsidiary Dongwoo Fine-Chem to form a joint venture that will produce glass cores, a key material used in next-generation semiconductor package substrates, the companies said.

Sunday 5 July 2026
Applied Materials unveils integrated tools for HBM, chiplet, and 3D packaging scale-up
Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM, advanced packaging, and process control to help chipmakers boost yields and accelerate mass production. The company said the platform combines materials engineering with process integration to support high-bandwidth memory (HBM), chiplet architectures, and multi-layer 3D stacking on advanced production lines.
Saturday 4 July 2026
Machvision's June revenue hits another record due to AI demand
Machvision posted another record monthly revenue in June 2026, as surging demand for AI servers, high-performance computing (HPC), and advanced packaging continued to lift orders for the semiconductor and PCB inspection equipment maker. The company said the biggest challenge has now shifted from winning orders to managing supply chains and expanding capacity.
Saturday 4 July 2026
China's CR Micro raises power chip prices as Chinese suppliers push fresh hikes

China Resources Microelectronics (CR Micro), a Chinese power semiconductor integrated device manufacturer, has notified customers and partners that it will raise prices across its entire product lineup starting July 1, with increases beginning at 15%.

Saturday 4 July 2026
Samsung and SK Hynix seek substrate price cuts for the second half of 2026
Samsung Electronics and SK Hynix are reportedly pressing South Korean semiconductor substrate suppliers to lower prices for the second half of 2026, even as memory demand remains in a Super Cycle. According to ET News, the talks have intensified pressure across the supply chain as raw material costs stay high and substrate makers warn of margin erosion.
Saturday 4 July 2026
Thinking wins varistor orders as Japanese rival exits amid silver prices hikes

Volatile precious metal prices weighed heavily on passive component suppliers in early 2026, but the cost pressures have also created unexpected order-transfer opportunities for Taiwanese manufacturers.

Friday 3 July 2026
Infineon China pushes back after GaN products removed at Shanghai electronics show

Infineon China said on July 3 that it is pursuing legal remedies after several gallium nitride (GaN) products became the subject of a removal dispute at electronica Shanghai 2026, saying public accounts of the incident did not fully reflect the case's background or specific circumstances.

Friday 3 July 2026
Medical demand, multimedia shipments drive Sonix recovery as drone strategy gains traction
With supply chain inventory normalization largely complete, Sonix Technology (Sonix) has seen business momentum recover. The MCU supplier is benefiting from resilient demand for microcontrollers used in medical monitoring devices and steady shipments of multimedia image-processing chips, giving it better order visibility for 2026 than in previous years. Meanwhile, the company's drone business has entered niche commercial and industrial applications, providing a stepping stone toward higher-end markets.
Friday 3 July 2026
AI server PMIC demand drives spillover orders for Taiwan chip designers

Taiwanese power management IC (PMIC) design houses have been expanding into new applications and broadening their product portfolios in recent years, aiming to move beyond consumer electronics into higher-spec, more stable markets as the AI boom accelerates.

Friday 3 July 2026
Analysis: Innoscience-Infineon clash shows China's courts becoming a weapon in the global GaN race
A rare gallium nitride (GaN) patent clash dominated the opening day of electronica Shanghai 2026, after China's Innoscience accused Infineon of displaying GaN power products covered by a Chinese court injunction.
Friday 3 July 2026
Chinese power chip price hikes lift Taiwanese suppliers
Inflationary pressures are hitting the semiconductor supply chain in 2026 as Chinese power device makers raise prices, while Taiwan-based firms say their flexibility, quality, and service advantages are becoming more visible as the search for non-China supply chains gains momentum.
Friday 3 July 2026
Innoscience says Infineon removed disputed GaN products from Shanghai trade show after patent challenge
Chinese gallium nitride (GaN) chipmaker Innoscience said on July 2 via its official WeChat account that certain GaN products from Infineon Technologies displayed at electronica China 2026 were covered by an ongoing patent dispute and had already been barred from sale under a Chinese court ruling. According to Innoscience, after its representatives identified the products during the exhibition and raised objections, the disputed exhibits were removed from Infineon's booth.
Thursday 2 July 2026
Passive component suppliers regain momentum on AI server and auto demand

Taiwan's passive component suppliers are entering the second half of 2026 with stronger order momentum, as demand from AI data centers, networking equipment, power systems, and automotive electronics helps offset earlier pressure from volatile metal prices and weaker consumer electronics planning.

Thursday 2 July 2026
China power chip makers raise prices, exposing AI server squeeze on mature-node supply

China's power semiconductor makers are entering a broader price-hike cycle, as AI server demand, raw material inflation, and tight mature-node capacity force suppliers to defend margins after years of low-end price wars.

Thursday 2 July 2026
BOE, Chinese panel makers' chip push tightens the squeeze on South Korea

China's display makers, led by BOE Technology (BOE), are pushing deeper into semiconductors, with BOE advancing glass substrates, and a 12-inch wafer fab reportedly slated to begin mass production in the second half of 2026. Industry analysts say China is extending display technologies built up with strong government backing into semiconductors as the US tightens restrictions, adding pressure on South Korea's chip and panel industries.

Thursday 2 July 2026
Apple PCB suppliers press ahead with iPhone 18 buildup despite memory price shock

Despite rising concerns over memory price hikes, Apple's PCB supply chain has seen little change to the company's 2026 order pull-in schedule as of the second quarter, according to people familiar with the PCB industry.

Thursday 2 July 2026
Europe's heatwave turns air conditioners into power chip growth story

Europe's intensifying heatwave is reshaping the region's air conditioner market, driving a surge in China's air conditioner exports and lifting demand for upstream power semiconductors, power management ICs and mature-node capacity.

Thursday 2 July 2026
GIS pivots to semiconductors and optics as memory shortages hit touch demand

Touch module maker General Interface Solution Holding (GIS) said the second half of 2026 will be more challenging as global memory shortages weaken end-market demand, compounded by the planned year-end closure of Sharp subsidiary Sakai Display Products' (SDP) large-size display panel plant.

Thursday 2 July 2026
GaAs and InP price hikes hit Taiwan supply chain
Compound semiconductor epitaxy makers are raising prices again for gallium arsenide (GaAs) and indium phosphide (InP) epi wafers, as persistent raw material cost increases, supply chain shortages, and inflation continue to weigh on the industry. Taiwanese suppliers warn that output in the second half of the year remains tied to material restrictions.
Wednesday 1 July 2026
Yageo chairman takes control of Anpec board
After Yageo confirmed its stake in Taiwanese power management IC maker Anpec, attention has turned to whether the group will deepen its involvement in Anpec's operations as part of a broader consolidation strategy. Anpec previously said that, based on the current understanding between the two companies, Yageo invested because it sees Anpec's operating performance as attractive and wants exposure to the semiconductor industry. Yageo also planned to use its distribution channels to help bring products to international markets and had no intention of intervening in operations. However, Anpec's leadership change suggests the two sides have clearly agreed to deepen cooperation.
Wednesday 1 July 2026
Yageo to raise capacitor prices, extending AI cost pressure to EMS and OEM customers
Leading passive components supplier Yageo is reportedly set to raise capacitor prices across the board from July 1, according to supply chain sources. The price hikes will cover tantalum capacitors, multilayer ceramic capacitors (MLCCs), film capacitors, aluminum electrolytic capacitors, and solid capacitors, with average increases ranging from 10-20%. For the first time, the adjustment will also apply to direct customers, including EMS and OEM manufacturers.
Wednesday 1 July 2026
AI fuels OSAT pricing power as chip packaging orders fill through 2027
Cloud AI demand is reshaping the seasonal cycle of the semiconductor industry, with capacity tightness spreading from front-end manufacturing to back-end packaging and testing. Since late 2025, outsourced semiconductor assembly and test, or OSAT, capacity has tightened steadily. New capacity added in 2026 has also been filled quickly, prompting multiple IC design houses to lock in capacity and pushing order visibility beyond 2027.