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Thursday 8 January 2026
PentaPro Materials enters TSMC supply chain with NT$3 billion Taiwan expansion
PentaPro Materials Inc., a Taiwanese supplier of semiconductor process chemicals, has joined the supply chain of TSMC and plans to invest NT$3 billion (US$95 million) in a second manufacturing facility in southern Taiwan as it scales capacity for advanced logic, advanced packaging, and high-performance computing applications.
Thursday 8 January 2026
TDK targets AI smartphones and foldables, plans to launch next-gen silicon anode battery
Japanese electronic components manufacturer TDK Electronics announced that it plans to update its industry-leading silicon anode battery technology later in 2026, coinciding with Apple and other electronics makers launching new devices for the end of year shopping season. TDK has made significant progress in increasing battery capacity while maintaining slim device profiles, and its technology is currently mainly adopted by Chinese smartphone makers.
Thursday 8 January 2026
Transcom's 2026 rebound: Taiwan Dome drives counter-drone demand
Transcom is targeting a return to growth in 2026 as defense procurement picks up and demand rises for counter-drone systems and air-defense infrastructure, following a steep revenue decline last year tied to delayed military certifications and shipments.
Wednesday 7 January 2026
Zhen Ding Tech ramps 10 plants as 2026 capex tops US$1.6bn
Looking ahead to 2026, PCB industry leader Zhen Ding Tech. (ZDT) said demand remains solid across high-end applications such as AI servers, optical communications, and IC substrates, with related revenue contributions expected to scale quarter by quarter.
Tuesday 6 January 2026
CHPT 2025 revenue jumps more than 30% year-over-year to hit record high
Chunghwa Precision Test Tech (CHPT) said that although revenue in December 2025 and the fourth quarter both declined compared with the same period in 2024, overall full-year performance in 2025 still exceeded the company's original expectations. As AI continues to drive transformation and growth across the semiconductor industry, CHPT is positive that market demand will continue to expand, with 2026 revenue expected to set another new record.
Tuesday 6 January 2026
Chang Wah interview: strong lead frame growth despite precious metals shortage
Post-pandemic inventory digestion for mature semiconductor processes has come to an end. Market conditions have rebounded amid tariff-hedging and precautionary stocking, driving Taiwan's leading packaging lead frame supplier, Chang Wah Technology, to see rising demand for high-end products in the second half of 2025. The company has also accelerated capacity expansion plans across Taiwan, China, and Malaysia.
Monday 5 January 2026
Inpaq CEO Pei-Jen Chen launches resource realignment plan
Inpaq Technology, a passive components maker under the Walsin Technology Group, has launched an internal resource realignment plan. Newly appointed CEO and president Pei-Jen Chen stated that the company is emphasizing shortening time to market by integrating sites and centralizing development to build flexible capacity allocation capabilities. Inpaq intends to launch new products every month in 2026.
Monday 5 January 2026
Taiwan power chipmakers bank on AI data centers and auto orders for 2026 growth
Taiwan's power semiconductor suppliers are positioning for steady growth through 2026. The momentum comes from two fronts: artificial intelligence data centers adopting new power architectures and automotive customers adjusting sourcing after supply disruptions linked to Nexperia.
Saturday 3 January 2026
Chang Wah accelerates Asia expansion as chip packaging booms
Chang Wah Electromaterials and its affiliate Chang Wah Technology are expanding operations across Taiwan, China, and Malaysia as global chipmakers and packaging houses ramp up capacity in Asia, positioning the group's combined distribution and manufacturing model to strengthen its role in the semiconductor back-end supply chain.
Friday 2 January 2026
IC substrates and networking PCBs grow; materials and equipment face shortages
The PCB industry is making large upgrades. The largest beneficiaries of the AI boom are IC substrate makers that are part of the advanced chip packaging supply chain, such as Unimicron and Kinsus, which have gradually emerged from the oversupply bottleneck caused by large-scale post-pandemic capacity expansion. The surge in orders has spread to multiple networking and server PCB manufacturers, including Gold Circuit Electronics (CGE), Allied Circuit Co. (ACCL), and First Hi-tec, driving double-digit year-over-year growth in Taiwan's PCB manufacturing output value in 2025.
Friday 2 January 2026
Yageo adopts co-COO structure to support global expansion
Yageo, a leading Taiwanese passive components manufacturer, announced a major executive reshuffle, naming current chief financial officer (CFO) Eddie Chen and senior executive vice president Claudio Lollini as co-chief operating officers (COO) effective January 1, 2026, reporting directly to CEO David Wang. Meanwhile, deputy CFO Gavin Zhong will be promoted to CFO.
Wednesday 31 December 2025
South Korean PCB industry faces cost challenges as AI drives raw material prices up
The South Korean printed circuit board (PCB) industry is struggling as soaring gold and copper prices, up 50% and 30% respectively since early 2025, increase production costs. Despite high factory utilization due to the AI boom in semiconductors, many companies cannot raise product prices, worsening profitability.
Wednesday 31 December 2025
The chip industry in 2025: Boom, rivalry, and a fragile new order
In 2025, generative AI investments are reshaping the global semiconductor industry. Nvidia, TSMC, and their supply chains emerge as the biggest winners. But the boom brings new challenges. Rising competition in AI chips threatens a market bubble. Meanwhile, China accelerates its push for self-reliance as US export restrictions tighten. The DIGITIMES news team highlights the year's defining trends.
Wednesday 31 December 2025
Copper surge ends CCL price war between China and Taiwan
Amid rising concerns over global copper supply shortages, London Metal Exchange (LME) copper prices have surged nearly 40% since early 2025, significantly increasing cost pressures for industries such as PCB and IC packaging. As the year draws to a close, this sharp rise has forced key players in both China and Taiwan to implement price hikes.
Saturday 27 December 2025
EV slump hits Taiwan's auto PCB suppliers
Taiwan's automotive printed circuit board suppliers are facing mounting shipment pressure as global vehicle demand remains weak into early 2025, with consumers and automakers hesitating over the pace of the shift from gasoline-powered cars to electric models, according to industry sources.
Friday 26 December 2025
Semiconductor, defense drive ChenFull Precision's 2026 performance toward double-digit growth
ChenFull Precision president CM Lai stated during an earnings call on December 24 that looking ahead to 2026, strong growth momentum in both the semiconductor and defense sectors is expected. For ChenFull, semiconductor business revenue is projected to rise by 20% to 30%, while the defense business is also showing robust potential with opportunities to deliver double-digit growth. Overall gross margin is anticipated to return to around 30%.
Friday 26 December 2025
South Korean giants race to mass-produce semiconductor glass substrates in 2026
As demand for artificial intelligence (AI) semiconductors continues to surge, the market for glass substrates, which are widely regarded as a critical material for next-generation advanced packaging, is gaining momentum. South Korean companies such as Samsung Electro-Mechanics (SEMCO) and LG Innotek are gearing up to compete for leadership in this emerging segment.
Friday 26 December 2025
Honey Hope Honesty expects growing demand for high-end MLCCs driven by AI infrastructure in 2025 and 2026
Electronic component distributor Honey Hope Honesty anticipates significant growth in sales of high-end multilayer ceramic capacitors (MLCCs) fueled by rising demand from AI servers and edge AI applications. Despite potential memory shortages affecting the consumer market, the company remains optimistic about 2026 outlook.
Friday 26 December 2025
FineMat pivots to drones, chip packaging amid China's display supply chain localization
FineMat Applied Materials is retooling its business as China's push to localize its display supply chain cuts into demand for the Taiwanese company's core products, prompting new investments in drones and advanced semiconductor packaging substrates, the company said.
Tuesday 23 December 2025
Chinese chip resistor makers cut production to address oversupply; Taiwan firms remain cautious
Chinese chip resistor manufacturers have cut production by 10-60% amid oversupply, but major firms haven't, limiting recovery. Taiwanese firms expect improvements by late 2026.
Monday 22 December 2025
Protection component prices stabilize: Thinking Electronic pins 2026 growth on AI

Record-high precious metal prices upstream are tightening cost pressure across the passive components industry, but the impact on protection components has so far been contained. Thinking Electronic Industrial said silver prices have surged since 2025, yet supply-demand dynamics have limited immediate price pass-through, allowing product prices to stabilize after a prolonged period of decline.

Monday 22 December 2025
Memory supercycle exposes T-Glass constraint, tightening BT substrate supply
As the global memory industry enters a supercycle driven by structural supply shortages, BT substrates for memory chips are also tightening. Taiwan-based IC substrate makers Kinsus and Nanya PCB have secured rush orders, with customers willing to sign long-term supply agreements amid material constraints. This has sharply improved order visibility from the second half of 2025 and emerged as a key driver of Taiwanese PCB output growth in the third quarter.
Monday 22 December 2025
AP Memory sets 2026 mass production timeline for S-SiCap discrete silicon capacitors

AP Memory is expanding into AI servers and high-performance computing, with its S-SiCap roadmap delivering concrete progress. Fourth-generation discrete silicon capacitors are set to adopt embedded substrate packaging first, having already entered sample-based process validation, with phased mass production starting from 2026.

Monday 22 December 2025
Apaq Technology sees strong growth in solid capacitors driven by AI demand
Apaq Technology reported a sharp rise in demand for solid capacitors, fueled primarily by AI servers and AI PCs, during an investor briefing on December 17. General Manager ST Lin stated that existing production lines for V-Chip, CAP, and Hybrid capacitors are now operating at full capacity, contributing to record revenue and profitability in the third quarter of 2025.
Monday 22 December 2025
Rafael Micro pivots to optical links and ASICs for 2026 growth

Rafael Microelectronics is positioning optical communications and custom ASIC services as the twin pillars of its growth strategy heading into 2026, as the company accelerates its transition from a niche receiver-chip supplier into a broader high-speed signal transmission solutions provider.