In power electronics engineering, Silicon Carbide (SiC) companies are competing to achieve the absolute lowest thermal resistance (Rth), with the mindset that lower heat signature equates a superior system. However, at PCIM Europe 2026, a collaborative project between Rohm Semiconductor, Schweizer Electronic, and eMoveUs GmbH exposed a revolutionary counter-intuitive shift in design philosophy: willingly accepting a localized thermal performance deficit to ultimately achieve dominant system-level advantages.
Astera Labs expects its Scorpio switch-chip business to become its largest revenue contributor by the end of 2026, marking a shift for the cloud AI connectivity chip supplier as demand grows for scale-up infrastructure in AI clusters.
Aker Technology plans to expand capacity by 20% in 2026 as automotive demand grows and the quartz component supplier pushes further into AI servers, optical modules, and industrial control applications.
Posiflex said order visibility for the second and third quarters of 2026 remains relatively clear, though the industrial PC and POS hardware supplier is taking a cautious view of the fourth quarter as component supply, geopolitical risks, and broader market conditions remain uncertain.
BOE Technology Group's push into glass-based packaging substrates remains short of mass production, even as the Chinese display maker expands into new materials and advanced display technologies to build growth beyond conventional panels.
