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Wednesday 1 April 2026
Chart: Taiwan's chip toolmakers re-rated as AI bottlenecks trump scale
The first quarter of 2026 has marked a decisive shift in how Taiwan's semiconductor equipment sector is valued. While February's accumulated revenue rankings continue to reflect the operational momentum of the early AI upcycle, capital market performance through March suggests that investors are no longer anchored to scale alone. Instead, valuation is increasingly driven by proximity to the most constrained segments of the AI supply chain — particularly advanced packaging and testing.
Tuesday 31 March 2026
Elite Material plans multi-country expansion to reach 9.45 million CCL sheets monthly capacity by 2027
Elite Material (EMC), a leading Taiwanese copper-clad laminate (CCL) manufacturer, announced the completion of capacity expansions at its Huangshi and Zhongshan plants in China and its Penang plant in Malaysia in 2025. Over the next two years, the company will launch a new round of investments to simultaneously expand production in Taiwan, China, and Malaysia, targeting a global monthly capacity of 9.45 million sheets by the end of 2027.
Tuesday 31 March 2026
Top 10 chart: Taiwan's AI winners diverge as market corrects ahead of lagging revenue data

By late March, Taiwan's equity market is offering a more nuanced read of the AI infrastructure boom. While accumulated revenue and year-over-year growth through February continue to point to strong structural demand, recent share price movements suggest that the market has begun to recalibrate expectations. The result is a growing divergence between backward-looking financial data and forward-looking capital market signals.

Tuesday 31 March 2026
Huawei poaches top scientist as Germany's tenure rules drive talent away
Huawei has recruited a leading scientist from a German research institute, raising concerns among the German government and academic circles. According to Nikkei Asia, Martin Schell, formerly director of Germany's Fraunhofer Heinrich Hertz Institute (HHI), announced his departure and moved to the UK in March to become research director at Huawei's Bragg Research Center.
Tuesday 31 March 2026
DDI price hikes mainly aim to pass on costs, not boost profits
The recent surge in display driver IC (DDI) price hikes has spread from China to Taiwan, with reports indicating that Taiwanese DDI design firms will begin raising prices starting in the second quarter of 2026 to reflect escalating supply chain costs. Besides DDIs, related chip products such as T-Con, touch ICs, and power management ICs (PMICs) may also see price adjustments depending on negotiations with individual customers. Reported increases range from 5-15%, with some cases reaching up to 20%.
Tuesday 31 March 2026
Fuel cell shift to metal bipolar plates opens door for Taiwan manufacturers
The Metal Industries Research & Development Centre (MIRDC) held the "2026 Metal Bipolar Plate Drives New Generation of Hydrogen Energy Symposium" on March 27, focusing on fuel cell and metal bipolar plate (BP) market developments and analyzing global supply chain dynamics.
Monday 30 March 2026
Passive component maker Tai-Tech wins US client, scales Malaysia plant for AI server, EV demand

Taiwan inductor maker Tai-Tech has begun mass production at its Malaysia plant, targeting customers shifting supply chains away from China. The facility has secured a qualification from a US networking equipment provider, supporting new AI-related orders and expected volume growth from 2026.

Monday 30 March 2026
Tai-Tech flags AI, auto demand as inductor price hikes loom
Taiwan-based inductor maker Tai-Tech Advanced Electronics said artificial intelligence and automotive electronics will drive growth in 2026, as rising raw material costs are setting the stage for another round of price hikes.
Saturday 28 March 2026
Holy Stone Enterprise expands Japan and Taiwan capacity, signaling tighter MLCC supply for AI power supplies
Holy Stone Enterprise plans to invest another NT$3 billion (US$94 million) to add a production line at its Hokkaido R&D center and expand capacity at its Yilan Lize plant in Taiwan as it targets growing demand from AI high-power power supplies.
Friday 27 March 2026
PCB material shortages intensify as CCL lead times hit 6 months, quota system imposed
The surge in AI applications driving PCB material upgrades is exacerbating upstream raw material supply shortages. Notably, besides ongoing price hikes, some IC substrate makers report that limited production capacity for glass fiber cloth and copper foil has tightened supply of copper-clad laminates (CCL) for months. This shortage has extended product lead times to as long as 6 months, forcing related companies to implement a "quota system."
Friday 27 March 2026
Eikei targets automotive and AI markets, establishes Slovakia subsidiary
Automotive printed circuit board (PCB) manufacturer Eikei Group announced plans to establish a subsidiary in Slovakia, aiming to diversify geopolitical risks across its three major markets in Europe, the Americas, and Asia in 2026. Company chairman Shih-lin Liu added that the rapid growth momentum of artificial intelligence (AI) servers is expected to drive profitability higher.
Friday 27 March 2026
UPS and Applied Materials boost Taiwan semiconductor logistics with new Taoyuan hub
Targeting the growing needs of Taiwan's high-tech and semiconductor sectors, UPS has officially launched its Taoyuan International Logistics Center (TILC) with a total investment nearing US$100 million. Part of the warehouse space is dedicated to Applied Materials as its Asia-Pacific storage and distribution center, providing customers with 24/7 operational services.
Thursday 26 March 2026
Innos set for late April listing on TPEx, riding advanced packaging boom
Probe card automation equipment maker Innostar Service (Innos) is expected to list on the Taipei Exchange (TPEx) main board in late April 2026. With artificial intelligence (AI) applications driving demand in the semiconductor industry, the probe card market is anticipated to grow rapidly, supporting strong revenue growth and sustained high gross margins for the company in 2026.
Thursday 26 March 2026
Holy Stone expects AI-driven surge in MLCC demand to lift 2026 revenue
Holy Stone Enterprise expects a 20–30% rise in passive component revenue in 2026 as demand for high-power AI server components accelerates globally. Doubling AI product sales could improve profits by shifting to a higher-value product mix, with implications for supply chains and procurement across data center and server manufacturers worldwide, as well as enterprise customers.
Thursday 26 March 2026
Lelon Electronics eyes 10% revenue growth in 2026 driven by automotive and AI servers
Lelon Electronics expects shipments to rise in 2026, driven by automotive electronics and AI servers, with wider supply-chain and pricing implications for global electronics manufacturers and suppliers as inventory buildups and pull-in deliveries reshape component flows and capacity planning worldwide.
Thursday 26 March 2026
Broadcom to mass-produce 400G single-lane PAM4 DSP by 2027, vows to maintain lead
Broadcom recently announced that it completed development of a 400G single-lane PAM4 digital signal processor (DSP) at the Optical Fiber Communication Conference (OFC) 2026, signaling accelerated progress toward higher-speed optical links, with implications for global data center scalability, AI deployments, and supply-chain dynamics as the industry awaits volume production and wider market adoption over the coming years.
Wednesday 25 March 2026
Taiwan Mask poised for advanced packaging growth in 2H26 off semiconductor rebound
Riding a semiconductor industry recovery and AI-driven demand for advanced packaging, Taiwan Mask Corporation (TMC) President Lidon Chen said the company expects significant and substantial core business growth in the second half of 2026. Despite headwinds from geopolitical tensions and competition from China, TMC is cautiously optimistic about full-year operations, backed by product line expansions and advanced process deployments, with current capacity utilization exceeding 90%.
Wednesday 25 March 2026
Samsung reportedly set to begin GaN foundry production, prepare SiC samples
Samsung Electronics is reportedly set to begin mass production at its gallium nitride (GaN) power semiconductor foundry line as early as the second quarter, while also preparing silicon carbide (SiC) samples for production later this year, according to reports from The Elec and ZDNet.
Tuesday 24 March 2026
MediaTek's Airoha takes on US giants in optical comms DSP chip arena
The expansion of AI data centers is creating new business opportunities that are opening the door for upstarts to challenge industry leaders. A prime example is the four-level pulse amplitude modulation digital signal processing (PAM4 DSP) chip market for optical communications, which is shifting from a duopoly dominated by US leaders Marvell Technology and Broadcom to a more diversified vendor landscape. MediaTek's subsidiary Airoha is now striving to climb this competitive ladder.
Tuesday 24 March 2026
China's AI GPUs face equipment and software constraints, but system-level design boosts self-reliance
Although it may appear that China's AI GPU development is behind the US by one or more generations, a recent Morgan Stanley report reveals the actual gap is smaller than widely perceived.
Monday 23 March 2026
China moves into high-end photoresist production: Dinglong ramps up, YMTC lends support
As geopolitical tensions and energy transport risks heighten volatility in the global semiconductor supply chain, the stability of upstream critical materials — particularly photoresists — is coming back into focus.
Monday 23 March 2026
Commentary: CPO mass production put to test as photonic integration faces challenges
Driven by massive demand from cloud AI, silicon photonics continues to gain momentum. At the Optical Fiber Communication Conference (OFC 2026), industry players engaged in in-depth discussions on the current state of co-packaged optics (CPO) mass production. IC design experts observed that, compared with previous OFC events, which focused primarily on new technological breakthroughs, the industry in 2026 is clearly more concerned with whether solutions can be delivered on time.
Monday 23 March 2026
Ventec eyes double-digit growth in 2026 amid product price hikes and niche material expansion
Niche copper-clad laminate (CCL) manufacturer Ventec expects to achieve double-digit revenue growth in 2026, driven by ongoing product price increases and strategic expansion into specialized markets such as defense aerospace and semiconductor test interfaces. Currently, special materials account for 50% of its revenue, positioning the company for what it predicts will be a robust order fulfillment phase.
Monday 23 March 2026
Konica Minolta to expand AI chip inspection optics capacity 2.6x by 2027

Japanese optical component and office equipment maker Konica Minolta said on March 18 it will scale up its optical components business for semiconductor inspection systems, targeting revenue of JPY15 billion (approx. US$94.1 million) in the fiscal year ending March 2031 (April 2030-March 2031). The segment is projected to generate JPY2.5 billion in fiscal 2025.

Monday 23 March 2026
Taiwan materials maker Daxin pivots to semiconductors with new display film ramp in 2026
Daxin Materials is expanding its semiconductor materials portfolio while maintaining optimization efforts in display materials. The company expects 2026 display material revenue to remain broadly flat year on year, with growth driven by liquid crystal alignment films. Cholesteric liquid crystal alignment films are expected to enter mass production in 2026.