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Thursday 28 May 2026
Iteq sees AI data center demand lift M7+ CCL shipments
Copper clad laminate (CCL) maker Iteq held its 2026 annual general meeting on Thursday, with Chairman Dennis Chen saying that the continued deepening of generative AI applications, faster cloud computing and data center expansion, and steady growth in demand from new energy-related industries are boosting demand for high-end electronic materials and high-frequency, high-speed printed circuit board (PCB) markets.
Thursday 28 May 2026
CXMT cleared for IPO listing; could boost China's memory supply chain
ChangXin Memory Technologies (CXMT), China's top DRAM maker, has been cleared by China's securities regulator for its highly anticipated IPO, which could raise funds worth CNY29.5 billion (approx. US$4.4 billion) for the company. The Shanghai Stock Exchange said on May 27 that it had cleared a listing review for its STAR Board.
Thursday 28 May 2026
SAS succession complete as founder Mingguang Lu exits board amid diversified growth
Sino-American Silicon Products (SAS) held its shareholders meeting on May 26 and completed a full board overhaul, with founder Mingguang Lu stepping down as a director and Hsiu-lan Hsu being re-elected chairwoman. Lu will continue supporting the group as honorary chairman as SAS deepens its generational transition and diversified growth strategy.
Thursday 28 May 2026
Yageo signals possible price hikes as Japanese and Korean passive component makers raise prices
Passive component manufacturer Yageo held its 2026 annual shareholders meeting on May 27. In a post-meeting interview, chairman Pierre Chen confirmed that the world's two largest multilayer ceramic capacitor (MLCC) makers, Japan's Murata Manufacturing and South Korea's Samsung Electro-Mechanics (Semco), have recently issued price increase notices to customers and distributors.
Thursday 28 May 2026
Yageo tops Murata in AI-driven passive component orders

Yageo, one of the world's largest passive component suppliers, said demand from AI-related applications has pushed its book-to-bill ratio to 1.3, surpassing levels seen at Japanese peers, including Murata, as tightening supply across the sector continues to extend lead times.

Thursday 28 May 2026
QRT eyes aerospace, defense growth with portable chip radiation tester

South Korean semiconductor testing company QRT is expanding its equipment business with a portable chip radiation reliability testing system, aiming to build a larger presence in aerospace and defense markets.

Wednesday 27 May 2026
Sino-American Silicon taps AI to tackle Taiwan's green power crunch
Sino-American Silicon Products (SAS) is turning to AI-based power management as Taiwan's green-power shortage persists, and electricity demand from advanced chipmaking and AI data centers continues to rise.
Wednesday 27 May 2026
WinWay weighs Texas shift after AI chip testing surge in North America
US efforts to rebuild its semiconductor supply chain are exposing a critical gap in domestic packaging and testing capacity, a bottleneck that industry sources expect to ease only after 2028 as the US OSAT ecosystem gradually takes shape.
Wednesday 27 May 2026
Hiwin opens Italy HQ, bridging Europe to global markets
Taiwanese machinery component maker Hiwin has officially opened its new headquarters in Agrate Brianza for its Italian subsidiary, saying the site will serve as a key hub connecting Europe with global markets and strengthening its international service network. Chairman Eddie Chuo said that Hiwin Italy is not only an operating base, but also a critical bridge for broader regional integration.
Wednesday 27 May 2026
PCB drill bit maker Topoint raises NT$600 million, brings in PCB giants as strategic investors
Printed circuit board (PCB) drill bit manufacturer Topoint Technology approved a private placement of unsecured convertible corporate bonds with a maximum issuance amount of NT$600 million (approx. US$19.10 million) at its shareholders' meeting on May 26. The company also welcomed Unimicron Technology, Gold Circuit Electronics (GCE), and Zhen Ding Technology Group (ZDT) as strategic investors.
Tuesday 26 May 2026
LED maker Ennostar pivots to optical interconnects after high-value shift agin traction
Ennostar Holdings' transformation has begun to show clear results, with chairman Paul Peng saying the company's "3+1" strategy is taking shape, as higher-value applications now account for more than half of revenue. Despite continued uncertainty in the global environment, Peng remains cautiously optimistic about the second half of 2026 and expects the company to maintain relatively strong performance.
Tuesday 26 May 2026
Chiplet boom puts Taiwan's InPsytech and its AI connectivity IPs in the spotlight
As the global semiconductor industry pivots toward chiplet-based designs — where multiple smaller chips are packaged together rather than built as a single monolithic die — the specialized intellectual property that makes those chips communicate reliably has become critical infrastructure. InPsytech, a Taiwanese IP design firm and subsidiary of Egis Technology, has staked its business on exactly that.
Tuesday 26 May 2026
Taiwan MLCC makers plug into AI server demand
AI servers are driving a surge in demand for high-end passive components, rapidly eating into multilayer ceramic capacitor (MLCC) capacity and extending lead times to more than 16–20 weeks. As a result, some orders that once went to major Japanese and South Korean suppliers are gradually spilling over to Taiwan-based makers.
Tuesday 26 May 2026
Wingtech sues Nexperia for US$1.2B as it fights delisting risk
Wingtech Technology, the Chinese tech company that owns Dutch semiconductor manufacturer Nexperia, has filed a civil lawsuit against Nexperia and five defendants for alleged damages worth CNY8 billion (approx. US$1.2 billion). The case is the latest development of the legal troubles between the Chinese company and its subsidiary following the Dutch government's seizure of the company in late 2025 for national security reasons.
Tuesday 26 May 2026
Holy Stone Enterprise says AI power surge will deepen global MLCC shortages
Holy Stone Enterprise warns that AI-driven power upgrades are creating global shortages and record demand for multilayer ceramic capacitors (MLCCs), with lead times beyond 20 weeks and tighter supply expected through 2027. The developments could reshape supply chains for servers, data centers, and high-power consumer electronics worldwide, and accelerate global investment in components.
Tuesday 26 May 2026
Lightmatter joins TSMC on COUPE for 3D optical engines
AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter to unveil its latest laser product, Guide DR. To advance its 3D-stacked silicon photonics engine, Lightmatter is also working closely with TSMC using its Compact Universal Photonic Engine (COUPE) platform.
Monday 25 May 2026
AI servers drive order growth; Weltrend's fan motor driver IC visibility strong
At its earnings conference, Weltrend Semiconductor described the first quarter of 2026 as an exceptional one. Despite the period being historically slow, the company posted year-over-year and sequential growth. Nearly all major product lines demonstrated strong growth momentum, with server-related products standing out in particular. Order visibility is now expected to remain strong throughout the full year. Meanwhile, AI servers are becoming increasingly diversified, with demand across GPUs, ASICs, and CPUs growing almost simultaneously, underpinning a highly promising operating outlook.
Monday 25 May 2026
AI data centers spark 800V HVDC rush for Taiwan lead frame suppliers

The shift toward 800V high-voltage direct current (HVDC) power architectures in AI data centers is driving a surge in demand for power semiconductors, boosting shipments for Taiwanese lead frame suppliers SDI Corporation and Jih Lin Technology and raising expectations for double-digit revenue growth in 2026.

Monday 25 May 2026
Ample Electronic says AI demand is boosting MLCC-related passive components
Ample Electronic said rising demand from artificial intelligence end customers has driven a stronger market for multilayer ceramic capacitors and related passive components, lifting orders, driving inventory builds, and prompting a shift toward longer-term material lock-in agreements. The conductive paste supplier reported a positive outlook for the second half of 2026 and said customers who initially carried low inventories were replenishing stock and, in some cases, signing extended supply arrangements.
Monday 25 May 2026
Samsung Electro-Mechanics secures large silicon capacitor supply contract
Samsung Electro-Mechanics (Semco)'s KRW1.5 trillion (approx. US$990 million) silicon capacitor supply contract with a major global company could reshape component supply for AI servers, GPUs, and HBM worldwide, promising denser integration and more stable power delivery in data centers, autonomous vehicles, and mobile devices as demand for high-performance computing grows and supply chains.
Monday 25 May 2026
Embedded substrates draw AI chip interest as packaging turns strategic
Rising interest in embedded substrates among Nvidia, AMD, and Intel signals potential shifts in AI data‑center supply chains, as the technology promises improved signal integrity and power stability for high-performance chips. Global hardware makers and suppliers may need to adapt their manufacturing and investment priorities to support advanced packaging worldwide.
Sunday 24 May 2026
Geopolitics disrupts chips — can Taiwan and South Korea cooperate to hold the line?
The global semiconductor industry is being pulled in two directions. On one side, the cost of building a single advanced chip factory has ballooned to as much as US$40 billion, concentrating production in the hands of a shrinking club of players. On the other hand, US-China technology rivalry is redrawing the map of who gets to make what — and for whom.
Sunday 24 May 2026
AI server boom squeezes Samsung Electro-Mechanics' component supply

Samsung Electro-Mechanics is emerging as another beneficiary of the AI data center buildout, as demand for high-end capacitors and package substrates pushes parts of its component business closer to full capacity.

Saturday 23 May 2026
Taiwan power chip maker Panjit targets AI and robotics for next growth phase

Panjit International Inc. is accelerating its expansion into AI and automotive electronics as the Taiwanese power semiconductor maker positions itself for a new growth cycle after four decades in the discrete device market.

Friday 22 May 2026
WPG Holdings flags server supply gaps amid memory price hikes, 800V shift
Amid the continued crowding-out effect of artificial intelligence (AI) demand, IC distributor WPG Holdings said memory shortages and rising prices are weakening end-product sales momentum, and forecast that smartphone and PC production will shift from flat growth to a decline in 2026.