UK-based investment firm Palliser Capital announced on September 9 that following several months of constructive dialogue with the management of veteran printed circuit board (PCB) manufacturer WUS Printed Circuit, it has further increased its holdings, officially pushing its stake past 5%. Moving forward, Palliser plans to actively present recommendations to WUS Printed Circuit to push for measures that fully reflect the company's value.
Renesas Electronics is reportedly preparing a second product price increase this year, with new pricing set to take effect January 1, 2027, as rising manufacturing costs coincide with stronger demand for power semiconductors used in data centers and other high-growth applications.
As Arm targets expansion in physical AI, microcontroller (MCU) maker Artery Technology has emerged as a key ecosystem partner. Focusing on high-end 32-bit MCU applications, Artery has penetrated supply chains for robotics and unmanned aerial vehicles, with full-year 2026 revenue projected to double.
Strong demand for AI computing is creating a capacity squeeze across the passive-component industry, opening new opportunities for Taiwanese suppliers.
At an optoelectronics trade expo in China, Hitachi High-Tech used its booth not to unveil a flagship product of its own, but to showcase a growing web of partnerships. This is a strategy the company says reflects both its late entry into the photonics race and its long-term goals in the region.
Alkaidsemi (Shanghai) Technologies Corporation has introduced a 1,200 V silicon carbide superjunction MOSFET that it describes as the world's first SiC superjunction MOSFET product. Project leader Hao Yue said it is among the first globally to complete product validation, positioning the company for emerging demand from AI server power supplies and high-voltage direct-current data center architectures.
Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules submitted to TSMC takes longer than expected, pushing back related equipment orders and adding pressure to a commercialization schedule that had already shifted into 2028.
LG Innotek is applying internally developed artificial intelligence to semiconductor glass substrate manufacturing, targeting microcracks, one of the technology's toughest yield challenges. The move comes as industry forecasts and supplier roadmaps increasingly point to around 2028 as an early window for initial glass-core substrate production.
WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV) substrates for optical communications and advanced packaging as AI demand expands.
