Optical film and nano-coating materials developer Victory For Technology (VFT) is focusing on three key areas — AI and semiconductor processes, foldable displays, and key new-energy materials — as it deepens R&D and product deployment to capture emerging opportunities in the global supply chain.
At VivaTech 2026 in Paris last week, Philippe Keryer, Chief Strategy and Innovation Officer at Thales, identified Europe's core quantum challenge in a single observation: "The problem is not really how we invent, it's really how we scale."
Dutch semiconductor metrology specialist Nearfield Instruments has secured US$380 million in Series D funding, marking the largest fundraising round ever completed by a deep-tech company in the Netherlands.
Samsung Electro-Mechanics has begun mass production of advanced package substrates for Qualcomm's first data center AI accelerator, extending the companies' supply relationship from mobile and PC chips into server-class semiconductors, ZDNet Korea reported.
Taiwan's semiconductor packaging and testing (OSAT) industry delivered strong year-over-year revenue growth in May 2026, with 21 of 24 tracked companies posting positive year-over-year gains, according to monthly revenue filings compiled for the period. The results underscore continued downstream demand driven by AI-related chip shipments and a broader recovery in consumer electronics.
Demand for high-end fiberglass cloth is surging on the AI boom, and orders from copper-clad laminate (CCL) customers are leaving the world's two largest suppliers, Nittobo and Taiwan Glass, short of capacity. In particular, low coefficient of thermal expansion (CTE) and low Dk2 products remain the tightest, with supply-demand gaps now expected to last through 2027.
Demand in the passive component market has rebounded alongside the rapid buildout of AI data centers. While Japanese suppliers continue to lead in technology, their capacity expansion has struggled to keep pace with AI-related demand, driving order spillover to Taiwan-based manufacturers.
The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving faster in headlines than in production lines. DIGITIMES has been tracking the latest developments in TSMC's CoPoS advanced packaging technology, with glass core substrates emerging as the most closely watched variable in that story.
Taiwan's semiconductor equipment, components, and solutions providers posted robust revenue growth through the first five months of 2026, with 34 of 43 tracked companies reporting positive accumulated year-on-year figures.
Taiyo Yuden is preparing to accelerate production of multilayer ceramic capacitors, or MLCCs, as AI servers and hyperscale data centers tighten supply across the global component market. But the Japanese supplier is resisting the kind of broad price increases now spreading through parts of the industry.
