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Friday 27 March 2026
PCB material shortages intensify as CCL lead times hit 6 months, quota system imposed
The surge in AI applications driving PCB material upgrades is exacerbating upstream raw material supply shortages. Notably, besides ongoing price hikes, some IC substrate makers report that limited production capacity for glass fiber cloth and copper foil has tightened supply of copper-clad laminates (CCL) for months. This shortage has extended product lead times to as long as 6 months, forcing related companies to implement a "quota system."
Friday 27 March 2026
Eikei targets automotive and AI markets, establishes Slovakia subsidiary
Automotive printed circuit board (PCB) manufacturer Eikei Group announced plans to establish a subsidiary in Slovakia, aiming to diversify geopolitical risks across its three major markets in Europe, the Americas, and Asia in 2026. Company chairman Shih-lin Liu added that the rapid growth momentum of artificial intelligence (AI) servers is expected to drive profitability higher.
Friday 27 March 2026
UPS and Applied Materials boost Taiwan semiconductor logistics with new Taoyuan hub
Targeting the growing needs of Taiwan's high-tech and semiconductor sectors, UPS has officially launched its Taoyuan International Logistics Center (TILC) with a total investment nearing US$100 million. Part of the warehouse space is dedicated to Applied Materials as its Asia-Pacific storage and distribution center, providing customers with 24/7 operational services.
Thursday 26 March 2026
Innos set for late April listing on TPEx, riding advanced packaging boom
Probe card automation equipment maker Innostar Service (Innos) is expected to list on the Taipei Exchange (TPEx) main board in late April 2026. With artificial intelligence (AI) applications driving demand in the semiconductor industry, the probe card market is anticipated to grow rapidly, supporting strong revenue growth and sustained high gross margins for the company in 2026.
Thursday 26 March 2026
Holy Stone expects AI-driven surge in MLCC demand to lift 2026 revenue
Holy Stone Enterprise expects a 20–30% rise in passive component revenue in 2026 as demand for high-power AI server components accelerates globally. Doubling AI product sales could improve profits by shifting to a higher-value product mix, with implications for supply chains and procurement across data center and server manufacturers worldwide, as well as enterprise customers.
Thursday 26 March 2026
Lelon Electronics eyes 10% revenue growth in 2026 driven by automotive and AI servers
Lelon Electronics expects shipments to rise in 2026, driven by automotive electronics and AI servers, with wider supply-chain and pricing implications for global electronics manufacturers and suppliers as inventory buildups and pull-in deliveries reshape component flows and capacity planning worldwide.
Thursday 26 March 2026
Broadcom to mass-produce 400G single-lane PAM4 DSP by 2027, vows to maintain lead
Broadcom recently announced that it completed development of a 400G single-lane PAM4 digital signal processor (DSP) at the Optical Fiber Communication Conference (OFC) 2026, signaling accelerated progress toward higher-speed optical links, with implications for global data center scalability, AI deployments, and supply-chain dynamics as the industry awaits volume production and wider market adoption over the coming years.
Wednesday 25 March 2026
Taiwan Mask poised for advanced packaging growth in 2H26 off semiconductor rebound
Riding a semiconductor industry recovery and AI-driven demand for advanced packaging, Taiwan Mask Corporation (TMC) President Lidon Chen said the company expects significant and substantial core business growth in the second half of 2026. Despite headwinds from geopolitical tensions and competition from China, TMC is cautiously optimistic about full-year operations, backed by product line expansions and advanced process deployments, with current capacity utilization exceeding 90%.
Wednesday 25 March 2026
Samsung reportedly set to begin GaN foundry production, prepare SiC samples
Samsung Electronics is reportedly set to begin mass production at its gallium nitride (GaN) power semiconductor foundry line as early as the second quarter, while also preparing silicon carbide (SiC) samples for production later this year, according to reports from The Elec and ZDNet.
Tuesday 24 March 2026
MediaTek's Airoha takes on US giants in optical comms DSP chip arena
The expansion of AI data centers is creating new business opportunities that are opening the door for upstarts to challenge industry leaders. A prime example is the four-level pulse amplitude modulation digital signal processing (PAM4 DSP) chip market for optical communications, which is shifting from a duopoly dominated by US leaders Marvell Technology and Broadcom to a more diversified vendor landscape. MediaTek's subsidiary Airoha is now striving to climb this competitive ladder.
Tuesday 24 March 2026
China's AI GPUs face equipment and software constraints, but system-level design boosts self-reliance
Although it may appear that China's AI GPU development is behind the US by one or more generations, a recent Morgan Stanley report reveals the actual gap is smaller than widely perceived.
Monday 23 March 2026
China moves into high-end photoresist production: Dinglong ramps up, YMTC lends support
As geopolitical tensions and energy transport risks heighten volatility in the global semiconductor supply chain, the stability of upstream critical materials — particularly photoresists — is coming back into focus.
Monday 23 March 2026
Commentary: CPO mass production put to test as photonic integration faces challenges
Driven by massive demand from cloud AI, silicon photonics continues to gain momentum. At the Optical Fiber Communication Conference (OFC 2026), industry players engaged in in-depth discussions on the current state of co-packaged optics (CPO) mass production. IC design experts observed that, compared with previous OFC events, which focused primarily on new technological breakthroughs, the industry in 2026 is clearly more concerned with whether solutions can be delivered on time.
Monday 23 March 2026
Ventec eyes double-digit growth in 2026 amid product price hikes and niche material expansion
Niche copper-clad laminate (CCL) manufacturer Ventec expects to achieve double-digit revenue growth in 2026, driven by ongoing product price increases and strategic expansion into specialized markets such as defense aerospace and semiconductor test interfaces. Currently, special materials account for 50% of its revenue, positioning the company for what it predicts will be a robust order fulfillment phase.
Monday 23 March 2026
Konica Minolta to expand AI chip inspection optics capacity 2.6x by 2027

Japanese optical component and office equipment maker Konica Minolta said on March 18 it will scale up its optical components business for semiconductor inspection systems, targeting revenue of JPY15 billion (approx. US$94.1 million) in the fiscal year ending March 2031 (April 2030-March 2031). The segment is projected to generate JPY2.5 billion in fiscal 2025.

Monday 23 March 2026
Taiwan materials maker Daxin pivots to semiconductors with new display film ramp in 2026
Daxin Materials is expanding its semiconductor materials portfolio while maintaining optimization efforts in display materials. The company expects 2026 display material revenue to remain broadly flat year on year, with growth driven by liquid crystal alignment films. Cholesteric liquid crystal alignment films are expected to enter mass production in 2026.
Friday 20 March 2026
Lumotive makes optical breakthrough, targets 10,000-port data centers

As Nvidia and Coherent signal a shift toward all-optical networking to solve the AI power crisis, Redmond-based Lumotive has announced a milestone that could redefine data center scalability. In an interview with DIGITIMES Asia, Gleb Akselrod, Co-founder and CTO of Lumotive, detailed the success of the world's first programmable 2D optical beamforming chip.

Friday 20 March 2026
Research Insight: AI reshapes Taiwan's PCB industry around high-end capacity and materials
DIGITIMES observes that as demand surges for AI servers, high-speed switches, optical communication modules, and edge AI devices, Taiwan's PCB industry is undergoing a structural shift in its growth model. The traditional cyclical, recovery-driven growth is giving way to competition centered on high-end capacity deployment, control of critical materials, and global expansion capabilities.
Friday 20 March 2026
HiSilicon unveils self-developed CIS chip, shaking global sensor supply chain
The global CMOS image sensor (CIS) supply chain faces a major disruption as HiSilicon, Huawei's core semiconductor subsidiary, officially enters the high-end CIS market with its first self-developed sensor chip. Partnering with strategic collaborator Gkuvision, an imaging solution provider, HiSilicon launched the new generation sports camera "Xiaotu S7PRO MAX" equipped with its proprietary sensor.
Friday 20 March 2026
MediaTek on cruise control as chipmakers scramble for next-gen silicon photonics standards
Nvidia GTC 2026 and the Optical Fiber Communication Conference (OFC) have underscored the growing importance of optical communication in cloud AI, with chipmakers playing an increasingly critical role in the ecosystem.
Friday 20 March 2026
AI tailwinds and global reach put Topco on track for double-digit growth in 2026
Driven by AI applications boosting advanced processes, HBM, and packaging technologies, demand for key materials like silicon wafers and photoresists has surged. Topco Scientific (TSC) has announced plans to focus on high-growth sectors such as AI, automotive, and data centers in 2026, targeting sustained double-digit growth.
Friday 20 March 2026
Allied Circuit sees server, IPC market growth boosting 2H26 outlook
Benefiting from rising demand across the server and industrial PC (IPC) markets, Allied Circuit (ACCL), a PCB manufacturer backed by Compal, reported that its new capacity added in 2025 has fully come online. Now running at full capacity, ACCL's monthly revenue contribution stands at approximately NT$500 million (US$15.7 million). The company plans to continue removing production bottlenecks in 2026 and expects second-half revenue performance to surpass the first half.
Friday 20 March 2026
Lumotive creates world's first 2D photonic beamforming chip
Lumotive, a pioneer in programmable optical semiconductor technology, has demonstrated the world's first programmable two-dimensional (2D) photonic beamforming chip. Built on its Light Control Metasurface (LCM) architecture, the chip enables electronic control of light across two dimensions within a single device — a capability long pursued in optical science and widely considered essential for scalable programmable optical systems.
Thursday 19 March 2026
Samsung Electro-Mechanics rumored to supply MLCCs to top private aerospace firm
Samsung Electro-Mechanics (Semco) is reportedly supplying multilayer ceramic capacitors (MLCC) for low Earth orbit (LEO) satellites to the world's largest private aerospace company. According to industry sources, this expansion from the automotive and industrial sectors into aerospace is a significant step for the company, as it demonstrates that its components have gained global recognition for durability and reliability.
Thursday 19 March 2026
China curbs, Middle East tensions drive surge in chip material risks from gallium to helium

Global semiconductor supply chains are facing rising pressure as Middle East geopolitical tensions and China's tightening export controls on strategic minerals converge, pushing up prices for key materials and raising uncertainty over critical industrial gas supplies, according to Chosun Biz and Reuters.