TSMC updates

Foundry house TSMC plays a crucial role in the semiconductor sector, and the world economy in general.

IN THE NEWS

Friday 31 July 2026

TSMC reportedly develops EMIB-like packaging to counter Intel

TSMC is reportedly developing a new advanced chip-packaging technology modeled on Intel's Embedded Multi-die Interconnect Bridge (EMIB),...

Friday 31 July 2026

AI strains mature-node and packaging capacity, leaving chip designers with orders but no supply

AI demand is tightening semiconductor capacity beyond TSMC's advanced nodes, with mature-process foundries and backend packaging providers...

Friday 31 July 2026

Analysis: Samsung's HBM4 base die is the foundry weapon TSMC and Intel can't copy

The most revealing thing about Samsung Electronics' foundry commentary on its second quarter of 2026 earnings call was not any single...

Friday 31 July 2026

Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry

TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening, according to Unimicron, which said Intel's EMIB-T advanced packaging platform will not reach...

Friday 31 July 2026

US manufacturing push draws Taiwan suppliers; electronics investment up nearly 500%

TSMC chairman C.C. Wei has announced an additional US$100 billion investment for building capacity in the US, on top of the company's...

Thursday 30 July 2026

South Korean chip exports increasingly flow to Taiwan for TSMC packaging amid rising AI demand

Growing demand for AI chips is sending a larger share of South Korea's semiconductor exports to Taiwan, where Korean-made high-bandwidth...

Thursday 30 July 2026

Taiwan semiconductor power demand is set to reach 52 billion kWh in 2026

Taiwan's semiconductor sector is set to become an even larger driver of electricity demand as AI-related expansion lifts output in...

Wednesday 29 July 2026

TSMC: JASM utilities back to normal, equipment calibration underway; construction resumes

TSMC on Wednesday issued its third statement since a magnitude 7 earthquake struck Kumamoto, Japan on July 28, saying that utility...

Tuesday 28 July 2026

Magnitude 7.1 quake strikes Japan's Kumamoto; TSMC says JASM staff safe, recovery underway

A powerful earthquake struck Japan's Kyushu region at 4:27 p.m. on July 28. The Japan Meteorological Agency initially estimated the quake at magnitude 7.1 with a depth of 6.2 miles...

Monday 27 July 2026

Qualcomm tells customers chip prices will rise by double digits from September

Qualcomm plans to raise chip prices by a double-digit percentage from September 1, passing higher supplier costs into a smartphone market...

Sunday 26 July 2026

KKR plans gradual exit as LCY Group accelerates semiconductor materials expansion

TSMC supplier LCY Group President Bowei Lee said private equity firm KKR & Co. plans to gradually divest its holdings in businesses affiliated with the Taiwanese chemical group,...

Sunday 26 July 2026

Podcast: TSMC, SK Hynix, Intel face AI chip and cash flow inflection

This excerpt of DIGITIMES analyst Luke Lin's podcast looks at two major themes: SK Hynix's openness to building in the US and the logic behind TSMC's extra US$100 billion investment...

Friday 24 July 2026

TSMC's Arizona expansion moves past initial hurdles as fabs and packaging ramp up

Since TSMC announced in 2020 that it would build factories in the US, the market has closely watched how overseas fab costs would affect operations. TSMC's long-running Arizona buildout...

Friday 24 July 2026

TGV still faces technical barriers; CoPoS commercialization not likely until 2030

Friday 24 July 2026

AMD's latest 2nm-EPYC rollout signals broader role for CPUs in the AI data center

AMD unveiled its sixth-generation EPYC 9006 server processors, widening its push into AI data centers with chips designed for agentic AI, cloud computing, enterprise workloads, and...

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