TSMC updates

Foundry house TSMC plays a crucial role in the semiconductor sector, and the world economy in general.

IN THE NEWS

Friday 10 July 2026

Apple's US$30 billion Broadcom deal puts its server-chip plans back in focus

Apple and Broadcom have extended their custom-chip partnership through 2031 under agreements expected to exceed US$30 billion, reinforcing...

Friday 10 July 2026

TSMC CoWoS output reportedly to reach at least 200K wafers in 2027

TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly...

Friday 10 July 2026

Analysis: Samsung, SK Hynix, and Micron's diverging approach to HBM4 base dies

Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening...

Friday 10 July 2026

TSMC, ASML, and Imec target 2D chip mass production in Taiwan within five years

ASML, Imec and TSMC are collaborating in southern Taiwan to develop manufacturing equipment for two-dimensional (2D) semiconductor...

Thursday 9 July 2026

AI demand pushes TSMC, Samsung to raise foundry prices — Rapidus aims to undercut 2nm

Rising demand for AI chips is changing how foundries set prices, giving TSMC and Samsung Electronics more leverage while forcing new...

Thursday 9 July 2026

Commentary: China's AI chip race leaves 15 chipmakers chasing SMIC's 7nm capacity

China's bid to replace Nvidia in AI chips faces a constraint more immediate than design capability: SMIC's limited 7nm-class manufacturing capacity.

Thursday 9 July 2026

Interview: UK courts Taiwan suppliers as AI hardware race shifts to chips and power

The UK is pitching itself as a new base and technology partner for Taiwanese electronics suppliers, seeking to turn its AI infrastructure push into a market and investment opportunity...

Wednesday 8 July 2026

TSMC earnings call could signal how long the AI boom can keep lifting its outlook

TSMC's July 16 earnings call is likely to test how far the chipmaker can extend its already upbeat guidance, as investors look for...

Wednesday 8 July 2026

National Center for Instrumentation Research helps academia break 2D materials bottleneck

As AI infrastructure chip orders flood in and TSMC runs near nonstop, academia has found it difficult to carry out industry-academia collaboration with the world's top foundry house...

Wednesday 8 July 2026

ASE expands globally as Hanmi Semiconductor targets CoWoS packaging demand

South Korean equipment maker Hanmi Semiconductor is moving beyond high-bandwidth memory (HBM) tools into advanced chip packaging, a shift that could affect the global semiconductor...

Tuesday 7 July 2026

TSMC's AI bottleneck spills demand across the semiconductor supply chain

Nvidia and other artificial intelligence chipmakers are still facing shortages as TSMC's advanced-node and CoWoS packaging capacity...

Tuesday 7 July 2026

Taiwan pushes care robots as eldercare shortages expose legal gaps

Taiwan is accelerating efforts to bring care robots into eldercare as labor shortages deepen, while lawmakers and regulators continue to debate how the devices should be classified...

Monday 6 July 2026

Meta's AI cloud idea underscores a search for returns, not an AI retreat

Meta is reportedly exploring a new AI cloud infrastructure business that would let enterprises use its AI models and some unused GPU capacity, a move that could lift hardware utilization...

Saturday 4 July 2026

TSMC's median pay trails four smaller IC design houses, filings show

Fabless chip designers dominate the upper ranks of Taiwan's newly disclosed non-managerial employee pay data for fiscal year 2025,...

Friday 3 July 2026

Intel takes aim at TSMC's CoWoS lead with EMIB-T

As transistor density scaling slows, chipmakers are leaning on advanced packaging to keep improving accelerator performance. A SemiAnalysis roundup of this year's IEEE Electronic Components...

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