TSMC updates

Foundry house TSMC plays a crucial role in the semiconductor sector, and the world economy in general.

IN THE NEWS

Thursday 18 June 2026

FOPLP race heats up as Innolux reportedly teams with TSMC

As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP...

Thursday 18 June 2026

SMIC narrows Intel's metal pitch gap, but Kirin 9030 teardown shows China's chip limits remain

A teardown of Huawei's latest Mate 80 Pro Max smartphone has put China's semiconductor progress back under scrutiny, after analysis...

Thursday 18 June 2026

TSMC, ASML and Imec push 2D transistors toward manufacturing

Imec, ASML and TSMC have demonstrated a 300mm integration route for 2D-material n-type and p-type field-effect transistors, marking a...

Wednesday 17 June 2026

Chip supply chains shift: TSMC's capacity crunch reportedly pushes Google, Tesla, BYD toward Samsung

Global chip buyers, including BYD, Google, AMD, and Tesla, are turning to Samsung Electronics as TSMC's advanced production lines remain...

Tuesday 16 June 2026

ASML, TSMC, and imec move 2D transistors closer to manufacturing reality

ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor...

Tuesday 16 June 2026

Samsung reportedly moves closer to 5nm-class MRAM as TSMC advances its roadmap

Samsung Electronics has secured key technology for a 5nm-class magnetoresistive random-access memory cell, according to Korean financial...

Tuesday 16 June 2026

TSMC eyes A16 mass production in 4Q26 and Intel refines 18A roadmap with 18A-P

Researchers and chipmakers presented new logic, memory, and device architectures at the 2026 IEEE/JSAP VLSI Technology and Circuits Symposium in Honolulu, with several results pointing...

Tuesday 16 June 2026

TSMC reportedly teams with Ibiden, Innolux to push CoPoS, glass substrates

TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in...

Tuesday 16 June 2026

TSMC PLP timeline faces skepticism from Taiwan industry sources

A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has...

Monday 15 June 2026

CoPoS and FOPLP accelerate as Manz delivers its first 310mm electrochemical deposition equipment

Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical...

Monday 15 June 2026

Google's TPU diversification challenges MediaTek and other ASIC partners

Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports...

Saturday 13 June 2026

Commentary: The cost of over-concentration—How TSMC's liquidity dominance is reshaping Taiwan's banking system

TSMC's financial dominance has reached unprecedented heights, with the world's leading foundry posting first-quarter 2026 profit of over NT$570 billion (approx. US$18.04 billion) and...

Friday 12 June 2026

Samsung's packaging gap clouds chip comeback as TSMC, Intel push ahead

Samsung Electronics is regaining ground in high-bandwidth memory and foundry services, but advanced packaging remains a weak point...

Friday 12 June 2026

Google weighs Samsung's role in next AI chip as TSMC capacity tightens

Google is considering using Samsung Electronics to manufacture part of a future artificial intelligence (AI) chip, a move that would mark a notable shift in the US tech group's supply...

Friday 12 June 2026

TSMC hit by US patent suit, Taiwan ministry pledges support

TSMC has been drawn into a patent infringement complaint in the US by Ireland-based patent licensing firms Longitude Licensing and Marlin Semiconductor. The companies have claimed...

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