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NEWS TAGGED 3D
Thursday 5 November 2026
oToBrite and Yuan build robot vision chain for Nvidia platform
As the Physical Intelligence and autonomous vehicle markets heat up, oToBrite is partnering with Yuan High-Tech Development to integrate its 3D binocular stereo vision camera module...
Wednesday 4 November 2026
GigaDevice sees tight niche DRAM supply, slower price gains
AI demand continues to heat up while major global memory makers shift capacity toward higher-value products, keeping niche memory supplies tight in the near term. China-based IC design...
Tuesday 3 November 2026
Micron dismisses 4F-squared DRAM as CXMT presses ahead — why Samsung, SK Hynix remain divided
Micron Technology and China's CXMT have taken sharply different approaches to next-generation DRAM scaling, exposing a divide over the commercial viability of 4F-squared memory-cell...
Friday 30 October 2026
Macronix to Showcase Automotive and IoT Memory Solutions at electronica 2026

Macronix International, a global leader in non-volatile memory (NVM), has announced its participation in electronica 2026, the world's premier electronics trade fair,...

Thursday 29 October 2026
Macronix halts NOR expansion, phases out ROM, bets NT$30B expansion on eMMC NAND
Macronix International posted record profits in the third quarter of 2026, surpassing $10 billion for the first time in company history. Chairman Miin-Chyou Wu announced that the company...
Wednesday 28 October 2026
SK Hynix bets on EUV to extend 6F-squared DRAM as CXMT pushes 4F-squared
SK Hynix plans to extend the life of its existing 6F-squared DRAM cell architecture through extreme ultraviolet (EUV) lithography and process improvements, keeping 4F-squared and three-dimensional...
Sunday 25 October 2026
Namuga expands beyond Samsung with humanoid robot camera modules
South Korean image-sensing module maker Namuga is accelerating its physical AI strategy after securing a supply deal with a global humanoid robot company. The company is preparing...
Sunday 25 October 2026
Column: Will general-purpose models overtake Physical AI?
After GPT-6 Astra launched in early September 2026, researchers quickly put it through Physical AI and robotics benchmarks. In some tests, it outperformed specialized models trained...
Friday 23 October 2026
PSMC eyes Taiwan, Japan, Singapore for 3D AI foundry expansion
Powerchip Semiconductor Manufacturing (PSMC) is urgently expanding its 3D AI foundry business and evaluating new plants in Taiwan, Singapore, and Japan, while exploring strategic joint...
Friday 23 October 2026
AMEC ships first Primo Domingo selective etching system, targeting critical gaps in China's advanced 3D chipmaking
China's Advanced Micro-Fabrication Equipment (AMEC) has shipped the first unit of its Primo Domingo high-selectivity vapor-phase etching system to a major domestic semiconductor research...
Thursday 22 October 2026
Micron skips 4F² for 3D DRAM as CXMT pushes ahead
Micron does not plan to commercialize 4F² DRAM even as Chinese rival ChangXin Memory Technologies (CXMT) advances the technology, saying the architecture offers limited benefits...
Wednesday 21 October 2026
AI chip scaling shifts into 3D, with performance per watt the new benchmark, says former TSMC VP
Growing AI computing demand is bringing the semiconductor industry to a technological turning point. Transistor scaling has long driven gains in chip density, performance, and energy...
Wednesday 21 October 2026
Breaking AI's memory wall: former TSMC VP charts a path with HBM, optical links and 3D stacking
AI processor performance continues to improve, but memory bandwidth is growing more slowly, making data supply a major constraint on AI chip performance and energy efficiency. Efforts...
Monday 19 October 2026
SK Hynix advances chip inspection technology as 3D memory pushes conventional metrology to its limits
SK Hynix is strengthening its metrology and inspection (MI) capabilities as the transition toward 3D DRAM architectures and increasingly complex NAND stacking creates new challenges...
Thursday 15 October 2026
Column: 3D memory could redraw chip competition, weaken US sanctions on China
In October 2022, the US Bureau of Industry and Security (BIS) imposed a package of export restrictions on China, including controls on equipment and components for manufacturing 3D...