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Friday 10 July 2026
JCET sets US$1.4bn capex for AI packaging expansion as China orders stay strong
JCET plans to invest about CNY10 billion (approx. US$1.4 billion) in fixed assets in 2026, sharply increasing spending on AI-driven advanced packaging, automotive electronics and selected...
Monday 6 July 2026
China advanced packaging maker SJ Semiconductor starts US$1.5bn 3DIC project for AI chips

SJ Semiconductor has started construction of a CNY10 billion (approx. US$1.47 billion) 3DIC manufacturing project in Shanghai's Lingang...

Monday 6 July 2026
Exclusive Interview: Dutch startup Nearfield bets on process control to rival EUV in AI chip manufacturing

As Moore's Law approaches its physical limits, simply shrinking semiconductor process nodes is no longer the sole path to improving...

Sunday 5 July 2026
Applied Materials unveils integrated tools for HBM, chiplet, and 3D packaging scale-up
Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM,...
Friday 3 July 2026
Tsinghua chip veteran’s US$1.8bn 3D AI chip startup targets China’s GPU gap

China's AI chip sector has a heavyweight new entrant: veteran semiconductor figure Shaojun Wei has formally unveiled Shanghai Orient...

Friday 3 July 2026
Kioxia begins sample shipments of 10th-generation flash memory
Kioxia has begun sample shipments of 1Tb triple-level-cell memory devices built with its 10th-generation BiCS FLASH 3D flash memory technology. The move underscores the race to supply...
Thursday 2 July 2026
Samsung showcases 3D stacked transistor breakthrough for next-gen chips

Samsung Electronics has unveiled new research on a three-dimensional transistor architecture that it says could help extend logic chip...

Monday 29 June 2026
Orbbec builds Vietnam factory to broaden global reach

Chinese 3D vision sensor maker Orbbec is expanding its global manufacturing network with a new production base in Vietnam, as robotics...

Monday 29 June 2026
Taiwan joins post-HBM memory race with Intel, SoftBank

Taiwan's semiconductor ecosystem has entered the race to develop a possible post-HBM memory architecture, with Powerchip Semiconductor...

Friday 26 June 2026
IBM breaks sub-1nm barrier with 3D nanostack transistor platform
On June 25, IBM unveiled what it calls the world's first sub-1nm chip technology: a 0.7nm — or 7 angstrom — transistor architecture built on an entirely new 3D platform...
Tuesday 23 June 2026
Nearfield Instruments raises US$380M in record Dutch deep-tech funding round

Dutch semiconductor metrology specialist Nearfield Instruments has secured US$380 million in Series D funding, marking the largest...

Monday 22 June 2026
YMTC NAND share rises to 13%, alarming South Korean rivals
China's memory makers are moving from technology catch-up to capital-market expansion, with ChangXin Memory Technologies' (CXMT) parent and Yangtze Memory Technology (YMTC) both preparing...
Thursday 18 June 2026
Imec, Sony unveil backside interconnect method for 3D chip stacking

Imec and Sony Semiconductor Solutions Corporation (Sony) have jointly presented a new integration method for connecting the front and...

Thursday 18 June 2026
Samsung pushes vertical transistor design as chip scaling hits limits

Samsung Electronics has demonstrated a 3D stacked transistor structure with a 42-nanometer gate pitch, a research milestone that extends...

Wednesday 17 June 2026
PSMC buys NT$1.04 billion in Lam Research equipment to support capacity growth
Powerchip Semiconductor Manufacturing (PSMC) announced on June 16 that, effective from May 22, 2026, it purchased semiconductor production facilities and machinery from Lam Research...