Imec and Sony Semiconductor Solutions Corporation (Sony) have jointly presented a new integration method for connecting the front and...

Samsung Electronics has demonstrated a 3D stacked transistor structure with a 42-nanometer gate pitch, a research milestone that extends...

Murata Manufacturing has partnered with Synopsys to make its latest electromagnetic and thermal simulation models directly accessible...

SK Hynix is preparing to begin mass production of its next-generation 375-layer 3D NAND flash memory by year-end, while pushing ahead...

Huawei is using self-developed packaging technology to build ultra-high-capacity enterprise SSDs, underscoring how Chinese technology companies...