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NEWS TAGGED 3D
Friday 2 October 2026
Nanya Technology wins approval for Southern 3D packaging plant
The Science Park Review Committee under Taiwan's National Science and Technology Council (NSTC) approved 13 investment projects at its 35th meeting on the 1st, including Nanya Technology's...
Thursday 1 October 2026
Applied Materials' EPIC Center adds Kioxia for AI memory, 3D stacking push
Applied Materials announced that Kioxia will join its Equipment and Process Innovation and Commercialization (EPIC) Center in Silicon Valley, California. The two companies will collaborate...
Thursday 1 October 2026
Speed 3D Showcases On-Device AI Generation with Snapdragon X2 Elite

Speed 3D Inc., a Taiwan-based AI software company specializing in computer vision, generative AI and hardware integration, will showcase Picbot Edge at Snapdragon Summit...

Wednesday 30 September 2026
Inside China's 3D DRAM push: from lab to fab, and the road ahead
China's push into 3D DRAM is moving from early-stage research into wafer processes and equipment, with efforts spanning the Institute of Microelectronics of the Chinese Academy of...
Tuesday 29 September 2026
AMD pays US$8.2 billion for Fei-Fei Li's 3D world-modeling startup to shape future AI chips
AMD has agreed to acquire World Labs, the San Francisco AI research startup led by Fei-Fei Li, in an all-stock deal valued at about US$8.2 billion. The chipmaker says it wants the...
Monday 28 September 2026
Column: For physical AI, maps are turning into memory
A robot that can map a factory floor still cannot necessarily find the box it has been asked to move, or remember what it saw on its last visit. For autonomous robots, building the...
Tuesday 22 September 2026
China's memory race turns inward — CXMT, YMTC head toward patent showdown

Global memory shortages remain severe, with AI and cloud applications intensifying demand for scarce supply. Prices for both DRAM and...

Tuesday 22 September 2026
GUC Announces 2nm 16 Gbps HBM4E IP

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced that its HBM4E PHY and Controller IP is design-ready and has been adopted in customer AI ASICs....

Monday 21 September 2026
SK Hynix pushes deeper into logic for next-generation 3D DRAM

SK Hynix is pushing deeper into logic design as it develops a next-generation 3D DRAM architecture that could separate memory-cell processing...

Thursday 17 September 2026
Samsung bets on zHBM as 2.5D memory nears its limits
Samsung Electronics is betting on vertically stacked zHBM to move memory beyond the physical constraints of conventional 2.5D architectures, setting a system-level target of raising...
Thursday 17 September 2026
Huawei's 3D data center redesign targets the next AI compute density wall
Huawei has unveiled what it calls the world's first 3D data center, introducing a vertically stacked four-layer architecture designed for increasingly dense AI computing clusters and...
Wednesday 16 September 2026
Interview: Forget transistors — speed is what's choking the chip supply chain, says Qnity exec
The global surge in AI demand is accelerating change across the semiconductor industry, and as Moore's Law scaling faces physical limits, chipmaking is no longer only about shrinking...
Sunday 13 September 2026
Column: What is SLAM? The first step in Physical AI
We previously discussed how automation removes environmental uncertainty, while autonomy requires systems to operate in complex settings. The biggest difference is that autonomous...
Thursday 10 September 2026
ITRI to showcase 3.2T silicon photonics and AI data center cooling
Taiwan's 2026 Innovation Technology Expo will run from September 17 to 19 at Taipei World Trade Center Hall 1. The Ministry of Economic Affairs Industrial Development Administration...