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    NEWS TAGGED 3D
    Thursday 4 June 2026
    Tripo AI raises nearly US$200 million to expand 3D and world model research
    Tripo AI said it has completed its Series A+ and Series A++ financing rounds, raising nearly US$200 million as it pushes deeper into AI 3D foundation models and world models.
    Thursday 4 June 2026
    Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging
    Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing...
    Wednesday 3 June 2026
    COMPUTEX 2026 highlights spatial AI for homes and turnkey enterprise edge solutions
    At COMPUTEX 2026 in Taipei, HOMEE AI, Osense Technology, and Senao International unveiled new AI products aimed at shifting deployment from cloud training to real-world inference and...
    Wednesday 3 June 2026
    oToBrite and Turing Drive partner on visual AI for autonomous vehicles
    oToBrite and Turing Drive announced a technology collaboration on June 2 to develop real-world autonomous vehicle applications using vehicle-grade vision AI, which combines oToBrite's...
    Monday 1 June 2026
    Exclusive: TSMC SoIC deepens AI chipmaker lock-in while Huawei hits process wall
    The global semiconductor industry is at an inflection point, split between those who can still shrink transistors and those who can no longer do so. US export controls and the denial...
    Wednesday 27 May 2026
    Huawei Tau Law series 2: Advanced packaging, AI interconnects, EDA lead the way
    Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking,...
    Tuesday 26 May 2026
    Powerchip unveils 3D AI Foundry with 3D WoW DRAM stacking at COMPUTEX 2026
    Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices...
    Tuesday 26 May 2026
    Kioxia targets 2027 BiCS 10 NAND production as Samsung, SK Hynix hold back investment
    Kioxia is targeting 2027 production of its 10th-generation BiCS 10 NAND, a move that could help the Japanese memory maker narrow its technology gap with Samsung Electronics and SK...
    Monday 25 May 2026
    Huawei bypasses 3D NAND limits with 122TB AI SSD packaging breakthrough

    Huawei is using self-developed packaging technology to build ultra-high-capacity enterprise SSDs, underscoring how Chinese technology companies...

    Wednesday 20 May 2026
    China's top NAND flash chipmaker YMTC begins IPO tutoring with Chinese banks
    China's leading memory chipmakers are accelerating their push into public capital markets, with YMTC Group formally entering IPO guidance on May 19, shortly after domestic DRAM leader...
    Thursday 14 May 2026
    Samsung reportedly speeds up 3D NAND, packaging, and substrate plans
    Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates —...
    Wednesday 13 May 2026
    Imec's IC-Link joins TSMC 3DFabric Alliance, extending 3D integration access worldwide
    Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate...
    Monday 11 May 2026
    From Basement to Deep Space: How AON3D is Redefining High-Performance 3D Printing

    Montreal-based AON3D is setting a new standard through its mastery of high-performance materials and precision 3D printing technology.

    Wednesday 6 May 2026
    Taiwan researchers create non-toxic blue-light material that could enable glasses-free 3D displays
    Researchers at National Yang Ming Chiao Tung University announced a new non-toxic, metal-free light-emitting silicone that produces blue fluorescence when mechanically stressed, a...
    Wednesday 6 May 2026
    SoftBank, Intel target HBM limits with 9-layer memory
    SoftBank's memory unit SAIMEMORY is preparing to present a new 3D DRAM technology developed with Intel, as the AI hardware industry seeks ways to ease the power and heat constraints...
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    Research Report Database
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    VIA Labs Announces Hub Controllers for Multi-Display USB-C Docking
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    CPC
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook