Macronix International, a global leader in non-volatile memory (NVM), has announced its participation in electronica 2026, the world's premier electronics trade fair,...
Macronix International posted record profits in the third quarter of 2026, surpassing $10 billion for the first time in company history. Chairman Miin-Chyou Wu announced that the company...
SK Hynix plans to extend the life of its existing 6F-squared DRAM cell architecture through extreme ultraviolet (EUV) lithography and process improvements, keeping 4F-squared and three-dimensional...
South Korean image-sensing module maker Namuga is accelerating its physical AI strategy after securing a supply deal with a global humanoid robot company. The company is preparing...
After GPT-6 Astra launched in early September 2026, researchers quickly put it through Physical AI and robotics benchmarks. In some tests, it outperformed specialized models trained...
Powerchip Semiconductor Manufacturing (PSMC) is urgently expanding its 3D AI foundry business and evaluating new plants in Taiwan, Singapore, and Japan, while exploring strategic joint...
China's Advanced Micro-Fabrication Equipment (AMEC) has shipped the first unit of its Primo Domingo high-selectivity vapor-phase etching system to a major domestic semiconductor research...
Micron does not plan to commercialize 4F² DRAM even as Chinese rival ChangXin Memory Technologies (CXMT) advances the technology, saying the architecture offers limited benefits...
Growing AI computing demand is bringing the semiconductor industry to a technological turning point. Transistor scaling has long driven gains in chip density, performance, and energy...
AI processor performance continues to improve, but memory bandwidth is growing more slowly, making data supply a major constraint on AI chip performance and energy efficiency. Efforts...
SK Hynix is strengthening its metrology and inspection (MI) capabilities as the transition toward 3D DRAM architectures and increasingly complex NAND stacking creates new challenges...
In October 2022, the US Bureau of Industry and Security (BIS) imposed a package of export restrictions on China, including controls on equipment and components for manufacturing 3D...
ASE has expanded its PowerSiP platform with a 3D system-in-package solution aimed at vertical voltage regulator modules (VRMs) for AI data centers and high-performance computing systems...
Huawei has begun mass-producing its Kirin 9050 series with LogicFolding, a 3D chip architecture that improves transistor density and computing efficiency without relying solely on...
China's ChangXin Memory Technologies (CXMT) plans to mass-produce next-generation 4F² DRAM by the end of 2026, potentially ahead of South Korean rivals Samsung Electronics and...
