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NEWS TAGGED 3D
Saturday 5 September 2026
Commentary: China builds three-pronged memory strategy around CXMT, YMTC, XMC
China's memory industry is shifting from a single-champion model towards a three-pronged structure. ChangXin Memory Technologies (CXMT) is building its position in DRAM, Yangtze Memory...
Friday 4 September 2026
TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex
TSMC is calling for future HBM and DRAM designs to become more compatible with X-ray inspection, as increasingly complex advanced packaging makes buried defects harder to detect while...
Friday 4 September 2026
Acer unveils IFA lineup with AI, slim notebooks, sustainability
Acer used its next@acer global press conference in Berlin during IFA to unveil a broad lineup of new products, highlighting its push into AI, sustainability, thin-and-light notebooks,...
Thursday 3 September 2026
China chip tool makers expand beyond import substitution at CSEAC 2026

China's semiconductor equipment industry is moving beyond replacing imported tools at mature nodes, with CSEAC 2026 highlighting deeper...

Thursday 3 September 2026
Fei-Fei Li's World Labs unveils Atlas world model for 3D AI, robotics

World Labs, the startup founded by Stanford professor Fei-Fei Li, has unveiled Atlas, a multimodal world model designed to generate,...

Thursday 3 September 2026
Zeiss deepens Taiwan bet as advanced chip packaging raises the stakes for inspection tools
Zeiss is expanding its Taiwan presence as artificial intelligence (AI) accelerates demand for smaller chips, vertical stacking, and 2.5D and 3D heterogeneous integration. The shift...
Thursday 3 September 2026
UniVista expands China EDA stack with AI agents, native 3DIC tools
Shanghai UniVista Industrial Software Group has launched an Agentic EDA framework, a native 3DIC physical-design tool and an advanced-process closure platform, expanding China's domestic...
Wednesday 2 September 2026
Micron says tightly coupled DRAM could deliver more than 10x HBM bandwidth
Micron Technology is exploring tightly coupled DRAM that could deliver more than 10 times the bandwidth of HBM while using substantially less energy per bit, as the memory maker looks...
Wednesday 2 September 2026
DRAM giants target 3D stacking to break memory wall and power bottlenecks
At a shared stage at Semicon Taiwan 2026, executives from Samsung Electronics, SK Hynix, and Micron agreed that traditional 2.5D high-bandwidth memory (HBM) using interposers is approaching...
Wednesday 2 September 2026
Take Control of Your Process: Onto Innovation at SEMICON Taiwan 2026

This year's SEMICON Taiwan will be packed with discussions about artificial intelligence and the on-wafer challenges it's creating, where the advanced node and emerging...

Tuesday 1 September 2026
Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing

As transistor scaling becomes more difficult and costly, advanced packaging has become one of the most important paths for extending Moore's Law. Technologies such as...

Tuesday 1 September 2026
China specialty foundry XMC plans fourfold capacity growth around 3D integration, silicon photonics
Wuhan Xinxin Semiconductor Manufacturing Company (XMC) has laid out a 10-year expansion strategy centered on 3D integration, silicon photonics (SiPh), and specialty processes, targeting...
Friday 28 August 2026
Samsung eyes zHBM products from 2029 as heat remains key hurdle
Samsung Electronics expects products based on its first-generation zHBM specifications to appear in 2029 or later, giving the 3D memory concept unveiled earlier this month an initial...
Thursday 27 August 2026
Samsung signals zHBF push as memory race moves beyond HBM
Samsung Electronics is signaling a push into high bandwidth flash (HBF), extending its next-generation memory ambitions beyond HBM as rivals move to establish a new NAND-based memory...
Tuesday 25 August 2026
Nvidia and SK Hynix CPO strategies diverge as 3D optics look toward a post-2030 horizon
On August 20, SK Hynix's global research team published a paper in Nature Electronics detailing its co-packaged optics (CPO) development for high-performance computing (HPC)...