Powerchip Semiconductor Manufacturing (PSMC) is urgently expanding its 3D AI foundry business and evaluating new plants in Taiwan, Singapore, and Japan, while exploring strategic joint...
China's Advanced Micro-Fabrication Equipment (AMEC) has shipped the first unit of its Primo Domingo high-selectivity vapor-phase etching system to a major domestic semiconductor research...
Micron does not plan to commercialize 4F² DRAM even as Chinese rival ChangXin Memory Technologies (CXMT) advances the technology, saying the architecture offers limited benefits...
Growing AI computing demand is bringing the semiconductor industry to a technological turning point. Transistor scaling has long driven gains in chip density, performance, and energy...
AI processor performance continues to improve, but memory bandwidth is growing more slowly, making data supply a major constraint on AI chip performance and energy efficiency. Efforts...
SK Hynix is strengthening its metrology and inspection (MI) capabilities as the transition toward 3D DRAM architectures and increasingly complex NAND stacking creates new challenges...
In October 2022, the US Bureau of Industry and Security (BIS) imposed a package of export restrictions on China, including controls on equipment and components for manufacturing 3D...
ASE has expanded its PowerSiP platform with a 3D system-in-package solution aimed at vertical voltage regulator modules (VRMs) for AI data centers and high-performance computing systems...
Huawei has begun mass-producing its Kirin 9050 series with LogicFolding, a 3D chip architecture that improves transistor density and computing efficiency without relying solely on...
China's ChangXin Memory Technologies (CXMT) plans to mass-produce next-generation 4F² DRAM by the end of 2026, potentially ahead of South Korean rivals Samsung Electronics and...
After 2013, planar NAND flash memory began reaching its scaling limits at the 15–16nm process node. Capacitive coupling between the floating gates of adjacent memory cells increasingly...
AI chip manufacturing demands are accelerating development of advanced logic and packaging technologies, prompting Applied Materials and Intel to expand their collaboration on next-generation...
Nanya Technology is stepping up investment in new factory capacity to expand packaging and testing as some customers move into trial production for specification-based designs. The...
The Science Park Review Committee under Taiwan's National Science and Technology Council (NSTC) approved 13 investment projects at its 35th meeting on the 1st, including Nanya Technology's...
Applied Materials announced that Kioxia will join its Equipment and Process Innovation and Commercialization (EPIC) Center in Silicon Valley, California. The two companies will collaborate...
