News tagged 3D at DIGITIMES

NEWS TAGGED 3D

Thursday 10 September 2026

ITRI to showcase 3.2T silicon photonics and AI data center cooling

Taiwan's 2026 Innovation Technology Expo will run from September 17 to 19 at Taipei World Trade Center Hall 1. The Ministry of Economic Affairs Industrial Development Administration...

Thursday 10 September 2026

From cHBM to 3D Stacked SRAM, AI inference drives AI accelerators toward memory architecture innovation

Introduction

Thursday 10 September 2026

SK Hynix says 3D DRAM will borrow from logic foundry playbook

SK Hynix is signaling a shift in memory design that could matter far beyond South Korea. By adopting logic foundry techniques for 3D DRAM, the company is moving toward a future where...

Thursday 10 September 2026

CIOE: Morphotonics draws on display background to break AR waveguide bottlenecks

At the China International Optoelectronic Expo (CIOE), Morphotonics, a Netherlands-based nanoimprint lithography company, made the case that the quickest way to reach affordable AR...

Wednesday 9 September 2026

Backed by Nanya partnership, PieceMakers eyes AI memory upgrade boom

As AI compute requirements scale, memory bandwidth has become a primary bottleneck governing system performance. PieceMakers Technology, which maintains a strategic partnership with...

Monday 7 September 2026

Micron scores seventh PTAB win in YMTC patent fight

Micron Technology has scored a seventh favorable Patent Trial and Appeal Board (PTAB) outcome in its wide-ranging patent fight with China's Yangtze Memory Technologies (YMTC), while...

Monday 7 September 2026

Naura 3D DRAM etching breakthrough could give CXMT a new path beyond EUV

China's Naura Technology has demonstrated a selective etching process for 64-layer 3D DRAM structures, potentially giving domestic memory makers another route to raise transistor density...

Monday 7 September 2026

Huawei Kirin 2026 challenges 3D chip heat limits with Tau Scaling Law

Huawei is using measured data from its upcoming Kirin 2026 processor to challenge a key concern around vertically stacked logic: that higher transistor density inevitably brings more...

Sunday 6 September 2026

Trumpf CTO says advanced packaging reshapes semiconductor equipment race

AI and high-performance computing (HPC) demand is changing the semiconductor industry's technology and investment priorities. As chip power consumption, computing density, and data...

Saturday 5 September 2026

Commentary: China builds three-pronged memory strategy around CXMT, YMTC, XMC

China's memory industry is shifting from a single-champion model towards a three-pronged structure. ChangXin Memory Technologies (CXMT) is building its position in DRAM, Yangtze Memory...

Friday 4 September 2026

TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex

TSMC is calling for future HBM and DRAM designs to become more compatible with X-ray inspection, as increasingly complex advanced packaging makes buried defects harder to detect while...

Friday 4 September 2026

Acer unveils IFA lineup with AI, slim notebooks, sustainability

Acer used its next@acer global press conference in Berlin during IFA to unveil a broad lineup of new products, highlighting its push into AI, sustainability, thin-and-light notebooks,...

Thursday 3 September 2026

China chip tool makers expand beyond import substitution at CSEAC 2026

China's semiconductor equipment industry is moving beyond replacing imported tools at mature nodes, with CSEAC 2026 highlighting deeper...

Thursday 3 September 2026

Fei-Fei Li's World Labs unveils Atlas world model for 3D AI, robotics

World Labs, the startup founded by Stanford professor Fei-Fei Li, has unveiled Atlas, a multimodal world model designed to generate,...

Thursday 3 September 2026

Zeiss deepens Taiwan bet as advanced chip packaging raises the stakes for inspection tools

Zeiss is expanding its Taiwan presence as artificial intelligence (AI) accelerates demand for smaller chips, vertical stacking, and 2.5D and 3D heterogeneous integration. The shift...

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Sep 11, 08:00

DAS Expands in Taiwan and Unveils World First at SEMICON

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