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NEWS TAGGED PACKAGING
Wednesday 2 September 2026
SEMICON Taiwan 2026 signals a broader race for AI-era semiconductor leadership
SEMICON Taiwan 2026 will draw more than 1,300 companies and 4,300 booths to Taipei from September 2 to 4, setting new records as the industry show expands beyond chipmaking into packaging,...
Wednesday 2 September 2026
Apple's M6 and M5 Ultra break rule tying process to chip strength
Apple has unveiled new Mac mini and Mac Studio models, equipped respectively with its first 2-nanometer chip, the M6, and the four-die M5 Ultra. Most notably, the latest 2-nanometer...
Wednesday 2 September 2026
Innolux targets advanced packaging with debut of Chip Last tech
Driven by the rapid growth of AI, high-performance computing (HPC), and automotive electronics, semiconductor architecture is shifting toward high-efficiency chiplets and heterogeneous...
Wednesday 2 September 2026
AI packaging demand surges, ASE EVP identifies two manufacturing bottlenecks
On the eve of the official opening of SEMICON Taiwan 2026, the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA), initiated by SEMI, TSMC, and ASE, held the 3DIC Global Summit on...
Wednesday 2 September 2026
World Diamond Technology accelerates mass production of 300 mm diamond wafers

As AI, high-performance computing (HPC), and advanced packaging continue to move toward higher levels of power integration, chip power consumption is rising rapidly....

Wednesday 2 September 2026
Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry

Taiwan is home to the world's most advanced semiconductor ecosystem. The island produces over 60% of global contract chip manufacturing and dominates key segments from...

Wednesday 2 September 2026
Manz Asia Broadens ECD Platform for Mass Panel-Level Packaging

Rapid evolution of High-Performance Computing (HPC) and artificial intelligence chips for Hyperscalers and tech giants continue pushing large sized silicon demands. As...

Wednesday 2 September 2026
Nvidia pushes into HBM base dies as NVHBM battle heats up
The competition in high-bandwidth memory (HBM) is moving beyond DRAM stack height, bandwidth, and packaging to the base die at the very bottom of the package. As Nvidia pushes its...
Tuesday 1 September 2026
Samsung Electro-Mechanics takes glass substrates to Semicon Taiwan
As AI packages grow larger, the next substrate battleground is rapidly extending from traditional organic materials to glass. Samsung Electro-Mechanics (SEMCO) will make its first...
Tuesday 1 September 2026
TSMC delays CoWoS orders as CoPoS plans take shape
TSMC's reported delay in placing 2027 advanced packaging equipment orders has sparked market speculation that the company sees excess CoWoS capacity ahead. But equipment suppliers...
Tuesday 1 September 2026
JCET lifts 2026 capex to CNY10 billion as AI packaging demand outruns forecasts
JCET Group is sharply increasing spending as demand for artificial intelligence strains advanced packaging capacity worldwide. The Chinese chip tester and assembler said the shift...
Tuesday 1 September 2026
Taiwan's G2C+ Alliance members target global markets
Artificial intelligence (AI) chips are driving a new wave of integration competition among Taiwan semiconductor equipment makers. Taiwan's G2C+ strategic alliance, comprised of C Sun,...
Tuesday 1 September 2026
Semicon Taiwan 2026 to spotlight AI-driven semiconductor supply chain shifts
Semicon Taiwan 2026 is set to open soon as Semiconductor Equipment and Materials International said AI is pushing a new wave of technology upgrades across the global chip industry...
Tuesday 1 September 2026
Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing

As transistor scaling becomes more difficult and costly, advanced packaging has become one of the most important paths for extending Moore's Law. Technologies such as...

Tuesday 1 September 2026
Chinese OSAT earnings surge on AI packaging demand, but recurring profit tells a narrower story
Five listed Chinese outsourced semiconductor assembly and test providers reported first-half 2026 results in the last two weeks of August, showing net profit growth of up to 317%,...