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    Taiwan's defense advances toward system warfare with integrated command platforms
    7h 26min ago
    Nexperia supply chain crisis eased but risks remain, Taiwan firms deepen long-term cooperation
    7h 27min ago
    Commentary: Tesla's AI5 chip dual foundry strategy is an double edge sword
    7h 27min ago
    China's Goke Microelectronics raises KGD memory prices up to 80%, may hike further in 2Q26
    7h 27min ago
    China accelerates auto semiconductor catch-up; Taiwan targets high-end market to avoid price wars
    7h 27min ago
    China dominates CES 2026 humanoid robot showcase, South Korea matches US presence
    7h 27min ago
    NEWS TAGGED PACKAGING
    Tuesday 27 January 2026
    TSMC and Nvidia ignite AI growth, Taiwan supply chain accelerates expansion
    With strong demand for AI servers, TSMC—holding the vast majority of AI chip orders—is executing major expansions in advanced process technology and packaging capacity...
    Tuesday 27 January 2026
    Column: From black-and-white TVs to AI chips, Taiwan's export leadership continues
    Taiwan's information and communications technology (ICT) sector—dominated by the semiconductor industry and Electronics Manufacturing Services (EMS)—accounted for 65.2%...
    Tuesday 27 January 2026
    China reportedly enters semiconductor glass substrate market
    China is moving into the semiconductor glass substrate market, with both chip-related suppliers and display makers entering the field, according to Korean industry reports.
    Tuesday 27 January 2026
    Micron breaks ground on US$24 billion advanced NAND fab in Singapore
    Micron has started construction on an advanced wafer fabrication facility at its existing NAND manufacturing complex in Singapore, marking a planned investment of approximately US$24...
    Monday 26 January 2026
    India roundup: India's semiconductor ambitions face hurdles echoing SEA as local IC design sector strives to grow
    With Micron's ATMP facility moving into commercial production and fresh investments from domestic players, India's semiconductor push is gaining firmer footing. However, despite its...
    Saturday 24 January 2026
    China advances T1000 carbon fiber supply chain for semiconductor materials
    As the global semiconductor industry pushes forward with advanced processes, heterogeneous integration, and cutting-edge packaging, competition now extends beyond process nodes to...
    Saturday 24 January 2026
    Energy limits AI growth; geopolitical stakes in rare earths, new packaging innovations reshape global supply chains
    The Global Electronics Association's latest "2026 Electronics Industry Trend Forecast" highlights critical challenges and shifts that will impact the sector over the next few years...
    Friday 23 January 2026
    ASML leads chip equipment charge into advanced packaging
    Global semiconductor equipment suppliers are accelerating their push into advanced packaging. They are positioning back-end processes as a new growth engine as artificial intelligence...
    Friday 23 January 2026
    Analysis: How Howard Lutnick is redrawing the memory-chip map

    US Commerce Secretary Howard Lutnick is driving a fundamental reordering of the global semiconductor supply chain. According to exclusive...

    Friday 23 January 2026
    TSMC reveals dual purpose behind Chiayi AP7 plant as Yunlin expansion looms
    TSMC has significantly expanded its advanced packaging capacity in recent years to meet surging AI customer demand. Despite planning six to eight phases for the Chiayi site, internal...
    Friday 23 January 2026
    Intel slows its most ambitious node—and signals where the real battle is for now
    Intel is sharpening its manufacturing strategy around yield improvement, selective capital spending, and differentiated advanced packaging, while keeping major 14A capacity investments...
    Friday 23 January 2026
    HBF likely overtaking HBM market by 2038 as commercialization speeds up

    High-Bandwidth Flash (HBF) is likely to reach commercialization sooner than previously expected and could become a key technology supporting...

    Thursday 22 January 2026
    Taiwanese firms prepare for silicon photonics and CPO packaging opportunities as AI data center continues growth
    As generative AI technologies scale up, the semiconductor industry is poised for a significant transition from copper-based interconnects to optical solutions to meet the stringent...
    Thursday 22 January 2026
    Lutnick warns memory chipmakers may face 100% tariffs without US production

    Samsung Electronics and SK Hynix have been investing tens of trillions of won each year to expand memory production as the global market...

    Thursday 22 January 2026
    India-based Paras Defence enters semiconductor packaging with new subsidiary
    Paras Defence and Space Technologies Ltd. announced the launch of a new subsidiary, Paras Semiconductor Pvt. Ltd., marking the company's expansion into the semiconductor packaging...
    1/41 pages
    NTN special report
    BIZ FOCUS
    Jan 6, 16:39
    MSI Unveils Full Lineup of AI Products at CES 2026
    Tuesday 6 January 2026
    SK hynix Showcases Next Generation AI Memory Innovation at CES 2026
    Tuesday 6 January 2026
    Mobilint Brings Award-Winning Edge AI Hardware to the Global Stage at CES 2026
    Tuesday 6 January 2026
    Skyted's Sound Bubble at CES 2026
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook