France's push into Taiwan's tech ecosystem has entered a new phase. After three years of cultural outreach and research exchanges,...

TSMC's July 16 earnings call is likely to test how far the chipmaker can extend its already upbeat guidance, as investors look for...

Samsung Electronics is using HBM4 to test whether its memory, logic, foundry, and advanced packaging businesses can finally work as...

Onsemi is selling two manufacturing facilities in the Philippines and the US to cut fixed costs, streamline its global production network...

AI server demand is lifting shipments of motor-related power devices at Cystech Electronics, helping the Taiwanese MOSFET and diode designer...

Huawei's next-generation flagship Mate 90 smartphone series has reportedly entered the chip packaging and testing stage, according...

Nvidia and other artificial intelligence chipmakers are still facing shortages as TSMC's advanced-node and CoWoS packaging capacity...

Corning has unveiled an early-stage fiber-to-chip connector concept that could reshape optical packaging if it matures, though the...

LG Chem has begun supplying semiconductor strippers to Amkor Technology, a major US-based packaging and testing provider, in its first...

SK Group, Samsung Electronics, and Amkor will invest a combined KRW896 trillion (US$585.2 billion) to build South Korea's second major...

SJ Semiconductor has started construction of a CNY10 billion (approx. US$1.47 billion) 3DIC manufacturing project in Shanghai's Lingang...