中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    Microsoft flattens leadership to speed AI decision-making across businesses
    1min ago
    Luxshare projects multi-year AI infrastructure surge while flagging energy and standards challenges
    3min ago
    Former Tencent AI lead says Chinese firms are trailing US on core LLM innovation
    7min ago
    Acer sees CPU shortages worse than memory as 2H24 PC market weakens
    May 26, 18:10
    Grab bets on agentic AI to reshape Taiwan's food delivery market with foodpanda acquisition
    May 26, 18:10
    Huawei’sTau Law breath new air into China's advanced packaging
    May 26, 17:50
    Taiwan's Wah Lee expands into specialty gases as materials costs are passed on quarterly
    May 26, 17:50
    CSP capex surge fuels hot AI server demand and tight supply in 2026
    May 26, 17:50
    Google and Blackstone form AI cloud venture to commercialize TPU capacity
    May 26, 17:50
    Taiwan's SAS breaks out of China's low-price solar trap with space, drone, and marine applications
    May 26, 17:50
    Intel 18A yield gains raise pressure on Samsung foundry
    May 26, 17:50
    NEWS TAGGED PACKAGING
    Wednesday 27 May 2026
    Broadcom and Taiwan's chipmakers ride ASIC wave
    The world's largest chip designers are steadily growing more bullish on the future of cloud artificial intelligence (AI) chips known as ASICs (application-specific integrated circuits)...
    Wednesday 27 May 2026
    AI infrastructure spending lifts Taiwan electronics sector outlook
    Cloud providers' large-scale investments in AI infrastructure have strengthened demand for Taiwan's electronics supply chain, boosting optimism among local manufacturers, according...
    Wednesday 27 May 2026
    Quality Innovation Powering AI: ZEISS Brings Quality to COMPUTEX Forum for the First Time

    ZEISS, a global leader in optics and optoelectronics, will bring the quality discussion to the official COMPUTEX 2026 Forum stage for the first time this year, highlighting...

    Wednesday 27 May 2026
    Huawei Tau Law series 2: Advanced packaging, AI interconnects, EDA lead the way
    Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking,...
    Tuesday 26 May 2026
    The US$16.5 Billion Bet: How Co-Packaged Optics Will Rewire AI's Backbone by 2030
    As AI clusters continue to scale, traditional interconnect architectures are facing new limits in bandwidth, power efficiency, and system integration. Co-Packaged Optics is emerging...
    Tuesday 26 May 2026
    AMD and Nvidia deepen investments in Taiwan semiconductor ecosystem

    When AMD CEO Lisa Su arrived in Taiwan on May 20, she announced plans to invest more than US$10 billion with local supply-chain partners...

    Tuesday 26 May 2026
    Intel's Rio Rancho fab becomes test case for AI-era chip packaging
    Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions...
    Tuesday 26 May 2026
    Huawei eyes AI storage breakthrough with DoB packaging, 245TB SSD roadmap
    Huawei has released its Data Storage 2030 white paper, setting out a technology roadmap for the global storage industry over the next five to...
    Tuesday 26 May 2026
    GUC showcases VSORA Jotunn8 AI processor at TSMC Europe Symposium

    Global Unichip Corp. (GUC), the Advanced ASIC Leader, will showcase Jotunn8, a next-generation data center AI inference processor developed by VSORA, at the TSMC Europe...

    Tuesday 26 May 2026
    Powerchip unveils 3D AI Foundry with 3D WoW DRAM stacking at COMPUTEX 2026
    Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices...
    Monday 25 May 2026
    Nvidia's reporting pivot and AMD's US$10B Taiwan bet signal a new frontier in AI chip war
    Nvidia's structural pivot to isolate its ACIE market and AMD's US$10 billion investment in Taiwan infrastructure signal a profound realignment in the AI chip war. Both developments...
    Monday 25 May 2026
    Lam Research CEO: New fabs alone will not solve chip bottlenecks
    Lam Research CEO Tim Archer said artificial intelligence and robotics can help chipmakers improve fab productivity as the semiconductor industry faces memory capacity constraints,...
    Monday 25 May 2026
    Nan Pao joint venture nears full capacity as semiconductor demand rises

    Nan Pao Resins Chemical is accelerating its push into the high-end semiconductor materials market through a joint venture with Advanced...

    Monday 25 May 2026
    Huawei bypasses 3D NAND limits with 122TB AI SSD packaging breakthrough

    Huawei is using self-developed packaging technology to build ultra-high-capacity enterprise SSDs, underscoring how Chinese technology companies...

    Monday 25 May 2026
    Weekly news roundup: TSMC faces its first real rivals; Agibot claims 100% success rate in factory deployment
    Below are the most-read DIGITIMES Asia stories from the week of May 18-24, 2026:
    1/53 pages
    CPC
    BIZ FOCUS
    Apr 28, 08:00
    AI anti-fraud solution wins virtual asset security hackathon
    Monday 27 April 2026
    Anti-fraud hackathon winner showcases multi-dimensional tech-nology framework
    Monday 27 April 2026
    SK hynix receives 2026 IEEE Corporate Innovation Award
    Friday 24 April 2026
    NewPower Named HPE 2026 Partner of the Year
    marketing
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook