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NEWS TAGGED PACKAGING
Friday 20 March 2026
Intel pushes large-area AI packaging to close foundry gap
Intel is reportedly preparing large-area AI chip packaging to strengthen its foundry business and challenge TSMC and Samsung Electronics.
Thursday 19 March 2026
Intel to expand EMIB capabilities in Malaysia amid Section 232 probe uncertainty
Intel's advanced packaging complex in Malaysia is expected to begin operations later this year, Prime Minister Datuk Seri Anwar Ibrahim said, as the company advances its assembly and...
Thursday 19 March 2026
How Hwaseong became South Korea's semiconductor supply-chain capital
The global race to onshore semiconductor production has a new focal point: Hwaseong. Nestled in South Korea's Gyeonggi-do province, the city is quietly emerging as the spine of the...
Wednesday 18 March 2026
Rohm eyes India as emerging hub for power semiconductor packaging and automotive supply
Japanese semiconductor maker Rohm is expanding its engagement with India's nascent semiconductor manufacturing ecosystem, positioning the country as a potential future export base...
Wednesday 18 March 2026
Jensen Huang's survival playbook: Nvidia navigates the next AI frontier
At GTC 2026, Nvidia CEO Jensen Huang delivered a blunt message to an industry fixated on raw compute: the next bottleneck in AI is not the chip — it is everything around it....
Wednesday 18 March 2026
Chipbond sets sights on SiPh and LPO for next phase of growth
Display driver IC (DDIC) packaging leader Chipbond outlined three key growth drivers at its recent earnings call that are expected to support its core driver IC business despite industry...
Monday 16 March 2026
Taiwan OSAT firms log double-digit annual growth despite slow season
Benefiting from the continued expansion of AI applications, demand for chips used in high-performance computing (HPC), memory, networking, and smartphones has grown simultaneously,...
Monday 16 March 2026
CMMT pushes ahead into semiconductor materials despite polarizer headwinds
Cheng Mei Materials Technology (CMMT), a Taiwan-based polarizer manufacturer, remains loss-making but has stepped up efforts to reposition itself as a semiconductor materials supplier...
Monday 16 March 2026
GEM Services upgrades copper clip bonding for AI server dual-sided cooling
Taiwan-based power semiconductor packaging and testing firm GEM Services has announced advancements in its copper clip bonding technology to meet growing demand for enhanced cooling...
Monday 16 March 2026
Weekly news roundup: Memory crunch, AI supply chains, new manufacturing hubs
Below are the most-read DIGITIMES stories from the week of Mar 9-15, 2026:
Sunday 15 March 2026
Niching sees AI-driven thermal products lift early 2026 revenue despite Lunar New Year slowdown
Semiconductor packaging and testing material supplier Niching Industrial Corp. reported NT$200 million (approx. US$6.29 million) in revenue for January and February 2026, a year-over-year...
Friday 13 March 2026
GUC outperforms as design services navigate volatility

Global Unichip Corp. (GUC) emerged as a standout performer in the design services sector for February 2026, reporting revenue of NT$3.4 million...

Friday 13 March 2026
Exclusive: Inside GlobalFoundries CEO's stealth Taiwan blitz: wafer deals, not a UMC takeover
Tim Breen, who became GlobalFoundries' CEO in 2025, reportedly led a senior delegation to Taiwan this week for a five-day visit. The group held intensive meetings with supply chain...
Thursday 12 March 2026
Daxin expands capacity to meet rising semiconductor material demand
Daxin, a key player in semiconductor materials, has seen rapid growth in recent years. Currently, wafer process materials account for a larger share of revenue than advanced packaging...
Wednesday 11 March 2026
ASE breaks ground on AI advanced packaging site in Southern Taiwan, set for 2Q28 completion
ASE Technology Holding has broken ground on its third technology park in Nanzi, Kaohsiung, focused on advanced semiconductor packaging and smart logistics, with construction to start...