SEMICON Taiwan 2025 gathered a wide range of packaging and test equipment suppliers, all unveiling their latest technologies and solutions. Central to the event was the emerging "advanced...
Chinese chip equipment maker Piotech said on September 12 its unit Piotech Jianke (Haining) Semiconductor Equipment has kicked off a new funding round at a CNY2.5 billion (approx...
The magnetic pull of TSMC is making waves, as the upcoming SEMICON West exhibition scheduled for October 7, 2025, at the Phoenix Convention Center in Arizona, is poised to reach record...
Recent market reports indicate that CoWoP has shown preliminary test results exceeding expectations. Nvidia, which leads its development, is expected to accelerate mass production...
India's push to establish itself as a semiconductor hub is beginning to yield results in the back-end packaging segment, with Suchi Semicon moving from presentation slides to actual...
To accelerate the development of heterogeneous integration and advanced packaging technologies, the "3DIC Advanced Manufacturing Alliance" was officially established on September...
Malaysia is emerging as a key beneficiary of the intensifying US-China technology rivalry, attracting billions in foreign investment as it seeks to cement its role as a critical player...
At SEMICON Taiwan 2025, AMD Fellow Daniel Ng, who heads the company's OSAT technology development, laid out a stark assessment of the semiconductor industry's next bottleneck: the...
The rising demand for AI servers and high-end GPUs has fueled growth in large-size 2.5D interposers, and Hanmi Semiconductor is moving quickly to capture this opportunity. At SEMICON...
Hanwha Semitech has announced a new strategic roadmap to strengthen its position in the advanced semiconductor packaging equipment market, unveiling next-generation systems set to...
Nitto Denko has entered a joint development agreement with IBM to explore advanced packaging technologies and materials for semiconductor applications. The partnership will focus...
Fan-out panel-level packaging (FOPLP) is poised to become the next-generation advanced packaging technology, driving industry competition and research investment. Leading outsourced...
Merck has pointed out that the semiconductor industry's growth curve has reached a combined output value of EUR650 billion (US$760.4 billion) and is expected to surpass EUR1 trillion...
ACM Research (Shanghai), Inc., dual-listed in the US and China, is maneuvering through Washington's escalating curbs on China's chip industry. Chairman David Wang emphasized that...
The global semiconductor industry is experiencing steady growth, driven by advances in wafer processing and packaging technologies. In line with this trend, Tongtai Machine &...
