Biwin Storage Technology plans to invest CNY4.5 billion (approx. US$672 million) in the third phase of its wafer-level advanced packaging...
Nexperia China is accelerating production on its domestic 12-inch wafer platform as it rebuilds a locally controlled semiconductor supply...
Rising demand for advanced packaging tied to AI and high-performance computing (HPC) is driving development at Baipu Industrial Park...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced that its HBM4E PHY and Controller IP is design-ready and has been adopted in customer AI ASICs....
Leading Interconnect Semiconductor, a Zhen Ding Technology subsidiary, has broken ground on an AI advanced packaging substrate project...
Tower Semiconductor plans to make Japan its largest manufacturing base for optical communications semiconductors after expanding silicon...
China's fast-rising AI models are running into a compute supply bottleneck as demand for advanced packaging substrates surges, with...
