China's leading OSAT player, JCET, reported solid first-quarter 2026 results, supported by demand in high-performance computing and automotive electronics, even as the broader semiconductor...
Workloads are shifting from training to inference. In this transition, CPUs are regaining a central role in coordinating diverse computing tasks, significantly boosting their importance...
Optical communication technology is shifting from traditional pluggable optics toward co-packaged optics (CPO) architectures. Advanced packaging technologies are extending from wafer-level...
Nvidia's next-generation AI platform Vera Rubin is approaching mass production, with a key architectural shift favoring low-power DRAM. Sources familiar with the matter say Nanya Technology...
Amkor Technology is off to a record start in 2026. First-quarter revenue hit US$1.68 billion, up 27% from the prior year, driven by record performance in AI data center applications...
Nvidia CEO Jensen Huang clarified in an April 2026 interview with Silicon Valley podcast host Dwarkesh Patel that the company allocates GPUs based on a first-come, first-served principle...
The Trump administration continues to push for reshoring the semiconductor industry to the US. As global foundry giants TSMC, Intel, and Samsung Electronics expand advanced manufacturing...
China's central tech hub Wuhan has unveiled its 2026 major project plan, targeting 355 city-level projects with total investment exceeding CNY260 billion (approx. US$38.1 billion).
Amkor Technology reported a strong start to 2026, with management attributing the performance to robust demand across multiple end markets and continued execution in advanced packa...
Innolux is expanding into the advanced semiconductor packaging sector, leveraging display technology as its core platform to accelerate integration with semiconductor and IoT technologies...
In recent weeks, chip companies ranging from major players to small and medium-sized firms have issued price increase notices or begun renegotiating product prices with select customers...
The semiconductor packaging equipment sector is experiencing order shifts linked to significant executive changes at a key Taiwanese supplier, raising concerns over TSMC's chip-on-wafer-on-substrate...
