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    NSIG chair exit brings leadership succession into focus
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    China's generative AI user base tops 700 million, driving adoption into manufacturing and humanoid robots
    15min ago
    NEWS TAGGED PACKAGING
    Wednesday 30 September 2026
    CXMT's US$5.2 billion buildout deepens China's push for domestic DRAM equipment
    China's largest dynamic random-access memory (DRAM) maker ChangXin Memory Technologies (CXMT) is accelerating a CNY34.9 billion (US$5.2 billion) expansion aimed at chipmaking equipment,...
    Wednesday 30 September 2026
    Foundry 2.0 revenue hits record as growth spreads beyond TSMC
    Global Foundry 2.0 market revenue reached a record US$96.6 billion in the second quarter of 2026, up 25% year-over-year and 11% sequentially, as semiconductor demand tied to data-center...
    Wednesday 30 September 2026
    Linde secures Sanand land as global materials suppliers race to localize for India's first fabs
    India's chip push is drawing the materials layer of the supply chain onshore. With Tata Electronics' Dholera fab and a cluster of packaging plants in Sanand under way, suppliers of...
    Wednesday 30 September 2026
    AMD's Lisa Su reportedly revisiting South Korea in October to deepen HBM4, NPU ties
    Advanced Micro Devices (AMD) CEO Lisa Su is reportedly set to visit South Korea again in October 2026, after her March 2026 trip, which formally launched next-generation AI memory...
    Wednesday 30 September 2026
    GlobalFoundries Singapore capacity utilization tops 90% as silicon photonics expansion hits equipment lead-time bottleneck
    GlobalFoundries (GF) is expanding its Singapore footprint following its acquisition of local silicon photonics foundry Advanced Micro Foundry (AMF), integrating 200mm and 300mm silicon...
    Wednesday 30 September 2026
    Powering Next-Gen AI: Materials Enabling Advanced Packaging's Future

    As artificial intelligence (AI) and high-performance computing (HPC) drive unprecedented demands on semiconductor performance, materials are playing an increasingly critical...

    Tuesday 29 September 2026
    SoftBank subsidiary Saimemory taps Shinko to bring ZAM closer to commercialization
    Saimemory, a SoftBank subsidiary, has brought Shinko Electric Industries into its effort to commercialize Z-Angle Memory (ZAM), adding packaging-substrate, high-density integration...
    Tuesday 29 September 2026
    In global semiconductor race, Singapore bets on critical, mature technologies
    Amid the ongoing restructuring of the global semiconductor supply chain, Singapore is focusing on advanced packaging, heterogeneous integration, silicon photonics, and optical interconnects,...
    Tuesday 29 September 2026
    Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal

    At Singapore's Innovate Together 2026 conference on September 25, executives and researchers from A*STAR's Institute of Microelectronics...

    Tuesday 29 September 2026
    Beyond 16 layers: HBM stacks test advanced packaging equipment makers
    At Singapore's Innovate Together 2026 conference on September 25, equipment makers including ASM, ASMPT, and KLA said the challenges facing next-generation advanced packaging are expanding...
    Tuesday 29 September 2026
    SK Hynix tests HBM5 with TSMC as HBM4 enters Nvidia's next platform

    SK Hynix has validated its HBM5 memory with TSMC's CoWoS packaging, the company said in a September 28 post on its corporate newsroom...

    Tuesday 29 September 2026
    Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard
    As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging...
    Tuesday 29 September 2026
    Behind CoWoS (part 1)—How a 0% yield crisis led to TSMC's first advanced packaging win
    In a recent interview on the DIGITIMES podcast, Dr. Shin-Puu Jeng, chairman of the International Microelectronics and Packaging Society (IMAPS) and a former longtime TSMC...
    Monday 28 September 2026
    South Korea's HBM-linked exports surge as Taiwan, Malaysia emerge as high-value destinations

    South Korea's exports of the customs category that carries high-bandwidth memory (HBM) are no longer a two-destination story. Unit-value...

    Monday 28 September 2026
    Weekly news roundup: China gains ground in memory and AI hardware as supply stays tight
    China's AI sector is shifting from catch-up to commercialization, with value concentrating in hardware bottlenecks and large platforms rather than independent model labs. Across memory,...
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    Wednesday 30 September 2026
    AI Memory & Storage: The 5th GMIF2026 Innovation Summit Concludes
    Wednesday 30 September 2026
    Powering Next-Gen AI: Materials Enabling Advanced Packaging's Future
    Tuesday 29 September 2026
    Breaking free from keyword constraints: GeoGraph elevates job matching
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