China's semiconductor investment is once again converging in Wuhan. YMTC's Phase III fab has entered an intensive equipment installation phase, with key process tools steadily moving...
TSMC has made a significant change in its process plan for the Kumamoto second fab, confirming an upgrade from the initially planned 6/7nm node to 3nm. This facility will become Japan's...
OSAT leader ASE Technology Holding is optimistic that its growth momentum will extend through 2026 and beyond, benefiting from the short supply of advanced packaging and testing capacity...
Given frequent price increases across precious metals, wafer foundry services, and packaging and testing, Infineon's announcement of price increases is very telling for the market...
Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding held its earnings call, revealing that robust demand for advanced semiconductor packaging services...
Amid rising wafer fab and raw material costs, Chinese MCU maker Cmsemicon led a 15-50% price increase to curb losses in the sluggish MCU market. Despite packaging firms signaling price...
As advanced packaging technologies continue to evolve toward larger sizes and panel formats, Skytech CEO George Yi stated that in response to the key process requirements of next-generation...
Texas Instruments (TI), Infineon Technologies AG, STMicroelectronics, and NXP Semiconductors are expanding their manufacturing footprint in Malaysia as global customers accelerate...
Samsung Electronics and SK Hynix have both secured production-ready technology for 16-layer stacks of sixth-generation high-bandwidth memory, known as HBM4, positioning the two South...
Memory packaging giant Powertech Technology is aggressively expanding into fan-out panel-level packaging (FOPLP), with chairman Duh-Kung Tsai optimistic about the AI industry. Amid...
Semiconductor and printed circuit board (PCB) equipment maker C Sun announced plans to invest approximately NT$1.48 billion (US$46.87 million) to acquire a nearly 3,000-ping (106,750...
Geopolitical tensions between the Netherlands and China led to Nexperia halting shipments at the end of 2025, raising concerns over potential disruptions in the automotive semiconductor...
Japanese materials maker Sumitomo Bakelite has announced plans to acquire the materials business of Japanese electronic components company Kyocera. Industry observers say the companies'...
As Intel, Samsung Electronics, and TSMC increase investment in advanced packaging, market sources say SMIC has set up an advanced packaging research organization in Shanghai, with...
ASE Technology Holding is accelerating capacity expansion across multiple locations to meet rising demand for advanced packaging and testing services, with projects underway in northern,...
