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Friday 12 June 2026
Samsung's packaging gap clouds chip comeback as TSMC, Intel push ahead

Samsung Electronics is regaining ground in high-bandwidth memory and foundry services, but advanced packaging remains a weak point...

Friday 12 June 2026
Sigurd revenue hits record as AI and chip demand lift operations

Sigurd announced that its May revenue reached a historic high, driven by overseas customer expansion, stronger demand for AI-related...

Friday 12 June 2026
PCIM 2026: Overcoming thermal warping in direct-cooled EV power modules
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing...
Friday 12 June 2026
Taiwan OSAT firms gain from AI chip demand and foundry spillover
The global push for AI and HPC chips is tightening advanced packaging capacity and lifting orders for outsourced semiconductor assembly and test providers. For international customers...
Thursday 11 June 2026
Amkor Korea weighs KRW1 trillion Gwangju expansion amid reported TSMC order growth

Amkor Technology Korea is considering investing about KRW1 trillion (approx. US$650 million) to expand its chip packaging and testing...

Thursday 11 June 2026
Applied Materials CEO: AI reshapes semiconductor innovation
Applied Materials said artificial intelligence (AI) is reshaping the global semiconductor industry and could drive years of heavy investment in chipmaking, packaging, and materials...
Thursday 11 June 2026
Commentary: TSMC's pricing power stays intact as AI demand keeps fabs full
Market chatter about TSMC has intensified, with reports that its advanced process and packaging prices will rise again in the second half of 2026 and 2027, while some Google TPU production...
Wednesday 10 June 2026
TSMC's May revenue grows 30% as AI demand and tight capacity support outlook
TSMC reported consolidated net revenue of about NT$416.98 billion (approx. US$13.2 billion) in May 2026, up 1.5% from April and 30.1% from a year earlier. The figure set a new monthly...
Wednesday 10 June 2026
Samsung weighs Gwangju packaging plant as power strains Seoul-area chip expansion

Samsung Electronics is considering building an advanced semiconductor packaging facility in the southwestern city of Gwangju, a move that...

Wednesday 10 June 2026
Chang Wah says semiconductor inventory correction has ended, sees 2026 sales growth
Chang Wah Technology has declared that the global semiconductor inventory correction has ended, with demand recovering in industrial control, networking, and AI data center power management...
Wednesday 10 June 2026
WinWay revenue rises on AI and HPC demand
WinWay Technologies said shipments linked to artificial intelligence, high-performance computing, central processing units, and application processors lifted consolidated revenue to...
Tuesday 9 June 2026
PCL Technologies targets CPO as Penang plant nears completion
Optical communications maker PCL Technologies is expanding into high-power laser packaging, with its new Malaysia plant on track to pass customer certification by the end of 2026....
Tuesday 9 June 2026
Commentary: COMPUTEX 2026 shows AI race moving from GPUs to ecosystems
One of the clearest shifts at COMPUTEX 2026 was that suppliers across the AI supply chain were no longer talking only about GPUs. The conversation has moved toward how CPUs, GPUs,...
Tuesday 9 June 2026
TSMC capacity crunch pushes Google, Nvidia closer to Intel
TSMC's AI capacity crunch is giving Intel its clearest opening in years to re-enter the most advanced chipmaking race, with Google and Nvidia exploring Intel as a potential backup...
Tuesday 9 June 2026
SK Hynix orders Hanmi equipment for HBM4 capacity buildout
SK Hynix has ordered new HBM4 production equipment from Hanmi Semiconductor, a clear signal that the South Korean memory maker is moving deeper into capacity expansion as Nvidia demand...