News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Friday 5 June 2026

AI demand strains PCB supply chains, lead times stretch past 20 weeks

Explosive demand for artificial intelligence is widening supply chain bottlenecks for global electronics makers, with shortages now reaching from advanced chips and packaging into...

Friday 5 June 2026

US targets China's PCB grip as AI and defense supply risks mount

As demand for artificial intelligence (AI) computing expands rapidly, market attention has long centered on GPUs, high-bandwidth memory (HBM), and advanced packaging. However, printed...

Friday 5 June 2026

Marvell says SerDes and packaging are key hurdles in switch chip development

Marvell says the next gains in switch chip performance will depend on faster SerDes and better packaging — issues that affect network capacity, signal quality, and cost across...

Friday 5 June 2026

Commentary: Memory boom driven by DRAM now, but HBM will decide future

AI demand is fueling a broad semiconductor upswing and pushing the memory industry into what many see as a long-awaited super-cycle. Samsung Electronics and SK Hynix have both reported...

Thursday 4 June 2026

TSMC shareholders clear record 2025 results, putting AI capacity roadmap in focus

TSMC shareholders approved the company's 2025 business report and financial statements at its 2026 annual shareholders' meeting on June 4, giving investors a formal look at a year...

Thursday 4 June 2026

LG Innotek targets Intel EMIB substrate chain with SK Hynix samples

LG Innotek is seeking to enter the supply chain for substrates used in Intel's EMIB advanced-packaging technology, supplying early samples...

Thursday 4 June 2026

HBM4 supply in focus as SK's Chey meets TSMC's Wei

SK Group chairman Chey Tae-won met TSMC chairman C.C. Wei in Taiwan on June 3, as SK Hynix and TSMC map out future cooperation in HBM4 base dies, advanced logic processes, and custom...

Thursday 4 June 2026

Applied Materials to add 1,000 Southeast Asia jobs as Singapore role grows

Applied Materials plans to expand its Southeast Asia workforce by about 25% this year, adding at least 1,000 workers mainly in Singapore...

Thursday 4 June 2026

Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging

Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing...

Thursday 4 June 2026

SK and TSMC deepen HBM, advanced packaging tie-up

SK Group Chairman Chey Tae-won met TSMC Chairman C.C. Wei in Taiwan on June 3, as the two sides exchanged views on the latest trends in next-generation AI technologies and discussed...

Thursday 4 June 2026

Interview: Andhra Pradesh moves to become India's semiconductor packaging hub

Andhra Pradesh is making its most concrete move yet in semiconductors, zeroing in on packaging as the immediate entry point into the chip supply chain. Speaking on the sidelines of...

Thursday 4 June 2026

Huawei's Tau Law exposes China's EDA gap; Empyrean advances memory chip design tools

Huawei's recently proposed Tau Law has drawn attention across the semiconductor industry, with the company arguing that chip performance can be improved by reducing the internal signal...

Wednesday 3 June 2026

MediaTek denies rumored EMIB adoption timeline

MediaTek denied a foreign report about a timeline for adopting Intel Corp.'s embedded multi-die interconnect bridge packaging at a recent investor event and said its supply-chain strategy...

Wednesday 3 June 2026

Analysis: New AI race is redefining semiconductor industry at Computex

Computex 2026 showcased the industry's latest innovations with its usual fanfare. Yet beneath the spectacle, the event revealed something far more consequential: artificial intelligence...

Wednesday 3 June 2026

Naura pushes into AI chip packaging with first 600mm PLP descum tool

Naura Technology Group has shipped its first 600mm × 600mm panel-level packaging descum tool, marking a key step in the Chinese semiconductor equipment maker's move from wafer-level...

1/55 pages

BIZ FOCUS

Jun 1, 08:00

LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE

MOST-READ
7 DAYS NEWS

Full list

RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook