News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Friday 4 July 2025

SEMICON Taiwan 2025 to launch AI chip packaging alliance, highlighting advanced packaging and ecosystem resilience

SEMICON Taiwan 2025 is scheduled to take place from September 10 to 12 at the Taipei Nangang Exhibition Center, with a series of technical forums kicking off on September 8. A key...

Friday 4 July 2025

TSMC, suppliers ride AI wave as Nvidia GB series powers record demand

Taiwan's semiconductor and electronics industries are entering a new period of explosive growth, driven by the full-scale rollout of...

Friday 4 July 2025

Global CoWoS players and capacity, 2025-2026

Introduction

Wednesday 2 July 2025

Towa expands South Korea presence as AI spurs demand for HBM packaging tools

Japanese semiconductor equipment maker Towa Corporation, a global leader in advanced packaging systems, recently unveiled its newest technology for sixth-generation HBM4, aiming squarely...

Wednesday 2 July 2025

TSMC Arizona chair to retire; senior management changes expected at US plant in 2026

TSMC announced important resolutions from the extraordinary general meeting of its subsidiary TSMC Arizona. Rick Cassidy, senior vice president of corporate strategy development and...

Wednesday 2 July 2025

TSMC's global fab push sparks Taiwan to form 18-firm chip alliance

As global semiconductor production shifts toward localization, Taiwan's chipmaking ecosystem is responding with a unified alliance strategy to expand its presence in the US, Europe,...

Tuesday 1 July 2025

Memory market rebounds: OSE projects quarterly growth through 2025

Benefiting from a surge of rush orders spurred by US tariffs and steadily rising demand from AI server customers, memory packaging and EMS firm OSE is seeing its business momentum...

Monday 30 June 2025

South Korea launches AI chip project with Taiwan's CoAsia and local unicorn Rebellions

CoAsia, a Taiwan-based semiconductor company, announced that its subsidiary, CoAsia SEMI, will partner with Rebellions, a South Korean AI chipmaker, to co-develop a next-generation...

Monday 30 June 2025

TSMC turns US expansion crisis into opportunity; personnel reshuffle set for 2026

TSMC's US$65 billion Arizona expansion, initially hampered by cost overruns and construction delays, is now showing signs of strategic success as the chipmaker addresses key operational...

Friday 27 June 2025

Niching sees strong growth ahead as AI boosts demand for advanced packaging

As artificial intelligence continues to accelerate the adoption of advanced semiconductor packaging, Taiwan-based materials supplier Niching is riding a wave of momentum. The company...

Friday 27 June 2025

Efun targets semiconductor packaging and OLED displays with water and gas barrier films

Optical film manufacturer Efun held its shareholders' meeting, successfully passing all proposals. Efun highlighted that with technological advancements, the demand for next-generation...

Friday 27 June 2025

TSMC expands its lead as global chip foundries enter '2.0' era

As semiconductor manufacturing becomes increasingly intricate, foundries are no longer confined to traditional chip fabrication. Instead, the industry is transitioning into what Taiwan...

Thursday 26 June 2025

IC distributors pivot to Southeast Asia under trade turbulence

With US-China tariff tensions intensifying and global manufacturers racing to decentralize their supply chains, Southeast Asia is emerging...

Thursday 26 June 2025

TSMC, ASE close ranks on PLP, 310x310mm emerges as the format to watch

Taiwanese chipmakers TSMC and ASE Holdings are quietly positioning themselves at the forefront of panel-level packaging (PLP), an emerging advanced packaging format poised to succeed...

Thursday 26 June 2025

ASE group Chair's daughter joins board, fuels succession rumors

ASE Technology Holding Co., the world's largest provider of semiconductor packaging and testing services, convened its annual shareholders' meeting on June 25, 2025, approving key...

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