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Wednesday 22 July 2026
SK Hynix denies report it is pursuing deal for Intel's Ohio fab

SK Hynix said in a July 22 disclosure that it had neither pursued nor decided on an acquisition of Intel's under-construction semiconductor...

Wednesday 22 July 2026
Chinese equipment makers win early production orders as TGV packaging moves beyond the lab

Chinese semiconductor equipment suppliers are beginning to secure production orders for through-glass via (TGV) manufacturing tools,...

Wednesday 22 July 2026
Intel and Fortinet deepen collaboration on new security processor

Intel and Fortinet have expanded their long-standing partnership to develop the Fortinet Security Processor 6 (SP6), a move expected...

Wednesday 22 July 2026
WAIC 2026: Enflame debuts China's first glass-based CoPoS AI chip sample

Chinese AI chip developer Enflame said at the World Artificial Intelligence Conference (WAIC) 2026 that it had jointly showcased an AI chip...

Wednesday 22 July 2026
AI infrastructure spending is reshaping Southeast Asia's PCB supply chain

Rising investment in AI servers, high-speed networking, and satellite communications is accelerating a shift in Southeast Asia's electronics...

Tuesday 21 July 2026
Huawei Kirin 9030 shows SMIC's 7nm gains and ongoing efficiency gap
A teardown of Huawei's Kirin 9030 flagship processor — built on SMIC's 7nm-class N+3 process — reveals continued density progress from China's leading chipmaker, but a...
Tuesday 21 July 2026
China's EUV gap keeps semiconductor catch-up in check
As the US continues to tighten export controls on advanced semiconductor equipment to China, questions are mounting over whether China can narrow the gap with leading-edge manufacturing...
Tuesday 21 July 2026
China's AI supernode race seeks systems edge through optics, packaging, and cloud scale

China's AI hardware race is shifting from individual accelerators to supernodes, optical interconnects, advanced packaging and cloud-scale...

Tuesday 21 July 2026
BOE expands into glass-core packaging, solar cells and optical interconnects
BOE Technology Group said on July 20 that it is pushing beyond display panels into glass-core substrate packaging, perovskite solar cells and Micro LED optical interconnects. The Chinese...
Tuesday 21 July 2026
Seoul Semiconductor weighs India LED plant to tap ISM 2.0 incentives
South Korea's Seoul Semiconductor, one of the world's largest optoelectronics makers, is assessing plans to build a manufacturing plant in India and is in early talks with several...
Tuesday 21 July 2026
Zeiss accelerates push into AI chip advanced packaging, CPO

Zeiss is moving into a new AI chip battleground as advanced packaging and silicon photonics rise on the back of chiplet-based architectures,...

Monday 20 July 2026
Rapidus taps Cadence AI agents to speed 2nm chip design
Japanese foundry Rapidus is integrating Cadence's AI-agent technology into its chip design platform as it seeks to shorten development cycles and attract customers for its planned...
Monday 20 July 2026
Intel reassigns global fabs, eyes early 14A and EMIB-T AI wins

Intel has accelerated its global footprint reset for 2026 after receiving investments from the US government, SoftBank, and Nvidia...

Monday 20 July 2026
Merck ramps up AI semiconductor materials push as Level Up nears completion

AI is redrawing the rules of semiconductor competition, pushing materials suppliers beyond simple chemical inputs and toward integrated...

Monday 20 July 2026
Huahsu expands capacity to tap AI and advanced packaging demand
Huahsu, a semiconductor materials supplier established in 1997 through a joint investment by Japan's Asahi Kasei and Wah Lee, has launched a new capacity expansion plan as demand for...