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Tuesday 23 June 2026
Intel expands Taiwan chip chain orders, October 2026 talks grow
Intel is deepening cooperation with Taiwan's semiconductor supply chain and plans to broaden its engagement again in mid-October after completing exchanges in the US with several Taiwanese...
Tuesday 23 June 2026
India reportedly plans to launch fresh chip incentive in fiscal 2027
The Indian government plans to disburse INR71 billion in semiconductor incentives in fiscal year 2027 to expand its local chip supply chain, according to anonymous government officials...
Tuesday 23 June 2026
Taiwan OSAT sector's strongest 1H in years puts 2026 full-year revenue records in sight

Taiwan's semiconductor packaging and testing (OSAT) industry delivered strong year-over-year revenue growth in May 2026, with 21 of...

Tuesday 23 June 2026
Wafer Works unveils golden triangle expansion to boost AI, optical, and SiC wafer capacity
Wafer Works announced after its June 18, 2026, shareholders meeting that it launched a "golden triangle" expansion plan to deepen silicon wafer product lines and support fast-growing...
Monday 22 June 2026
Intel CEO doubles down on advanced packaging with former SK Hynix chief's return
Former SK Hynix CEO Lee Seok-Hee is set to return to Intel as executive vice president (EVP) of Intel's foundry business, strengthening Intel's push into advanced packaging technologies...
Monday 22 June 2026
TSMC glass substrate rollout unlikely before 2030

The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving...

Monday 22 June 2026
Global suppliers race accelerates: TSMC's first CoPoS demo tools enter validation
TSMC is accelerating its CoPoS rollout, replacing traditional round wafers with larger rectangular glass panels to support packaging demand for AI GPUs and HPC chips over the next...
Monday 22 June 2026
India roundup: Apple's India manufacturing bet faces reminder of operational risks after Tata probe closure

India is accelerating its electronics manufacturing ambitions through AI infrastructure, semiconductor...

Saturday 20 June 2026
Techman Robot pushes lightweight cobots with built-in AI vision into Southeast Asia
Techman Robot brought a lineup of collaborative robots and AI vision automation systems to the ME Assembly & Automation 2026 trade show in Bangkok this week, targeting manufacturers...
Thursday 18 June 2026
Samsung, SK Hynix weigh first chip packaging plants in South Korea's Honam region

Samsung Electronics and SK Hynix are each reviewing locations in South Korea's Honam region for new semiconductor packaging plants,...

Thursday 18 June 2026
FOPLP race heats up as Innolux reportedly teams with TSMC
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP...
Thursday 18 June 2026
Exclusive: Galatek sees Penang facility driving semiconductor, life sciences ecosystem growth
Beyond its established role in assembly, testing and packaging (ATP), Penang's next stage of development will depend on its ability to deepen capabilities in precision engineering,...
Wednesday 17 June 2026
Kaynes' Japan push signals India's bid to become an alternative chip packaging hub

India-based Kaynes Technology is seeking outsourced automotive semiconductor orders in Japan, a move that could help establish a foothold...

Wednesday 17 June 2026
Exclusive: Galatek eyes up to 200% chip growth with Malaysia packaging push

Singapore-based Galatek Technologies is expanding into scarce advanced packaging equipment as it builds localized manufacturing capacity...

Tuesday 16 June 2026
AI chip race sends semiconductor equipment sales to record US$36.55 billion
Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced...