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NEWS TAGGED PACKAGING
Friday 13 February 2026
TSMC and memory makers boost capex to offset China export restrictions impact
TSMC raised its 2026 capital expenditure forecast to US$52-56 billion, driving strong demand in the global semiconductor supply chain amid AI growth. Memory giants SK Hynix, Micron,...
Friday 13 February 2026
SK Hynix reportedly begins equipment orders for Cheongju HBM packaging line amid AI-driven capacity race
SK Hynix has started placing initial equipment orders to convert an idle Cheongju fab into a high-bandwidth memory (HBM) packaging and testing line, according to ET News,...
Friday 13 February 2026
Display makers exit old LCD plants as chipmakers hunt cleanrooms
Due to low production efficiency and intense price competition, major panel makers like AUO, Innolux, and LG Display are selling older LCD factories. Semiconductor companies such as...
Friday 13 February 2026
Why Applied says the AI boom is real—just waiting for more cleanrooms
Applied Materials used its fiscal first quarter 2026 earnings call to underscore that AI-related semiconductor demand is running ahead of earlier forecasts, with industry revenues...
Thursday 12 February 2026
Taiwan PCB industry unites at Apex Expo for US advanced packaging push
Amid mounting tariff pressures and geopolitical risks, the Taiwan Printed Circuit Association (TPCA) announced that it will showcase a Taiwan advanced packaging zone at Apex Expo 2026,...
Thursday 12 February 2026
China claims five places in 2025 global OSAT top 10
The latest global ranking of the top 10 outsourced semiconductor assembly and test (OSAT) providers points to a shift in competitive balance. In 2025, five Chinese companies entered...
Thursday 12 February 2026
MCU makers raise prices as packaging costs surge
The microcontroller unit (MCU) sector has emerged from inventory destocking in 2025, with the easing of US-China tariff tensions signaling a market recovery. Industry insiders expect...
Thursday 12 February 2026
TSMC spillover lifts Xintec testing orders, 2026 growth in sight
Xintec, the packaging and testing subsidiary of TSMC, held an investor conference in which Chairman CH Chen said full-year 2025 revenue maintained modest growth, driven primarily by...
Wednesday 11 February 2026
TSMC supplier AblePrint sees January 2026 revenue jump 142% on AI chips packaging boom
Taiwan-based AblePrint Technology, a key supplier of advanced packaging defoaming equipment for major clients including TSMC, reported record-breaking performance despite earlier regulatory...
Wednesday 11 February 2026
Tongtai Machine & Tool shifts from equipment maker to system integrator in face of accelerated global manufacturing restructuring
Tongtai Machine & Tool has launched a transformation to shift from traditional equipment manufacturing to providing integrated process and system solutions, targeting AI server,...
Wednesday 11 February 2026
South Korean IC designers face year-long packaging delays
Surging demand for artificial intelligence servers and high-performance computing (HPC) has tightened capacity across the semiconductor supply chain. For many small South Korean communications...
Wednesday 11 February 2026
AUO's pivot toward AI, optics and satellites aims to shift revenue mix and steady margins by 2030
AUO is overhauling its business model to make Vertical Solution and Mobility Solution the dominant revenue sources, targeting a combined 70% share of sales by 2030 while expanding...
Tuesday 10 February 2026
Amkor pivots toward AI and HPC with ambition to expand advanced packaging
Amkor Technology is accelerating its transition into the next wave of advanced packaging growth, focusing on high-performance computing (HPC) and artificial intelligence (AI). This...
Tuesday 10 February 2026
Commentary: From retreat to return, SMIC's long road back to advanced packaging
China-based foundry SMIC will release fourth-quarter 2025 results on February 10 and hold its first 2026 investor briefing on February 11. Market focus is expected to center on its...
Tuesday 10 February 2026
Amkor accelerates US expansion with Arizona investment and closer alignment with TSMC
Amkor Technology is accelerating its global expansion, projecting 2026 capex between US$2.5 billion and US$3 billion. This plan emphasizes significant facility construction, including...