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    Motorola and Google drove 28% growth in North American foldable smartphone shipments in 2025
    11h 21min ago
    2AM's Lim Seul-ong highlights untapped AI potential in entertainment experience economy at AI Expo 2026
    11h 21min ago
    Analysis: OpenAI shifts focus to compete with Anthropic; Gemini targets consumers with Apple's collaboration
    11h 21min ago
    AI computing power to drive semiconductor revenues to US$1.8 trillion by 2030
    11h 41min ago
    TSMC prioritizes 3nm capacity supply for cloud AI and loyal clients
    11h 44min ago
    DIGITIMES chairman and Acer founder praise Taiwan's important role in AI industry
    11h 48min ago
    NEWS TAGGED PACKAGING
    Thursday 26 March 2026
    Innos set for late April listing on TPEx, riding advanced packaging boom
    Probe card automation equipment maker Innostar Service (Innos) is expected to list on the Taipei Exchange (TPEx) main board in late April 2026. With artificial intelligence (AI) applications...
    Thursday 26 March 2026
    SEMICON China opens with focus on AI chips and advanced packaging
    SEMICON China 2026 opened on March 25 in Shanghai, as the global semiconductor industry enters a new expansion cycle fueled by the rapid rise of artificial intelligence.
    Thursday 26 March 2026
    China's Naura and AMEC lead China's push into advanced chip packaging
    As advanced packaging pushes toward 3D integration and high-bandwidth computing, hybrid bonding has emerged as a critical battleground for semiconductor equipment makers.
    Thursday 26 March 2026
    Tescan Opens Korea Demo Lab for APAC Semiconductor and Academia

    Tescan  announced the official opening of its upgraded Tescan Korea Demo Lab & Office in Seoul, bringing together its relocated Korea office and enhanced demo...

    Wednesday 25 March 2026
    Tescan targets Taiwan and South Korea for semiconductor investment
    Czech microscopy equipment supplier Tescan is continuing to deepen its presence in the Asia-Pacific market, targeting growing opportunities in semiconductor failure analysis (FA)....
    Wednesday 25 March 2026
    Taiwan Mask poised for advanced packaging growth in 2H26 off semiconductor rebound
    Riding a semiconductor industry recovery and AI-driven demand for advanced packaging, Taiwan Mask Corporation (TMC) President Lidon Chen said the company expects significant and substantial...
    Tuesday 24 March 2026
    Eternal Materials braces for stronger 2026 but flags oil-driven cost monitoring
    Eternal Materials expects operations in 2026 to outperform 2025, driven primarily by growth in precision equipment and scaling shipments of semiconductor advanced packaging materials...
    Monday 23 March 2026
    Advanced Echem expands DUV, packaging, and optical materials to serve global chip progress
    Advanced Echem Materials' (AEMC's) expansion in DUV photoresists, advanced packaging, and optical materials signals increased global supply capacity for cutting‑edge semiconductor...
    Monday 23 March 2026
    Tescan integrates Seoul demo lab to speed testing for AI memory and advanced packaging customers
    Tescan's expansion of its Seoul site integrates a Demo Lab with office space to better serve semiconductor clients amid global AI-driven memory demand, promising faster failure analysis...
    Monday 23 March 2026
    At Cheonan, Samsung is rewriting HBM's bonding playbook
    Samsung Electronics is accelerating the expansion of its high-bandwidth memory (HBM) backend capacity at its Cheonan campus while preparing a transition to next-generation bonding...
    Friday 20 March 2026
    As NAND makers move on, MLC memory nears the end of the line

    As global NAND flash makers shift toward higher-layer 3D architectures, legacy MLC NAND is slipping into a severe supply-demand imbalance...

    Friday 20 March 2026
    AI tailwinds and global reach put Topco on track for double-digit growth in 2026
    Driven by AI applications boosting advanced processes, HBM, and packaging technologies, demand for key materials like silicon wafers and photoresists has surged. Topco Scientific (TSC)...
    Friday 20 March 2026
    Commentary: Taiwan's display panel makers are quietly becoming chip companies
    Taiwan built its technology identity on two pillars: semiconductors and display panels. One has thrived. The other is reinventing itself.
    Friday 20 March 2026
    Intel pushes large-area AI packaging to close foundry gap
    Intel is reportedly preparing large-area AI chip packaging to strengthen its foundry business and challenge TSMC and Samsung Electronics.
    Thursday 19 March 2026
    Intel to expand EMIB capabilities in Malaysia amid Section 232 probe uncertainty
    Intel's advanced packaging complex in Malaysia is expected to begin operations later this year, Prime Minister Datuk Seri Anwar Ibrahim said, as the company advances its assembly and...
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    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook