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    Analysis: Europe's battery independence dream is over: Chinese makers dominate global supply
    9h 46min ago
    Apple's iPhone Fold aims for crease-free display with key panel orders
    9h 46min ago
    Huawei and ByteDance jointly developed RRAM memory to accelerate AI applications
    9h 46min ago
    Apple accelerates US chip supply chain rebuild fuel by TSMC and Foxconn expansion
    9h 46min ago
    Nvidia tops US$100B in profit — but is China still worth the wait?
    9h 46min ago
    Commentary: German BBA price war in China threatens used car residual value system
    9h 46min ago
    NEWS TAGGED PACKAGING
    Thursday 26 February 2026
    Macronix January profit surges 195%; OSE, Walton earnings rise
    Despite persistent noise in the memory market, leading memory chipmaker Macronix reported a sharp surge in profitability in January 2026. The company posted preliminary pre-tax net...
    Thursday 26 February 2026
    Taiwan Mask posts nearly NT$100m profit in January, advanced packaging to boost revenue in 2H26
    Benefiting from its group integration strategy, Taiwan Mask Corporation (TMC) is seeing operations that are gradually recovering. The parent company's core business has seen five consecutive...
    Thursday 26 February 2026
    Fiberglass shortage persists in 2026, Unimicron increases substrate price
    As demand for high-speed transmission in AI advanced packaging surges, IC substrate major Unimicron Technology said that high-end ABF substrates required for AI applications are strongly...
    Thursday 26 February 2026
    Is Nvidia's GTC mystery chip a 3D IC with memory stacked on the GPU?
    All eyes are on Jensen Huang ahead of the March 16–19 GTC conference. Nvidia's chief executive has promised to unveil a chip unlike anything the world has seen before —and...
    Thursday 26 February 2026
    GUC Announces Tape-out of UCIe 64G IP on TSMC N3P Technology

    Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced it has successfully taped-out industry-leading, Universal Chiplet Interconnect Express. (UCIe.)...

    Wednesday 25 February 2026
    Unimicron names UMC's SC Chien chair in substrate strategy shift
    Unimicron held an investor conference on 25 February 2026. A day earlier, its board approved the appointment of UMC co-president SC Chien as chairman and group chief strategy officer...
    Wednesday 25 February 2026
    TSMC's record profits signal AI boom far from over
    Blowout earnings from TSMC in 2025 — and an even more bullish outlook for 2026 — have reignited investor enthusiasm across the global semiconductor sector. Attention is...
    Wednesday 25 February 2026
    ChipMOS raises memory test prices again, signs 3-year capacity contract
    ChipMOS returned to profitability in 2025 after a fourth-quarter 2025 rebound driven by memory shortages and higher test prices, and the company forecasts a stronger second-half performance...
    Wednesday 25 February 2026
    India's Kaynes Semicon deepens ties with Synopsys in push toward advanced packaging
    Kaynes Semicon, the semiconductor assembly and test arm of Kaynes Technology India Ltd., has adopted engineering simulation software from Synopsys to strengthen its outsourced semiconductor...
    Wednesday 25 February 2026
    ASE accelerates panel-level packaging push with fully automated 310mm line by 2026
    AI and high-performance computing chip demand continue to expand, keeping TSMC's CoWoS capacity tight into 2026. The supply constraint is pushing Taiwan's major OSAT providers, including...
    Tuesday 24 February 2026
    Analysis: Foxconn's India semiconductor push signals deeper localization and supply-chain shift
    Foxconn's move from assembly to semiconductor packaging in India marks a strategic deepening that could accelerate local supply-chain integration and influence global EMS competition,...
    Monday 23 February 2026
    Can Polymatech anchor India's compound semiconductor supply chain?
    Looking beyond advanced logic nodes, compound semiconductors have emerged as a strategic priority for applications ranging from power electronics and RF to optoelectronics.
    Wednesday 18 February 2026
    Analysis: 2nm shifts chipmaking from scaling to chiplet integration

    The semiconductor industry is shifting at 2nm from transistor scaling to chiplet-based architectures and advanced packaging. Performance...

    Tuesday 17 February 2026
    Samsung accelerates HBM hybrid bonding line to meet Nvidia demand
    Samsung Electronics is reportedly accelerating preparations for next-generation high-bandwidth memory (HBM), moving to establish a hybrid bonding production line at its Cheonan campus...
    Friday 13 February 2026
    TSMC and memory makers boost capex to offset China export restrictions impact
    TSMC raised its 2026 capital expenditure forecast to US$52-56 billion, driving strong demand in the global semiconductor supply chain amid AI growth. Memory giants SK Hynix, Micron,...
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    AIEXPO2026
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    Special Report
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook