News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Monday 27 July 2026

Samsung, Hyundai expand AI push from chips to robotics

Samsung Electronics and Hyundai Motor Group used the San Francisco AI Summit to outline separate artificial intelligence (AI) expansion...

Monday 27 July 2026

CXMT's US$8.6 billion IPO sets off new spending cycle across China's DRAM supply chain

China's leading DRAM producer CXMT listed on Shanghai's STAR Market on July 27 after raising about CNY57.9 billion (approx. US$8.6 billion), the board's largest initial public offering...

Sunday 26 July 2026

Podcast: TSMC, SK Hynix, Intel face AI chip and cash flow inflection

This excerpt of DIGITIMES analyst Luke Lin's podcast looks at two major themes: SK Hynix's openness to building in the US and the logic behind TSMC's extra US$100 billion investment...

Saturday 25 July 2026

Rapidus links 2nm chips, HBM and advanced packaging in AI foundry strategy

Rapidus is treating advanced packaging as a central part of its 2nm foundry strategy, not a downstream assembly service. The Japanese chipmaker aims to connect design enablement, front-end...

Saturday 25 July 2026

Taiwan's chip partnerships widen beyond fabs to AI, photonics and quantum

Taiwan's semiconductor industry is expanding overseas while deepening cooperation with the US, Europe, and Asia across advanced packaging, AI infrastructure, research, talent, cybersecurity,...

Saturday 25 July 2026

Intel, China-based Lens Technology partner to explore glass substrate semiconductor packaging

Intel Corporation and Lens Technology have announced a strategic collaboration to explore the development of advanced semiconductor packaging technologies using glass substrates. The...

Friday 24 July 2026

India's chip plants face harder test: finding repeat customers

India's first major semiconductor customers are likely to come through existing global supply chains rather than domestic electronics brands immediately replacing imported components,...

Friday 24 July 2026

TSMC's Arizona expansion moves past initial hurdles as fabs and packaging ramp up

Since TSMC announced in 2020 that it would build factories in the US, the market has closely watched how overseas fab costs would affect operations. TSMC's long-running Arizona buildout...

Friday 24 July 2026

Rapidus expands Hokkaido chip hub with packaging and analysis

Rapidus is expanding the semiconductor development and production network around its Chitose, Hokkaido foundry, adding chip analysis...

Friday 24 July 2026

TGV still faces technical barriers; CoPoS commercialization not likely until 2030

Introduction

Friday 24 July 2026

Amkor, Nvidia widen AI packaging partnership as US capacity expands

Amkor Technology has deepened its partnership with Nvidia to develop advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms...

Friday 24 July 2026

Samsung to break ground on Onyang HBM expansion in October, targets 2029 production

Samsung Electronics plans to break ground in October 2026 on a KRW 1.3 trillion (approx. US$884 million) expansion of its Onyang semiconductor packaging site in South Korea, targeting...

Thursday 23 July 2026

SK Hynix speeds P&T7 cleanroom rollout, keeps overall budget at KRW19 trillion

SK Hynix's board approved approximately KRW 7.09 trillion (approx. US$4.83 billion) in facility investment on July 22 to accelerate construction of its P&T7 advanced packaging...

Thursday 23 July 2026

Commentary: Intel must show real AI orders to prove its turnaround

Agentic AI is rapidly gaining traction worldwide, while cloud giants and Anthropic are accelerating spending on AI infrastructure. That surge is pulling CPU demand back to the center...

Wednesday 22 July 2026

CPO commercialization opens new SiPh packaging race for Taiwan OSATs

Exploding demand for AI server computing power is pushing data-center architectures to upgrade at a faster pace, and the traditional...

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Jun 1, 08:00

LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE

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