South Korea's Hanmi Semiconductor has reportedly begun supplying 2.5D packaging bonders to an unnamed Taiwanese foundry after the equipment passed mass-production qualification, giving...
Facing rapid demand expansion across the semiconductor and AI industries, Tongtai Group (TT Group) has aggressively promoted an import-substitution and localization strategy in recent...
In a podcast, DIGITIMES analyst Luke Lin said hybrid bonding is drawing fresh attention at SEMICON Taiwan 2026 and could become a key driver of advanced packaging capacity expansion...
AI and high-performance computing (HPC) demand is extending order visibility for Taiwanese semiconductor equipment supplier Scientech into 2028, while capacity constraints may force...
AI and high-performance computing (HPC) demand is changing the semiconductor industry's technology and investment priorities. As chip power consumption, computing density, and data...
Dutch equipment maker ITEC used Semicon Taiwan to promote a die-bonding architecture that it says triples throughput over earlier versions of the design by removing the largest source...
As Semicon Taiwan kicked off at the Taipei Nangang Exhibition Center, the Ministry of Economic Affairs (MOEA) announced that, based on forecasts compiled from multiple research institutions,...
TSMC is steering the future of artificial intelligence toward high-density three-dimensional advanced packaging designed to mimic the architectural connectivity of the human brain,...
TSMC is calling for future HBM and DRAM designs to become more compatible with X-ray inspection, as increasingly complex advanced packaging makes buried defects harder to detect while...
MSScorps saw August 2026 revenue post a new single-month high, as global artificial intelligence (AI) computing power continues to expand, driving demand for advanced process technologies,...
Singapore-based semiconductor packaging equipment maker Kulicke and Soffa (K&S) said AI demand is spreading into adjacent applications, lifting 2026 orders for wire bonding equipment...
Rising semiconductor packaging and testing demand is exposing space and logistics constraints at existing plants. Kenmec Mechanical Engineering is targeting the upgrade market with...
Gary Huang, vice president and head of Asia-Pacific research and business development at Yole Group, said the imbalance is already showing signs of what he described as supply-chain...
The rapid expansion of artificial intelligence is forcing a radical shift from individual chip design to holistic system-level engineering, requiring competitors and supply chain partners...
Electroninks, a global provider of metal-composite conductive inks and advanced semiconductor packaging materials, has formed a strategic partnership with Merck and Taiwan-based Qualipoly...
