News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Monday 22 June 2026

Intel CEO doubles down on advanced packaging with former SK Hynix chief's return

Former SK Hynix CEO Lee Seok-Hee is set to return to Intel as executive vice president (EVP) of Intel's foundry business, strengthening Intel's push into advanced packaging technologies...

Monday 22 June 2026

TSMC glass substrate rollout unlikely before 2030

The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving...

Monday 22 June 2026

Global suppliers race accelerates: TSMC's first CoPoS demo tools enter validation

TSMC is accelerating its CoPoS rollout, replacing traditional round wafers with larger rectangular glass panels to support packaging demand for AI GPUs and HPC chips over the next...

Monday 22 June 2026

India roundup: Apple's India manufacturing bet faces reminder of operational risks after Tata probe closure

India is accelerating its electronics manufacturing ambitions through AI infrastructure, semiconductor...

Saturday 20 June 2026

Techman Robot pushes lightweight cobots with built-in AI vision into Southeast Asia

Techman Robot brought a lineup of collaborative robots and AI vision automation systems to the ME Assembly & Automation 2026 trade show in Bangkok this week, targeting manufacturers...

Thursday 18 June 2026

Samsung, SK Hynix weigh first chip packaging plants in South Korea's Honam region

Samsung Electronics and SK Hynix are each reviewing locations in South Korea's Honam region for new semiconductor packaging plants,...

Thursday 18 June 2026

FOPLP race heats up as Innolux reportedly teams with TSMC

As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP...

Thursday 18 June 2026

Exclusive: Galatek sees Penang facility driving semiconductor, life sciences ecosystem growth

Beyond its established role in assembly, testing and packaging (ATP), Penang's next stage of development will depend on its ability to deepen capabilities in precision engineering,...

Wednesday 17 June 2026

Kaynes' Japan push signals India's bid to become an alternative chip packaging hub

India-based Kaynes Technology is seeking outsourced automotive semiconductor orders in Japan, a move that could help establish a foothold...

Wednesday 17 June 2026

Exclusive: Galatek eyes up to 200% chip growth with Malaysia packaging push

Singapore-based Galatek Technologies is expanding into scarce advanced packaging equipment as it builds localized manufacturing capacity...

Tuesday 16 June 2026

AI chip race sends semiconductor equipment sales to record US$36.55 billion

Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced...

Tuesday 16 June 2026

Murata and Synopsys deepen simulation integration as electronics design complexity grows

Murata Manufacturing has partnered with Synopsys to make its latest electromagnetic and thermal simulation models directly accessible...

Tuesday 16 June 2026

AMD opens EFB front beyond CoWoS, putting Taiwan substrate trio in play

The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility...

Tuesday 16 June 2026

TSMC reportedly teams with Ibiden, Innolux to push CoPoS, glass substrates

TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in...

Tuesday 16 June 2026

TSMC PLP timeline faces skepticism from Taiwan industry sources

A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has...

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