The Selangor state government has committed MYR50 million (US$12.24 million) to the National Strategic Investment Fund, joining Khazanah Nasional Bhd and the Penang government in a...
Electricity demand from semiconductor manufacturing, memory production, advanced packaging, and server assembly is rising rapidly, fueling reports that Taiwan Power Company (Taipower)...
Kaynes Semicon, the chip packaging arm of Indian electronics maker Kaynes Technology, is calling for foreign semiconductor companies to form joint ventures in India, as its executives...
Nanya Technology reported record profits in the third quarter of 2026, with president Pei-Ing Lee saying long-term agreements (LTAs) now cover approximately 50–70% of the company's...
Under what the industry terms the "Filter Moore's Law," each process node shrink lowers tolerance for airborne molecular contaminants, causing filtration demand to grow exponentially...
Sumitomo Bakelite announced that it is expanding production capacity for encapsulation materials used in advanced chip packaging at its facilities in Singapore and Suzhou, China. This...
PEN SJ Electronics, a subsidiary of China's SJ Electronics, will invest more than US$70 million in an advanced packaging materials and thermal management facility at Batu Kawan Industrial...
Optical communications is becoming a key global bottleneck as AI workloads expand, and Sigurd is positioning itself to benefit. The IC test and packaging company said demand is rising...
A former iPhone display factory in Mobara, Japan, is set for a new role in the semiconductor supply chain, with Shinko Electric Industries planning to convert the site into a production...
This week's (October 5 to October 11, 2026) coverage highlights intensifying efforts to build resilient semiconductor and AI hardware supply chains. Elon Musk's Terafab project faces...
As explosive AI computing demand drives hardware architecture change, Taiwan Printed Circuit Association (TPCA) is set to open its annual flagship event, with the 21st International...
South Korea's JNTC plans to invest KRW347 billion (approx. US$259 million) in glass substrate manufacturing as it reports a sharp reduction in copper-filling time for thick glass cores,...
Malaysia is moving from traditional semiconductor back-end manufacturing toward higher value-added work, with advanced packaging set to drive growth over the next two to three years,...
GF said on October 8, 2026, that it has signed a multi-year, US$2 billion manufacturing agreement with TSMC to produce silicon interposers for TSMC's CoWoS ecosystem at its Malta,...
