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NEWS TAGGED PACKAGING
Friday 14 August 2026
SK hynix scouts US memory fab sites as customers seek local supply
SK hynix has spent more than a month studying potential locations in the US and other regions for a front-end memory fab, as American customers press the company to expand wafer production...
Friday 14 August 2026
Samsung weighs moving legacy memory backend work to Vietnam to free up capacity for HBM
Samsung Electronics may move part of the general-purpose DRAM and NAND packaging and testing now handled at its Cheonan and Onyang sites in South Korea to Vietnam, potentially freeing...
Friday 14 August 2026
Eternal Precision Mechanics accelerates advanced packaging push with wafer lamination
Eternal Precision Mechanics (EPM), a small but fast-growing subsidiary of Eternal Materials, is accelerating its shift from IC substrates into advanced packaging equipment. The company...
Friday 14 August 2026
Nvidia Feynman pushes TSMC A16 and CPO ramp

Nvidia is accelerating development and supply-chain alignment for its Feynman generation in the second half of 2028, even as Vera Rubin...

Friday 14 August 2026
Lam Research to spend more than US$3 billion expanding global R&D labs
Lam Research plans to invest more than US$3 billion over the next five years to expand its global research and development lab network, increasing experimental capacity as semiconductor...
Friday 14 August 2026
Applied Materials sets 2028 capacity target as it commits new manufacturing hires
Applied Materials used its fiscal third-quarter earnings call to lay out a multi-year capacity build rather than just a strong quarter. Alongside record results, the company said it...
Friday 14 August 2026
Rapidus targets 8-reticle interposers by 2030
Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...
Friday 14 August 2026
PixArt revenue rises on game-console demand as margin pressure grows

PixArt's latest results signal how shifting demand across consumer electronics and emerging sensor markets can reshape profitability...

Friday 14 August 2026
Grand Process's Challentech partners with Japan's Seiki for bonding tech

Artificial intelligence (AI) and high-performance computing (HPC) continue to drive demand for advanced packaging, where bonding technology...

Thursday 13 August 2026
Taiwan's packaging and integration ecosystem positions it as the backbone of CPO scaling, Ayar Labs says

The technical feasibility of co-packaged optics (CPO) has been demonstrated repeatedly at major industry conferences in recent years...

Thursday 13 August 2026
ChipMOS lifts capex for 2026-2027 on memory and AI ASIC growth

ChipMOS said strong demand for automotive panels and memory products drove revenue and profit to record highs in the second quarter...

Thursday 13 August 2026
Intel signals memory push after hiring former SK Hynix CEO

Intel is signaling a broader push into next-generation memory technologies, with CEO Lip-Bu Tan revealing that the company is exploring...

Thursday 13 August 2026
Siemens EDA unveils AI-Native Design strategy in South Korea
Siemens EDA has introduced an AI-Native Design strategy in Seoul, aiming to help chipmakers and system designers manage rising complexity while reducing the risk of AI errors. The...
Wednesday 12 August 2026
OCP APAC 2026: Ecosystem not yet ready for co-packaged optics, ASE's Nicole Tien warns

Co-packaged optics has become the inflection point for AI infrastructure, but the industry has not yet built the shared testing standards...

Wednesday 12 August 2026
OCP APAC 2026: Nvidia SVP Shainer on taking CPO to mass production —'can't release something just because it's cool'

Nvidia's Spectrum-6 co-packaged optics (CPO) switches are in production and shipping, Gilad Shainer, senior vice president of networking...