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Wednesday 7 October 2026
Towa returns strategic chip packaging production to Japan as AI demand accelerates
Towa plans to build a new factory in Kyoto Prefecture to produce assembly and packaging equipment for advanced semiconductors used in artificial intelligence applications.
Wednesday 7 October 2026
Apple Watch sensor demand and InP supply tightness lift TASC's 2H26 outlook
Taiwan-Asia Semiconductor Corporation (TASC) expects a stronger second half of 2026 as new Apple Watch demand lifts sensor orders. The company said weak consumer electronics demand...
Wednesday 7 October 2026
Semicon 2.0 widens focus beyond fabs: Dassault Systèmes pitches virtual twins to India's chipmakers
Dassault Systèmes is pitching its virtual twin software as the link between India's chip design base and the factories and packaging plants now being built under the country's...
Wednesday 7 October 2026
Hua Yang, Zeiss launch COSMA-M for chip metrology
Hua Yang Precision Machinery has teamed up with Zeiss to launch COSMA-M, a high-precision measurement system aimed at the semiconductor metrology market as demand surges from AI, high-performance...
Tuesday 6 October 2026
AMD to expand Taiwan supply chain investment as AI demand drives capacity needs
AMD CEO Lisa Su said the company plans to further increase investment in Taiwan's semiconductor supply chain as demand for CPUs, GPUs, and AI computing continues to outpace available...
Tuesday 6 October 2026
Taiwan bets on SiPh, CPO to tackle AI data center power bottlenecks
Taiwan's National Science and Technology Council (NSTC) has launched two research programs targeting silicon photonics (SiPh) and next-generation AI data center power systems, seeking...
Tuesday 6 October 2026
Samsung steps up HBM cooling as TSMC expands CoWoS
Samsung Electronics is expanding its thermal-management efforts for high-bandwidth memory (HBM) beyond the memory stack as increasingly large chip packages raise heat-management ch...
Tuesday 6 October 2026
Behind the US$4.2 trillion revenue gap in AI infrastructure
AI data center plans and computing demand are expanding far faster than physical infrastructure can be built, creating a widening gap between planned and actually deployed compute...
Monday 5 October 2026
AMD's Lisa Su back in Taiwan as AI capacity crunch spreads beyond TSMC
AMD CEO Lisa Su arrived in Taiwan on October 5 for a lightning visit, less than five months after her May trip. No major public events are scheduled, but meetings with key suppliers...
Monday 5 October 2026
TSMC, Intel named as Musk's Terafab ambitions face reality check
As Elon Musk's Terafab ambitions advance, the realities of modern silicon manufacturing become increasingly apparent, prompting Musk to enter talks with industry mainstays like Intel...
Monday 5 October 2026
Taiwan's GIS targets optical communications growth with fresh laser-packaging capacity
General Interface Solution (GIS) Holding is gaining traction in optical communications and other new products despite weak consumer electronics demand caused by rising memory prices...
Monday 5 October 2026
TSMC emerges as potential Terafab partner as suppliers see over 80% chance of Musk deal
Days after reports emerged that TSMC was reassessing plans for a wafer fab in Texas, Tim Culpan, a former Bloomberg columnist and founder of independent media outlet Culpium,...
Monday 5 October 2026
Micronex plans Sanand lead-frame plant as India expands chip packaging supply chain
Micronex Technology plans to build a semiconductor lead-frame factory in Sanand, Gujarat, seeking to localize a packaging component as India expands its chip assembly and testing industry...
Monday 5 October 2026
Applied Materials, Besi broaden packaging partnership for AI chip integration
Applied Materials and BE Semiconductor Industries (Besi) are expanding their partnership to address the increasingly complex connections between AI chips, extending joint development...
Monday 5 October 2026
Nanya Tech expands 3D OSAT to chase HBM-like demand
Nanya Technology is stepping up investment in new factory capacity to expand packaging and testing as some customers move into trial production for specification-based designs. The...