News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Friday 11 September 2026

Taiwan govt boosts EDA R&D to target global gaps

Taiwan's National Science and Technology Council (NSTC) briefed Premier Jung-tai Cho on September 10, 2026, at an Executive Yuan meeting on the Chip-Driven, Taiwan-wide semiconductor...

Friday 11 September 2026

AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle

Taiwan supply-chain sources said low-CTE glass fibre cloth used in high-end substrates remains tight, while glass-core substrates for next-generation packaging are still in technical...

Friday 11 September 2026

Apple's new chip packaging boosts A20 Pro AI power, pushing MediaTek, Qualcomm to follow suit

Apple has unveiled its latest iPhone 18 Pro and the A20 Pro, its first 2nm chip. According to Apple's official specifications, the A20 Pro features a six-core CPU, seven-core GPU,...

Friday 11 September 2026

Taiwan tech minister in Europe to advance semiconductor cooperation

National Science and Technology Council (NSTC) Minister Cheng-Wen Wu visited the UK and Belgium in early September to advance Taiwan-Europe...

Friday 11 September 2026

China's Shenzhen Kaifa plans CNY1.85 billion expansion for high-end memory packaging and testing

Chinese electronics manufacturer Shenzhen Kaifa Technology, also known as Shenzhen Kaifa or Kaifa, plans to invest CNY1.85 billion (about US$260 million) to expand high-end memory-chip...

Friday 11 September 2026

Samsung 2nm push gains momentum as Synopsys cuts NPU die area by 22%

Synopsys has reported a 22% reduction in die area for a neural processing unit (NPU) implemented with its Fusion Compiler design tool on Samsung Foundry's SF2P process, providing a...

Friday 11 September 2026

Global IC substrate market to surge 32% to US$19.5 billion in 2026 as Taiwan, Korea lead ABF, BT

Rising demand for generative AI, high-performance computing (HPC), and data center buildouts is pushing the global IC substrate industry into a new phase marked by upgrades in high-end...

Thursday 10 September 2026

ASE August revenue tops NT$80 billion record as AI packaging capacity stays sold out

ASE Technology Holding's revenue surpassed NT$80 billion (US$2.5 billion) for the first time in August 2026, as AI continued to drive demand for both advanced and conventional semiconductor...

Thursday 10 September 2026

AUO matching glass substrate size stokes TSMC collab speculation

AUO is accelerating its transformation by extending its established large-format panel manufacturing capabilities into advanced semiconductor packaging.

Thursday 10 September 2026

Spirox TGV inspection capable of scanning entire substrate in 20 minutes

As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates...

Thursday 10 September 2026

AI semiconductor equipment boom redraws Taiwan IPC market: Edge AI, advanced packaging lift high-end demand

AI and high-performance computing (HPC) demand is sustaining strong investment in advanced semiconductor processes, high-bandwidth memory (HBM), and advanced packaging, lifting the...

Thursday 10 September 2026

SK Hynix says 3D DRAM will borrow from logic foundry playbook

SK Hynix is signaling a shift in memory design that could matter far beyond South Korea. By adopting logic foundry techniques for 3D DRAM, the company is moving toward a future where...

Thursday 10 September 2026

Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules...

Thursday 10 September 2026

Nvidia reportedly drives testing interface capacity crunch, pushes Taiwan suppliers

AI chip demand is tightening high-end testing interface capacity, and supply-chain sources say Nvidia has raised prices to secure most of the probe card and test socket output from...

Thursday 10 September 2026

Hiwin supply deal with Semes points to deeper access in South Korea's memory equipment market

Hiwin Technologies has signed a supply contract with Semes, Samsung Electronics' semiconductor equipment arm, for a single-axis positioning stage being tested in hybrid bonding equipment,...

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Sep 11, 08:00

DAS Expands in Taiwan and Unveils World First at SEMICON

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