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    Chinese automakers advance global ecosystem with new wave of export strategy
    2h 7min ago
    Memory shortage drives price hikes in China's PC and smartphone markets
    2h 7min ago
    Commentary: Why does China's AI chip startups gets high valuations despite ongoing losses
    2h 7min ago
    Memory costs account for 35% of mid-range smartphone expenses
    2h 7min ago
    Taiwan dronemaker AIDC to start small-scale production in US amid global supply chain reshuffle
    2h 7min ago
    Samsung sees memory shortage as opportunity, no plans to reduce phone memory in 2026
    2h 8min ago
    NEWS TAGGED PACKAGING
    Thursday 18 December 2025
    Niching targets multi-year vapor chamber upswing, insulates margins against metal costs
    Niching Industrial Corp., a supplier of semiconductor packaging and testing materials, said revenue in 2025 is likely to hit a record high, driven by rising cooling demand from AI...
    Thursday 18 December 2025
    Advanced packaging drives ABF substrate expansion as Taiwanese companies exit post-pandemic capacity cuts
    As more AI GPU, CPU, and ASIC customers ramp up their market push, advanced packaging capacity continues to face tight supply. This has prompted upstream IC packaging substrate makers...
    Thursday 18 December 2025
    Apple reportedly explores chip assembly in India, signaling supply chain diversification
    Apple is reportedly in preliminary talks with Indian chip manufacturers to assemble and package components for the iPhone, potentially marking a first step in shifting part of its...
    Wednesday 17 December 2025
    Taiwan academia advances E-band research for satellite communication applications
    E-band wireless communication, operating between 71-76 GHz and 81-86 GHz, offers extremely high data throughput and ultra-low latency. Beyond its current use in automotive radar,...
    Wednesday 17 December 2025
    Tokyo Ohka ramps up South Korea investment for advanced chip materials

    Tokyo Ohka Kogyo plans to accelerate investment in South Korea and expand production of materials critical to generative AI semiconductors,...

    Tuesday 16 December 2025
    China's chip resilience: Naura M&A, ACM's HBM push defy US export controls
    Escalating US-China tech rivalry and the politicization of the supply chain are accelerating a structural transformation in the global semiconductor equipment sector. While the US...
    Monday 15 December 2025
    TSMC to expand CoW Orders in 2H26 as OSAT CoWoS-like tech rises
    As major US CSPs are ramping up ASIC development, the capacity gap in TSMC's CoWoS advanced packaging continues to widen. Thus, the rise of "CoWoS-like" capacity by OSAT providers...
    Monday 15 December 2025
    Micron's DDR5 outsourcing ramp redraws memory packaging trajectories through 2026
    Memory demand remains overheated and supply tight, driving upstream manufacturers to lift utilization while majors such as Micron pivot toward customized, higher value-added output...
    Monday 15 December 2025
    Samsung pushes new thermal packaging to win back Qualcomm and Apple

    Samsung Electronics is positioning a proprietary thermal management technology for external clients as it seeks to reclaim foundry market...

    Friday 12 December 2025
    Exclusive: Ex-TSMC R&D VP on advanced packaging and Morris Chang's vision
    Douglas Yu, former TSMC R&D vice president, highlighted the development of TSMC's 3D Fabric platform, including challenges in early adoption and the impact of founder Morris Chang's...
    Friday 12 December 2025
    CPO tech and Taiwan player deployment

    Introduction

    Thursday 11 December 2025
    Ta Liang PCB and advanced packaging orders surge, equipment lead times hit 6 months
    PCB and semiconductor equipment manufacturer Ta Liang Technology reported a surge in orders as AI chip and AI server demand solidifies. Customers have been investing to expand capacity,...
    Wednesday 10 December 2025
    Scientech posts over NT$10B revenue in 11 months, order visibility extends to 2H26
    Advanced packaging equipment and wafer reclaim solutions provider Scientech reported consolidated revenue of NT$958 million (US$30.77 million) in November 2025, up 9% sequentially...
    Wednesday 10 December 2025
    TSMC expands CoWoS capacity with Nvidia booking over half for 2026-27
    Semiconductor equipment suppliers reveal that TSMC and non-TSMC players, including ASE, Amkor, and UMC, are accelerating the expansion of advanced packaging Chip on Wafer on Substrate...
    Tuesday 9 December 2025
    Topco Scientific to showcase key semiconductor materials and equipment at SEMICON Japan
    The SEMICON Japan 2025 exhibition is set to take place in Tokyo from December 17 to 19, 2025, with Topco Scientific (TSC) and its Japanese subsidiary Shunkawa participating alongside...
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    BIZ FOCUS
    Dec 18, 09:28
    SK hynix First to Complete Intel Data Center Certification for 256GB DDR5 RDIMM
    Thursday 18 December 2025
    NXP Technology Summit Taipei: Opening the Window to a Smarter Future with AI and Edge Computing
    Tuesday 16 December 2025
    Dimerco leverages Asia logistics expertise to navigate complex 2026 freight market
    Tuesday 16 December 2025
    Japan's $65 Billion Bet: Inside the Government's Semiconductor Revival Plan
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