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    Qualcomm unveiled Dragonfly data center push, with Microsoft and Meta orders in hand
    7h 39min ago
    BOE added to US military-linked list as South Korean panel makers see an opening
    7h 39min ago
    Taiwan revives NT$210 billion drone procurement plan amid industry hopes and concerns
    7h 40min ago
    SK Hynix pushes 2027 launch for Yongin triple-deck fab
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    Gwangju eyes a Taiwan-style semiconductor cluster
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    Google lost two AI stars as talent concerns deepened
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    NEWS TAGGED PACKAGING
    Thursday 25 June 2026
    Samsung chairman reviews HBM4 supply as revenue tops US$1 billion

    Samsung Electronics chairman Lee Jae-yong visited the company's Cheonan plant on June 23 to review high-bandwidth memory production operations,...

    Thursday 25 June 2026
    Sigurd expands AI testing capacity as demand keeps facilities full
    Sigurd is expanding testing and packaging capacity as AI demand and steady customer orders keep its facilities fully utilized. For global readers, the move underscores how supply chains...
    Thursday 25 June 2026
    ASE sees AI demand stretching packaging capacity into 2030
    ASE Holdings COO Dr Tien Wu said the global semiconductor industry is growing faster than expected on the back of AI investment, with demand so strong that the capacity the company...
    Thursday 25 June 2026
    TSMC-Amkor alliance jolts packaging map as ASE races to expand
    The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing...
    Thursday 25 June 2026
    Chinese chip packaging giant JCET plans US$1.1b AI chip packaging plant
    JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening...
    Thursday 25 June 2026
    China moves to build helium reserve as Nippon Sanso sets over 30% price hike

    Global helium supply is under renewed strain. Nippon Sanso, Japan's largest industrial gas supplier, announced it will raise prices across...

    Thursday 25 June 2026
    IC design firms race to secure packaging capacity
    IC design firms are scrambling to expand their partner networks as tight packaging and testing capacity remain the most pressing bottleneck in the supply chain. Companies in Taiwan,...
    Wednesday 24 June 2026
    Global market for advanced chip packaging set for rapid expansion
    The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global...
    Wednesday 24 June 2026
    MediaTek-Global Unichip tie-up talk puts TSMC's AI ASIC ecosystem on watch
    Cloud service providers are accelerating in-house AI chip development, lifting demand for application-specific integrated circuits, or ASICs, and reshaping collaboration across the...
    Wednesday 24 June 2026
    Samsung, SK Hynix weigh new Korean chip belt as concerns mount for Yongin cluster

    South Korea's government is in talks with Samsung Electronics and SK Hynix over a potential new phase of large-scale semiconductor investments,...

    Wednesday 24 June 2026
    JEDEC reportedly approves SPHBM4 standard to broaden HBM4 packaging and boost glass substrate prospects
    JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources...
    Tuesday 23 June 2026
    Intel deepens ties with Taiwan's chip supply chain as October talks expand
    Intel is deepening cooperation with Taiwan's semiconductor supply chain and plans to broaden its engagement again in mid-October after completing exchanges in the US with several Taiwanese...
    Tuesday 23 June 2026
    India reportedly plans to launch fresh chip incentive in fiscal 2027
    The Indian government plans to disburse INR71 billion in semiconductor incentives in fiscal year 2027 to expand its local chip supply chain, according to anonymous government officials...
    Tuesday 23 June 2026
    Taiwan OSAT sector's strongest 1H in years puts 2026 full-year revenue records in sight

    Taiwan's semiconductor packaging and testing (OSAT) industry delivered strong year-over-year revenue growth in May 2026, with 21 of...

    Tuesday 23 June 2026
    Wafer Works unveils golden triangle expansion to boost AI, optical, and SiC wafer capacity
    Wafer Works announced after its June 18, 2026, shareholders meeting that it launched a "golden triangle" expansion plan to deepen silicon wafer product lines and support fast-growing...
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    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    VIA Labs Announces MST Hub Controllers for Multi-Display USB-C Docking
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook