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Friday 23 January 2026
ASML leads chip equipment charge into advanced packaging
Global semiconductor equipment suppliers are accelerating their push into advanced packaging. They are positioning back-end processes as a new growth engine as artificial intelligence...
Friday 23 January 2026
Analysis: How Howard Lutnick is redrawing the memory-chip map

US Commerce Secretary Howard Lutnick is driving a fundamental reordering of the global semiconductor supply chain. According to exclusive...

Friday 23 January 2026
TSMC reveals dual purpose behind Chiayi AP7 plant as Yunlin expansion looms
TSMC has significantly expanded its advanced packaging capacity in recent years to meet surging AI customer demand. Despite planning six to eight phases for the Chiayi site, internal...
Friday 23 January 2026
Intel slows its most ambitious node—and signals where the real battle is for now
Intel is sharpening its manufacturing strategy around yield improvement, selective capital spending, and differentiated advanced packaging, while keeping major 14A capacity investments...
Friday 23 January 2026
HBF likely overtaking HBM market by 2038 as commercialization speeds up

High-Bandwidth Flash (HBF) is likely to reach commercialization sooner than previously expected and could become a key technology supporting...

Thursday 22 January 2026
Taiwanese firms prepare for silicon photonics and CPO packaging opportunities as AI data center continues growth
As generative AI technologies scale up, the semiconductor industry is poised for a significant transition from copper-based interconnects to optical solutions to meet the stringent...
Thursday 22 January 2026
Lutnick warns memory chipmakers may face 100% tariffs without US production

Samsung Electronics and SK Hynix have been investing tens of trillions of won each year to expand memory production as the global market...

Thursday 22 January 2026
India-based Paras Defence enters semiconductor packaging with new subsidiary
Paras Defence and Space Technologies Ltd. announced the launch of a new subsidiary, Paras Semiconductor Pvt. Ltd., marking the company's expansion into the semiconductor packaging...
Wednesday 21 January 2026
Samsung reportedly exploring ASMPT for TCB supply
Samsung Electronics is reportedly diversifying its supply chain for thermal compression bonders (TCB), a critical tool in high-bandwidth memory (HBM) production, by engaging Singapore-based...
Wednesday 21 January 2026
China's semiconductor equipment leaders push HBM autonomy as US tightens restrictions
US export restrictions on advanced semiconductor equipment to China have become the biggest obstacle to China's domestic production of high-bandwidth memory (HBM). It has been reported...
Tuesday 20 January 2026
PowerTech and ChipMOS report robust November profits amid strong memory demand
Memory packaging and testing firms PowerTech Technology and ChipMOS Technologies recorded significant profit increases in November 2025, reflecting robust demand in the memory sector...
Tuesday 20 January 2026
Advantest faces three standardization challenges in shift-left testing
The silicon photonics (SiPh) and common packaged optics (CPO) solutions supply chains are emerging this year. Japanese testing equipment maker Advantest says that although optical...
Tuesday 20 January 2026
Samsung reportedly to test EUV tools at Taylor fab in March
Samsung Electronics will reportedly begin test operations of extreme ultraviolet lithography equipment at its Taylor, Texas, fabrication plant in March, ahead of full operations planned...
Tuesday 20 January 2026
Eternal Precision secures position in AI with glass substrate, panel-level packaging equipment
Eternal Precision Mechanics (EPM), a subsidiary of Eternal Materials, made its official market debut on January 16, listing shares at an underwriting price of NT$125 (approx. US$3....
Monday 19 January 2026
Weekly news roundup: memory shortages, packaging power, TSMC's global pivot
Below are the most-read DIGITIMES Asia stories of the week of January 12-18, 2026.