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    China's optical supply chain gains ground in smart glasses
    11h 42min ago
    Exclusive: China's CAS microelectronics institute unveils DUV-based 3nm GAA development path
    11h 43min ago
    Samsung expands SRAM and IP support as memory shortages reshape chip design
    11h 43min ago
    AMD shifts China strategy from chips to developer ecosystems as Nvidia retreats
    11h 43min ago
    SK Hynix passes new performance bonus plan with cash and stock split evenly
    11h 43min ago
    NEWS TAGGED PACKAGING
    Thursday 17 September 2026
    Intel CEO warns of 2027 memory crunch and tighter CPU supply
    AI infrastructure expansion is turning memory supply into a major bottleneck for the semiconductor industry. Intel CEO Lip-Bu Tan warned that the memory shortage in 2027 could be worse...
    Thursday 17 September 2026
    Charts: Taiwan's chip packaging growth runs deeper than ASE

    Taiwan's back-end semiconductor sector is growing well beyond its largest player. The 24 listed packaging and testing firms tracked...

    Thursday 17 September 2026
    Samsung looks to outside suppliers as HBM boom shifts priorities
    Samsung Electronics has long benefited from a level of vertical integration few technology companies can match, spanning smartphones, memory, chip design, foundry manufacturing and...
    Wednesday 16 September 2026
    India's Eastern state clears SiCSem's SiC unit in SEZ
    The Falta Special Economic Zone unit approval committee has cleared a proposal from SiCSem Private Limited to build an integrated silicon carbide (SiC) device plant near Bhubaneswar,...
    Wednesday 16 September 2026
    Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging
    Samsung Electro-Mechanics and Qualcomm are working together to develop an organic bridge for 2.1D packaging architectures. The partnership takes place as AI chips grow larger, denser,...
    Wednesday 16 September 2026
    Geckos sees copper paste as a lower-cost answer to shrinking glass via challenges

    AI, high-performance computing, and advanced packaging are accelerating demand for glass substrates, but smaller through-glass vias...

    Wednesday 16 September 2026
    Samsung reportedly pushes conventional memory modules to partners in Vietnam and India as HBM crowds its back end
    Samsung Electronics is reportedly handing the growth in its commodity memory module business to outside assemblers in Vietnam, India, and the Philippines, a sign of how completely...
    Wednesday 16 September 2026
    Glass substrates, TGV set to reshape 2027 advanced packaging race
    As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive...
    Wednesday 16 September 2026
    Hanmi Semiconductor reportedly lands first back-end foothold at Terafab
    Hanmi Semiconductor has reportedly secured an order to supply advanced packaging equipment to Elon Musk's Terafab, marking the first known entry by a South Korean back-end equipment...
    Wednesday 16 September 2026
    MediaTek keeps Dimensity 9600 Pro on HBPoP as cost drives decisions

    MediaTek officially unveiled the Dimensity 9600 Pro on September 15, 2026, drawing significant industry attention to its choice of packaging...

    Wednesday 16 September 2026
    Apple, Intel links sharpen focus on Lens Technology's next glass growth markets
    Lens Technology is pushing its precision-glass expertise into two higher-value markets that could reshape its growth profile: Apple-linked foldable devices and Intel-linked through-glass-via...
    Wednesday 16 September 2026
    US-based Teradyne opens Bengaluru office to support India's semiconductor push
    Teradyne has opened a new office in Bengaluru as India expands its chipmaking ambitions, which could affect supply chains, pricing, and manufacturing capacity worldwide. The move gives...
    Wednesday 16 September 2026
    Interview: Forget transistors — speed is what's choking the chip supply chain, says Qnity exec
    The global surge in AI demand is accelerating change across the semiconductor industry, and as Moore's Law scaling faces physical limits, chipmaking is no longer only about shrinking...
    Wednesday 16 September 2026
    FSC teams with South Korean maker on TGV equipment for glass substrates
    Fu Chun Shin Machinery Manufacture (FSC), a major plastic injection molding machine maker, is expanding further into semiconductors by teaming up with Korean-Chinese joint venture...
    Tuesday 15 September 2026
    Interview: Corning sees CPO, glass core as new semiconductor battlegrounds

    As artificial intelligence applications accelerate, surging global semiconductor demand is pushing advanced packaging, co-packaged optics...

    1/72 pages
    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
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