Touch Taiwan 2027 will take place on April 21–23, 2027, and will expand its scope with two dedicated co-located shows: the Advanced Packaging & Testing Expo and the Silicon...
India's RRP Electronics has inaugurated an Advanced Wafer-Level Packaging (AWLP) facility at its semiconductor unit in Navi Mumbai, Maharashtra, adding SIM and eSIM module production...
Chinese semiconductor equipment maker AMEC plans to develop 102 new equipment models over the next three to five years, backed by nearly CNY13 billion (≈ US$1.94 billion) in...
Micron Technology on October 15 opened Micron Advanced Assembly and Test Taiwan 2 (AATT2) in Taichung, its second advanced assembly and test facility in Taiwan. The plant expands the...
Samsung Ventures and Applied Ventures, the venture capital arm of Applied Materials, have invested in US-based Flexcompute, backing simulation technology designed to predict semiconductor...
AI chips are becoming harder to build, but that complexity is also creating new opportunities for semiconductor equipment suppliers. Applied Materials says rising transistor counts,...
Applied Materials sees advanced packaging as a key growth lever as AI chips move to multi-die designs, with the company projecting more than US$5 billion in related revenue in the...
Rising demand for semiconductor wafer fabrication, memory, advanced packaging and high-end servers is driving a sharp increase in Taiwan's power consumption. Taipower estimates that...
Chemical and solvent distributor Yuan Jen Enterprises is actively expanding its electronic materials business. Company chairman Yuan-Jen Hsu stated that Yuan Jen established a dedicated...
Applied Materials is increasing investments in research and development, manufacturing and its global supply chain as it targets greater market share and profitability through 2030...
Fujifilm is expanding semiconductor materials production in Arizona as global chip demand rises, especially for artificial intelligence, advanced logic, and memory. The move aims to...
Largan Precision chairman En-ping Lin has questioned the viability of Micro LED-based optical links for AI data centers, citing concerns over power consumption, size, and transmission...
JCET is directing most of its increased capital spending towards advanced packaging, modules and testing while reorganising its two South Korean factories to meet AI infrastructure...
Broadcom's Frank Ostojic said semiconductor firms need joint innovation across equipment, materials, and design to overcome bottlenecks that affect AI chips worldwide. He warned that...
The contest for leadership in AI computing is being fought on two fronts—technology and manufacturing capacity—and chipmakers must advance chips, memory, advanced packaging...
