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NEWS TAGGED PACKAGING
Friday 9 January 2026
AMIES Technology acquires SMEE affiliate in US$32m deal, clarifying China's lithography split
China's domestic lithography sector is entering another phase of internal restructuring, with AMIES Technology consolidating industrial assets originally spun out from Shanghai Micro...
Friday 9 January 2026
MA-tek reports higher December and full-year revenue driven by AI chip and advanced process demand
Taiwan-based semiconductor testing firm MA-tek announced December 2025 revenue of NT$501 million (approx. US$15.91 million), marking a 2.7% increase from November and a 10.65% rise...
Friday 9 January 2026
Niching Industrial reports record revenue driven by advanced packaging materials in December 2025
Niching Industrial, a supplier of semiconductor packaging materials, reported consolidated revenue of NT$128.37 million (approx. US$4.07 million) in December 2025, representing a...
Thursday 8 January 2026
India's OSATs are comfortable with materials today, but that may not last
India's backend semiconductor manufacturers are benefiting from a narrow window of materials comfort that is closely tied to the use of legacy packaging technologies.
Thursday 8 January 2026
PentaPro Materials enters TSMC supply chain with NT$3 billion Taiwan expansion
PentaPro Materials Inc., a Taiwanese supplier of semiconductor process chemicals, has joined the supply chain of TSMC and plans to invest NT$3 billion (US$95 million) in a second...
Tuesday 6 January 2026
TSMC reportedly set to build 12 Arizona fabs as Japan, Germany expansions stall
Recent market reports highlight ongoing challenges for TSMC's wafer fabs in Arizona, including high costs and low profits. Industry sources cite supply chain issues, talent shortages,...
Monday 5 January 2026
Japan's Rapidus to launch advanced packaging pilot line in Hokkaido by spring 2026
Japanese chipmaker Rapidus is advancing its 2nm process technology while developing advanced packaging solutions tailored for AI chips. The company aims to officially start trial...
Monday 5 January 2026
Samsung reportedly pitches bundled solutions to Google and AMD
As major corporations expand investments in artificial intelligence (AI), memory suppliers have seen a flood of orders. According to the latest reports from South Korean media, Samsung...
Monday 5 January 2026
TSMC's CoWoS outsourcing to ASE and Amkor challenges Samsung
As its most advanced packaging lines are operating at full capacity, TSMC has transferred part of its advanced packaging orders to outsourced semiconductor assembly and test (OSAT)...
Saturday 3 January 2026
Micron and GlobalFoundries strengthen Singapore's position in advanced AI chip manufacturing
Singapore is drawing a new wave of semiconductor investment as global chipmakers expand advanced manufacturing tied to artificial intelligence infrastructure, reinforcing the city-state's...
Saturday 3 January 2026
Analysis: Japan targets advanced packaging to crack TSMC's manufacturing edge
Japanese semiconductor firms are pivoting toward advanced packaging and alternative lithography as TSMC extends its scale advantage in artificial intelligence chips. TSMC's 3nm and...
Saturday 3 January 2026
Chang Wah accelerates Asia expansion as chip packaging booms
Chang Wah Electromaterials and its affiliate Chang Wah Technology are expanding operations across Taiwan, China, and Malaysia as global chipmakers and packaging houses ramp up capacity...
Friday 2 January 2026
Vietnam urges Intel to boost semiconductor backend capacity
The Vietnamese government is urging Intel to further grow its semiconductor packaging and testing capabilities in the country, seeking to strengthen the nation's role in the global...
Thursday 1 January 2026
Spirox to ship self-developed TSV inspection equipment in 1H26, easing wafer fab bottlenecks
Veteran semiconductor equipment distributor Spirox has successfully entered the advanced packaging supply chain in the second half of 2025 with its self-developed advanced optical...
Thursday 1 January 2026
Commentary: Nvidia's Groq deal reshapes semiconductor industry in 3 key ways
The biggest recent news in AI chip development is Nvidia's non-exclusive technology licensing agreement with Groq. Nvidia invested US$20 billion to acquire Groq's technology license...