ASE, together with National Cheng Kung University (NCKU), National Sun Yat-sen University (NSYSU), and National Chung Cheng University (CCU), unveiled 18 technology research projects...
Five senior Samsung Electronics executives, including the heads of its semiconductor and consumer electronics businesses, reportedly traveled to Tokyo on October 13 while chairman...
As the semiconductor industry enters the artificial intelligence (AI) era, Intel, once the dominant force in the PC market, has increasingly been viewed as a company that fell behind...
As global wafer capacity expands rapidly, TSMC and GlobalFoundries (GF) are highlighting a fast-growing market for mature processes serving advanced applications. In particular, demand...
Chinese display manufacturer BOE has made further progress in advanced semiconductor packaging, extending its panel manufacturing expertise to glass-core packaging substrates. At an...
LG Innotek expects to begin supplying glass substrates for advanced semiconductor packaging around 2028 and sees its chip substrate business improving in 2027, as the South Korean...
TSMC addressed pricing adjustments, CPUs, and advanced packaging at its earnings briefing on October 15, 2026, confirming that demand for CPUs related to agentic AI continues to rise...
China's largest chip equipment makers are buying their way into hybrid bonding, the advanced packaging step that global players from Besi to ASML are also chasing. For Chinese firms,...
As it becomes harder and costlier to shrink transistors, advanced packaging has become the place chip equipment makers look to for their next leg of growth, and ASML appears to be...
TSMC will not let customers sublease or auction off their wafer capacity allocations, chairman C.C. Wei said during the company's October 15 earnings call. With AI chip demand still...
Touch Taiwan 2027 will take place on April 21–23, 2027, and will expand its scope with two dedicated co-located shows: the Advanced Packaging & Testing Expo and the Silicon...
India's RRP Electronics has inaugurated an Advanced Wafer-Level Packaging (AWLP) facility at its semiconductor unit in Navi Mumbai, Maharashtra, adding SIM and eSIM module production...
Chinese semiconductor equipment maker AMEC plans to develop 102 new equipment models over the next three to five years, backed by nearly CNY13 billion (≈ US$1.94 billion) in...
Micron Technology on October 15 opened Micron Advanced Assembly and Test Taiwan 2 (AATT2) in Taichung, its second advanced assembly and test facility in Taiwan. The plant expands the...
Samsung Ventures and Applied Ventures, the venture capital arm of Applied Materials, have invested in US-based Flexcompute, backing simulation technology designed to predict semiconductor...
