News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Saturday 18 July 2026

As AI expands nanotech, Samsung fortifies ecosystem and LG pivots to chip equipment

Nanotechnology is increasingly seen as a key enabler in the AI era, with competition broadening from semiconductors, manufacturing to home appliances. At Nano Korea 2026 held in Goyang,...

Saturday 18 July 2026

JNTC-TOPPAN glass substrate push signals AI packaging supply-chain shift

As AI accelerators and high-bandwidth memory (HBM) packages grow larger and more complex, substrate technology is becoming a new constraint in advanced packaging. Organic substrates...

Friday 17 July 2026

TSMC's CoWoS capacity remains 'extremely tight' as OSAT partners ramp expansion

During its July 16 earnings conference, Taiwan Semiconductor Manufacturing Company (TSMC) offered an upbeat outlook on AI demand. Responding...

Friday 17 July 2026

Laser Tek says AI demand is driving orders, but parts shortages are delaying shipments

Taiwanese laser processing equipment maker Laser Tek said that artificial intelligence(AI)-led investment in advanced packaging, testing, and passive components is boosting orders...

Friday 17 July 2026

Powertech and Broadcom expand AI ASIC push with US$400M Singapore FOPLP venture

Powertech Technology is deepening its panel-level packaging (FOPLP) strategy after its board approved a joint venture with Broadcom...

Friday 17 July 2026

TSMC welcomes EMIB relief as MediaTek pressure eases

TSMC Chairman C.C. Wei said on July 16 that if more competitors can offer advanced packaging solutions that meet customer needs, the...

Friday 17 July 2026

TSMC boosts US manufacturing as Taiwan chip designers wait on moving production

TSMC Chairman C.C. Wei formally announced on July 16 that the company will invest an additional US$100 billion in the US, funding several...

Friday 17 July 2026

TSMC's US$100 billion bet: AI growth, US pressure and the cost of staying ahead

Taiwan Semiconductor Manufacturing Company (TSMC) posted record second-quarter earnings for 2026, issued third-quarter revenue guidance above market expectations, and raised its full-year...

Friday 17 July 2026

China's AI chips hit three walls — and bet on 3D memory to break through

China's AI chip industry is moving beyond a contest over process nodes and into a broader race involving memory, advanced packaging, chip interconnects and system architecture.

Thursday 16 July 2026

C.C. Wei on EMIB, memory envy, and why TSMC won't squeeze its customers

TSMC Chairman and CEO C.C. Wei used the company's second-quarter 2026 earnings call to push back on two narratives gaining traction among analysts: that rival packaging technologies...

Thursday 16 July 2026

AI chips are running hotter — and Niching is betting its future on keeping them cool

As AI chips and HPC chips continue to draw more power, major advanced packaging orders at ASE, Powertech Technology, and Amkor remain strong, lifting demand for heat spreaders. Semi-conductor...

Thursday 16 July 2026

Taiwan OSATs expand non-China capacity with US and SEA push

As the global AI boom drives up demand for semiconductor packaging and testing, Taiwan's OSAT players are accelerating overseas capacity expansion beyond their home market and China...

Thursday 16 July 2026

Cadence launches agentic AI platform for PCB and package design

Cadence has launched the AuraStack AI Super Agent on Allegro AI Studio, positioning it as the world's first agentic AI platform for printed circuit board (PCB) and advanced packaging...

Thursday 16 July 2026

Commentary: CXMT IPO binds China's DRAM supply chain into one ecosystem

CXMT's STAR Market IPO has become more than a fundraising exercise. The strategic placement roster shows how China's largest DRAM maker...

Thursday 16 July 2026

Commentary: Chip lead times extend as cloud AI squeezes capacity

Reports of longer chip lead times have been mounting. ADI has notified customers that, as recovering demand tightens supply, lead times for some analog chip products have stretched...

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Jun 1, 08:00

LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE

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