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    IC substrate shortage to persist in 2026, AI and memory clients sign long-term contracts
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    NEWS TAGGED PACKAGING
    Wednesday 19 November 2025
    Global semiconductor IDM investment in ASEAN

    Introduction

    Tuesday 18 November 2025
    Panjit acquires Torex Vietnam to boost global packaging and testing capacity
    Panjit International has approved the use of US$10.03 million of internal funds to acquire a 95% stake in Torex Vietnam Semiconductor (Torex Vietnam), a subsidiary of Torex Semiconductor,...
    Tuesday 18 November 2025
    Panjit's MOSFET becomes top 3Q25 revenue contributor
    Power semiconductor integrated device manufacturer (IDM) Panjit International has announced its consolidated financial results for the third quarter of 2025. Although quarterly revenue...
    Tuesday 18 November 2025
    PGC Strengthens Cloud and AI ASIC Acceleration with Synopsys' Next-Generation Interface and Memory IP on Advanced Nodes

    As AI workloads scale across global cloud infrastructure, chip designers face a persistent challenge: balancing compute throughput, bandwidth, and power efficiency amid...

    Tuesday 18 November 2025
    OSE plans price hikes and capacity expansion as memory market tightens
    Orient Semiconductor Electronics (OSE) said the global memory industry has shifted decisively into a "seller's market," prompting the company to pass higher costs to customers and...
    Monday 17 November 2025
    Hiwin Mikrosystem secures strong semiconductor advanced packaging orders
    Hiwin Mikrosystem, leveraging years of expertise in nanometer-level high-precision positioning platforms and direct-drive motors, has successfully penetrated the semiconductor and...
    Monday 17 November 2025
    TSMC accelerates CoPoS mass production to 2029, Taiwan suppliers win first orders
    The market is focusing on rising demand for Nvidia AI GPUs and various ASICs, with optimism growing as TSMC plans to expand its CoWoS capacity and sees OSAT partners joining the race...
    Monday 17 November 2025
    Weekly news roundup: Musk advances US chip-fab plans; SpaceX shifts industry economics; memory shortages continue into 2026
    These are the most-read DIGITIMES Asia stories in the week of November 10 to November 16, 2025.
    Monday 17 November 2025
    GUC and Ayar Labs Partner to Advance Co-Packaged Optics for Hyperscalers

    Global Unichip Corp. (GUC), the Advanced ASIC leader, and Ayar Labs, a leader in co-packaged optics (CPO) for large-scale AI workloads, have announced a strategic...

    Monday 17 November 2025
    India roundup: India's Kaynes Semicon outlines OSAT roadmap from power to advanced packaging
    Kaynes Semiconductor is looking to expand into IC backend businesses as Kaynes Technologies' EMS business faces uncertainties due to US tariffs.
    Sunday 16 November 2025
    Semco eyes big tech deals in the glass substrate boom
    Samsung Electro-Mechanics (Semco) is reportedly in supply talks with several Big Tech companies, two years after moving into glass substrates. Seen as a next-generation breakthrough...
    Friday 14 November 2025
    DDR5 becomes 2026 standard, and power-control overhaul lifts passive component market
    The memory market's ongoing shortage-and-price surge continues to accelerate, lifting the broader sector and boosting earnings for DRAM manufacturers, module suppliers, memory packaging...
    Thursday 13 November 2025
    Taiwan's materials suppliers ride AI and semiconductor boom into record revenue

    Taiwan's major materials distributors — Niching Industrial, Wah Lee Industrial, Topco Scientific (TSC), and Chang Wah Electromaterials...

    Thursday 13 November 2025
    Elon Musk's secret fab plan: new US chip plant targets 2026 ramp
    Elon Musk, owner of SpaceX and Tesla Inc., is making significant strides to develop a comprehensive semiconductor manufacturing supply chain in the US. Sources indicate that the fan-out...
    Thursday 13 November 2025
    Powertrim - power module manufacturing service and equipment provider

    Founded in 2020, Powertrim Technologies is a provider of back-end packaging equipment for power modules. Rooted in over 40 years of semiconductor trim and form toolmaking...

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