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NEWS TAGGED PACKAGING
Tuesday 28 April 2026
Nanya breaks into Nvidia's AI memory ecosystem with LPDDR
Nvidia's next-generation AI platform Vera Rubin is approaching mass production, with a key architectural shift favoring low-power DRAM. Sources familiar with the matter say Nanya Technology...
Tuesday 28 April 2026
Amkor records strong 1Q26, advanced packaging expected to triple YoY
Amkor Technology is off to a record start in 2026. First-quarter revenue hit US$1.68 billion, up 27% from the prior year, driven by record performance in AI data center applications...
Tuesday 28 April 2026
Nvidia says GPU allocation follows first-come, first-served principle, not highest bidder
Nvidia CEO Jensen Huang clarified in an April 2026 interview with Silicon Valley podcast host Dwarkesh Patel that the company allocates GPUs based on a first-come, first-served principle...
Tuesday 28 April 2026
US chip packaging capacity to hit 10% by 2032
The Trump administration continues to push for reshoring the semiconductor industry to the US. As global foundry giants TSMC, Intel, and Samsung Electronics expand advanced manufacturing...
Tuesday 28 April 2026
Wuhan unveils US$38 billion plan; YMTC and XMC lead memory expansion
China's central tech hub Wuhan has unveiled its 2026 major project plan, targeting 355 city-level projects with total investment exceeding CNY260 billion (approx. US$38.1 billion).
Tuesday 28 April 2026
Strong demand and advanced packaging execution drive Amkor's upbeat quarter
Amkor Technology reported a strong start to 2026, with management attributing the performance to robust demand across multiple end markets and continued execution in advanced packa...
Tuesday 28 April 2026
AI chip testing complexity lifts probe card and upstream supply chain demand
As AI chips move to advanced process nodes and packaging technologies, semiconductor testing requirements are becoming significantly more complex.
Monday 27 April 2026
India roundup: Micron ramp, Dholera SEZ push India toward full-stack chip manufacturing

India is accelerating its semiconductor ambitions, from Micron Technology's Sanand ramp to new...

Monday 27 April 2026
Innolux enters leading tier of advanced packaging with new RDL and TGV technology
Innolux is expanding into the advanced semiconductor packaging sector, leveraging display technology as its core platform to accelerate integration with semiconductor and IoT technologies...
Friday 24 April 2026
Chipmakers face higher cost pressure as packaging outpaces foundry price hikes
In recent weeks, chip companies ranging from major players to small and medium-sized firms have issued price increase notices or begun renegotiating product prices with select customers...
Friday 24 April 2026
TSMC CoPoS equipment orders face reshuffle with legal turmoil at Taiwanese equipment maker
The semiconductor packaging equipment sector is experiencing order shifts linked to significant executive changes at a key Taiwanese supplier, raising concerns over TSMC's chip-on-wafer-on-substrate...
Friday 24 April 2026
SMIC returns to advanced packaging, scales team to boost AI chip strategy

China's leading foundry, SMIC, is quietly recalibrating its strategy, moving beyond its long-standing focus on front-end wafer manufacturing...

Friday 24 April 2026
Intel bets on CPUs as backbone of AI growth
Intel executives are expressing growing confidence in the company's long-term outlook, arguing that a fundamental shift in artificial intelligence toward real-world deployment aligns...
Friday 24 April 2026
Intel says 18A yield improves as 14A advances to early customer engagement stage
Intel reported steady progress on its most advanced manufacturing technologies, saying its 18A process node is seeing meaningful yield improvements, while the next-generation 14A node...
Friday 24 April 2026
DIGITIMES Insight: SK Hynix's US HBM push sets up a showdown with Micron
SK Hynix Inc. has moved to deepen its presence in the US by building an HBM packaging and testing plant and planning a US stock exchange listing to raise capital — steps that...