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Saturday 4 July 2026
Machvision's June revenue hits another record due to AI demand
Machvision posted another record monthly revenue in June 2026, as surging demand for AI servers, high-performance computing (HPC), and advanced packaging continued to lift orders for...
Saturday 4 July 2026
China's CR Micro raises power chip prices as Chinese suppliers push fresh hikes

China Resources Microelectronics (CR Micro), a Chinese power semiconductor integrated device manufacturer, has notified customers and...

Friday 3 July 2026
Intel takes aim at TSMC's CoWoS lead with EMIB-T
As transistor density scaling slows, chipmakers are leaning on advanced packaging to keep improving accelerator performance. A SemiAnalysis roundup of this year's IEEE Electronic Components...
Friday 3 July 2026
BOE targets AI packaging with Micro LED optical interconnect and glass substrate CPO

BOE, China's leading display panel maker, is accelerating its move into next-generation packaging technologies for the AI era. The company...

Friday 3 July 2026
How TSMC quietly turned its supply chain into a 'second fleet'

TSMC has accelerated efforts to localize its supply chain in recent years, using joint development, joint validation, and long-term...

Friday 3 July 2026
Global server demand is set to stay strong through 2027 as supply chain pressure widens

Global server demand is expected to stay strong through 2027, with implications for cloud operators, hardware makers, and data center...

Friday 3 July 2026
SK Hynix puts US$64 billion into Cheongju chip buildout
SK Hynix plans to invest KRW100 trillion (approx. US$64.38 billion) to build new NAND memory chip and advanced packaging facilities in Cheongju, betting that AI demand will keep tightening...
Thursday 2 July 2026
China power chip makers raise prices, exposing AI server squeeze on mature-node supply

China's power semiconductor makers are entering a broader price-hike cycle, as AI server demand, raw material inflation, and tight...

Thursday 2 July 2026
GIS pivots to semiconductors and optics as memory shortages hit touch demand

Touch module maker General Interface Solution Holding (GIS) said the second half of 2026 will be more challenging as global memory...

Wednesday 1 July 2026
Samsung, SK Hynix southwest fab plans put Gwangju's silicon photonics ambitions in focus
Samsung Electronics' and SK Hynix's planned memory investments in South Korea's southwest have mostly been viewed as a push to balance regional development and tap into local renewable...
Wednesday 1 July 2026
China's chip material makers riding the AI boom close in on Japan

Chinese semiconductor material manufacturers are accelerating investments in advanced products as Beijing pushes for greater self-sufficiency,...

Wednesday 1 July 2026
South Korea's southwest chip hub plan faces supplier gap
South Korea's plan to build a KRW800 trillion (approx. US$51 billion) memory fab cluster in the southwestern Honam region is running into an inconvenient fact: the region has the country's...
Wednesday 1 July 2026
AI fuels OSAT pricing power as chip packaging orders fill through 2027
Cloud AI demand is reshaping the seasonal cycle of the semiconductor industry, with capacity tightness spreading from front-end manufacturing to back-end packaging and testing. Since...
Wednesday 1 July 2026
Naphtha supply risk adds pressure to semiconductor materials
A crude oil shortage tied to the US-Iran war is raising concern about naphtha, a refinery byproduct used deep in industrial supply chains. While a direct semiconductor shortage is...
Wednesday 1 July 2026
South Korea's southwest chip hub grows from memory fabs into full semiconductor and AI ecosystem
South Korea's government laid out a detailed plan on June 30 for building its southwest region into a major new semiconductor production base, with SK, Samsung Electronics and Amkor...