South Korean memory chipmaker SK Hynix has named former development chief Hyun Ahn to lead a new Americas unit as competition for custom high-bandwidth memory (HBM) pushes suppliers...
Intel is expanding its computing platform strategy for agentic AI and enterprise workloads with the Intel Core Series 3 processor, codenamed Wildcat Lake, targeting mainstream consumer...
SynPower has signed a strategic cooperation agreement with AblePrint Technology (APT) to jointly develop substrate equipment with warpage suppression annealing system (WSAS) functions,...
Memory testing and packaging company ChipMOS Technologies posted strong profit growth in the third quarter of 2026, with net income rising 48.4% quarter-over-quarter to NT$1.323 billion...
TSMC reported a 59.7% year-over-year increase in October 2026 revenue, extending its strong growth momentum as demand for advanced chips used in artificial intelligence (AI) infrastructure...
GIS is shifting from touch displays to semiconductor optics, with laser packaging entering small-volume production in the fourth quarter of 2026 and full capacity expected by the second...
China's Lens Technology plans to build and operate its first through-glass via (TGV) glass substrate pilot line by the end of 2026 and is seeking partnerships with South Korean semiconductor...
Tong Hsing Electronic Industries (THEIL), a semiconductor packaging company under the YAGEO Group, said its board has approved the acquisition of a 100% stake in Singapore-listed Global...
Paras Semiconductors, a subsidiary of Indian defense company Paras Defence & Space Technologies, announced a strategic technology partnership with US-based BroadPak Corporation...
Shanghai Micro Electronics Equipment (SMEE) has showcased a new generation of domestically developed lithography systems spanning front-end wafer fabrication and advanced packaging,...
Surging demand for advanced packaging driven by artificial intelligence (AI) has turned chip-on-wafer-on-substrate (CoWoS) from an "interesting" technology into a headache, making...
India's push to expand semiconductor assembly and packaging capacity risks outpacing the development of its chip testing infrastructure, potentially increasing costs and prolonging...
This week's coverage highlights accelerating competition across AI infrastructure, semiconductor manufacturing and advanced memory. Sweden launched the NVIDIA-based Sferical One supercomputer...
The boom in AI demand has triggered a global memory crunch, creating persistent supply shortages and price hikes. The market is currently dominated by Samsung Electronics, SK Hynix,...
Chinese semiconductor equipment makers report record orders extending into 2027, with AI-driven investment in advanced memory, logic chips and packaging strengthening demand for domestic...
