When the agenda for this year's OCP APAC Summit landed, seasoned observers noticed something unusual. TSMC, Applied Materials, Advantest,...
Driven by robust AI-related demand for advanced packaging and testing, ASE Technology Holding has raised its 2026 capital expenditure...
TSMC is reportedly developing a new advanced chip-packaging technology modeled on Intel's Embedded Multi-die Interconnect Bridge (EMIB),...
AI demand is tightening semiconductor capacity beyond TSMC's advanced nodes, with mature-process foundries and backend packaging providers...
Growing demand for AI chips is sending a larger share of South Korea's semiconductor exports to Taiwan, where Korean-made high-bandwidth...
Marvell Technology has opened 100,000 square feet of additional semiconductor R&D space in Bengaluru and plans to double its India...
Italy and the US are set to sign a cooperation agreement tied to the US-led Pax Silica initiative on July 31, as Rome expands efforts...
India has launched two indigenously developed silicon photonics solutions to strengthen local chip design and testing capabilities...
