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Thursday 18 September 2025
Hanwha E-ssential challenges Ajinomoto's ABF monopoly with 2026 launch
Hanwha E-ssential, a subsidiary of Hanwha Solutions, has successfully localized the production of semiconductor packaging insulation materials in South Korea. The company plans to...
Thursday 18 September 2025
CoPoS emerges as successor to CoWoS: K&S aligns with AI chip demands
Advanced packaging has emerged as the centerpiece of semiconductor innovation, with industry attention now focused on what will replace the dominant chip-on-wafer-on-substrate (CoWoS)...
Thursday 18 September 2025
FPT eyes leadership in Vietnam's semiconductor packaging and testing sector
Vietnamese technology giant FPT Corporation is intensifying its push into the semiconductor industry with plans to establish a new backend semiconductor manufacturing facility in...
Thursday 18 September 2025
Kaynes Semicon, Mirrorcle Technologies sign MoU to produce MEMS mirrors in India
Bengaluru-based Kaynes Semicon has signed a memorandum of understanding with California's Mirrorcle Technologies to manufacture MEMS mirrors and optical systems in India.
Wednesday 17 September 2025
Taiwan's MPI, WinWay, and Chunghwa Precision join advanced chip test race
SEMICON Taiwan 2025 gathered a wide range of packaging and test equipment suppliers, all unveiling their latest technologies and solutions. Central to the event was the emerging "advanced...
Wednesday 17 September 2025
China's Big Fund Phase III opens with Piotech Jianke investment in hybrid bonding technology
Chinese chip equipment maker Piotech said on September 12 its unit Piotech Jianke (Haining) Semiconductor Equipment has kicked off a new funding round at a CNY2.5 billion (approx...
Tuesday 16 September 2025
TSMC’s grip on SEMICON Taiwan sets the stage for record-breaking SEMICON West
The magnetic pull of TSMC is making waves, as the upcoming SEMICON West exhibition scheduled for October 7, 2025, at the Phoenix Convention Center in Arizona, is poised to reach record...
Monday 15 September 2025
China targets CoWoP leapfrog as Taiwan holds tech edge
Recent market reports indicate that CoWoP has shown preliminary test results exceeding expectations. Nvidia, which leads its development, is expected to accelerate mass production...
Sunday 14 September 2025
From slides to silicon: India's Suchi Semicon shows progress in chip packaging
India's push to establish itself as a semiconductor hub is beginning to yield results in the back-end packaging segment, with Suchi Semicon moving from presentation slides to actual...
Saturday 13 September 2025
Utechzone joins 3D IC alliance to expand semiconductor testing capabilities and depth
To accelerate the development of heterogeneous integration and advanced packaging technologies, the "3DIC Advanced Manufacturing Alliance" was officially established on September...
Friday 12 September 2025
Malaysia steps up semiconductor drive as G2 rivalry spurs new investments
Malaysia is emerging as a key beneficiary of the intensifying US-China technology rivalry, attracting billions in foreign investment as it seeks to cement its role as a critical player...
Friday 12 September 2025
SEMICON Taiwan 2025: AMD pushes panel-level, 3D, and optical packaging as AI demands soar
At SEMICON Taiwan 2025, AMD Fellow Daniel Ng, who heads the company's OSAT technology development, laid out a stark assessment of the semiconductor industry's next bottleneck: the...
Friday 12 September 2025
SEMICON Taiwan 2025: Hanmi Semiconductor unveils large 2.5D packaging equipment
The rising demand for AI servers and high-end GPUs has fueled growth in large-size 2.5D interposers, and Hanmi Semiconductor is moving quickly to capture this opportunity. At SEMICON...
Friday 12 September 2025
SEMICON Taiwan 2025: Hanwha Semitech maps out roadmap for advanced packaging equipment with 2026 launch plans
Hanwha Semitech has announced a new strategic roadmap to strengthen its position in the advanced semiconductor packaging equipment market, unveiling next-generation systems set to...
Friday 12 September 2025
Nitto Denko and IBM collaborate on advanced semiconductor packaging materials
Nitto Denko has entered a joint development agreement with IBM to explore advanced packaging technologies and materials for semiconductor applications. The partnership will focus...