CONNECT WITH US
NEWS TAGGED PACKAGING
Friday 7 August 2026
Exclusive: STATS ChipPAC readies broad packaging price hikes on AI-driven OSAT squeeze

AI chip demand is sustaining a global rise in semiconductor packaging and testing prices, with STATS ChipPAC preparing a broad round...

Friday 7 August 2026
Panel makers turn old fabs into AI-advanced packaging hubs

AI-driven demand for advanced packaging is giving old-generation panel fabs and equipment new value. As Taiwan's panel makers accelerate...

Friday 7 August 2026
V5 July revenue reaches NT$273 million on AI chip demand, packaging expansion
V5 Technologies reported record consolidated revenue of NT$273 million in July 2026, as demand for AI chips and semiconductor packaging capacity expansion lifted orders. Revenue rose...
Thursday 6 August 2026
Apple scrambles to secure DRAM as US$1 billion worth of iPhone 18 chips reportedly await packaging

Apple and its manufacturing partners are rushing to secure mobile DRAM ahead of the expected launch of the iPhone 18 lineup, as about...

Thursday 6 August 2026
Parade sees steadier outlook despite margin pressure from memory costs

Parade said its second-quarter 2026 results were squeezed by a sudden increase in back-end testing and packaging costs, but the high-speed...

Thursday 6 August 2026
TSMC's CoW outsourcing spurs OSAT capacity push amid AI packaging bottleneck
Taiwan Semiconductor Manufacturing Co. (TSMC) is expanding outsourcing of the chip-on-wafer (CoW) stage of its CoWoS advanced packaging to outsourced semiconductor assembly and test...
Thursday 6 August 2026
India's ASIP Technologies makes FCBGA core of OSAT plan
ASIP Technologies will focus its Visakhapatnam semiconductor facility on flip-chip ball grid array packaging as it works toward volume production in the fourth quarter of 2027, Managing...
Thursday 6 August 2026
FOPLP leads production as CoPoS advances glass packaging
AI chip computing power is rising rapidly, pushing advanced packaging toward larger form factors, higher bandwidth, and greater integration. Traditional Ajinomoto build-up film (ABF)...
Wednesday 5 August 2026
Samsung, SK Hynix expansion puts Korea's chip supply chain to the test

Daeduck Electronics plans to invest KRW497 billion(US$349.50 million) in semiconductor production facilities through 2027, its second...

Wednesday 5 August 2026
SK Hynix to hold late-August groundbreaking for US$3.9 billion Indiana chip packaging plant
SK Hynix plans to hold a formal groundbreaking ceremony in late August for its US$3.9 billion advanced chip packaging facility in West Lafayette, Indiana, as the memory maker expands...
Wednesday 5 August 2026
PSMC open to US, Singapore, Malaysia joint ventures as Intel packaging partnership enters mass production

Market interest in whether Taiwan's Powerchip Semiconductor Manufacturing (PSMC) would deepen cooperation with Intel or potentially...

Wednesday 5 August 2026
Manz opens Tainan R&D center for advanced packaging equipment

Manz has applied to establish a branch in the Tainan Science Park and plans to set up an R&D center there for advanced packaging...

Wednesday 5 August 2026
Everlight files third US patent suit over LED flip chip technology
Everlight Electronics filed a new US patent infringement lawsuit against Nichia on July 30 in the Southern Division of the US District Court for the Eastern District of Michigan. The...
Wednesday 5 August 2026
Hanwha Semitech expands packaging tools as TCB turns profitable

South Korean semiconductor equipment maker Hanwha Semitech is expected to begin recognizing revenue from fan-out panel-level packaging...