In the AI era, technological competition among leading chip design companies continues to intensify. Broadcom announced in 2024 that it...

ASML dominates extreme ultraviolet (EUV) lithography, the technology used to manufacture the world's most advanced logic chips. Decades...

Introduction

Broadcom has begun shipping the industry's first 2nm custom compute SoC built on its 3.5D eXtreme Dimension System in Package (XDSiP) platform...

XTPL (WSE:XTP), a developer of Ultra-Precise Dispensing (UPD) technology for nanomaterial deposition, has entered a strategic partnership with Manz Asia to support the...

A trilateral semiconductor model is emerging, combining Japan's capital, Taiwan's ecosystem expertise,...