Rigid-flexible PCB maker Dynamic Electronics has dismissed a recent Chinese-language report indicating the company plans to sell its factory site in Taiwan to a fellow Taiwan-based...

Clear order visibility for diverse IC packaging materials is seen through the end of the third quarter of the year thanks mainly to increasingly robust demand from OSAT (outsourced...

Taiwan's handset TDDI IC supply chain for Huawei, including designers, backend COF service providers and substrate suppliers, have turned guardedly optimistic about their business...

ASE Technology Holding, the parent company of Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), is gearing up to tap business opportunities in...

Taiwan-based Spirox, which distributes IC packaging and testing equipment, stands to benefit from the US-China trade war as it has seen a fast pickup in orders from China semiconductor...

Tong Hsing Electronic Industries, which provides ceramic substrates and niche-IC backend services, has elected its new board of directors with Yageo chairman Pierre Chen becoming...

Siliconware Precision Industries (SPIL) has achieved satisfactory results from applying AI to detect defects on packaging lines following nine months of efforts, according to KH Wan,...

Chipbond Technology will put on hold its 5G PA (power amplifier) packaging capacity expansion originally set to be enforced in the second half of 2019, due mainly to the uncertainties...

Taiwan-based JMC Electronics, which uses both subtrative and semi-additive processes to manufacture chip-on-film (COF) substrates, has strength to better compete with its larger international...

Unimicron Technology and Kinsus Interconnect Technology both have plans to expand additional new capacities for ABF (ajinomoto build-up film) substrates judging from robust demand...

Suppliers engaged in the supply chain for chip-on-film (COF) packaging remain optimistic about demand coming from the smartphone sector, citing the rising popularity of bezel-less...

Niche-market IC packaging house Xintec continues to expand its offerings and client portfolio in its target markets, and remains focused on wafer-level packaging, according to company...

COF packaging demand for automotive OLED displays has emerged, which may further tighten market supply as capacity expansion will remain quite limited in the short term, according...

Taiwan-based Spirox, which distributes packaging and testing equipment, has signed a new contract with National Instruments (NI) under which Spirox will sell NI's STS (semiconductor...

Taiwan's CMOS image sensor (CIS) packaging specialist Kingpak Technology is expected to see its second-quarter revenues fall only slightly on quarter as its average capacity utilization...

Taiwan-based Spirox, which distributes packaging and testing equipment, expects sales to hit bottom for 2019 in the second quarter.

The global IC packaging and testing market had a scale of US$28 billion in 2018 with the top-10 players commanding a combined 84% share. Three of the top-10 players are based in China...

PCB and IC substrate maker Nanya Printed Circuit Board saw its net loss improve to NT$278 million (US$8.9 million) in the first quarter from loss of NT$677.9 million during the same...

Qualcomm has introduced the world's first 5G NR mmWave antenna modules and sub-6 GHz RF modules for smartphones and other mobile devices, but Samsung is fast catching up.

IC backend house ASE Technology Holding's newly-developed fan-out panel-level packaging (FOPLP) technology has obtained orders from HiSilicon, according to sources familiar with the...

IC backend house ASE Technology Holding and wafer probe card specialist Chunghwa Precision Test Tech (CHPT) are both engaged in the supply chain for HiSilicon's next-generation flagship...

TSMC has certified Ansys' solutions for its SoIC (system-on-integrated chips) 3D chip-stacking technology, according to Ansys, an engineering simulation software provider.

Memory backend specialist Powertech Technology is aggressively developing its advanced packaging technology capability for logic IC production, and will remain focused on fan-out...

Powertech Technology (PTI) expects to post flat or slight sequential growth in revenues for the second quarter, followed by a substantial increase in the third quarter, accordin to...

With the crypto mining fever subsiding, many Taiwan backend houses have seen their FC-CSP machines dedicated to packaging mining ASICs stay idle since late 2018, forcing them into...