AI server demand is lifting shipments of motor-related power devices at Cystech Electronics, helping the Taiwanese MOSFET and diode designer...
Huawei's next-generation flagship Mate 90 smartphone series has reportedly entered the chip packaging and testing stage, according...
Nvidia and other artificial intelligence chipmakers are still facing shortages as TSMC's advanced-node and CoWoS packaging capacity...
Corning has unveiled an early-stage fiber-to-chip connector concept that could reshape optical packaging if it matures, though the...
LG Chem has begun supplying semiconductor strippers to Amkor Technology, a major US-based packaging and testing provider, in its first...
SK Group, Samsung Electronics, and Amkor will invest a combined KRW896 trillion (US$585.2 billion) to build South Korea's second major...
SJ Semiconductor has started construction of a CNY10 billion (approx. US$1.47 billion) 3DIC manufacturing project in Shanghai's Lingang...
As Moore's Law approaches its physical limits, simply shrinking semiconductor process nodes is no longer the sole path to improving...
