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Monday 10 August 2026
Samsung HBM4 yield nears 80% as production race with SK Hynix heats up

Samsung Electronics has reportedly pushed the production yield of its sixth-generation high-bandwidth memory (HBM4) close to 80%, marking...

Monday 10 August 2026
Semiconductor material prices surge across silicon wafers, specialty gases and advanced packaging
Demand for advanced processes and packaging continues to rise, while the Middle East conflict is lifting energy and raw-material costs and tighter Chinese controls on strategic-mineral...
Monday 10 August 2026
Interview: Nvidia sees Taiwan as more than an assembler — an engineering partner

Taiwan's role in the global AI supply chain is shifting from manufacturing toward engineering, Nvidia networking senior vice president...

Monday 10 August 2026
Weekly news roundup: AI infrastructure race spans HBM, DRAM, EMIB, optical transceivers and next-gen lithography
AI infrastructure, memory supply, advanced packaging and US-China tech restrictions led this week's industry agenda. Below are the most-read DIGITIMES stories from the week...
Monday 10 August 2026
India roundup: Chip push broadens as localization and capacity remain works in progress
India is accelerating its bid to build a broader semiconductor and electronics ecosystem, combining new packaging capacity, longer-term tax incentives and deeper localization with...
Monday 10 August 2026
Aurotek profit jumps on embodied AI and semiconductor automation demand
Aurotek Corporation reported stronger second-quarter and first-half 2026 results on August 6 as demand rose for embodied AI solutions, semiconductor foundry and advanced packaging...
Sunday 9 August 2026
Ajinomoto rides advanced packaging boom as ABF demand surges

Ajinomoto raised its full-year forecast on August 6 as growing demand for AI servers and high-performance computing lifted sales of...

Saturday 8 August 2026
TSMC vs. UMC and beyond: the hostile bids that forged Taiwan's chip dominance

Powerchip chairman Frank Huang, who spent much of his career mirroring the trajectory of Taiwan's memory and foundry industries and...

Saturday 8 August 2026
Nova Technology posts record second-quarter and first-half profit on strong order recognition
Nova Technology posted record second-quarter and first-half 2026 profit as orders from semiconductor, memory, and advanced packaging customers continued to drive revenue recognition...
Friday 7 August 2026
WinWay revenue jumps as AI test socket orders drive growth
WinWay Technologies said orders from AI customers and stronger demand for advanced testing products lifted shipments in the second quarter of 2026, with revenue rising for a fourth...
Friday 7 August 2026
Analysis: TSMC expands Japan footprint with 3nm fab, advanced packaging push
TSMC is expanding Japan's role in its global network as it prepares to add 3nm production in Kumamoto and deepens local capabilities in advanced packaging, chip design and next-generation...
Friday 7 August 2026
Exclusive: STATS ChipPAC readies broad packaging price hikes on AI-driven OSAT squeeze

AI chip demand is sustaining a global rise in semiconductor packaging and testing prices, with STATS ChipPAC preparing a broad round...

Friday 7 August 2026
Panel makers turn old fabs into AI-advanced packaging hubs

AI-driven demand for advanced packaging is giving old-generation panel fabs and equipment new value. As Taiwan's panel makers accelerate...

Friday 7 August 2026
V5 July revenue reaches NT$273 million on AI chip demand, packaging expansion
V5 Technologies reported record consolidated revenue of NT$273 million in July 2026, as demand for AI chips and semiconductor packaging capacity expansion lifted orders. Revenue rose...
Thursday 6 August 2026
Apple scrambles to secure DRAM as US$1 billion worth of iPhone 18 chips reportedly await packaging

Apple and its manufacturing partners are rushing to secure mobile DRAM ahead of the expected launch of the iPhone 18 lineup, as about...