Samsung Electronics said on November 12 it had moved up the planned opening of its new high-bandwidth memory (HBM) packaging plant in South Korea by one year to June 2028 to meet rising...
Taiwan’s glass fiber exports to South Korea rose 54.0% year-over-year in the first nine months of 2026 as demand for high-bandwidth memory (HBM) and advanced packaging expanded...
Mitsubishi Gas Chemical (MGC) announced on November 10 that it will expand manufacturing and shipment-inspection equipment at its Thailand subsidiary to increase capacity for BT (Bismaleimide-Triazine)...
A semiconductor chip no thicker than a fraction of a human hair might seem insignificant beside the powerful silicon processors driving the world's AI revolution. Yet at Pragmatic...
Faced with sluggish end-user demand, chronic overcapacity, and intensifying market competition, global display manufacturers are under pressure to reinvent themselves. In Taiwan, leading...
TSMC is facing unprecedented demand for its advanced chips as artificial intelligence (AI) infrastructure investment accelerates, with advanced packaging and emerging physical AI applications...
The National Science and Technology Council's Department of Engineering and Technologies recently issued a call for proposals encouraging academia to modify expensive semiconductor...
South Korean memory chipmaker SK Hynix has named former development chief Hyun Ahn to lead a new Americas unit as competition for custom high-bandwidth memory (HBM) pushes suppliers...
Intel is expanding its computing platform strategy for agentic AI and enterprise workloads with the Intel Core Series 3 processor, codenamed Wildcat Lake, targeting mainstream consumer...
SynPower has signed a strategic cooperation agreement with AblePrint Technology (APT) to jointly develop substrate equipment with warpage suppression annealing system (WSAS) functions,...
Memory testing and packaging company ChipMOS Technologies posted strong profit growth in the third quarter of 2026, with net income rising 48.4% quarter-over-quarter to NT$1.323 billion...
TSMC reported a 59.7% year-over-year increase in October 2026 revenue, extending its strong growth momentum as demand for advanced chips used in artificial intelligence (AI) infrastructure...
GIS is shifting from touch displays to semiconductor optics, with laser packaging entering small-volume production in the fourth quarter of 2026 and full capacity expected by the second...
China's Lens Technology plans to build and operate its first through-glass via (TGV) glass substrate pilot line by the end of 2026 and is seeking partnerships with South Korean semiconductor...
Tong Hsing Electronic Industries (THEIL), a semiconductor packaging company under the YAGEO Group, said its board has approved the acquisition of a 100% stake in Singapore-listed Global...
