News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Friday 30 January 2026

KLA: AI-driven process control boom lifts 2026 semiconductor equipment demand

US semiconductor equipment maker KLA said growing AI infrastructure demand is accelerating investment in advanced logic chips, high-bandwidth...

Friday 30 January 2026

ABF substrate crunch reshapes market: Unimicron leads and rivals close in

AI server architectures are rapidly shifting toward ultra-high-density designs, keeping advanced CoWoS packaging capacity persistently tight...

Friday 30 January 2026

From Shenzhen to Global Opportunity: The BIWIN Mini SSD Ecosystem Application Seminar

The "From Shenzhen to Global Opportunity: BIWIN Mini SSD Ecosystem Application Seminar", jointly hosted by BIWIN and Intel, was successfully concluded at the Intel Greater...

Friday 30 January 2026

Lam Research hits US$20.6 billion revenue high, sees 2026 WFE spending at US$135 billion

Lam Research, a leading supplier of semiconductor manufacturing equipment dubbed the "US version of ASML," capped off fiscal 2025 with stellar performance, fueled by surging AI demand...

Friday 30 January 2026

Tex Year Industries eyes strong 1H26 growth on India, Vietnam capacity, and specialty chemicals

Tex Year Industries anticipates returning to growth in 2026 following a slight revenue decline in 2025, driven by expanded production capacity in India and Vietnam and the maturation...

Friday 30 January 2026

Greatek hits full capacity on AI-driven flip chip, QFN packaging demand

Powertech Technology (PTI) and its subsidiary test and assembly firm Greatek jointly held an online investor conference to discuss future operations. Greatek president Yu-Chang Chi...

Thursday 29 January 2026

China's MCU sector trends from price cutting to margin repair

China's microcontroller (MCU) vendors have started raising prices, led by Cmsemicon's increases across MCU and related products, marking the first upward move in a market that has...

Thursday 29 January 2026

Analysis: China's chip price spiral has begun; a grey rhino threatening the 2026 supply chain

China's semiconductor supply chain is sending a clear signal: a wave of "chip inflation" driven by mature-node manufacturing, memory, and packaging costs is no longer theoretical;...

Thursday 29 January 2026

Exclusive: TSMC reshapes advanced packaging expansion, shifting AP8, AP7, and US fab plans

The surge in generative AI (GenAI) and high-performance computing (HPC) demand has pushed advanced semiconductor packaging to become the most critical and constrained capacity bottleneck...

Thursday 29 January 2026

UMC accelerates advanced packaging and silicon photonics development as AI drives demand

As artificial intelligence (AI) applications expand globally, United Microelectronics Corporation (UMC) is intensifying its efforts in advanced packaging and silicon photonics (SiPh)...

Thursday 29 January 2026

Cmsemicon triggers MCU, NOR Flash price hikes of up to 50% in widening China chip cost cycle

Chinese microcontroller (MCU) supplier Cmsemicon has raised prices on its MCU and NOR Flash products by 15% to 50%, citing tighter chip supply and higher packaging and testing costs...

Thursday 29 January 2026

Scientech's growth signals shift in semiconductor investment toward packaging and system integration

As artificial intelligence (AI) and high-performance computing (HPC) expand rapidly, the global semiconductor industry is redirecting investments from advanced process nodes to advanced...

Wednesday 28 January 2026

Powertech will invest NT$43.3 billion to accelerate FOPLP, targets mass production in 1H27

In response to growing demand from AI and high-performance computing (HPC) for advanced packaging capacity such as fan-out panel-level packaging (FOPLP), Powertech chairman DK Tsai...

Wednesday 28 January 2026

Powertech posts 4Q25 profit high, eyes growth momentum into 2026

Memory testing and packaging firm Powertech Technology (PTI) reported that its revenue and earnings met expectations in the fourth quarter of 2025. Quarterly revenue reached NT$21.41...

Wednesday 28 January 2026

Exclusive: Nvidia to reportedly shift 2028 chip production to Intel, reshaping TSMC strategy

TSMC's dominance in advanced process and packaging has made it a prime target amid US manufacturing mandates. Chip customers now face mounting pressure to diversify supply chains due...

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Jan 30, 12:05

Taiwan's Tron Future Tech to Debut Advanced Drone Interception and Multi-cam Tracking Solutions at Singapore Airshow 2026

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook