South Korean semiconductor packaging and testing company LB Semicon reportedly plans to invest KRW30 billion (approx. US$22.4 million) to expand its power management IC (PMIC) back-end...
KLA expects global wafer fabrication equipment (WFE) spending to exceed US$200 billion in 2027, as semiconductor manufacturers accelerate investments in advanced logic, DRAM and high-bandwidth...
Rising demand for high-end AI chips is accelerating Powertech's transformation into an advanced packaging strategic partner. Powertech said its utilization rate exceeded 90% in the...
Surging demand for AI computing is driving advanced packaging toward larger form factors, according to Ting-Hao Lin, R&D vice president at Kinsus Interconnect Technology, speaking...
Kinsus Interconnect Technology is exploring aluminum nitride (AlN) ceramics as a core material for substrates used in large-scale advanced packaging, seeking an alternative to glass...
China-based IC design firm Goke Microelectronics will raise prices for its Known Good Die (KGD) packaged products by US$0.5 to US$1.5 per unit from November 2026, depending on capacity...
Silicon Valley venture capital firm Playground Global returned to Taiwan with six portfolio companies spanning memory, power management, optical communications and advanced packaging,...
Silicon Valley venture capital firm Playground Global has returned to Taiwan alongside a cohort of portfolio companies specializing in memory, power management, optical communications,...
AMD and Nvidia have separately invested in supply-chain capacity expansion, making substrates, packaging, and testing key priorities as AI demand diversifies. The moves show that chipmakers...
Vietnam's first wafer fab may miss its 2027 trial-production target, Reuters reported on October 26, citing concerns about project execution and equipment procurement. Developer...
India's semiconductor drive has largely been led by New Delhi, which selects projects for large central incentives while state governments add their own packages of land, infrastructure...
Amkor Technology is using customer prepayments and longer-term commitments to support an expanding manufacturing network across the US, South Korea, and Vietnam, as demand for advanced...
Amkor Technology's latest quarter shows how a shift toward advanced packaging can strengthen profitability even when overall sales barely grow. Computing and automotive demand lifted...
As advanced packaging shifts toward large-size glass substrates, Cheng Mei Materials Technology is developing materials to address warpage, heat resistance, and drilling challenges...
In the era of AI and high-performance computing (HPC), the once-separate worlds of chip design, packaging, and circuit boards are converging. According to the Global Electronics Association,...
