ASE Holdings posted record second-quarter and first-half 2026 revenue, driven by strong demand for advanced semiconductor packaging and...

Wolfspeed's patent lawsuit against Navitas Semiconductor has opened a new front in the wide-bandgap power chip race, extending the legal...

TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly...

Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening...

For most of its modern history, India's Northeast — the eight states anchored by Assam — has sat at the margins of the...

SK Group chairman Tae-Won Chey is reportedly set to travel to the US for SK Hynix's American depositary receipt (ADR) listing on Nasdaq,...

Foxconn Chairman Young Liu recently revealed that one of the group's IC design subsidiaries is preparing for a Taiwan listing as early...

France's push into Taiwan's tech ecosystem has entered a new phase. After three years of cultural outreach and research exchanges,...

TSMC's July 16 earnings call is likely to test how far the chipmaker can extend its already upbeat guidance, as investors look for...

Samsung Electronics is using HBM4 to test whether its memory, logic, foundry, and advanced packaging businesses can finally work as...