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NEWS TAGGED HPC
Wednesday 6 April 2022
IC foundries, fab toolmakers continue to see orders piling up
TSMC and other Taiwan-based IC foundries including United Microelectronics (UMC), Vanguard International Semiconductor (VIS) and Powerchip Semiconductor Manufacturing (PSMC) continue...
Friday 1 April 2022
IC test interface vendors diversifying into non-handset chip segments
Taiwan's IC test interface specialists including Chunghwa Precision Test Tech (CHPT) are striving hard to strengthen deployments in multiple market segments beyond handsets as demand...
Thursday 31 March 2022
TSMC to reiterate sales and capex outlook at upcoming investor meeting
TSMC is expected to reiterate its sales growth outlook for 2022 of 25-29% while maintaining its capex target this year of US$40-44 billion at its upcoming investor conference call...
Thursday 24 March 2022
China OSAT growing advanced packaging capability
Having hired R&D talent from Huawei's HiSilicon, China's leading OSAT Jiangsu Changjiang Electronics Technology (JCET) has been developing its flip-chip(FC) packaging, 2.5D IC,...
Wednesday 23 March 2022
New Nvidia GPU fabbed by TSMC with 4nm process
Nvidia has announced its next-generation accelerated computing platform with Hopper architecture, dubbed H100 GPU, which is built using TSMC's 4nm (N4) process customized for the...
Monday 21 March 2022
TSMC may triple CoWoS material purchases for Nvidia new HPC chips
Nvidia is set to launch new HPC GPU platforms for datacenter, AI and gaming applications in 2022, and its manufacturing partner TSMC reportedly is expected to triple order placements...
Thursday 10 March 2022
GUC announces 2.5D and 3D multi-die APT platform for AI, HPC, networking ASICs
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces the availability of a platform to shorten design cycles for low-risk, high-yield production of ASICs with TSMC 2.5D...
Wednesday 9 March 2022
MediaTek seeing handset AP inventory swell
MediaTek has seen its inventory level for handset application processors (including 4G and 5G ones) swell to 160-180 days from past regular levels of around 100 days, due mainly to...
Tuesday 8 March 2022
Apple Car reportedly may adopt ABF substrates from Korean maker
Apple reportedly is in talks with a Korean substrate maker for the supply of ABF-based FC-BGA substrates for processing Apple Car chip solutions, sparking concerns about which IC...
Monday 7 March 2022
OSATs slowing down wirebonding capacity expansions for 2H22
Taiwan's OSATs are slowing down their logic IC wirebonding capacity expansions as the visibility of orders for processing consumer ICs is still unclear beyond the second quarter of...
Friday 4 March 2022
Nan Ya PCB doubles capex budget for 2022
Nan Ya PCB has set aside a capex budget of NT$17 billion (US$605.5 million) for 2022, double last year's level of NT$8.45 billion, mainly to expand its production capacity for ABF...
Wednesday 23 February 2022
Intel's IDM 2.0 vision juggles chip cost and performance
It remains to be seen how Intel will materialize its IDM 2.0 growth vision, but the chipmaker will have to face a trade-off between production cost and chip performance in determining...
Tuesday 22 February 2022
TSMC obtains significant sub-7nm chip orders
TSMC has secured significant orders demanding its sub-7nm process manufacturing from major US vendors, according to sources at semiconductor equipment suppliers.
Friday 18 February 2022
Silicon photonics gaining ground in datacenter applications
Demand for silicon photonics, mainly used in high-bandwidth optical transceivers, continues to gain momentum to support proliferating high-performance computing (HPC) applications...
Thursday 17 February 2022
Kinsus to expand production capacity for ABF substrates in 2022, 2023
Kinsus Interconnect Technology is on track to expand its production capacity for ABF substrates by 30-40% in 2022, and by another 40% in 2023, to meet ever-increasing demand for processing...